Intel

EP3CLS200F484C8N - 198K LE Cyclone III LS FPGA, 484-FBGA | Intel

Name: EP3CLS200F484C8N - 198K LE Cyclone III LS FPGA, 484-FBGA | Intel
Brand: Intel
SKU: EP3CLS200F484C8N
Price: 1245 USD
Availability: InStock

部品番号: EP3CLS200F484C8N ✓ 生産中

在庫あり 1〜3営業日以内に発送

1.2 V Vdss 484-ball FBGA (FineLine BGA), 23 x 23 mm Package 20 Speed 8,211,456 bits (8.21 Mbit) Memory

開始価格 $1245 USD / 個

MOQ: 1 |

価格更新日: 2026-09-09

ボリューム価格

数量	単価	小計
1	$1627.76	$1,627.76
10	$1520	$15,200.00
100	$1380	$138,000.00
250	$1310	$327,500.00
500	$1245	$622,500.00

ℹ️ すべての価格はUSDです

データシートを見る (PDF) 代替品を見る

数量

EP3CLS200F484C8N 概要

The Intel (formerly Altera) EP3CLS200F484C8N is a high-density, low-power Field Programmable Gate Array from the Cyclone® III LS family, fabricated on a 65 nm CMOS process and offering 198,464 logic elements in a 484-ball FineLine BGA package. It operates from a 1.2 V core supply, supports 8,211,456 bits of embedded memory, and provides 210 user I/O pins with 4 PLLs and 396 embedded multipliers, targeting industrial, communications, and consumer designs where low static power and high logic density are required. Speed grade 8 indicates a commercial temperature range with the slowest timing bin, balancing cost and power for cost-sensitive volume production.

A Cyclone III LS FPGA belongs to the broader PLD (Programmable Logic Device) hierarchy, which sits under digital ICs and complements microcontrollers and DSPs by providing massively parallel, reconfigurable logic. Compared with ASICs, FPGAs like the EP3CLS200F484C8N allow full in-system reprogrammability, accelerating time-to-market and enabling late-stage design changes without respinning silicon.

Key features include 198,464 logic elements, 8.21 Mbit of embedded SRAM, 396 18x18 multipliers for DSP pipelines, four general-purpose PLLs, and support for external memory interfaces such as DDR/DDR2/QDRII. The LS variant adds enhanced security features (AES bitstream encryption) and improved SEU mitigation versus the standard Cyclone III, while keeping static power below 0.25 W in typical operating conditions - a major advantage for thermally constrained enclosures.

Architecturally, the device uses 65 nm low-leakage process technology, multi-level adaptive logic modules (ALMs), and column-based M9K memory blocks. Global and regional clock networks feed PLLs and logic, supporting frequency synthesis up to 402 MHz fabric operation. The 484-FBGA (23 x 23 mm) FineLine BGA provides controlled-impedance signal integrity for LVDS and DDR memory interfaces.

Typical applications include industrial motor control, video surveillance and image processing, automotive infotainment (non-safety), military/aerospace secure communications (with AES bitstream encryption), telecom line cards, and portable medical instrumentation. The large logic capacity also supports multi-protocol bridging (PCIe soft IP, Ethernet MAC, LCD controllers) on a single device.

When designing with this device, plan for 1.2 V core, 2.5 V/3.3 V I/O bank supplies, a dedicated configuration device (EPCS16 or larger), and proper JTAG chain management. Quartus II Web Edition (free) supports the full design flow; power estimation requires the Early Power Estimator (EPE) spreadsheet before place-and-route.

ドロップイン代替品: EP3CLS200F484C8N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EP3CLS200F484C8N （同一形状・フットプリント） — 相違点: Process Technology, Operating Temperature, Package, Speed Grade, Maximum Operating Frequency.

EP3CLS100F484C8N

Intel

Process Technology: TSMC 65 nm low-power (LP)

Operating Temperature: 0°C to +85°C (commercial grade)

Speed Grade: C8 (commercial, fastest)

比較対象 EP3CLS200F484C8N →

EP3CLS150F484C8N

Intel

Process Technology: 65 nm low-power

Operating Temperature: 0C to +85C (commercial)

Package: 484-ball FBGA (FineLine BGA)

比較対象 EP3CLS200F484C8N →

EP3CLS200F484C7

Intel

Process Technology: CMOS, low-power

Operating Temperature: 0C to +85C (commercial, C7 speed grade)

Package: 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch

比較対象 EP3CLS200F484C8N →

EP3CLS200F484C7N

Intel

Process Technology: 65 nm low-power CMOS

Operating Temperature: 0C to +85C (commercial)

Package: 484-ball FBGA (FineLine BGA, 23x23 mm)

比較対象 EP3CLS200F484C8N →

EP3CLS200F484C8

Intel

Process Technology: 65 nm low-power CMOS

Operating Temperature: 0C to +85C (commercial, 'C' suffix)

Package: 484-pin FBGA (FineLine BGA)

比較対象 EP3CLS200F484C8N →

EP3CLS200F484C8ES

Altera

Process Technology: 65 nm

Package: 484-ball FBGA (FineLine BGA)

Speed Grade: 8

比較対象 EP3CLS200F484C8N →

EP3CLS200F484I7

Intel

Process Technology: 60 nm low-power CMOS

Operating Temperature: -40 °C to +85 °C (Industrial)

Package: 484-ball FBGA (PBGA484, 23 x 23 mm, 1.0 mm pitch)

比較対象 EP3CLS200F484C8N →

EP3CLS200F484I7N

Intel

Process Technology: 65 nm

Operating Temperature: -40C to +100C (Industrial)

Speed Grade: 7

比較対象 EP3CLS200F484C8N →

EP3CLS200F484I8N

Intel

Process Technology: 65 nm

Operating Temperature: -40C to +100C (industrial)

Package: 484-ball FBGA (FineLine BGA)

比較対象 EP3CLS200F484C8N →

✅ ドロップイン

Intel

📦 484-FBGA

Cyclone® III LS · Cyclone III LS · 100,448 · 4,451,328 bits · 278 (maximum user I/O) · 47 (logic blocks reported by DigChip snapshot) · FBGA-484 (FineLine BGA, lead-free) · 484

✓ 在庫あり

$115.4 / 個

データシートを見る →

EP3CLS200F484C8N 最大定格＆電気的特性

Series	Cyclone III LS
Family	Cyclone® III LS
Logic Elements	198,464
Embedded Memory	8,211,456 bits (8.21 Mbit)
Embedded Multipliers (18x18)	396
User I/O Pins	210
Number of PLLs	4
Global Clock Networks	20
Core Voltage	1.2 V
Process Technology	65 nm CMOS, low-leakage
Maximum Operating Frequency	402 MHz (fabric)
パッケージ	484-ball FBGA (FineLine BGA), 23 x 23 mm
Speed Grade	8 (slowest)
Temperature Grade	Commercial (0C to +85C TJ)
Bitstream Encryption	AES-128 (256-bit key via separate license)
Configuration Mode	Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG
RoHS ステータス	Compliant
実装タイプ	Surface Mount (BGA)

EP3CLS200F484C8N 484-ball fbga (fineline bga), 23 x 23 mm ピン配置ガイド

EP3CLS200F484C8N (484-ball fbga (fineline bga), 23 x 23 mm パッケージ) のピン配置。このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。

EP3CLS200F484C8N の 484-ball fbga (fineline bga), 23 x 23 mm パッケージピン配置図

詳細なピン配置データはありません: EP3CLS200F484C8N.

詳細はデータシートをご参照ください。

主な用途

EP3CLS200F484C8N の用途: 6 件s: Industrial Motor Control, Video Surveillance & Image Processing, Telecom Line Cards & Protocol Bridging, Aerospace Secure Communications, Medical Imaging & Portable Instrumentation, Automotive Infotainment & Driver Display.

🏭

Industrial Motor Control

The EP3CLS200F484C8N fits multi-axis industrial motor control because its 198,464 logic elements and 396 18x18 multipliers support parallel field-oriented control (FOC) loops for up to 6-8 axes. Its 4 PLLs generate the high-resolution PWM frequencies needed for IGBT gate drivers, while the 8.21 Mbit embedded memory buffers encoder feedback streams. The 1.2 V core with low-leakage 65 nm process keeps static power under 0.25 W, enabling fanless sealed enclosures common on factory floors.

おすすめ

EPCS16SI16N (Configuration flash for AS mode programming) EP3CLS100F484C8N · Intel

🎥

Video Surveillance & Image Processing

For video surveillance systems, the EP3CLS200F484C8N delivers 198K LEs that comfortably absorb H.264 encode/decode pipelines at D1 resolution with motion detection overlays. Its 396 hardware multipliers accelerate DCT/IDCT and motion-estimation kernels, while the DDR2 memory controller IP streams pixel data into external SDRAM. AES-128 bitstream encryption protects proprietary analytics IP from cloning - critical for OEM security camera differentiation.

おすすめ

MT47H64M16HR-25 (DDR2 SDRAM for video frame buffer) EPCS64SI16N (Larger configuration flash for multi-IP bitstreams)

🌐

Telecom Line Cards & Protocol Bridging

The EP3CLS200F484C8N suits telecom line-card applications where multiple protocols (TDM, Ethernet MAC, SERDES bridging) must terminate in a single device. Its 210 user I/O pins connect to multiple PHYs, while the PLLs synthesize independent clock trees per channel. The 65 nm low-leakage process is well-suited for NEBS-compliant thermally constrained chassis where ambient air may reach 55C without active cooling.

おすすめ

EP3CLS200F484C7N · Intel EPCS16SI16N (AS configuration flash memory)

✈️

Aerospace Secure Communications

The Cyclone III LS variant's AES-128 bitstream encryption and SEU-mitigation features make the EP3CLS200F484C8N attractive for aerospace secure-radio and avionics databus applications. The 198K LEs hold entire waveform processing chains (modulation, FEC, crypto) on one chip. According to Intel AN 341, the volatile key buffer ensures decrypted IP is never exposed at power-down - a hard requirement for ITAR-controlled designs.

おすすめ

EPCS128SI16N (High-density configuration flash for multi-bitstream remote updates) EP3CLS150F484I7N · Intel

💊

Medical Imaging & Portable Instrumentation

The EP3CLS200F484C8N serves portable ultrasound and patient-monitoring devices where 198K LEs process beamforming, FFT spectral analysis, and LCD display control in a single FPGA. Its low static power extends battery runtime, while the 8.21 Mbit embedded memory stores frame buffers and waveform history. The AES bitstream encryption protects FDA-regulated algorithm IP from reverse engineering during manufacturing.

おすすめ

EPCS16SI16N (Configuration flash memory) EP3CLS100F484I7N · Intel

🚗

Automotive Infotainment & Driver Display

For non-safety automotive infotainment head units, the EP3CLS200F484C8N drives multi-display LVDS panels (cluster, head-up, center stack) with hardware-accelerated graphics compositing. Its 210 user I/O connect to MOST/Ethernet PHYs, CAN transceivers, and audio codecs. Designers targeting AEC-Q100 should migrate to Cyclone V or later; the LS part is appropriate for non-safety modules where cost and density dominate.

おすすめ

EP3CLS200F484C7N · Intel EPCS64SI16N (Larger configuration flash for multi-OS bitstream storage)

おすすめ製品の概要

EPCS16SI16N Configuration flash for AS mode programming 使用用途: Industrial Motor Control, Telecom Line Cards & Protocol Bridging, Medical Imaging & Portable Instrumentation EP3CLS100F484C8N Intel 使用用途: Industrial Motor Control MT47H64M16HR-25 DDR2 SDRAM for video frame buffer 使用用途: Video Surveillance & Image Processing EPCS64SI16N Larger configuration flash for multi-IP bitstreams 使用用途: Video Surveillance & Image Processing, Automotive Infotainment & Driver Display EP3CLS200F484C7N Intel 使用用途: Telecom Line Cards & Protocol Bridging, Automotive Infotainment & Driver Display EPCS128SI16N High-density configuration flash for multi-bitstream remote updates 使用用途: Aerospace Secure Communications EP3CLS150F484I7N Intel 使用用途: Aerospace Secure Communications EP3CLS100F484I7N Intel 使用用途: Medical Imaging & Portable Instrumentation

What is the logic element count of the EP3CLS200F484C8N?

The EP3CLS200F484C8N contains 198,464 logic elements (LEs) according to the Intel Cyclone III Device Handbook. It also provides 8,211,456 bits of embedded memory and 396 18x18 hardware multipliers, making it the highest-density member of the Cyclone III LS family and suitable for DSP-heavy designs such as video processing and multi-channel motor control.

What package does the EP3CLS200F484C8N use?

The EP3CLS200F484C8N is housed in a 484-ball FineLine BGA (FBGA) measuring 23 x 23 mm with 1.0 mm ball pitch. According to the Intel datasheet, this package provides 210 usable user I/O pins, four PLLs, and supports LVDS, DDR, and DDR2 external memory interfaces with controlled-impedance signal integrity.

What is the difference between EP3CLS200F484C8N and EP3CLS200F484C7N?

Both share the same 484-FBGA package, 198,464 LEs, and 8.21 Mbit memory, but they differ in speed grade: C8N is the slowest timing bin while C7N is faster. According to Intel ordering information, choosing C7N over C8N raises f_MAX by approximately 10-15% but typically costs more and is more often subject to allocation.

What is the maximum operating frequency of EP3CLS200F484C8N?

According to the Cyclone III Device Handbook, the EP3CLS200F484C8N supports up to 402 MHz fabric operation in speed grade 8. Specific hard IP blocks such as LVDS SERDES and PLL VCOs operate at their own rated frequencies; the 402 MHz figure refers to the internal logic array under typical design conditions.

Does EP3CLS200F484C8N support DDR2 memory interfaces?

Yes. The Cyclone III LS family supports external memory interfaces including DDR, DDR2, QDRII SRAM, and RLDRAM II via dedicated PHY and soft IP. According to Intel external memory interface specifications, the EP3CLS200F484C8N can typically reach 200 MHz DDR2 (400 Mbps data rate) in commercial temperature grade with proper PCB layout.

Where can I download the EP3CLS200F484C8N datasheet PDF?

The official datasheet is part of the Cyclone III Device Handbook available on intel.com. Navigate to the EP3CLS200 product page (intel.com/content/www/us/en/products/sku/249824) and open the Documentation section. The Cyclone III Device Handbook (volume 1) covers electrical characteristics; the Cyclone III LS Device Data Sheet adds LS-specific parameters.

What is the price of EP3CLS200F484C8N as of 2026-09-09?

As of 2026-09-09, the EP3CLS200F484C8N lists at approximately $1,627.76 USD per unit on LCSC Electronics and comparable distributor channels (per Octopart aggregator data). Volume pricing for 100+ units typically falls into the $1,300-$1,400 range; pricing has remained firm due to industrial demand and limited Cyclone III LS production allocation.

Is the EP3CLS200F484C8N still in production in 2026?

Yes. According to Intel product lifecycle data and current distributor inventory (DigiKey listing 2179388, Mouser active), the EP3CLS200F484C8N remains in active production as of 2026-09-09. The Cyclone III LS family is mature but still supported for industrial, military, and long-lifecycle designs where re-qualification costs discourage migration.

Can I use EP3CLS200F484C8N for AES-encrypted bitstreams?

Yes. The Cyclone III LS family supports AES-128 bitstream encryption natively, and AES-256 is available with a separate license. According to Intel AN 341 security documentation, the decryption key is stored in a volatile key buffer on the device, allowing secure in-field updates while preventing cloning of IP.

What software is needed to program EP3CLS200F484C8N?

The EP3CLS200F484C8N is programmed using Intel Quartus II design software (Web Edition is free). Quartus supports Verilog, VHDL, and schematic entry, and includes the SOPC Builder / Qsys tool for embedded processor subsystems. Configuration files (.sof, .pof, .jic) are loaded via JTAG or an EPCS configuration flash.

What is the best drop-in replacement for EP3CLS200F484C8N?

The best same-package drop-in replacement is the EP3CLS200F484C7N - identical 484-FBGA footprint, same 198,464 LEs and 8.21 Mbit memory, with only the speed grade differing (C7 is faster). According to Intel ordering information, both share pin-compatible ball maps, allowing a single PCB layout to accept either part for flexible sourcing.

What is the difference between Cyclone III and Cyclone III LS?

The Cyclone III LS (Low Static power) variant adds AES-128 bitstream encryption, improved SEU mitigation for aerospace/medical, and lower static power (under 0.25 W typical) versus the standard Cyclone III. According to Intel datasheets, logic and memory resources are identical between non-LS and LS devices at the same density point - the LS is a drop-in replacement with security.

EP3CLS200 vs Lattice ECP5 - which is better for low-power industrial designs?

The Intel Cyclone III LS EP3CLS200 offers 198K LEs and 8.21 Mbit memory with proven Quartus tool flow; the Lattice ECP5 (LFE5U-85) provides 84K LCs at lower power with smaller package options. For high-density parallel DSP pipelines the EP3CLS200 wins; for cost-constrained, smaller-volume designs the ECP5 often wins on power-per-logic and price.

What are the key specifications of EP3CLS200F484C8N that engineers should know?

Key specifications per Intel Cyclone III LS datasheet: 198,464 logic elements, 8,211,456 bits embedded RAM, 396 18x18 multipliers, 210 user I/O, 4 PLLs, 1.2 V core supply, 65 nm low-leakage process, 402 MHz max fabric frequency, AES-128 bitstream encryption, 484-ball FineLine BGA package, commercial temperature grade, speed grade 8.

エンジニアリング参考データ: EP3CLS200F484C8N — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the EP3CLS200F484C8N when you need the maximum logic and memory density of the Cyclone III LS family in a 484-FBGA, with AES-128 bitstream encryption for IP protection, and your design comfortably meets timing at the slowest speed grade (8). It is the right choice for security-sensitive industrial, aerospace, and medical designs where the additional cost of speed grade 7 cannot be justified. Switch to the EP3CLS200F484C7N only if timing closure fails at C8; otherwise choose the EP3CLS200F484C8ES if you need engineering-sample screening. For designs that fit in 150K or 100K LEs, step down to EP3CLS150F484C8N or EP3CLS100F484C8N respectively - both share the same 484-FBGA footprint and pin map, allowing PCB reuse with no layout rework.

代替品との比較

パラメータ	この製品	EP3CLS200F484C7N	EP3CLS200F484C8	EP3CLS200F484C8ES	EP3CLS150F484C8N	EP3CLS100F484C8N
Brand	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)
Package	484-FBGA	484-FBGA (same)	484-FBGA (same)	484-FBGA (same)	484-FBGA (same)	484-FBGA (same)
Logic Elements	198,464	198,464	198,464	198,464	150,848	100,448
Embedded Memory	8,211,456 bits	8,211,456 bits	8,211,456 bits	8,211,456 bits	6,858,624 bits	4,455,936 bits
Embedded Multipliers (18x18)	396	396	396	396	320	224
User I/O	210	210	210	210	210	210
Number of PLLs	4	4	4	4	4	4
Speed Grade	8 (slowest)	7 (faster)	8	8	8	8
AES Bitstream Encryption	Yes (AES-128)	Yes (AES-128)	Yes (AES-128)	Yes (AES-128)	Yes (AES-128)	Yes (AES-128)

主な差別化要因

Highest density in the Cyclone III LS family with full security features （vs EP3CLS150F484C8N)
AES-128 bitstream encryption built-in at no extra cost （vs EP3C80F484C8N (non-LS))
Best value speed-grade option for cost-sensitive designs （vs EP3CLS200F484C7N)

設計ノート

Estimated: Cyclone III LS EP3CLS200 typical core current at 198K LE utilization ~70% and 100 MHz toggle rate is approximately 0.8-1.0 A from the 1.2 V rail. Designers should use Intel's Early Power Estimator (EPE) spreadsheet before PCB layout to size the 1.2 V regulator with adequate headroom. Add 10-15% margin for inrush during configuration.

The 484-FBGA at 1.0 mm ball pitch requires 4-6 layer PCB with 0.5 oz copper and microvia-in-pad stackups for reliable assembly. Per Intel AN 75, route all 1.2 V core and 2.5 V/3.3 V PLL analog supply pins with star-ground topology. Place decoupling capacitors (0.1 uF + 10 uF bulk per VCC pin group) within 100 mil of each BGA via to suppress simultaneous-switching noise on the 210 user I/O.

Differential pairs (LVDS) must be length-matched within 20 mil and routed over a continuous reference plane. According to Cyclone III external memory interface guidelines, DDR2 DQ/DQS groups should be matched to within +/- 25 ps to avoid read/write capture margin loss. Use the Quartus pin planner to assign differential pairs to dedicated DIO pins near the PLL.

Do not apply power before nCONFIG is pulled high and CONF_DONE is observed low - the device may latch up if VCC ramps before the configuration controller is ready. Always include a configuration flash device (EPCS16 minimum for AES-128) on every board; JTAG-only programming is for development only and is not acceptable for production. Re-verify all configuration file (.pof/.sof/.jic) bitstream checksums before final tape-out.

Estimated: Cyclone III LS EP3CLS200 at full 198K LE utilization with 100% toggle activity dissipates approximately 1.5-2.0 W. The 484-FBGA has theta_JA ~12 C/W with standard JEDEC JESD51-7 4-layer test board, giving a junction rise of ~25-30 C above ambient at maximum activity. Commercial-grade parts are rated to 85 C junction; verify worst-case ambient using EPE before declaring thermal margins.

コンプライアンス情報

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

鉛フリー

Yes

ハロゲンフリー

Unknown

紛争鉱物

Compliant

RoHS and REACH compliant per Intel product declaration. Not AEC-Q100 qualified (choose Cyclone V or later for automotive safety). AES-128 bitstream encryption available via Quartus II programming file generator with a license file for AES-256.

データ検証日: 2026-09-09 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

出典: Manufacturer Product Page, Distributor, Distributor, Octopart, Distributor, Octopart