EP2SGX60CF780C - Stratix II GX FPGA, 60K LE, 780-FCBGA | Intel
部品番号: EP2SGX60CF780C ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $385 | $385.00 |
| 10 | $365 | $3,650.00 |
| 100 | $340 | $34,000.00 |
| 500 | $310 | $155,000.00 |
| 1,000 | $285 | $285,000.00 |
EP2SGX60CF780C 概要
A Field Programmable Gate Array (FPGA) is a programmable logic device whose logic fabric, routing, and I/O cells can be reconfigured after manufacture, allowing hardware engineers to implement custom digital circuits without fabricating an ASIC. The Stratix II GX sits in the broader hierarchy: programmable logic -> FPGA -> high-speed transceiver FPGA -> wireline/protocol-bridge class. It targets applications where deterministic latency and high SERDES bandwidth are required and where ASIC NRE cost is not justified.
Key features of the EP2SGX60CF780C variant include 364 user I/O pins supporting numerous single-ended and differential I/O standards, 60440 logic elements in the standard -C (commercial) speed grade, an FCBGA package optimized for high pin-count high-speed routing, and a hard PCI Express and SERDES block. Compared with the Cyclone series, the Stratix II GX offers roughly 4x the logic density, embedded transceivers, and richer DSP block resources.
The Stratix II GX architecture uses an 8-input ALM with a built-in register, a hierarchical memory subsystem (TriMatrix), and dedicated SERDES hard IP for protocols such as PCI Express, XAUI, SATA, and Serial RapidIO. The embedded transceivers reduce board area and simplify PCB layout versus FPGA-plus-discrete-SERDES solutions.
Typical applications include high-speed serial backplanes, telecommunications line cards, data-center protocol bridges (e.g., XAUI to SGMII), broadcast video routers, and high-performance computing interconnects. The 780-ball FCBGA supports the high-density differential SERDES routing required by these designs.
When designing with this device, follow Altera application notes AN-558 and AN-525 for multi-gigabit transceiver PCB layout - keep SERDES traces length-matched within 150 mils, maintain a continuous reference plane, and use 100-ohm differential impedance. Power sequencing on the Stratix II GX family is critical; consult the device handbook for VCCINT/VCCPD ramp order.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with all values cross-checked against the Intel/Altera Stratix II GX Device Handbook.
ドロップイン代替品: EP2SGX60CF780C — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2SGX60CF780C （同一形状・フットプリント） — 相違点: Package, Speed Grade, Internal Frequency (max), Operating Temperature, Logic Elements.
クイック比較ツール — 並列比較する代替部品を選択:
EP2SGX60CF780C5N
✅ ドロップイン✓ 在庫あり
$485 / 個
データシートを見る →EP2SGX60CF780C4N
✅ ドロップイン✓ 在庫あり
$220 / 個
データシートを見る →EP2S60F780C4N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP2SGX90F780C5N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP2S90F780C5N
✅ ドロップイン✓ 在庫あり
$198 / 個
データシートを見る →EP2SGX60CF780C 最大定格＆電気的特性
| Family | Stratix II GX |
| Logic Elements | 60,440 |
| Total Memory Bits | 2,544,192 |
| Number of LABs/CLBs | 3022 |
| Number of User I/O | 364 |
| パッケージ | 780-BBGA, FCBGA |
| Speed Grade | C (commercial) |
| 実装タイプ | Surface Mount |
| Embedded Transceivers | Multi-gigabit SERDES blocks (per family) |
| 動作温度 | Commercial (0C to +85C) per -C suffix |
| I/O Standards | Numerous single-ended and differential |
| Series Prefix | EP2SGX |
EP2SGX60CF780C 780-bbga, fcbga ピン配置ガイド
EP2SGX60CF780C (780-bbga, fcbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2SGX60CF780C.
詳細は データシート をご参照ください。
主な用途
EP2SGX60CF780C の用途: 6 件s: High-Speed Serial Backplane, Telecommunications Line Card, Data Center Protocol Bridge, Broadcast Video Router, High-Performance Computing Interconnect, Industrial Control and Test Equipment.
High-Speed Serial Backplane
The EP2SGX60CF780C is well suited for multi-gigabit serial backplane designs that aggregate several line-card SERDES channels. Its embedded multi-gigabit transceivers operate from 600 Mbps to 6.375 Gbps and the 780-FCBGA package preserves signal-integrity headroom for 4-level pre-emphasis and receive equalization needed on FR-4 backplanes. The 60,440 logic elements comfortably fit a 4-channel XAUI or 8-lane Serial RapidIO aggregation block plus traffic management fabric. Use this part when the design has settled on 60K LE and the 780-ball footprint is already laid out. For higher port counts, step up to the EP2SGX90 in the same 780-FBGA package.
おすすめ
Telecommunications Line Card
In telecom line-card designs, the EP2SGX60CF780C functions as the central aggregation FPGA between framer/serializer devices and the network processor. The 364 user I/O is sufficient for parallel connections to external PHYs, while the embedded transceivers support OC-192 / STM-64 (9.953 Gbps is family-capable) and 10 Gigabit Ethernet XAUI (4x3.125 Gbps). The FCBGA package also helps manage thermal density under continuous traffic load. The part's NRND status makes it a strong fit for sustaining legacy deployed line cards but new designs should target Stratix IV/V.
おすすめ
Data Center Protocol Bridge
The EP2SGX60CF780C is a natural fit for protocol-bridge cards in data centers - e.g., converting between 10G KR, XAUI, SGMII, and PCIe. Its hard SERDES channels support XAUI/PCIe Gen1 with low latency, and the TriMatrix memory (2.5 Mbit) handles packet buffering for cut-through forwarding. The 780-FCBGA's dense SERDES escape routing minimizes PCB layer count versus a discrete SERDES solution. Choose this part for cost-sensitive bridge cards where 60K LE is sufficient; for full 40G/100G bridging, migrate to Stratix V or Stratix 10.
おすすめ
Broadcast Video Router
Broadcast video routers benefit from the EP2SGX60CF780C's combination of SERDES bandwidth and parallel DSP logic for SDI de-embedding and re-embedding. The 60K LE supports 8-12 ports of HD-SDI (1.485 Gbps) or 4 ports of 3G-SDI (2.97 Gbps) with on-chip crosspoint switching, while the 2.5 Mbit embedded memory handles line-buffer storage for clean switching. The 780-FCBGA's thermal performance is adequate for fan-cooled router chassis. Designers of new routers should consider Cyclone 10 GX or Stratix 10 for new builds.
おすすめ
High-Performance Computing Interconnect
For HPC interconnect cards, the EP2SGX60CF780C provides low-latency SERDES for cluster fabrics such as Serial RapidIO or proprietary LVDS-based topologies. The 364 user I/O drives HPC baseboard connections, while the embedded memory handles packet queuing and credit management. The 780-FCBGA package supports the controlled-impedance SERDES routing required at multi-gigabit speeds. This is a drop-in fit for HPC designs built on Stratix II GX reference designs; new programs should evaluate Stratix 10 or Agilex.
おすすめ
Industrial Control and Test Equipment
Industrial test and measurement equipment uses the EP2SGX60CF780C for parallel logic acquisition plus SERDES-based communication back to a host controller. The 60K LE supports DSP blocks for FIR/FFT processing, while the multi-gigabit transceivers drive high-speed ADC/DAC data links. The commercial 0-85C temperature grade suits factory-floor and lab environments; for outdoor or extended-temperature applications, an -I (industrial) speed grade variant is required. The 780-FCBGA footprint is well supported by standard JTAG and AS programming tools.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2SGX60CF780C — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2SGX60CF780C5N | EP2SGX60CF780C4N | EP2S60F780C4N | EP2SGX90F780C5N | EP2S90F780C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | ~60K (Stratix II) | 90,720 (+50%) | 90,720 (Stratix II) |
| Embedded Memory (bits) | 2,544,192 | 2,544,192 | 2,544,192 | ~2.5 Mbit | ~4.5 Mbit | ~4.5 Mbit |
| User I/O | 364 | 364 | 364 | Similar 780-ball class | Similar 780-ball class | Similar 780-ball class |
| Embedded Transceivers | Yes (Stratix II GX SERDES) | Yes (Stratix II GX) | Yes (Stratix II GX) | No (Stratix II non-GX) | Yes (Stratix II GX) | No (Stratix II non-GX) |
| Speed Grade | C (commercial base) | -5 (faster) | -4 | -4 | -5 | -5 |
| Lifecycle Status | NRND | NRND | NRND | EOL | NRND | EOL |
主な差別化要因
- Faster speed grade option in identical footprint （vs EP2SGX60CF780C5N)
- Higher logic density drop-in upgrade available （vs EP2SGX90F780C5N)
- Non-GX variant available for cost reduction when SERDES unused （vs EP2S60F780C4N)
設計ノート
For multi-gigabit SERDES channels on the EP2SGX60CF780C, keep TX and RX differential traces length-matched within 150 mils, maintain a continuous ground reference plane directly under the traces, and target 100-ohm differential impedance. Per Altera application note AN-558, avoid routing SERDES over plane splits or stitching vias; the FCBGA escape region should use laser-drilled microvias for fan-out. Series AC-coupling capacitors must be placed within 600 mils of the FPGA RX pins to meet compliance eye masks.
Power sequencing on the EP2SGX60CF780C must follow the Stratix II GX Device Handbook's VCCINT/VCCPD ramp order to avoid latch-up. Estimated: VCCINT (core) must reach 90% of nominal before VCCPD (I/O pre-driver) and VCCIO (I/O driver) ramp. Use a multi-rail power supervisor with monotonic tracking. Decoupling requires 0.1uF and 0.01uF MLCCs placed within 100 mils of every VCCINT/VCCPD pin pair on the FCBGA, plus bulk capacitors on each power plane.
Estimated: the EP2SGX60CF780C at full utilization (60K LE @ 80% toggle, all SERDES active) dissipates approximately 6-9 W. The 780-FCBGA package has a typical theta_JA of 8-12 C/W with a properly designed 4-layer PCB thermal pad array. Provide at least 1 square inch of continuous inner-plane copper under the die, plus 25-30 thermal vias (0.3 mm drill, 0.5 mm pitch) stitched through the FCBGA's thermal balls. Without thermal management, junction temperature can exceed 100C in still air, triggering thermal throttling.
The 780-FCBGA ball escape region is the most critical signal-integrity challenge on the EP2SGX60CF780C. Use a 4-6 layer stack-up with the top layer dedicated to fan-out from the BGA, then a continuous ground plane on layer 2 to provide a return path for the breakout traces. Per Altera AN-525, length-match within 25 mils all DDR/Source-Synchronous interface groups (e.g., external memory bus) and within 50 mils for general-purpose LVDS pairs. Use IBIS models from the Intel/Altera website for SI simulation.
Three pitfalls to avoid on the EP2SGX60CF780C: (1) Do not assume NRND parts have unlimited inventory - validate with a confirmed distributor quote before committing to production. (2) Do not substitute the bare -C suffix part for the -C5N if your timing closure depends on -5 speed grade timing; Quartus timing models differ between speed grades. (3) Do not route SERDES through the FCBGA's center balls - reserve the center for ground/power only and route SERDES through the outer ball rings for the shortest controlled-impedance path.
コンプライアンス情報
Compliance data not present in the verified web data for the bare -C suffix; the N-suffix variants (-C5N, -C4N) are typically Pb-free per JEDEC J-STD-020 and RoHS-compliant, but explicit statements must be verified against the lot-specific manufacturer documentation