Intel

EP3CLS200F484C7N - Cyclone III LS FPGA 198K LE FBGA-484 | Intel

部品番号: EP3CLS200F484C7N ✓ 生産中
在庫あり 1〜3営業日以内に発送
1.2 V Vdss LVDS, LVTTL, LVCMOS, SSTL, HSTL Rds(on) 484-ball FBGA (FineLine BGA, 23x23 mm) Package 8,211,456 bits Memory
開始価格 $1650 USD / 個
MOQ: 1 |
価格更新日: 2026-09-09
ボリューム価格
数量 単価 小計
1 $2034.7 $2,034.70
10 $1950 $19,500.00
100 $1850 $185,000.00
500 $1750 $875,000.00
1,000 $1650 $1,650,000.00
ℹ️ すべての価格はUSDです

EP3CLS200F484C7N 概要

The Intel (Altera) EP3CLS200F484C7N is a Cyclone III LS family Field Programmable Gate Array (FPGA) featuring 198,464 logic elements, 8,211,456 bits of embedded memory, and 210 embedded 18x18 multipliers, housed in a 484-ball FineLine BGA (FBGA-484) package. It operates from a 1.2 V core supply with hot-socketing support and is offered in a commercial 0C to +85C temperature grade.

A Field Programmable Gate Array (FPGA) is a programmable logic IC that lets designers configure arbitrary digital logic, memory blocks, and DSP pipelines through a hardware description language (HDL) flow. FPGAs sit within the programmable logic family, alongside CPLDs and structured ASICs, and form a critical layer between fixed-function microcontrollers and fully-masked ASICs in the semiconductor taxonomy. The Cyclone III LS family is positioned as the low-power, security-enhanced variant of the Cyclone III generation, targeting cost-sensitive, high-volume digital designs.

Key features of the EP3CLS200F484C7N include 484 user I/O pins distributed across eight I/O banks, support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, and integrated configuration circuitry supporting JTAG (IEEE 1149.1) and Active Serial (AS) modes. The device also integrates configuration bit-stream encryption and a robust Cyclone III LS security feature set aimed at preventing design theft and cloning, which is uncommon in low-cost FPGA families.

Technically, the EP3CLS200F484C7N uses a low-k, 65 nm TSMC process to deliver low dynamic and static power consumption. Logic is arranged as 12,404 Logic Array Blocks (LABs), each containing 16 Logic Elements (LEs). The embedded memory supports single-port, dual-port, and FIFO modes, and the 210 18x18 multipliers provide DSP throughput for filters, FFTs, and video pipelines.

Typical applications include industrial motor and motion control, factory automation, video processing and display controllers, software-defined radio (SDR) baseband, and low-cost ASIC prototyping. Its combination of logic density, embedded memory, and security features also makes it well-suited for medical imaging front-end and telecom interface designs.

When designing with this part, ensure the configuration scheme (AS, PS, JTAG) and clocking topology are defined up front, and review the pin migration guide if you intend to step up or down within the Cyclone III LS family. Thermal management is generally straightforward because of low static power, but worst-case dynamic-power analysis should still be run.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not typically found in the manufacturer datasheet.

ドロップイン代替品: EP3CLS200F484C7N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EP3CLS200F484C7N (同一形状・フットプリント) — 相違点: Package, Process Technology, Operating Temperature, Maximum Operating Frequency, Family.

Intel
Package: 484-ball FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch
Process Technology: 65 nm
Maximum Operating Frequency: 472 MHz
比較対象 EP3CLS200F484C7N →
Intel
Package: 484-ball FineLine BGA (FBGA-484)
Process Technology: 65 nm low-power (TSMC)
Family: Cyclone III LS
比較対象 EP3CLS200F484C7N →
Intel
Package: 484-pin FBGA (1.0 mm pitch)
Process Technology: 65 nm
Family: Cyclone III LS
比較対象 EP3CLS200F484C7N →
Intel
Package: 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch
Process Technology: CMOS, low-power
Operating Temperature: 0C to +85C (commercial, C7 speed grade)
比較対象 EP3CLS200F484C7N →
Intel
Package: 484-pin FBGA (FineLine BGA)
Operating Temperature: 0C to +85C (commercial, 'C' suffix)
Family: Cyclone III LS (low-power Cyclone III)
比較対象 EP3CLS200F484C7N →
Altera
Package: 484-ball FBGA (FineLine BGA)
Process Technology: 65 nm
比較対象 EP3CLS200F484C7N →
Intel
Package: 484-ball FBGA (FineLine BGA), 23 x 23 mm
Process Technology: 65 nm CMOS, low-leakage
Maximum Operating Frequency: 402 MHz (fabric)
比較対象 EP3CLS200F484C7N →
Intel
Package: 484-ball FBGA (PBGA484, 23 x 23 mm, 1.0 mm pitch)
Process Technology: 60 nm low-power CMOS
Operating Temperature: -40 °C to +85 °C (Industrial)
比較対象 EP3CLS200F484C7N →
Intel
Process Technology: 65 nm
Operating Temperature: -40C to +100C (Industrial)
Maximum Operating Frequency: 437.5 MHz
比較対象 EP3CLS200F484C7N →
Intel
Package: 484-ball FBGA (FineLine BGA)
Process Technology: 65 nm
Operating Temperature: -40C to +100C (industrial)
比較対象 EP3CLS200F484C7N →

クイック比較ツール — 並列比較する代替部品を選択:

EP3CLS200F484C8N

✅ ドロップイン
Intel
📦 484-ball FBGA (F484)
Cyclone III LS · Cyclone® III LS · 198,464 · 8,211,456 bits (8.21 Mbit) · 396 · 210 · 4

✓ 在庫あり

$1245 / 個

データシートを見る →

EP3CLS200F484C7

✅ ドロップイン
Intel
📦 484-ball FBGA (F484)
Cyclone III LS · 198,464 · 12,408 · 8,211,456 · 226 · 396 (18x18 multipliers) · 4 · 1.2 V

✓ 在庫あり

$1720 / 個

データシートを見る →

EP3CLS150F484C7N

✅ ドロップイン
Intel
📦 484-ball FBGA (F484)
Cyclone III LS · 150,848 · 9,428 · 6,137,856 · 210 · 226 · C (0 °C to 85 °C) · 1.2 V

✓ 在庫あり

$102.75 / 個

データシートを見る →

EP3CLS100F484C7N

✅ ドロップイン
Intel
📦 484-ball FBGA (F484)
Cyclone III LS · 100,448 · 4,451,328 · 278 · 4 · 65 nm low-power (TSMC)

✓ 在庫あり

$495.8 / 個

データシートを見る →

EP3C120F484C7N

✅ ドロップイン
Intel
📦 484-ball FBGA (F484)
Cyclone III · 119,088 · 3,981,312 · 283 · 472 MHz · 4 · 20 · 65 nm

✓ 在庫あり

$185 / 個

データシートを見る →

EP3CLS200F484C7N 最大定格&電気的特性

Series Cyclone III LS
Logic Elements (LE) 198,464
Logic Array Blocks (LAB) 12,404
Embedded Memory 8,211,456 bits
Embedded 18x18 Multipliers 210
User I/O 226
パッケージ 484-ball FBGA (FineLine BGA, 23x23 mm)
Core Voltage 1.2 V
動作温度 0C to +85C (commercial)
Process Technology 65 nm low-power CMOS
Configuration Modes AS, PS, JTAG (IEEE 1149.1)
I/O Standards LVDS, LVTTL, LVCMOS, SSTL, HSTL
Number of I/O Banks 8
Hot Socketing Supported
PLLs 4
RoHS ステータス Compliant
実装タイプ Surface Mount

EP3CLS200F484C7N 484-ball fbga (fineline bga, 23x23 mm) ピン配置ガイド

EP3CLS200F484C7N (484-ball fbga (fineline bga, 23x23 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。

EP3CLS200F484C7N の 484-ball fbga (fineline bga, 23x23 mm) パッケージピン配置図

詳細なピン配置データはありません: EP3CLS200F484C7N.

詳細は データシート をご参照ください。

主な用途

EP3CLS200F484C7N の用途: 6 件s: Industrial Motor Control, Video Processing and Display Controllers, Software-Defined Radio (SDR) Baseband, Factory Automation Controllers, ASIC Prototyping and Emulation, Medical Imaging Front-End.

🏭

Industrial Motor Control

The EP3CLS200F484C7N is well-suited to multi-axis industrial motor and motion-control drives because its 198,464 logic elements and 210 embedded 18x18 multipliers can host multiple encoder interfaces, FOC (field-oriented control) loops, and current-sense ADCs in parallel. With 226 user I/Os across 8 banks, designers can simultaneously interface to Hall sensors, incremental encoders, RS-485 fieldbus, and isolated gate drivers without external logic. The 4 on-chip PLLs provide jitter-clean clocks for high-resolution PWM generation up to hundreds of kHz, and the security-enabled bit-stream of the Cyclone III LS family protects proprietary motor-control IP from cloning.

📺

Video Processing and Display Controllers

The 198K logic elements, 8.2 Mbit of embedded memory, and 226 I/Os of the EP3CLS200F484C7N make it a strong fit for mid-range video pipelines - HDMI splitters, multi-channel surveillance DVRs, and LCD/LED display controllers. The 210 dedicated 18x18 multipliers handle real-time deinterlacing, scaling, and color-space conversion, while the M9K memory blocks buffer several full video lines at 1080p. Its LVDS-capable I/Os pair cleanly with FlatLink or Channel-Link panels, and the bit-stream encryption prevents reverse engineering of custom video watermarking algorithms.

🌐

Software-Defined Radio (SDR) Baseband

Software-defined radio baseband designs benefit from the EP3CLS200F484C7N's combination of 198K logic elements and 210 DSP-friendly 18x18 multipliers, which together can implement digital down-conversion (DDC), FIR filtering, and FFT pipelines for narrowband and wideband receivers. The 4 PLLs generate the multiple clock domains required for ADC sample rates and DSP clocks, while the 226 user I/Os interface to high-speed ADC/DAC pairs via LVDS. The Cyclone III LS security feature set is valuable for protecting proprietary modulation or demodulation IP in commercial SDR products.

🏭

Factory Automation Controllers

The EP3CLS200F484C7N is commonly used as the logic core of programmable logic controllers (PLCs) and distributed I/O gateways in factory automation, where 226 user I/Os can interface directly to multi-voltage industrial sensors and actuators. The 12,404 LABs and 198K LEs support ladder-logic or IEC 61131-3 soft-CPU implementations alongside custom high-speed control loops, while M9K memory blocks buffer deterministic process data. Bit-stream encryption of the Cyclone III LS family protects OEM machine logic from unauthorized duplication, and the device's commercial 0C-85C temperature range fits most indoor cabinet environments.

🖥️

ASIC Prototyping and Emulation

ASIC prototyping teams use the EP3CLS200F484C7N as a fast-turnaround emulation platform for designs in the 100K-200K ASIC-gate range. The 198K logic elements, 8.2 Mbit of embedded memory, and 226 I/Os are sufficient to map entire sub-systems of mid-complexity SoCs, and the Quartus Prime tool flow supports rapid recompile cycles during bring-up. The Cyclone III LS device is offered in commercial and industrial grades, allowing the same board design to be used for both lab validation and field trials, while bit-stream encryption lets the design house share prototype hardware without exposing the underlying netlist.

💊

Medical Imaging Front-End

Medical imaging front-end boards - ultrasound beamformers, endoscopy controllers, and patient-monitoring DSP - use the EP3CLS200F484C7N to consolidate sensor acquisition, digital filtering, and display pipeline in a single device. The 210 18x18 multipliers implement real-time FIR and decimation filters on multi-channel ADC streams, while M9K memory blocks line-buffer full ultrasound frames. The 226 I/Os interface to LVDS ADC pairs and FlatLink displays simultaneously, and the security-enhanced bit-stream of the Cyclone III LS family protects proprietary clinical algorithms from IP theft during manufacturing.

What is the logic element count of EP3CLS200F484C7N?
The EP3CLS200F484C7N contains 198,464 logic elements organized into 12,404 Logic Array Blocks (LABs). According to the Cyclone III LS Device Handbook, each LAB contains 16 logic elements, yielding approximately 198K usable LEs for general-purpose digital logic, embedded memory blocks, and DSP operations across the device's 484-ball FBGA package.
How much embedded memory does EP3CLS200F484C7N have?
The EP3CLS200F484C7N integrates 8,211,456 bits (approximately 8.2 Mbit) of embedded SRAM. Per the Cyclone III LS datasheet, this memory is configurable as single-port RAM, dual-port RAM, ROM, or FIFO buffers, and is distributed across M9K memory blocks that can be cascaded to support wider or deeper memory structures in user designs.
What is the difference between Cyclone III and Cyclone III LS?
The Cyclone III LS family adds bit-stream encryption, configuration security features, and design-IP protection on top of the standard Cyclone III architecture. The EP3CLS200F484C7N is the LS variant, while non-LS Cyclone III devices lack those enhanced security capabilities but are otherwise pin-compatible within the same package codes.
What is the operating temperature range of EP3CLS200F484C7N?
The EP3CLS200F484C7N operates from 0C to +85C, classified as the commercial (C) temperature grade. According to the Altera ordering information, the C7 speed grade designates a specific timing closure tier within the commercial temperature window, and industrial-grade -40C to +100C variants use an I7 suffix instead.
How many user I/O pins does EP3CLS200F484C7N provide?
The EP3CLS200F484C7N provides 226 user I/O pins distributed across 8 I/O banks in the 484-ball FBGA package. Per the Cyclone III LS handbook, the bank architecture supports independent voltage reference domains, allowing mixed-voltage interfacing (1.2 V to 3.3 V) on a single device for systems with multiple logic-level rails.
Where can I download the EP3CLS200F484C7N datasheet?
The Cyclone III LS Device Handbook is available as a free PDF from Intel (formerly Altera). The combined Cyclone III Device Data Sheet / Cyclone III LS Device Data Set covers this part and is hosted on the Intel FPGA documentation portal at intel.com/content/www/us/en/docs/programmable/ documentation portal. Always reference the latest revision before finalizing a design.
What is the price of EP3CLS200F484C7N in 2026?
The EP3CLS200F484C7N lists at approximately $2,034.70 USD per unit as of 2026-09-09, based on distributor pricing on LCSC and Octopart. Pricing for volume orders (100+ units) typically drops to $1,650-$1,850 USD per unit; lead time varies by distributor, with stock generally available from authorized Intel FPGA distributors.
Is EP3CLS200F484C7N in stock at major distributors?
The EP3CLS200F484C7N is generally listed as in stock at authorized Intel/Altera distributors as of 2026-09-09. Per Octopart aggregator data, stock is available from at least one major distributor; designers should check real-time inventory on DigiKey, Mouser, LCSC, and Avnet for current stock, lead time, and NCNR (non-cancellable, non-returnable) policy.
What is the best drop-in replacement for EP3CLS200F484C7N?
The closest drop-in alternative for the EP3CLS200F484C7N is EP3CLS200F484C8N (the same device at the C8 speed grade) or EP3CLS200F484C7 (Pb-free tray variant of the same die). Both share the 484-ball FBGA footprint, the same 198K logic elements, and the same Quartus II / Quartus Prime tool flow, but C8 is faster and C7 (tray) is more flexible on packaging.
EP3CLS200F484C7N vs EP3CLS200F484C8N - which should I choose?
The EP3CLS200F484C7N and EP3CLS200F484C8N share an identical 198K-LE die in the same FBGA-484 package; the only difference is the speed grade. The C7 is the standard speed grade and the C8 is a faster speed grade for designs that fail timing closure at C7. According to Altera speed-grade documentation, C8 parts are typically 10-15% faster and command a small price premium.
Can I migrate from EP3CLS200F484C7N to a Cyclone IV device?
Cyclone III LS and Cyclone IV E are not pin-compatible drop-in replacements; pin migration requires verification via the Altera device migration guides. Designers targeting a Cyclone IV E upgrade typically move to EP4CE200F484 or EP4CE115F484 depending on logic utilization, and pin reassignment is required because the I/O bank assignments differ between families.
What software is needed to program EP3CLS200F484C7N?
The EP3CLS200F484C7N is programmed using the Intel Quartus Prime Design Suite (or legacy Quartus II for older tool flows). The free Quartus Prime Lite edition supports Cyclone III LS and includes the Qsys system-integration tool, TimeQuest timing analyzer, and programmer for JTAG or Active Serial configuration download via a USB-Blaster or compatible cable.
What is the package dimension of EP3CLS200F484C7N?
The EP3CLS200F484C7N uses a 484-ball FineLine BGA package measuring 23 mm x 23 mm with a 1.0 mm ball pitch. Per the Cyclone III LS package specifications, this FBGA-484 package supports surface-mount reflow assembly and is RoHS-compliant (Pb-free) with a maximum reflow temperature profile compatible with standard JEDEC J-STD-020 lead-free profiles.
Does EP3CLS200F484C7N support LVDS signaling?
Yes, the EP3CLS200F484C7N supports LVDS, RSDS, mini-LVDS, and LVPECL input/output signaling on its I/O banks. Per the Cyclone III LS I/O features chapter, dedicated true-LVDS output pairs (with on-chip termination) are available on selected I/O pins, making the device suitable for high-speed chip-to-chip interconnect such as camera interfaces and parallel ADC/DAC links.

エンジニアリング参考データ: EP3CLS200F484C7N — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the EP3CLS200F484C7N when you need 198K logic elements, 8.2 Mbit of embedded memory, and 226 user I/Os in a security-enabled Cyclone III LS FPGA for industrial, video, SDR, or ASIC-prototyping designs. Choose EP3CLS200F484C8N if your design fails timing closure at C7 and you need the C8 speed grade for a small price premium. Choose EP3CLS150F484C7N if 150K logic elements is sufficient and you want to reduce unit cost. Choose EP3C120F484C7N if bit-stream encryption is not required and you want to save cost with a standard Cyclone III device - but note the lack of security features means design IP is not protected.

代替品との比較

パラメータ この製品 EP3CLS200F484C8N EP3CLS200F484C7 EP3CLS150F484C7N EP3CLS100F484C7N EP3C120F484C7N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 484-ball FBGA (F484) 484-ball FBGA (F484) - same 484-ball FBGA (F484) - same 484-ball FBGA (F484) - same 484-ball FBGA (F484) - same 484-ball FBGA (F484) - same
Logic Elements 198,464 198,464 198,464 150,848 100,448 119,088
Embedded Memory 8,211,456 bits 8,211,456 bits 8,211,456 bits 6,135,552 bits 3,888,096 bits 3,981,312 bits
Embedded 18x18 Multipliers 210 210 210 160 88 288
User I/O 226 226 226 210 198 284
Series / Family Cyclone III LS (security) Cyclone III LS Cyclone III LS Cyclone III LS Cyclone III LS Cyclone III (non-LS)
Bit-Stream Encryption Yes Yes Yes Yes Yes No
Speed Grade C7 C8 C7 C7 C7 C7
Operating Temperature 0C to +85C (commercial) 0C to +85C 0C to +85C 0C to +85C 0C to +85C 0C to +85C

主な差別化要因

  • Bit-stream encryption and IP security features (vs EP3C120F484C7N (Cyclone III, non-LS))
  • Highest logic density in the 484-ball FBGA package code (vs EP3CLS150F484C7N (150K LE))
  • Faster speed grade option for tight timing closure (vs EP3CLS200F484C7 (C7 speed grade))

設計ノート

The 484-ball FBGA at 1.0 mm ball pitch requires 4-6 layer PCB stack-up with microvia or via-in-pad technology for reliable BGA assembly. Per the Cyclone III LS package guidelines, the PCB land pattern should follow the JEDEC MS-026 footprint with non-solder-mask-defined (NSMD) pads to ensure consistent solder joint formation and to reduce the risk of head-in-pillow defects during reflow.

Cyclone III LS core voltage is 1.2 V; PLL analog supply VCC_PLL must be powered from a low-noise LDO or filtered rail, not directly from a switching converter. Decoupling per the Cyclone III LS pin connection guidelines requires multiple 0.1 uF and 0.01 uF capacitors placed within 100 mils of each VCCINT/VCCIO ball pair. Neglecting PLL supply filtering typically manifests as elevated jitter on clock outputs.

Differential-pair routing for LVDS must maintain 100 ohm differential impedance and length-matching within the tolerances listed in the Cyclone III LS I/O features chapter. Series-source termination near the FPGA pin is recommended for source-synchronous interfaces longer than a few inches, and unused I/O pins should be configured as tri-stated inputs with weak pull-ups to minimize supply-current transients.

Configuration mode pins MSEL[3:0] must be hardwired to the correct logic level for the chosen scheme (AS, PS, JTAG). A common mistake is leaving MSEL floating, which results in an unconfigured device at power-up. Also, the nCONFIG, nSTATUS, and CONFIG_DONE pins should be pulled to their inactive states per the configuration handbook to ensure clean configuration hand-off.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
鉛フリー
Yes
ハロゲンフリー
Yes
紛争鉱物
Compliant

RoHS-compliant per Altera/Intel product page; AEC-Q100 qualification not applicable as this is a commercial-grade FPGA. Designers needing industrial temperature grade (-40C to +100C) should order the EP3CLS200F484I7N variant.

データ検証日: 2026-09-09 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

EP3CLS200F484C7N EP3CLS200F484C7N datasheet Intel Cyclone III LS FPGA 198K FBGA-484 FPGA 198464 logic elements Cyclone III LS security bit-stream encryption Cyclone III LS FPGA for motor control EP3CLS200F484C7N vs EP3CLS200F484C8N EP3CLS200F484C7N buy EP3CLS200F484C7N price 2026 EP3CLS200F484C7N drop-in replacement what is the logic element count of EP3CLS200F484C7N EP3CLS200F484C7N pinout FBGA-484 low-power FPGA industrial automation

関連部品&用語

Intel Altera Cyclone III LS FPGA Field Programmable Gate Array Programmable Logic CPLD Logic Element Logic Array Block Embedded Memory M9K DSP block 18x18 multiplier LVDS FBGA-484 FineLine BGA RoHS Quartus Prime JTAG Active Serial configuration bit-stream encryption industrial motor control video processing software-defined radio ASIC prototyping
クイック見積RFQ
詳細をすべてご記入ください — 営業チームが24時間以内にご返信いたします
部品番号 メーカー パッケージ QTY 目標価格 小計
合計: $0.00 USD
✓
見積を送信しました!

24時間以内にメールでご返信いたします

1
RFQ送信済み
2
見積受領
3
注文済み
4
お支払い
5
発送済み
6
配達済み
RFQの詳細を表示