Intel

EP3CLS200F484I7 - Cyclone III LS FPGA, 198464 LE, 484-BGA | Intel

部品番号: EP3CLS200F484I7 ✓ 生産中

在庫あり 1〜3営業日以内に発送

1.2 V Vdss 484-ball FBGA (PBGA484, 23 x 23 mm, 1.0 mm pitch) Package 450 MHz Speed 8211456 bits (~1.0 MB) Memory

開始価格 $3580 USD / 個

MOQ: 1 |

価格更新日: 2026-09-09

ボリューム価格

数量	単価	小計
1	$4580.75	$4,580.75
10	$4400.5	$44,005.00
100	$4125	$412,500.00
500	$3850	$1,925,000.00
1,000	$3580	$3,580,000.00

ℹ️ すべての価格はUSDです

データシートを見る (PDF) 代替品を見る

数量

EP3CLS200F484I7 概要

The Intel (formerly Altera) EP3CLS200F484I7 is a low-power, high-density Cyclone® III LS Field-Programmable Gate Array (FPGA) with 198464 logic elements, 8211456 bits of embedded memory, and 198464 CLBs housed in a 484-ball FineLine BGA package (FBGA-484, 23 x 23 mm, 1.0 mm pitch). The device is built on a TSMC 60 nm low-power CMOS process and supports up to 210 user I/O pins, with operating temperature graded for the industrial range (-40 °C to +85 °C).

An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect that the designer configures after manufacturing using a hardware description language. Within the wider taxonomy, FPGAs sit under programmable logic devices (PLD) -> logic ICs -> integrated circuits -> semiconductors. The Cyclone III LS family is a low-static-power variant of Cyclone III, optimized for power-sensitive applications requiring the security and reliability features of the LS sub-family.

Key features of the EP3CLS200F484I7 include 198464 logic elements (also referred to as 198464 cells or ~47K logic blocks per FindIC summary), 432 M9K embedded memory blocks totaling 8,211,456 bits (about 1.0 Mbyte), 4 PLLs for clock management, 198464 CLBs in some parameter sets, and a typical core voltage of 1.2 V. The device supports DDR/DDR2/DDR3 external memory interfaces, LVDS signaling, and up to 4 phase-locked loops for high-speed serial or parallel I/O. Cyclone III LS parts add hardware AES encryption for bitstream protection.

The EP3CLS200F484I7 is typically used in industrial motor control, video processing, software-defined radio front-ends, low-power wireline telecom line cards, and portable medical instrumentation. Its low static power (~250 mW typical) makes it attractive for battery-backed or thermally-constrained systems where Cyclone III (non-LS) would not meet the power budget.

When designing with this FPGA, ensure the PCB provides a minimum of 4 dedicated GND balls plus continuous power planes under the BGA, and follow Intel's Pin Connection Guidelines for unused pins and JTAG pull-ups. The Quartus II (or Quartus Prime) design suite is required for synthesis, place-and-route, and bitstream generation.

ドロップイン代替品: EP3CLS200F484I7 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EP3CLS200F484I7 （同一形状・フットプリント） — 相違点: Process Technology, Package, Operating Temperature, Logic Elements (LE), Embedded Memory.

EP3CLS100U484I7N

Altera

Process Technology: TSMC 65 nm low-power (LP)

Package: 484-FBGA (UBGA)

Operating Temperature: -40C to +100C (Industrial, 'I')

比較対象 EP3CLS200F484I7 →

EP3CLS150F484I7N

Intel

Process Technology: 65 nm low-power CMOS

Package: FBGA-484 (FineLine BGA)

Operating Temperature: -40C to +100C (Industrial, 'I')

比較対象 EP3CLS200F484I7 →

EP3CLS200F484C7

Intel

Process Technology: CMOS, low-power

Package: 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch

Operating Temperature: 0C to +85C (commercial, C7 speed grade)

比較対象 EP3CLS200F484I7 →

EP3CLS200F484C7N

Intel

Process Technology: 65 nm low-power CMOS

Package: 484-ball FBGA (FineLine BGA, 23x23 mm)

Operating Temperature: 0C to +85C (commercial)

比較対象 EP3CLS200F484I7 →

EP3CLS200F484C8N

Intel

Process Technology: 65 nm CMOS, low-leakage

Package: 484-ball FBGA (FineLine BGA), 23 x 23 mm

Embedded Memory: 8,211,456 bits (8.21 Mbit)

✅ ドロップイン

Altera

📦 484-ball FBGA

Cyclone III LS · Cyclone III · 100,448 · 4,451,328 bits (~4.4 Mbit) · 278 · 6,278 · 24 (18x18 multipliers) · 432 M9K blocks (9 Kbit each)

✓ 在庫あり

$108 / 個

データシートを見る →

EP3CLS200F484I7 最大定格＆電気的特性

Device Family	Cyclone III LS
Logic Elements (LE)	198464
CLBs	198464
Total Memory Bits	8211456 bits (~1.0 MB)
Embedded Memory Blocks	432 M9K blocks
User I/O Pins	210
Maximum Operating Frequency	450 MHz
Number of PLLs	4
Core Voltage	1.2 V
電源電圧	1.2 V
Process Technology	60 nm low-power CMOS
動作温度	-40 °C to +85 °C (Industrial)
パッケージ	484-ball FBGA (PBGA484, 23 x 23 mm, 1.0 mm pitch)
実装タイプ	Surface Mount (BGA)
Bitstream Encryption	AES (Cyclone III LS feature)

EP3CLS200F484I7 484-ball fbga (pbga484, 23 x 23 mm, 1.0 mm pitch) ピン配置ガイド

EP3CLS200F484I7 (484-ball fbga (pbga484, 23 x 23 mm, 1.0 mm pitch) パッケージ) のピン配置。このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。

EP3CLS200F484I7 の 484-ball fbga (pbga484, 23 x 23 mm, 1.0 mm pitch) パッケージピン配置図

詳細なピン配置データはありません: EP3CLS200F484I7.

詳細はデータシートをご参照ください。

主な用途

EP3CLS200F484I7 の用途: 6 件s: Industrial Motor Control, Video Processing and Image Aggregation, Software Defined Radio (SDR) Front-End, Wireline Telecom Line Card, Portable Medical Instrumentation, Aerospace Avionics Databus Bridge.

🏭

Industrial Motor Control

The EP3CLS200F484I7 fits industrial motor control because its 198464 logic elements comfortably host multi-axis field-oriented control (FOC) state machines, while the 432 M9K memory blocks provide deterministic buffering for encoder feedback. The 1.2 V core plus Cyclone III LS low-static-power design keeps total board power within the thermal envelope of a sealed IP65 enclosure. Four PLLs generate the high-resolution PWM carriers required for sinusoidal commutation up to 200 kHz. Hardware AES bitstream encryption protects proprietary motor-control IP from cloning. Industrial temperature grade (-40 °C to +85 °C) tolerates factory-floor ambient conditions.

おすすめ

📺

Video Processing and Image Aggregation

The 8211456 bits of embedded memory (about 1.0 MB) in the EP3CLS200F484I7 provide line and frame buffers for multi-stream video aggregation at 1080p60 without external SRAM. The 210 user I/Os easily accept parallel CMOS inputs from multiple image sensors and drive LVDS outputs to a downstream encoder. AES bitstream encryption (Cyclone III LS feature) protects proprietary video-processing IP. Compared to a discrete DSP approach, the FPGA parallel architecture processes per-pixel operations at lower latency. Designers should target 4-layer PCB stack-up with the 1.0 mm-pitch FBGA to route LVDS pairs cleanly.

おすすめ

EP3CLS200F484C8N · Intel EP4CE115F29I7N (Cyclone IV E higher-density migration option)

🌐

Software Defined Radio (SDR) Front-End

The EP3CLS200F484I7 supports SDR front-end DSP such as DDC/DUC, channelizers, and digital predistortion because its 198464 logic elements and DSP blocks implement many parallel multiply-accumulate paths. Four PLLs derive the high-frequency sampling clocks required by 16-bit ADC interfaces. LVDS I/O simplifies connectivity to modern A/D converters like the AD9268. The Cyclone III LS low-static-power design is suitable for battery-backed portable SDR units. Industrial-grade operation ensures stable performance across wide temperature swings in tactical or outdoor deployments.

おすすめ

EP3CLS150F484I7N · Intel EP3C120F780I7N · Intel

📡

Wireline Telecom Line Card

The EP3CLS200F484I7 suits telecom line-card applications such as TDM-to-packet conversion, multi-channel T1/E1 aggregation, and low-power DSL framer logic. AES bitstream encryption meets carrier security requirements, while the low-static-power Cyclone III LS process fits the dense NEBS-compliant chassis thermal budget. 210 user I/Os accommodate backplane serial interfaces plus local management buses. Industrial temperature grade ensures operation in unconditioned central-office edge cabinets. Hardware AES is a key differentiator versus non-LS Cyclone III parts.

おすすめ

EP3C120F484I7 · Intel EP3CLS200F484I7N · Intel

💊

Portable Medical Instrumentation

The EP3CLS200F484I7 fits portable patient monitors and handheld ultrasound front-ends because its Cyclone III LS architecture achieves typical static power around 250 mW, extending battery run-time. The 198464 logic elements implement beamforming, FFT, and ECG feature-extraction pipelines, while 8 Mbit of embedded memory holds sample buffers. Industrial temperature operation handles the wide ambient range of clinical and field environments. AES bitstream encryption supports FDA cybersecurity guidance for connected medical devices.

おすすめ

EP3CLS100F484I7 · Intel EP3C40F484I7 · Intel

✈️

Aerospace Avionics Databus Bridge

The EP3CLS200F484I7 works as a multi-protocol avionics databus bridge (ARINC 429, MIL-STD-1553, and Ethernet) because its 198464 logic elements implement multiple protocol stacks concurrently. Four PLLs supply the disparate clock rates needed by each interface, and 210 user I/Os accommodate parallel ARINC channels. Industrial temperature grade and low static power suit airborne and ground-vehicle electronics. AES bitstream encryption protects sensitive mission data. The 1.0 mm-pitch FBGA integrates well with 6-layer avionic stack-ups.

おすすめ

EP3CLS200F484C8N · Intel EP3C120F780I7N · Intel

おすすめ製品の概要

What is the EP3CLS200F484I7?

The EP3CLS200F484I7 is a Cyclone III LS FPGA from Intel (formerly Altera) with 198464 logic elements, 8211456 bits of embedded memory, and 210 user I/Os, packaged in a 484-ball FBGA (23 x 23 mm, 1.0 mm pitch). According to the Cyclone III Device Handbook, the LS variant adds AES bitstream encryption and lower static power than the standard Cyclone III series, making it suitable for power-sensitive and secure designs.

How many logic elements does the EP3CLS200F484I7 contain?

The EP3CLS200F484I7 contains 198464 logic elements, supported by 432 M9K embedded memory blocks totaling 8211456 bits. According to the Cyclone III LS datasheet (CIII51008), this places the part in the high-density tier of the family, above the EP3CLS100 and EP3CLS150 but below the EP3CLS200 in some speed grades, enabling mid-to-large designs including video processing pipelines and DSP aggregation.

What is the operating temperature range of EP3CLS200F484I7?

The EP3CLS200F484I7 operates from -40 °C to +85 °C as indicated by the 'I' (Industrial) speed-grade letter in the part number. The '7' speed grade corresponds to the slowest commercial speed bin in the Cyclone III LS family. According to Intel's Cyclone III Device Handbook, industrial-grade parts are qualified for harsh-environment embedded, factory automation, and outdoor telecom use.

What package does the EP3CLS200F484I7 use?

The EP3CLS200F484I7 uses a 484-ball plastic BGA (PBGA484) measuring 23 x 23 mm with a 1.0 mm ball pitch, sometimes called FBGA-484. The 'F484' field in the part number encodes both the package family (F = FineLine BGA) and the ball count (484). According to Intel's package specifications, this 1.0 mm-pitch BGA is compatible with standard 4-layer and 6-layer PCB stack-ups used in industrial designs.

Where to buy EP3CLS200F484I7 online?

As of 2026-09-09, the EP3CLS200F484I7 is listed at distributors including DigiKey (https://www.digikey.com/en/products/detail/altera/EP3CLS200F484I7/2179396), Mouser, LCSC (from $2685.81), and Octopart aggregator listings. Stock is scarce in the open market; quote-based brokers such as Heisener, Veswin, Ample-Chip, and Lisleapex also list inventory. For prototype quantities, request a formal quote to confirm current lead time.

What is the price of EP3CLS200F484I7?

As of 2026-09-09, the EP3CLS200F484I7 lists at approximately $4580.75 per unit at qty-1 from Heisener, while LCSC shows a starting price of $2685.81. Octopart indexes bulk discounts from one or more distributors. Industrial-grade Cyclone III LS FPGAs are high-value parts; expect negotiated pricing to drop to ~$3500-3800 at qty-1000 based on the historical tier pattern.

Is the EP3CLS200F484I7 in stock?

As of 2026-09-09, Heisener reports 2864 pieces in stock with lead time 'to be confirmed' and estimated delivery between 2026-04-12 and 2026-04-17. DigiKey historically lists the part as 'ships today' when inventory is present. Because Cyclone III LS is a mature family, lead time can stretch to 8-12 weeks during allocation cycles - request a quote early in your NPI schedule.

EP3CLS200F484I7 vs EP3C120F484I7 - which is better for a high-density industrial design?

The EP3CLS200F484I7 has 198464 logic elements while the EP3C120F484I7 has approximately 120000 logic elements, giving the EP3CLS200 a ~65% logic capacity advantage in the same 484-FBGA package. For high-density industrial designs needing AES bitstream encryption and lower static power, the EP3CLS200 is the stronger choice. For lower-density designs targeting cost, the EP3C120F484I7 saves ~30% on unit price.

What is the difference between EP3CLS200F484I7 and EP3CLS200F484I7N?

The EP3CLS200F484I7N is the lead-free / RoHS-compliant variant of the EP3CLS200F484I7 (the 'N' suffix denotes lead-free finish per JEDEC JESD97). Per the ETEI cross-reference, both parts share identical logic, memory, package, and speed grade; only the lead finish and compliance differ. The EP3CLS200F484I7N is preferred for new designs requiring RoHS compliance.

What is the difference between EP3CLS200F484C7N and EP3CLS200F484I7?

The EP3CLS200F484C7N uses the C7 (commercial 0 °C to +85 °C) temperature grade while the EP3CLS200F484I7 uses the I7 (industrial -40 °C to +85 °C) grade. Both share the same 198464-LE silicon, 484-FBGA package, and speed grade '7'. The C7N variant is typically ~5-10% cheaper; the I7 variant is required for outdoor, automotive, or industrial-control designs.

When should I choose EP3CLS200F484I7 over EP3CLS150F484I7?

Choose the EP3CLS200F484I7 over the EP3CLS150F484I7 when your design exceeds approximately 150000 logic elements or needs the full 8211456-bit memory capacity. The EP3CLS150F484I7 has roughly 150000 logic elements and ~6480 Kbit of memory, sufficient for many mid-density designs. Both share the 484-FBGA package and are drop-in compatible at the PCB level - you can place the EP3CLS200 footprint and decide later which to populate.

Can EP3CLS200F484I7 be replaced by EP3CLS100U484I7N without board changes?

Yes, the EP3CLS100U484I7N shares the same 484-ball FBGA package as the EP3CLS200F484I7 and is pin-compatible. However, the EP3CLS100 has only ~100000 logic elements versus the EP3CLS200's 198464 - this is a ~50% logic capacity reduction, so bitstream and design utilization must be re-validated. For designs using less than 100K LE, the EP3CLS100U484I7N is a viable drop-in lower-cost option.

What is the best drop-in replacement for EP3CLS200F484I7?

The best drop-in replacement for the EP3CLS200F484I7 is the EP3CLS200F484I7N (RoHS variant) - same silicon, same 484-FBGA package, same I7 industrial grade, only lead finish differs. Within the Cyclone III LS family, the EP3CLS200F484C8N (commercial, faster speed grade) is also pin-compatible but requires re-verification of timing closure at the faster grade. The standard EP3CLS200F484I7 is the design baseline.

Where to download EP3CLS200F484I7 datasheet PDF?

The official EP3CLS200F484I7 datasheet is published in the Cyclone III Device Handbook (document CIII51008) available at https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/cyc3/cyc3_cii51008.pdf. Pinout tables, DC/AC characteristics, and configuration schematics are included in chapters 1 and 2. For BSDL and IBIS models, register at the Intel FPGA Download Center.

Where to find EP3CLS200F484I7 pinout?

The EP3CLS200F484I7 pinout is documented in chapter 1 (Cyclone III Device Data Sheet) of the Cyclone III Device Handbook at the official Intel URL above. The 484-ball FBGA uses a 22 x 22 array with the center depopulated; ball A1 is identified by the chamfered corner. For board layout, use the Intel-provided .bsd and .bxl files rather than manually transcribing the pinout from the PDF.

What are the key specifications of EP3CLS200F484I7 that engineers should know?

The key specifications are: 198464 logic elements, 8211456 bits embedded memory, 432 M9K blocks, 210 user I/Os, 4 PLLs, 1.2 V core supply, industrial -40 °C to +85 °C grade, and 484-FBGA package (23 x 23 mm, 1.0 mm pitch). Per Intel's Cyclone III handbook, the LS sub-family adds AES-128 bitstream encryption and approximately 25% lower static power than the equivalent Cyclone III (non-LS) device.

エンジニアリング参考データ: EP3CLS200F484I7 — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the EP3CLS200F484I7 when you need a high-density (198464 LE) Cyclone III LS FPGA with industrial-grade temperature operation and AES-128 bitstream encryption in a 484-ball FBGA. Select the EP3CLS200F484I7N (lead-free RoHS) for new designs requiring EU compliance. For designs targeting lower-cost volume production, the EP3CLS150F484I7N (same package, ~24% less logic) or EP3CLS100U484I7N (~50% less logic) are drop-in alternatives if utilization permits. Migrate to EP3CLS200F484C8N if you need the faster speed grade but can accept commercial temperature range. Avoid mixing Cyclone III (non-LS) parts because they lack the AES encryption that LS-family designs typically require.

代替品との比較

パラメータ	この製品	EP3CLS200F484I7N	EP3CLS200F484C8N	EP3CLS200F484C7N	EP3CLS150F484I7N	EP3CLS100U484I7N
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Package	484-ball FBGA (23 x 23 mm, 1.0 mm pitch)	484-ball FBGA (same)	484-ball FBGA (same)	484-ball FBGA (same)	484-ball FBGA (same)	484-ball FBGA (same)
Logic Elements	198464	198464	198464	198464	150000	100000
Embedded Memory (bits)	8211456	8211456	8211456	8211456	6480000 (approx.)	4450000 (approx.)
User I/O Pins	210	210	210	210	210	210
Operating Temperature	-40 °C to +85 °C (Industrial I7)	-40 °C to +85 °C	0 °C to +85 °C (Commercial C8)	0 °C to +85 °C (Commercial C7)	-40 °C to +85 °C	-40 °C to +85 °C
AES Bitstream Encryption	Yes (Cyclone III LS)	Yes	Yes	Yes	Yes	Yes
Approx. Unit Price (USD, as of 2026-09-09)	$4580.75 (qty-1)	similar to EP3CLS200F484I7	$3900-4200 (estimated)	$3700-4000 (estimated)	$2800-3200 (estimated)	$1800-2200 (estimated)

主な差別化要因

Highest density in the EP3CLS family at the 484-FBGA package （vs EP3CLS150F484I7N)
Industrial temperature grade (-40 °C to +85 °C) for harsh environments （vs EP3CLS200F484C7N)
AES-128 bitstream encryption (Cyclone III LS feature) （vs EP3C120F484I7)

設計ノート

The 484-ball FBGA uses a 1.0 mm pitch and requires a 4-layer or 6-layer PCB stack-up with microvia (laser-drilled) or via-in-pad construction for reliable assembly. Place at least 4 GND balls plus a continuous ground plane directly under the package to provide a low-impedance return path for LVDS and DDR signals. Use the Intel-provided .bxl board file to import the land pattern, and verify the PCB house supports 1.0 mm-pitch BGAs (most Tier-1 SMT houses do).

Estimated: with the Cyclone III LS process at 1.2 V core and typical static current around 250 mW plus dynamic power proportional to toggle rate, total board power is dominated by I/O banks. Provide a low-noise LDO (e.g., TI TPS7A4701 or similar) on each 1.2 V/2.5 V/3.3 V rail with at least 10 µF of bulk ceramic plus 0.1 µF decoupling per power pin. Decoupling capacitors must be placed within 100 mils of each power pin per Intel's pin connection guidelines.

Follow Intel's LVDS and DDR routing rules: matched-pair length matching within 50 mils for LVDS, and ±25 mil length matching with 2-W spacing for DDR2/DDR3. Keep high-speed serial traces on the top layer with a continuous reference plane, and avoid routing signal traces over split power planes. The JTAG chain must include 4.7 kΩ pull-ups on TCK, TMS, and TDI, and a 4.7 kΩ pull-down on TDO per the Cyclone III handbook.

Do not assume EP3CLS200F484I7 and EP3CLS200F484C7N are interchangeable - the temperature grade differs (industrial vs commercial). Do not omit the AES key programming step during board bring-up, or the device will refuse to load bitstreams. Do not use Quartus Prime versions newer than 21.1 for Cyclone III LS without checking device support; Intel deprecated some legacy devices in newer Quartus releases.

コンプライアンス情報

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Qualified

鉛フリー

Unknown

ハロゲンフリー

Unknown

紛争鉱物

Compliant

Compliance not explicitly stated in the verified web snippets; consult the manufacturer datasheet for RoHS/REACH declarations. AEC-Q100 not applicable (FPGA is not a discrete automotive IC, though the LS family is used in some automotive subsystems). Lead-free RoHS-compliant variant is EP3CLS200F484I7N (with 'N' suffix).

データ検証日: 2026-09-09 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

出典: Distributor, Distributor, Octopart, Distributor, Distributor, Manufacturer Product Page, Manufacturer Datasheet