EP3CLS70F484C8N - Cyclone III LS FPGA 70K LE FBGA-484 | Intel
部品番号: EP3CLS70F484C8N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $81.2 | $812.00 |
| 100 | $72.45 | $7,245.00 |
| 500 | $64.1 | $32,050.00 |
| 1,000 | $56.8 | $56,800.00 |
EP3CLS70F484C8N 概要
What is a Cyclone III LS FPGA? The Cyclone III LS family is a variant of Intel's Cyclone III low-power FPGA series with enhanced security features (AES-256 bitstream encryption) and reduced static power, making it suitable for battery-powered or thermally-constrained products. Within the broader taxonomy, FPGAs sit alongside ASICs and microcontrollers as reconfigurable digital logic devices; Cyclone III LS specifically belongs to the low-cost, low-power segment below Cyclone IV/V and Intel Cyclone 10.
Key features include 4,388 LABs (logic array blocks), 247 DSP blocks (18x18 multipliers), four phase-locked loops (PLLs), 278 maximum user I/Os, and 20 global clock networks. The LS suffix adds hardware AES-256 bitstream encryption and JTAG-based configuration, plus 2 Mb of on-chip configuration memory that supports passive serial (PS), fast passive parallel (FPP), and JTAG configuration modes. Compared to the standard Cyclone III EP3C70, the LS variant typically reduces static current by 50-70% in idle states while preserving the same logic and DSP resources.
Typical applications include industrial motor control, low-power video processing, portable medical instrumentation, handheld test equipment, automotive infotainment, and secure communications front-ends. The wide operating temperature range (industrial -40C to +100C junction, commercial 0C to +85C ambient) and the 484-pin FBGA's modest 23x23 mm footprint suit compact embedded boards where board area and power budget are tightly constrained.
Designers should note that the FBGA-484 package requires X-ray inspection for solder-joint verification and that the device must be configured by an external flash or CPLD at power-up. For new designs, engineers often evaluate Cyclone IV E (EP4CE series) or Cyclone 10 LP as modern alternatives with longer lifecycle, but the EP3CLS70 remains a drop-in choice for existing boards with validated firmware.
This page synthesizes real distributor pricing, drop-in alternatives from Intel's Cyclone III LS family, and practical FPGA design considerations not consolidated on the manufacturer datasheet alone.
ドロップイン代替品: EP3CLS70F484C8N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3CLS70F484C8N （同一形状・フットプリント） — 相違点: Process Technology, Package, Bitstream Encryption, Configuration Mode, Embedded Memory Bits.
クイック比較ツール — 並列比較する代替部品を選択:
EP3CLS100F484C8N
✅ ドロップイン✓ 在庫あり
$115.4 / 個
データシートを見る →EP3CLS50F484C8N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP3CLS70F484I8N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP3CLS70F484C7N
✅ ドロップイン✓ 在庫あり
$96.3 / 個
データシートを見る →EP3C70F484C8N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP3CLS200F484C8N
✅ ドロップイン✓ 在庫あり
$1245 / 個
データシートを見る →EP3CLS70F484C8N 最大定格＆電気的特性
| Family | Cyclone III LS |
| Device Logic Elements (LEs) | 70,208 |
| Logic Array Blocks (LABs) | 4,388 |
| Embedded Memory Bits | 3,068,928 bits (approx. 2,997 Kbit) |
| DSP Blocks (18x18 Multipliers) | 247 |
| Maximum User I/Os | 278 |
| Phase-Locked Loops (PLLs) | 4 |
| Global Clock Networks | 20 |
| Core Supply Voltage | 1.2 V |
| Process Technology | 65 nm TSMC low-power |
| パッケージ | 484-ball FBGA (FineLine BGA), 23x23 mm |
| 動作温度 | Commercial 0C to +85C (C8 grade) |
| Speed Grade | 8 (slowest commercial) |
| Configuration Modes | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |
| Bitstream Encryption | AES-256 (LS family feature) |
| RoHS ステータス | Compliant |
EP3CLS70F484C8N 484-ball fbga (fineline bga), 23x23 mm ピン配置ガイド
EP3CLS70F484C8N (484-ball fbga (fineline bga), 23x23 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP3CLS70F484C8N.
詳細は データシート をご参照ください。
主な用途
EP3CLS70F484C8N の用途: 7 件s: Industrial Motor Control, Portable Medical Instrumentation, Low-Power Video Processing, Secure Communications Front-End, Automotive Infotainment, Handheld Test and Measurement, Industrial IoT Edge Gateway.
Industrial Motor Control
The EP3CLS70F484C8N is well matched to multi-axis industrial motor control, where its 247 DSP blocks and 70,208 LEs can host field-oriented control (FOC) loops for three or more axes simultaneously, while the AES-256 bitstream encryption protects proprietary control IP. The 278 user I/Os accept quadrature encoder inputs, PWM outputs, and gate-driver enable signals without external logic, and the LS variant's low static current keeps cabinet thermal load manageable. Designers typically instantiate one Nios II soft-core for housekeeping plus dedicated HDL blocks for current loops, achieving sub-microsecond current-loop update rates at 100 MHz system clock.
おすすめ
Portable Medical Instrumentation
Battery-powered medical devices such as handheld ultrasound, patient monitors, and point-of-care analyzers benefit from the EP3CLS70F484C8N's low static power and 1.2 V core supply, which together extend runtime on a single Li-ion charge by 30-50% versus the standard Cyclone III. The 247 DSP blocks accelerate FFT-based signal processing for ECG/EEG front-ends, and the 278 I/Os handle multi-channel ADC data, display interfaces, and wireless module connections. AES-256 encrypted bitstreams are increasingly required to satisfy FDA cybersecurity guidance for connected medical devices.
おすすめ
Low-Power Video Processing
Mid-resolution video pipelines (D1, 720p) at modest frame rates can run entirely in the EP3CLS70F484C8N's logic and 3 Mbit of embedded RAM, eliminating an external frame buffer for many designs. The 247 DSP blocks handle real-time motion estimation, color-space conversion, and scaling, while the 278 user I/Os accept parallel video from CMOS sensors and drive LCD panels directly. Cyclone III LS's reduced static current is particularly valuable in always-on surveillance cameras that run from PoE or solar power.
おすすめ
Secure Communications Front-End
Defense and industrial secure-radio front-ends use the EP3CLS70F484C8N to implement baseband processing, encryption accelerators, and protocol stacks, with the AES-256 bitstream encryption preventing firmware extraction from tampered units. The 70,208 LEs support a Nios II/f core plus several custom DSP and crypto accelerators running concurrently, and the four PLLs generate independent sample clocks for ADC, DAC, and modem sections. The 1.2 V core keeps board-level power dissipation below 2 W typical for SWaP-C constrained platforms.
おすすめ
Automotive Infotainment
The EP3CLS70F484C8N's combination of mid-range density, low power, and automotive-qualified operating range makes it suitable for entry-level infotainment head units, instrument clusters, and rear-seat entertainment modules. Designers typically integrate a Nios II/e soft-core for OS support, custom hardware blocks for audio decoding (MP3, AAC), and CAN/LIN interfaces over the abundant user I/Os. Note that for AEC-Q100-grade applications the part should be sourced from the automotive temperature grade; the LS family is functionally compatible but not formally Q100 qualified.
おすすめ
Handheld Test and Measurement
Portable oscilloscopes, logic analyzers, and protocol testers benefit from the EP3CLS70F484C8N's ability to integrate high-speed sample capture, triggering, and display rendering in a single low-power device. The 247 DSP blocks support real-time FFT and statistical analysis, while 278 user I/Os accommodate multi-channel probe inputs, USB, Ethernet, and LCD interfaces. Cyclone III LS's low idle current is critical for battery-powered instruments that must operate for 8+ hours on a charge.
おすすめ
Industrial IoT Edge Gateway
Edge gateways aggregating Modbus, CAN, Ethernet/IP, and proprietary fieldbus protocols can use the EP3CLS70F484C8N as a protocol-translation and pre-processing engine before forwarding data to the cloud. The 70,208 LEs support multiple soft protocol stacks concurrently, AES-256 encryption secures OTA firmware updates, and the 278 I/Os interface with multiple isolated serial and Ethernet ports. Low static power allows fanless DIN-rail enclosure operation in control cabinets at up to 70C ambient.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3CLS70F484C8N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3CLS100F484C8N | EP3CLS50F484C8N | EP3CLS70F484I8N | EP3CLS70F484C7N | EP3C70F484C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-ball FBGA (23x23 mm) | 484-ball FBGA (23x23 mm) | 484-ball FBGA (23x23 mm) | 484-ball FBGA (23x23 mm) | 484-ball FBGA (23x23 mm) | 484-ball FBGA (23x23 mm) |
| Logic Elements | 70,208 | 100,448 | 50,320 | 70,208 | 70,208 | 70,208 |
| DSP Blocks | 247 | 247 | 247 | 247 | 247 | 247 |
| Embedded Memory (bits) | 3,068,928 | 3,888,000 | 2,138,880 | 3,068,928 | 3,068,928 | 3,068,928 |
| Maximum User I/Os | 278 | 278 | 278 | 278 | 278 | 278 |
| Family / Variant | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III (non-LS) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C junction) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| AES-256 Bitstream Encryption | Yes | Yes | Yes | Yes | Yes | No |
主な差別化要因
- Hardware AES-256 bitstream encryption （vs EP3C70F484C8N)
- Low static power consumption （vs EP3C70F484C8N)
- Mid-density with rich DSP and memory （vs EP3CLS50F484C8N)
設計ノート
The Cyclone III LS family uses a 1.2 V core supply that must be derived from a high-efficiency buck regulator; Linear Technology (now Analog Devices) LT3502 and TI TPS5430 are commonly used. Decoupling requires at least 12x 0.1 uF X7R 0402/0603 capacitors within 5 mm of the BGA balls, plus four 4.7 uF bulk capacitors near the corners. Estimate (assumes VIN 3.3 V, VOUT 1.2 V, IOUT 1.5 A typical): regulator efficiency 88%, so budget approximately 0.3 W of regulator loss on top of FPGA core consumption. Add a power-good signal to the nCONFIG pin for clean configuration startup.
The FBGA-484 package's theta_JA is approximately 17 C/W with a 4-layer PCB and adequate thermal vias in the center ball array. Estimated: at 1.5 W typical core dissipation and 25C ambient, junction rises 25C, giving 50C junction (well within commercial limit). For sealed enclosures without airflow, derate Icc or use the I-temperature grade. Recommended to add a thermal pad copper pour on the top layer connected through the BGA thermal balls.
The FBGA-484 has 1.0 mm ball pitch, requiring either laser-drilled microvias or 0.4 mm drilled microvias with via-in-pad plating for fanout. Use a 4- or 6-layer stackup with at least one solid ground plane directly under the device. Route all differential pairs (LVDS) with 100 ohm differential impedance and length-match within 5 mils. JTAG chain signals (TCK, TMS, TDI, TDO) must be length-matched and isolated from switching I/O; add a 10 kohm pull-up on TCK.
Do not confuse the 'F484' FBGA package with the 'U484' UBGA package - they have different footprints and pinouts despite similar ball counts. Always specify 'FBGA-484' explicitly. Configuration mode pins (MSEL0/MSEL1/MSEL2/MSEL3) must be tied to VCCIO or GND through 1 kohm resistors for the desired mode; floating MSELs cause configuration failure. For AES-256 designs, use the Quartus II 'Configuration' tool to generate the encryption key file (.ekp) and the .cof bitstream before programming the EPCS flash.
コンプライアンス情報
RoHS compliant per Intel product page. Not AEC-Q100 qualified - choose automotive temp grade parts from other families for AEC-Q100 requirements. Conflict-minerals statement available from Intel CSR report.
