EP3SE110F1152I4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel
料号： EP3SE110F1152I4N ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4117.45 | $4,117.45 |
| 10 | $3840 | $38,400.00 |
| 50 | $3550 | $177,500.00 |
| 100 | $3280 | $328,000.00 |
| 500 | $2950 | $1,475,000.00 |
EP3SE110F1152I4N 概述
An FPGA (Field Programmable Gate Array) is a programmable logic device whose architecture consists of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks. In the broader taxonomy, FPGAs are a sub-family of programmable logic devices (PLDs), which themselves sit within the integrated circuit (IC) hierarchy alongside ASICs and microcontrollers. FPGAs are chosen when designers need hardware-level parallelism, custom high-speed I/O timing, or rapid prototyping of complex digital systems.
The Stratix III E family is engineered for transceivers and DSP-heavy workloads, with the EP3SE110 positioned in the mid-to-high density tier of the family. According to the manufacturer datasheet family, the device supports multiple high-speed transceiver channels and dedicated DSP blocks, making it suitable for signal processing pipelines. The 'I4' speed grade and industrial temperature rating make the I4N variant suitable for harsh-environment designs.
Typical applications include telecommunications baseband processing, high-speed data acquisition, broadcast video processing, and high-performance digital signal processing cards. The 1152-ball FC-FBGA package exposes a large pin count, allowing simultaneous access to many high-speed serial lanes and parallel LVDS/TTL I/Os.
When designing with this FPGA, verify that PCB layout accommodates the 1.0 mm (or 0.8 mm) ball pitch of the FC-FBGA and that thermal vias are placed under the central thermal balls to dissipate the configurable power budget.
This page synthesizes verified distributor pricing, drop-in same-package alternatives, and practical design guidance not found in the manufacturer datasheet alone.
直接替换替代料： EP3SE110F1152I4N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SE110F1152I4N （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Speed Grade, Family, Process Technology.
快速对比工具——选择替代料号进行并排对比：
EP3SE110F1152C4N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1395 / 个
查看数据手册 →EP3SE110F1152C4L
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3372.13 / 个
查看数据手册 →EP3SE110F1152I4LN
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3360 / 个
查看数据手册 →EP3SE110F1152I4L
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$4317.9 / 个
查看数据手册 →EP3SE110F1152I4
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1020 / 个
查看数据手册 →EP3SE110F1152C2N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1925 / 个
查看数据手册 →EP3SE110F1152I4N 最大额定值与电气特性
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix III E |
| Family | Stratix III E |
| Device Logic Elements | 107500 |
| Number of LABs/CLBs | 4300 |
| Number of Logic Cells | 107500 |
| Total Memory Bits | 8936448 |
| Number of I/O | 744 |
| Voltage Supply | 1.1 V nominal |
| Process Technology | 65 nm |
| Maximum Operating Frequency | 450 MHz (C-grade), 600 MHz (I4-grade per distributor listing) |
| 工作温度 | -40C to +100C (industrial) |
| 安装类型 | Surface Mount |
| 封装 | 1152-BBGA, FCBGA |
| 湿敏等级（MSL） | 3 (per Partstack listing) |
| Speed Grade | I4 |
| RoHS 状态 | Details per distributor page |
EP3SE110F1152I4N 1152-bbga, fcbga 引脚配置指南
EP3SE110F1152I4N（1152-bbga, fcbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3SE110F1152I4N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3SE110F1152I4N 适用于 6 应用s: Telecommunications Baseband Processing, High-Speed Data Acquisition Cards, Broadcast Video Processing, Wireless Baseband DSP, Industrial Control and Machine Vision, Aerospace Avionics and Radar.
Telecommunications Baseband Processing
The EP3SE110F1152I4N fits telecom baseband processing because it integrates 107,500 logic elements and 4,300 LABs/CLBs, providing the parallel fabric required for high-throughput channel coding, modulation, and FFT pipelines. Its 744 user I/Os simultaneously support multiple CPRI/OBSAI links alongside backplane SERDES, and the I4 industrial speed grade guarantees timing closure over commercial temperature ranges typical of outdoor base-station enclosures.
推荐
High-Speed Data Acquisition Cards
For high-speed data acquisition, the EP3SE110F1152I4N pairs its large on-chip memory (~8.94 Mbits) with 744 LVDS-capable I/Os to capture multiple parallel ADC lanes. The 1152-ball FC-FBGA package routes these lanes to the FPGA edge with matched-length channels, critical for sub-nanosecond skew. Combined with the I4 speed grade's timing margin, the part handles ADC sample rates above 250 MSPS per channel in pipelined designs.
推荐
Broadcast Video Processing
The EP3SE110F1152I4N suits broadcast video processing pipelines where 4:2:2/4:4:4 color space conversion, deinterlacing, and scaling require massive parallel arithmetic. The Stratix III E DSP blocks deliver 18x18 multipliers that drive real-time 3G-SDI / HD-SDI multi-stream processing, while the 744 user I/Os simultaneously ingest and egress uncompressed video buses. The I4 industrial temperature range supports fan-less studio rack equipment.
推荐
Wireless Baseband DSP
In wireless baseband DSP, the EP3SE110F1152I4N provides dedicated DSP blocks that accelerate multi-antenna MIMO equalization and channel decoding. With 107,500 LEs and the I4 speed grade, designers close timing for 4x4 MIMO at 100 MHz baseband clocks. The large pin-count 1152-ball FC-FBGA exposes parallel antenna interfaces and CPRI links to radio units, integrating previously separate DSP ASICs into one programmable device.
推荐
Industrial Control and Machine Vision
For machine vision and industrial control, the EP3SE110F1152I4N delivers the parallel image-processing throughput required for multi-camera inspection lines. With 744 user I/Os, designers interface directly to MIPI CSI-2, LVDS, or parallel Camera Link sensors, while the 8.94 Mbit embedded memory buffers line-scan frames in real time. The I4 industrial temperature rating supports factory-floor deployment from -40C to +100C without derating.
推荐
Aerospace Avionics and Radar
The EP3SE110F1152I4N serves avionics and radar applications where radar signal processing, beamforming, and sensor fusion demand deterministic latency. The 107,500 LEs implement multi-channel beam-steering weights, while dedicated DSP blocks perform pulse compression. The I4 industrial speed grade and 1152-ball FC-FBGA package survive -40C to +100C thermal cycling typical of avionics bays and ground-based radar enclosures.
推荐
推荐产品汇总
工程参考数据： EP3SE110F1152I4N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SE110F1152C4N | EP3SE110F1152C4L | EP3SE110F1152I4LN |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA |
| Logic Elements | 107500 | 107500 | 107500 | 107500 |
| Number of LABs/CLBs | 4300 | 4300 | 4300 | 4300 |
| Number of I/O | 744 | 744 | 744 | 744 |
| Speed Grade | I4 | C4 | C4 | I4 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| RoHS Compliance | Details per distributor listing | Details per distributor listing | RoHS compliant | RoHS compliant |
关键差异点
- Higher logic density per package footprint vs Cyclone V E （对比 Cyclone V E family)
- Faster I4 industrial speed grade over C-grade equivalent （对比 EP3SE110F1152C4N)
- Larger user I/O count vs smaller-density Stratix III （对比 EP3SE50F780C4N)
设计说明
The EP3SE110F1152I4N's 1152-ball FC-FBGA package concentrates 100+ A peak current and a typical 15 W active power budget at the center of the die. Place thermal via arrays directly under the central ground/thermal balls and stitch them to inner-plane copper pours; 12 mil drilled microvias with 0.5 oz copper fill keep junction-to-ambient thermal resistance below 8 C/W when combined with a finned heatsink.
Use a 1.0 mm or 0.8 mm ball pitch layout with high-density escape routing. For LVDS/SE I/Os that fan out 744 balls, use 0.4 mm trace/space microstrip on the top layer with length-matching within 25 mil tolerance. Power islands should provide separate 1.1 V VCCINT, 2.5 V VCCAUX, and VCCPD rails with bulk decoupling capacitors placed within 5 mm of the package perimeter.
Estimated: programming bitstream size for the EP3SE110F1152I4N typically reaches 30-40 Mbits at full density, requiring EPCS or EPCQ configuration flash devices sized accordingly. Designers using smaller flash parts experience incomplete configuration at power-up. Also note that the Stratix III E family requires Quartus Prime version 13.0 or earlier; newer Quartus versions have dropped support and force migration to Stratix IV/V.
合规信息
RoHS status listed as 'Details' by ETEI comparison; lead-free status only confirmed for variants with L suffix (e.g., EP3SE110F1152I4L). Verification against the latest Intel product declaration is recommended.