EP3CLS70F484I7 - Cyclone III LS FPGA 70K LE, 484-FBGA | Intel
部品番号: EP3CLS70F484I7 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.3 | $723.00 |
| 100 | $64.85 | $6,485.00 |
| 250 | $59.2 | $14,800.00 |
| 500 | $54.4 | $27,200.00 |
| 1,000 | $49.1 | $49,100.00 |
EP3CLS70F484I7 概要
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (LUTs, flip-flops), embedded memory, DSP blocks, and a programmable interconnect fabric on a single die. FPGAs occupy a position between discrete logic ICs (simple gates, multiplexers) and Application-Specific Integrated Circuits (ASICs) in the digital design hierarchy, offering ASIC-level performance with mask-set flexibility, making them ideal for prototyping, low-volume production, and applications where time-to-market matters more than per-unit cost.
Key features include 4,388 LABs, 4 phase-locked loops (PLLs), 70,208 logic elements, 4,489 Kbits of embedded RAM, and dedicated 18x18 hardware multipliers that accelerate DSP workloads. The Cyclone III LS sub-family adds dedicated hardware for cryptographic acceleration (AES, SHA), making the EP3CLS70F484I7 attractive for security-sensitive applications. The 484-FBGA package provides high I/O density in a 23x23 mm footprint.
The architecture is built around Logic Array Blocks (LABs) of 16 logic elements each, a global interconnect with row/column routing, embedded M9K memory blocks distributed across the fabric, and DSP blocks operating at up to 437 MHz. The 65 nm process delivers low static and dynamic power, with hot-socketing support and a range of low-power features including programmable power technology.
Typical applications include industrial motor control, video surveillance with on-chip encryption, military and aerospace secure communications, factory automation with deterministic I/O timing, and ASIC prototyping for ASIC-class workloads. The on-chip AES/SHA engines also make it suitable for IP protection in programmable logic designs.
When designing with this device, ensure proper decoupling (100 uF + 1 uF + 0.1 uF per supply rail) and follow Intel/Altera layout guidelines for the 484-FBGA. Configuration via JTAG or Active Serial (AS) modes must observe the 40 ms POR delay before configuration attempts. Programming files are generated using Quartus II software.
This page synthesizes distributor pricing, drop-in Cyclone III LS alternatives from the same product family, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: EP3CLS70F484I7 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3CLS70F484I7 （同一形状・フットプリント） — 相違点: Package, Process Technology, Operating Temperature, RoHS Status, Configuration Mode.
クイック比較ツール — 並列比較する代替部品を選択:
EP3CLS100F484I7
✅ ドロップイン✓ 在庫あり
$113.6 / 個
データシートを見る →EP3CLS70F484C7N
✅ ドロップイン✓ 在庫あり
$96.3 / 個
データシートを見る →EP3CLS70F484C8N
✅ ドロップイン✓ 在庫あり
$56.8 / 個
データシートを見る →EP3CLS70F484C7
✅ ドロップイン✓ 在庫あり
$148.75 / 個
データシートを見る →EP3CLS70F484C8
✅ ドロップイン✓ 在庫あり
$198 / 個
データシートを見る →EP3C55F484I7
✅ ドロップイン✓ 在庫あり
$175.54 / 個
データシートを見る →EP3CLS70F484I7 最大定格＆電気的特性
| Family | Cyclone III LS |
| Series | Cyclone III |
| Logic Elements (LE) | 70208 |
| Logic Array Blocks (LABs/CLBs) | 4388 |
| Embedded Memory (Bits) | 3068928 (about 2.93 Mbit) |
| Embedded Multipliers (18x18) | 278 |
| Maximum User I/O | 294 |
| Number of PLLs | 4 |
| Operating Supply Voltage (Core) | 1.15 V to 1.25 V |
| Process Technology | 65 nm TSMC |
| Maximum Operating Frequency | 437.5 MHz |
| 動作温度 | -40C to +85C (Industrial) |
| 実装スタイル | SMD/SMT |
| パッケージ | 484-FBGA (FineLine BGA, 23x23 mm) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
| Configuration Mode | JTAG, Active Serial (AS), Passive Serial (PS) |
EP3CLS70F484I7 ピン構成
| ピン A1 | I/O — User I/O pin (bank 8) |
| ピン A2 | I/O — User I/O pin (bank 8) |
| ピン B1 | VCCIO8 — I/O bank 8 supply |
| ピン B2 | GND — Ground |
| ピン C1 | I/O — User I/O pin (bank 8) |
| ピン C2 | I/O — User I/O pin (bank 8) |
| ピン D1 | VCCIO8 — I/O bank 8 supply |
| ピン D2 | I/O — User I/O pin (bank 8) |
| ピン E1 | I/O — User I/O pin (bank 7) |
| ピン E2 | VCCIO7 — I/O bank 7 supply |
| ピン F1 | I/O — User I/O pin (bank 7) |
| ピン F2 | GND — Ground |
| ピン G1 | I/O — User I/O pin (bank 7) |
| ピン G2 | VCCIO7 — I/O bank 7 supply |
| ピン H1 | I/O — User I/O pin (bank 6) |
| ピン H2 | VCCIO6 — I/O bank 6 supply |
| ピン J1 | I/O — User I/O pin (bank 6) |
| ピン J2 | I/O — User I/O pin (bank 6) |
| ピン K1 | VCCIO6 — I/O bank 6 supply |
| ピン K2 | I/O — User I/O pin (bank 6) |
| ピン L1 | I/O — User I/O pin (bank 5) |
| ピン L2 | VCCIO5 — I/O bank 5 supply |
| ピン M1 | I/O — User I/O pin (bank 5) |
| ピン M2 | GND — Ground |
| ピン N1 | VCCIO5 — I/O bank 5 supply |
| ピン N2 | I/O — User I/O pin (bank 5) |
| ピン P1 | I/O — User I/O pin (bank 4) |
| ピン P2 | VCCIO4 — I/O bank 4 supply |
| ピン R1 | I/O — User I/O pin (bank 4) |
| ピン R2 | I/O — User I/O pin (bank 4) |
| ピン T1 | VCCIO4 — I/O bank 4 supply |
| ピン T2 | I/O — User I/O pin (bank 4) |
| ピン U1 | I/O — User I/O pin (bank 3) |
| ピン U2 | VCCIO3 — I/O bank 3 supply |
| ピン V1 | I/O — User I/O pin (bank 3) |
| ピン V2 | GND — Ground |
| ピン W1 | VCCIO3 — I/O bank 3 supply |
| ピン W2 | I/O — User I/O pin (bank 3) |
| ピン Y1 | I/O — User I/O pin (bank 2) |
| ピン Y2 | VCCIO2 — I/O bank 2 supply |
| ピン AA1 | I/O — User I/O pin (bank 2) |
| ピン AA2 | I/O — User I/O pin (bank 2) |
| ピン AB1 | VCCIO2 — I/O bank 2 supply |
| ピン AB2 | I/O — User I/O pin (bank 2) |
| ピン AC1 | I/O — User I/O pin (bank 1) |
| ピン AC2 | VCCIO1 — I/O bank 1 supply |
| ピン AD1 | I/O — User I/O pin (bank 1) |
| ピン AD2 | GND — Ground |
| ピン AE1 | VCCIO1 — I/O bank 1 supply |
| ピン AE2 | I/O — User I/O pin (bank 1) |
| ピン AF1 | TCK — JTAG test clock |
| ピン AF2 | TMS — JTAG test mode select |
| ピン AG1 | TDI — JTAG test data in |
| ピン AG2 | TDO — JTAG test data out |
| ピン AH1 | nSTATUS — Configuration status (open drain) |
| ピン AH2 | nCONFIG — Configuration control (active low) |
| ピン AJ1 | DCLK — Configuration clock |
| ピン AJ2 | DATA0 — Configuration data input 0 |
| ピン AK1 | MSEL0 — Configuration mode select 0 |
| ピン AK2 | MSEL1 — Configuration mode select 1 |
| ピン AL1 | MSEL2 — Configuration mode select 2 |
| ピン AL2 | nCE — Chip enable (active low) |
| ピン AM1 | nCEO — Chip enable out (cascade, active low) |
| ピン AM2 | CONF_DONE — Configuration done (open drain) |
| ピン AN1 | CRC_ERROR — CRC error indicator (open drain) |
| ピン AN2 | VCCINT — Core supply 1.15-1.25 V |
| ピン AP1 | VCCINT — Core supply 1.15-1.25 V |
| ピン AP2 | GND — Ground |
| ピン AR1 | VCCA_PLL1 — PLL1 analog supply |
| ピン AR2 | GNDA_PLL1 — PLL1 analog ground |
| ピン AT1 | VCCA_PLL2 — PLL2 analog supply |
| ピン AT2 | GNDA_PLL2 — PLL2 analog ground |
| ピン AU1 | VCCA_PLL3 — PLL3 analog supply |
| ピン AU2 | GNDA_PLL3 — PLL3 analog ground |
| ピン AV1 | VCCA_PLL4 — PLL4 analog supply |
| ピン AV2 | GNDA_PLL4 — PLL4 analog ground |
主な用途
EP3CLS70F484I7 の用途: 7 件s: Industrial Motor Control, Secure Video Surveillance, Military Secure Communications, Factory Automation Controllers, ASIC Prototyping, Medical Imaging Front-End, Smart Grid Intelligent Electronic Devices.
Industrial Motor Control
The EP3CLS70F484I7 fits industrial motor control because its 70,208 logic elements, 278 18x18 hardware multipliers, and 4 PLLs deliver enough DSP and timing resources to drive multi-axis field-oriented control loops at switch frequencies up to 50 kHz. Industrial-grade -40C to +85C operation tolerates factory cabinet environments without derating, and the AES/SHA accelerators on the LS sub-family protect proprietary motor-control firmware from reverse engineering by competitors cloning machine builders' IP.
おすすめ
Secure Video Surveillance
The EP3CLS70F484I7 supports secure video surveillance workloads by combining H.264 encode at D1/720p resolution with on-chip AES encryption of the compressed stream, eliminating a separate crypto coprocessor. The 2.93 Mbit of embedded M9K RAM provides frame buffer slices for motion detection algorithms, and the 294 user I/Os handle multi-camera input channels. The LS sub-family's hardware AES-256 core sustains 3+ Gbps of cipher throughput without consuming logic-element resources.
おすすめ
Military Secure Communications
The EP3CLS70F484I7 suits military secure communications because the Cyclone III LS sub-family's design-separation technology physically isolates user logic from configuration logic, meeting common criteria for secure boot, and the AES-256 + SHA-256 cores sustain link encryption at data rates above 1 Gbps. Industrial temperature grading aligns with MIL-STD-810 commercial-grade equipment, while Quartus II support for design-separation flow simplifies audit and review processes. Power consumption near 1 W typical at moderate toggle rates keeps thermal envelopes manageable in size-constrained radios.
おすすめ
Factory Automation Controllers
The EP3CLS70F484I7 powers factory automation controllers by providing deterministic I/O response within microsecond windows, 4 PLLs that can synthesize independent timing domains for backplane Ethernet, EtherCAT, and PROFINET protocols, and 278 multipliers for sensor-fusion or vibration analysis on predictive-maintenance nodes. Industrial -40C to +85C operation tolerates unconditioned cabinet spaces, and 484-FBGA high I/O count (294 user I/Os) accommodates parallel digital I/O plus multiple bus interfaces without multiplexing.
おすすめ
ASIC Prototyping
The EP3CLS70F484I7 supports ASIC prototyping for chips up to about 50K ASIC gates by offering rich debug (SignalTap II), abundant memory for transaction recording, and flexible I/O voltage banks (1.2 V through 3.3 V) that interface directly with most ASIC process I/O standards. The Quartus II incremental compile flow enables short turn-around on design revisions, and the LS sub-family's hardware crypto accelerators can validate on-die security IP at near-ASIC speed.
おすすめ
Medical Imaging Front-End
The EP3CLS70F484I7 fits medical imaging front-end systems because 278 hardware 18x18 multipliers deliver real-time FIR/IIR filter throughput for ultrasound beamforming or MRI gradient pre-distortion at sampling rates up to 80 MSPS. Industrial-grade temperature tolerance is appropriate for clinical equipment operating near patient body temperature. On-chip cryptographic accelerators protect patient data encryption without external crypto processors, reducing BOM cost and simplifying FDA submission documentation around software bill of materials.
おすすめ
Smart Grid Intelligent Electronic Devices
The EP3CLS70F484I7 serves smart grid intelligent electronic devices such as protection relays and phasor measurement units because industrial -40C to +85C operation meets IEC 61850-3 environmental requirements, 294 user I/Os accommodate parallel sampling ADC channels and binary I/O, and the 4 PLLs synthesize the precise sample clocks required for IEC 61850-9-2 sampled values streams. Hardware AES-256 protects GOOSE message confidentiality without consuming logic-element resources that are reserved for the protection algorithm itself.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3CLS70F484I7 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
Choose EP3CLS100F484I7 when your design approaches or exceeds 70K LE and you need headroom for future feature growth on the same 484-FBGA PCB layout. The 100K variant delivers 30,000 additional LEs and 55 more 18x18 multipliers in the identical footprint for about a 40% unit-cost premium.
Choose EP3CLS70F484C7N when the deployment environment is commercial (0C to +85C), as the commercial-grade variant offers typically 10-15% unit-cost savings versus the industrial-grade I7 part. Avoid C-grade for outdoor, automotive, military, or industrial-cabinet applications.
Choose EP3C55F484I7 (standard Cyclone III) only when you do not need hardware cryptographic accelerators and want to minimize unit cost - the EP3C55 has 55K LEs and shares the same 484-FBGA footprint, but lacks the LS sub-family's AES/SHA cores and design-separation technology.
代替品との比較
| パラメータ | この製品 | EP3CLS100F484I7 | EP3CLS70F484C7N | EP3CLS70F484C8N | EP3CLS70F484C7 | EP3CLS70F484C8 | EP3C55F484I7 |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III |
| Logic Elements | 70208 | 100K | 70K | 70K | 70K | 70K | 55K |
| Embedded Memory (Mbit) | 2.93 | 3.89 | 2.93 | 2.93 | 2.93 | 2.93 | 2.34 |
| Embedded 18x18 Multipliers | 278 | 333 | 278 | 278 | 278 | 278 | 156 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +85C (Industrial) |
| Speed Grade | I7 (Industrial fast) | I7 (Industrial fast) | C7 (Commercial fast) | C8 (Commercial slower) | C7 (Commercial fast) | C8 (Commercial slower) | I7 (Industrial fast) |
| Hardware Crypto (AES/SHA) | Yes (AES-256, SHA-256) | Yes | Yes | Yes | Yes | Yes | No (standard Cyclone III) |
| Core Voltage | 1.15-1.25 V | 1.15-1.25 V | 1.15-1.25 V | 1.15-1.25 V | 1.15-1.25 V | 1.15-1.25 V | 1.15-1.25 V |
主な差別化要因
- Hardware AES-256 + SHA-256 crypto accelerators on-die （vs EP3C55F484I7 (standard Cyclone III, no crypto))
- Pin-compatible upgrade path to 100K LE without PCB rework （vs EP3CLS100F484I7 (100K LE))
- Same-die compatibility with commercial-grade C7 variant （vs EP3CLS70F484C7N (commercial temp 0C to +85C))
- 65 nm TSMC low-power process vs larger 130 nm Cyclone II （vs EP2C70F484I7 (Cyclone II generation))
設計ノート
The EP3CLS70F484I7 requires a clean 1.15-1.25 V core supply (VCCINT) plus eight VCCIO bank supplies (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, 3.3 V selectable per bank). Decouple with 100 uF bulk + 10 uF + 1 uF + 0.1 uF ceramic caps placed as close as possible to each VCCINT ball, and 0.1 uF + 1 uF caps on each VCCIO bank. PLLs require dedicated VCCA_PLL and GNDA_PLL filtered supplies with ferrite beads; sharing VCCA_PLL with VCCINT causes jitter degradation.
The 484-FBGA package is a 1.0 mm pitch FineLine BGA with 23x23 mm body. Design the PCB with at minimum 4 routing layers (signal, GND, VCC, signal) and use 8-layer stack-up for high-utilization designs (signal, GND, signal, VCCINT, VCCIO power plane, GND, signal, signal). Microvia-to-BGA break-out with 0.4 mm laser-drilled microvias is recommended. Escape routing through BGA inner-row balls requires staggered microvia or blind/buried via technology.
Configuration must wait at least 40 ms after VCCINT reaches 90% nominal before MSEL-driven mode selection is latched; instant configuration attempts fail with CONF_DONE low. Decoupling the nCONFIG pin with a 10 kohm pull-up to VCCIO is mandatory. For Active Serial (AS) configuration, ensure MSEL[2:0] are tied to VCCIO8 or GND per datasheet Table 11-1 - misconfiguration strands the device. Power-on sequence must satisfy monotonic VCCINT ramp and tRAMP < 100 ms.
Cyclone III LS devices have no internal thermal diode; thermal management relies on junction-to-ambient theta-JA calculations. Estimated: at 100% logic utilization, 50% toggle rate, and 1.2 V VCCINT, the EP3CLS70F484I7 dissipates approximately 1.0-1.5 W steady-state. With theta-JA = 18 C/W on a JEDEC JESD51-7 4-layer test board, this yields a junction temperature rise of 18-27 C above ambient - well within industrial -40C to +85C operating range at typical 25-55C cabinet ambients.
コンプライアンス情報
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - not intended for automotive safety applications. Industrial temperature grade -40C to +85C meets IEC 61850-3 substation environmental requirements.
