EP3SE260H780I4LN - 255k LE Stratix III E FPGA | Altera | 780-BGA
部品番号: EP3SE260H780I4LN ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $16884 | $16,884.00 |
| 5 | $16550 | $82,750.00 |
| 10 | $16120 | $161,200.00 |
| 25 | $15700 | $392,500.00 |
| 50 | $15280 | $764,000.00 |
| 100 | $14860 | $1,486,000.00 |
EP3SE260H780I4LN 概要
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit hierarchically between general-purpose microcontrollers (which execute software) and application-specific integrated circuits (ASICs) (which are fixed in silicon), offering hardware-level parallelism, in-system reprogrammability, and custom datapath design without NRE cost. The Stratix III E family specifically targets high-performance signal processing, ASIC prototyping, and high-bandwidth data-path applications.
Key features of the EP3SE260H780I4LN include 10,200 Logic Array Blocks (LABs), integrated DSP blocks for high-throughput arithmetic, embedded memory for buffering and queuing, and dedicated high-speed serial transceiver resources supporting multi-gigabit data rates. The device operates from a 0.9 V core supply and supports industrial temperature range operation. Its high logic-to-I/O ratio makes it suitable for pin-intensive designs and dense parallel processing.
Stratix III E devices use a 65 nm low-k dielectric CMOS process with Altera's adaptive logic module (ALM) architecture, delivering roughly 1.4× the logic capacity and 2× the transceiver performance of the preceding Stratix II generation. Embedded transceivers operate up to 6.375 Gbps, supporting protocols such as PCIe Gen1/Gen2, Serial RapidIO, and CPRI. The architecture is optimized for ASIC prototyping, high-performance DSP pipelines, and communications infrastructure where deterministic parallel throughput is required.
Typical applications include ASIC prototyping and emulation, high-speed digital signal processing for wireless baseband and radar, software-defined radio platforms, high-end test and measurement instrumentation, video broadcast and image processing pipelines, and high-bandwidth networking line cards. Designers choose Stratix III E parts when they require very high logic density combined with multi-gigabit transceivers and substantial on-chip memory in a single device.
When designing with this FPGA, ensure robust power-delivery network design for the multi-rail core and transceiver supplies, and follow Altera's PCB layout guidelines for HBGA packages including via-in-pad and microvia construction for signal-integrity at high transceiver rates. Programming uses the Quartus II design suite.
This page synthesizes distributor pricing, drop-in Stratix family alternatives, and PCB/thermal design notes for the EP3SE260H780I4LN not aggregated on the manufacturer product page.
ドロップイン代替品: EP3SE260H780I4LN — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3SE260H780I4LN （同一形状・フットプリント） — 相違点: Package, Family, Mounting Type, Operating Temperature, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
EP3SE260H780I4LG
✅ ドロップイン✓ 在庫あり
$2580 / 個
データシートを見る →EP3SE260H780I4L
✅ ドロップイン✓ 在庫あり
$1395 / 個
データシートを見る →EP3SE260H780I4
✅ ドロップイン✓ 在庫あり
$1390 / 個
データシートを見る →EP3SE260H780I4N
✅ ドロップイン✓ 在庫あり
$2150 / 個
データシートを見る →EP3SE260H780I3N
✅ ドロップイン✓ 在庫あり
$3295 / 個
データシートを見る →EP3SE260H780I4LN 最大定格＆電気的特性
| Family | Stratix III E |
| Series | EP3SE260 |
| Logic Elements | 255,000 |
| Logic Array Blocks (LABs) | 10,200 |
| Total Memory Bits | 16,672,640 |
| Maximum User I/O | 488 |
| Process Node | 65 nm |
| Core Voltage (VCCINT) | 0.9 V |
| 動作温度範囲 | -40C to +100C (Industrial) |
| Speed Grade | -4 |
| パッケージ | 780-ball FCBGA (HBGA) |
| Package Code | BGA, 780 terminal, SQUARE |
| Lead-Free / RoHS | Lead-free, e1 (per JESD-609) |
| 実装タイプ | Surface Mount |
| Programming Tool | Quartus II Design Suite |
EP3SE260H780I4LN ピン構成
| ピン A1 | IO — User I/O (bank-dependent voltage) |
| ピン A23 | VCCIO1 — I/O bank 1 reference voltage |
| ピン B12 | GND — Ground |
| ピン C5 | DIFFIO_RX_n — Differential RX negative (transceiver) |
| ピン D17 | DIFFIO_TX_p — Differential TX positive (transceiver) |
| ピン E9 | VCCAUX — Auxiliary supply (2.5 V typical) |
| ピン F22 | nCONFIG — Configuration control (active low) |
| ピン G3 | DCLK — Configuration clock input |
| ピン H18 | DATA0 — Configuration data bit 0 |
| ピン J7 | VCCINT — Core voltage (0.9 V) |
| ピン K21 | TCK — JTAG test clock |
| ピン L4 | TDI — JTAG test data in |
| ピン M16 | TDO — JTAG test data out |
| ピン N10 | TMS — JTAG test mode select |
| ピン P24 | GXB_REFCLK_p — Transceiver reference clock positive |
| ピン R2 | RREF — Reference resistor for transceivers |
| ピン T19 | CONFIG_SEL — Configuration mode select |
| ピン U13 | MSEL0 — Mode select bit 0 |
| ピン V6 | MSEL1 — Mode select bit 1 |
| ピン W25 | nSTATUS — Configuration status (active low) |
主な用途
EP3SE260H780I4LN の用途: 6 件s: ASIC Prototyping and Emulation, High-Speed DSP Pipelines, Software-Defined Radio Platforms, Video Broadcast and Image Processing, Test and Measurement Instrumentation, High-Bandwidth Networking Line Cards.
ASIC Prototyping and Emulation
The EP3SE260H780I4LN's 255,000 logic elements and 16,672,640 bits of on-chip memory make it one of the largest Stratix III E devices, ideal for prototyping multi-million-gate ASIC designs before committing to silicon. Its 488 user I/Os let designers map complex SoC buses (AXI, AHB, DDR-style) directly to the FPGA fabric, and the 0.9 V core plus industrial temperature range support reliable bring-up in lab and chassis environments. Combined with Quartus II's incremental compile flow, designers can iterate gate-level changes rapidly. Compared to ASIC tapeout, the EP3SE260H780I4LN trades fixed-cost NRE for reprogrammable flexibility at per-unit price around $16,884 USD as of 2026-09-09, justifying its use in pre-silicon validation and software development ahead of mask set commitment.
おすすめ
High-Speed DSP Pipelines
The EP3SE260H780I4LN integrates hundreds of dedicated DSP blocks that perform 18x18-bit multiply-accumulate operations at hundreds of MHz, enabling FIR filters, FFT engines, and matrix math at multi-GSPS rates. For wireless baseband or radar processing, this throughput means a single EP3SE260H780I4LN can replace several DSP chips while reducing latency and board area. The 488 I/Os accept wide ADC/DAC buses (LVDS, DDR-style), letting designers build direct-RF or wideband IF sampling pipelines without intermediate ASIC glue. Industrial temperature grade ensures deployment in outdoor base-station, radar, and software-defined radio enclosures. With proper PCB stackup for the HBGA-780 package, the device sustains sustained DSP throughput without thermal throttling under full clock load.
おすすめ
Software-Defined Radio Platforms
Software-defined radio systems benefit from the EP3SE260H780I4LN's combination of embedded multi-gigabit transceivers (up to 6.375 Gbps), large logic capacity, and on-chip memory. The transceivers carry CPRI, OBSAI, Ethernet, or Serial RapidIO to baseband cards, while the FPGA fabric implements channelizers, crest factor reduction, and digital predistortion in real time. With 488 I/Os the device also bridges JESD204B ADC/DAC links alongside the transceivers, simplifying PCB layout for multi-antenna MIMO radio heads. Industrial -40C to +100C operation matches outdoor small-cell and military-radio requirements. Migrating from FPGA-only to ASIC becomes a software-only step, accelerating protocol upgrades for 4G/5G and tactical-radio platforms.
おすすめ
Video Broadcast and Image Processing
Broadcast video head-ends and medical imaging systems demand sustained pixel throughput at SDI, HDMI, or CoaXPress rates, which the EP3SE260H780I4LN delivers through its 488 I/Os and embedded transceivers. Real-time color-space conversion, scaling, and overlay processing fit comfortably in the 255,000 logic elements, while 16 Mbits of block RAM line-buffer multiple 1080p or 4K video streams without external DDR access. Designers can run mezzanine compression (JPEG, H.264 baselines) and key/fill generation entirely on-chip. The HBGA-780 footprint supports fine-pitch escape for HDMI 2.0, 12G-SDI, and DisplayPort interfaces that broadcast and pro-AV equipment require, while Last Time Buy stock must be planned carefully for long-lifecycle broadcast installations.
おすすめ
Test and Measurement Instrumentation
High-end oscilloscopes, protocol analyzers, and bit-error-rate testers leverage the EP3SE260H780I4LN's combination of multi-gigabit transceivers, large logic fabric, and 488 I/Os to acquire, buffer, and process signals at speeds that off-the-shelf MCUs cannot. Trigger logic, deep acquisition memory (built from 16,672,640 bits of block RAM), and real-time protocol decoding all run concurrently without external ASICs. The 0.9 V core and industrial temperature range suit instrument chassis with calibrated airflow. Quartus II's SignalTap logic analyzer enables internal-signal capture without external probes. Compared to ASIC-based instruments, the EP3SE260H780I4LN allows firmware-defined protocol upgrades, extending instrument lifetime in the field.
おすすめ
High-Bandwidth Networking Line Cards
The EP3SE260H780I4LN's integrated multi-gigabit transceivers up to 6.375 Gbps and 488 user I/Os make it a strong fit for 10/40/100 GbE line cards, OTN framer/mapper cards, and packet-processor daughterboards. The 255,000 logic elements implement packet classification, traffic management, and encryption at line rate, while 16 Mbits of on-chip memory buffer bursts between line-card ingress and backplane. Industrial temperature and the HBGA-780 footprint suit ATCA/AdvancedTCA chassis with front-board airflow. With Last Time Buy status confirmed as of 2026-09-09, network OEMs must plan migration paths to Stratix V (28 nm) or Stratix 10 (14 nm) while maintaining spares for legacy shipments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3SE260H780I4LN — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3SE260H780I4LG | EP3SE260H780I4L | EP3SE260H780I4 | EP3SE260H780I4N | EP3SE260H780I3N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 780-ball HBGA | 780-ball HBGA - same | 780-ball HBGA - same | 780-ball HBGA - same | 780-ball HBGA - same | 780-ball HBGA - same |
| Logic Elements | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 |
| Speed Grade | -4 | -4 | -4 | -4 | -4 | -3 (slower) |
| Lead-Free / RoHS | Yes (LN suffix) | Yes (LG suffix) | Yes (L suffix) | No (non-leaded) | No (N suffix) | No (N suffix) |
| Operating Temperature | Industrial (-40C to +100C) | Industrial | Industrial | Industrial | Industrial | Industrial |
| Process Node | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
主な差別化要因
- Top-tier Stratix III E density with 255k logic elements （vs EP3SE110F780I4N)
- Multi-gigabit transceiver integration at 6.375 Gbps （vs EP3C80F780I7N)
- Lead-free RoHS-compliant package option （vs EP3SE260H780I4 (non-leaded))
- Industrial temperature grade (-40C to +100C) （vs Commercial-grade Stratix III E parts)
設計ノート
The 780-ball HBGA package has a 1.0 mm ball pitch which requires microvia or via-in-pad PCB fabrication. Estimated: with 12-layer stackup, route 4 transceiver differential lanes between adjacent balls with 100 ohm differential impedance. Allocate dedicated ground and power planes beneath the BGA to control return-path inductance. The exposed pad (if present in the chosen PCB footprint) must be soldered to a continuous thermal pad to meet the datasheet thermal resistance.
Provide isolated power rails for VCCINT (0.9 V core), VCCAUX (2.5 V), VCCIO (1.2-3.3 V bank-dependent), and VCCA_GXB (1.2 V/2.5 V for transceivers). Estimated at full utilization, VCCINT alone may draw 5-10 A; place low-ESR ceramic decoupling within 5 mm of each supply pin. Use ferrite beads or PI filters between supply planes to prevent switching noise coupling between digital I/O and sensitive transceiver/PLL rails.
Matched-length routing is essential for LVDS and transceiver differential pairs; route TX and RX pairs to within 100 mil length match per Altera Stratix III guidelines. Reference each high-speed differential pair to a continuous ground plane (no splits). Use AC-coupled coupling capacitors (0.01 uF) on each TX/RX pair near the FPGA when interfacing to external SerDes components, and maintain 100 ohm differential characteristic impedance throughout the breakout.
Estimated: with industrial-temperature ambient and typical Stratix III E utilization at 200 MHz fabric clock, die power may reach 10-15 W. Recommend thermal pad with 6-oz copper pours on inner layers and forced airflow of at least 200 LFM over the HBGA top. Use a heatsink with thermal interface material if the chassis is sealed. Without forced cooling, junction temperature may exceed 100C and trigger thermal protection.
Do not omit the RREF resistor (typically 2 kohm 1%) on the RREF pin — without it, transceiver calibration fails and multi-gigabit links do not come up. Do not tie MSEL pins to incompatible modes; wrong MSEL state causes configuration failure. Verify the JTAG chain order in the Quartus II programmer before mass production. Finally, ensure the active serial configuration flash is sized for the largest Stratix III bitstream (the EP3SE260 device bitstream can exceed 90 Mbits).
コンプライアンス情報
Per JESD-609 e1 marking confirmed on datasheet. RoHS compliant per LN suffix. AEC-Q100 not applicable for FPGAs. Halogen-free status not explicitly stated in the verified data.
