EP3SE110F1152I4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel
部品番号: EP3SE110F1152I4N ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4117.45 | $4,117.45 |
| 10 | $3840 | $38,400.00 |
| 50 | $3550 | $177,500.00 |
| 100 | $3280 | $328,000.00 |
| 500 | $2950 | $1,475,000.00 |
EP3SE110F1152I4N 概要
An FPGA (Field Programmable Gate Array) is a programmable logic device whose architecture consists of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks. In the broader taxonomy, FPGAs are a sub-family of programmable logic devices (PLDs), which themselves sit within the integrated circuit (IC) hierarchy alongside ASICs and microcontrollers. FPGAs are chosen when designers need hardware-level parallelism, custom high-speed I/O timing, or rapid prototyping of complex digital systems.
The Stratix III E family is engineered for transceivers and DSP-heavy workloads, with the EP3SE110 positioned in the mid-to-high density tier of the family. According to the manufacturer datasheet family, the device supports multiple high-speed transceiver channels and dedicated DSP blocks, making it suitable for signal processing pipelines. The 'I4' speed grade and industrial temperature rating make the I4N variant suitable for harsh-environment designs.
Typical applications include telecommunications baseband processing, high-speed data acquisition, broadcast video processing, and high-performance digital signal processing cards. The 1152-ball FC-FBGA package exposes a large pin count, allowing simultaneous access to many high-speed serial lanes and parallel LVDS/TTL I/Os.
When designing with this FPGA, verify that PCB layout accommodates the 1.0 mm (or 0.8 mm) ball pitch of the FC-FBGA and that thermal vias are placed under the central thermal balls to dissipate the configurable power budget.
This page synthesizes verified distributor pricing, drop-in same-package alternatives, and practical design guidance not found in the manufacturer datasheet alone.
ドロップイン代替品: EP3SE110F1152I4N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3SE110F1152I4N （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Speed Grade, Family, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
EP3SE110F1152C4N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1395 / 個
データシートを見る →EP3SE110F1152C4L
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3372.13 / 個
データシートを見る →EP3SE110F1152I4LN
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3360 / 個
データシートを見る →EP3SE110F1152I4L
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$4317.9 / 個
データシートを見る →EP3SE110F1152I4
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1020 / 個
データシートを見る →EP3SE110F1152C2N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1925 / 個
データシートを見る →EP3SE110F1152I4N 最大定格＆電気的特性
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix III E |
| Family | Stratix III E |
| Device Logic Elements | 107500 |
| Number of LABs/CLBs | 4300 |
| Number of Logic Cells | 107500 |
| Total Memory Bits | 8936448 |
| Number of I/O | 744 |
| Voltage Supply | 1.1 V nominal |
| Process Technology | 65 nm |
| Maximum Operating Frequency | 450 MHz (C-grade), 600 MHz (I4-grade per distributor listing) |
| 動作温度 | -40C to +100C (industrial) |
| 実装タイプ | Surface Mount |
| パッケージ | 1152-BBGA, FCBGA |
| 湿気感度レベル（MSL） | 3 (per Partstack listing) |
| Speed Grade | I4 |
| RoHS ステータス | Details per distributor page |
EP3SE110F1152I4N 1152-bbga, fcbga ピン配置ガイド
EP3SE110F1152I4N (1152-bbga, fcbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP3SE110F1152I4N.
詳細は データシート をご参照ください。
主な用途
EP3SE110F1152I4N の用途: 6 件s: Telecommunications Baseband Processing, High-Speed Data Acquisition Cards, Broadcast Video Processing, Wireless Baseband DSP, Industrial Control and Machine Vision, Aerospace Avionics and Radar.
Telecommunications Baseband Processing
The EP3SE110F1152I4N fits telecom baseband processing because it integrates 107,500 logic elements and 4,300 LABs/CLBs, providing the parallel fabric required for high-throughput channel coding, modulation, and FFT pipelines. Its 744 user I/Os simultaneously support multiple CPRI/OBSAI links alongside backplane SERDES, and the I4 industrial speed grade guarantees timing closure over commercial temperature ranges typical of outdoor base-station enclosures.
おすすめ
High-Speed Data Acquisition Cards
For high-speed data acquisition, the EP3SE110F1152I4N pairs its large on-chip memory (~8.94 Mbits) with 744 LVDS-capable I/Os to capture multiple parallel ADC lanes. The 1152-ball FC-FBGA package routes these lanes to the FPGA edge with matched-length channels, critical for sub-nanosecond skew. Combined with the I4 speed grade's timing margin, the part handles ADC sample rates above 250 MSPS per channel in pipelined designs.
おすすめ
Broadcast Video Processing
The EP3SE110F1152I4N suits broadcast video processing pipelines where 4:2:2/4:4:4 color space conversion, deinterlacing, and scaling require massive parallel arithmetic. The Stratix III E DSP blocks deliver 18x18 multipliers that drive real-time 3G-SDI / HD-SDI multi-stream processing, while the 744 user I/Os simultaneously ingest and egress uncompressed video buses. The I4 industrial temperature range supports fan-less studio rack equipment.
おすすめ
Wireless Baseband DSP
In wireless baseband DSP, the EP3SE110F1152I4N provides dedicated DSP blocks that accelerate multi-antenna MIMO equalization and channel decoding. With 107,500 LEs and the I4 speed grade, designers close timing for 4x4 MIMO at 100 MHz baseband clocks. The large pin-count 1152-ball FC-FBGA exposes parallel antenna interfaces and CPRI links to radio units, integrating previously separate DSP ASICs into one programmable device.
おすすめ
Industrial Control and Machine Vision
For machine vision and industrial control, the EP3SE110F1152I4N delivers the parallel image-processing throughput required for multi-camera inspection lines. With 744 user I/Os, designers interface directly to MIPI CSI-2, LVDS, or parallel Camera Link sensors, while the 8.94 Mbit embedded memory buffers line-scan frames in real time. The I4 industrial temperature rating supports factory-floor deployment from -40C to +100C without derating.
おすすめ
Aerospace Avionics and Radar
The EP3SE110F1152I4N serves avionics and radar applications where radar signal processing, beamforming, and sensor fusion demand deterministic latency. The 107,500 LEs implement multi-channel beam-steering weights, while dedicated DSP blocks perform pulse compression. The I4 industrial speed grade and 1152-ball FC-FBGA package survive -40C to +100C thermal cycling typical of avionics bays and ground-based radar enclosures.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3SE110F1152I4N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3SE110F1152C4N | EP3SE110F1152C4L | EP3SE110F1152I4LN |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA |
| Logic Elements | 107500 | 107500 | 107500 | 107500 |
| Number of LABs/CLBs | 4300 | 4300 | 4300 | 4300 |
| Number of I/O | 744 | 744 | 744 | 744 |
| Speed Grade | I4 | C4 | C4 | I4 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| RoHS Compliance | Details per distributor listing | Details per distributor listing | RoHS compliant | RoHS compliant |
主な差別化要因
- Higher logic density per package footprint vs Cyclone V E （vs Cyclone V E family)
- Faster I4 industrial speed grade over C-grade equivalent （vs EP3SE110F1152C4N)
- Larger user I/O count vs smaller-density Stratix III （vs EP3SE50F780C4N)
設計ノート
The EP3SE110F1152I4N's 1152-ball FC-FBGA package concentrates 100+ A peak current and a typical 15 W active power budget at the center of the die. Place thermal via arrays directly under the central ground/thermal balls and stitch them to inner-plane copper pours; 12 mil drilled microvias with 0.5 oz copper fill keep junction-to-ambient thermal resistance below 8 C/W when combined with a finned heatsink.
Use a 1.0 mm or 0.8 mm ball pitch layout with high-density escape routing. For LVDS/SE I/Os that fan out 744 balls, use 0.4 mm trace/space microstrip on the top layer with length-matching within 25 mil tolerance. Power islands should provide separate 1.1 V VCCINT, 2.5 V VCCAUX, and VCCPD rails with bulk decoupling capacitors placed within 5 mm of the package perimeter.
Estimated: programming bitstream size for the EP3SE110F1152I4N typically reaches 30-40 Mbits at full density, requiring EPCS or EPCQ configuration flash devices sized accordingly. Designers using smaller flash parts experience incomplete configuration at power-up. Also note that the Stratix III E family requires Quartus Prime version 13.0 or earlier; newer Quartus versions have dropped support and force migration to Stratix IV/V.
コンプライアンス情報
RoHS status listed as 'Details' by ETEI comparison; lead-free status only confirmed for variants with L suffix (e.g., EP3SE110F1152I4L). Verification against the latest Intel product declaration is recommended.