Intel

EP3SE50F484C2 - 47.5K LE Stratix III E FPGA | Intel | 484-FCBGA

Name: EP3SE50F484C2 - 47.5K LE Stratix III E FPGA | Intel | 484-FCBGA
Brand: Intel
SKU: EP3SE50F484C2
Price: 895 USD
Availability: InStock

部品番号: EP3SE50F484C2 ⚠ ラストタイムバイ

在庫あり 1〜3営業日以内に発送

1.1 V Vdss 484-ball FC-FBGA (FCBGA) Package 600 MHz Speed 5,760,000 bits Memory

開始価格 $895 USD / 個

MOQ: 1 |

価格更新日: 2026-09-09

ボリューム価格

数量	単価	小計
1	$1250	$1,250.00
10	$1180	$11,800.00
100	$1095	$109,500.00
500	$990	$495,000.00
1,000	$895	$895,000.00

ℹ️ すべての価格はUSDです

データシートを見る (PDF) 代替品を見る

数量

EP3SE50F484C2 概要

The Intel (formerly Altera) EP3SE50F484C2 is a Stratix III Enhanced family Field Programmable Gate Array (FPGA) delivering 47,500 logic elements, 296 user I/Os, and 5,760,000 bits of embedded memory, housed in a 484-ball FineLine BGA (FC-FBGA) package. It is fabricated on a 65 nm process node, operates from a 1.1 V core supply, and targets high-performance DSP, communications, and signal-processing designs.

What is a Stratix III Enhanced FPGA? The Stratix III E family is the high-performance variant of Altera's third-generation 65 nm FPGA line, tuned for DSP-rich designs that require abundant embedded multipliers, MLAB/M9K memory blocks, and rich transceivers or external memory interfaces. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), which sit alongside ASICs and ASSPs as reconfigurable digital silicon; they are widely used when design iteration, parallelism, or hardware-level DSP throughput is required.

Key features include 1,900 Logic Array Blocks (LABs), 296 user I/O pins, embedded memory of 5,760,000 bits distributed in M9K blocks, dedicated 18x18 multipliers for DSP, and support for external memory interfaces including DDR3/DDR2/QDRII+/RLDRAM2. The device is offered in a commercial (C2) speed grade with the C2 indicating the specific performance tier, and the industrial-grade versions are also available within the family.

Architecturally, Stratix III E uses Altera's adaptive logic module (ALM) structure that doubles register density per 6-input LUT compared to the previous generation. The 65 nm process and 1.1 V core voltage balance performance with dynamic power, while optional -2/-3/-4 speed grades allow designers to trade timing margin for power. The FC-FBGA-484 package provides a high-density, low-parasitic interconnect suitable for designs with high I/O utilization.

Typical applications include high-speed serial backplane interfaces, software-defined radio, video processing pipelines, military/aerospace signal intelligence, ASIC prototyping, and high-performance DSP co-processing. The combination of 18x18 multipliers, MLAB/M9K memory, and abundant user I/O suits parallel compute, image processing, and protocol-bridging designs.

When designing with this device, ensure the PCB BGA breakout accommodates 1.0 mm pitch routing, supply decoupling follows Altera's PowerPlay guidance, and configuration is via JTAG or AS configuration schemes. Stratix III E is now in last-time-buy status in many channels; verify lifecycle before committing to new designs.

ドロップイン代替品: EP3SE50F484C2 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EP3SE50F484C2 （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Family, Process Technology, Embedded Memory.

EP3SE50F484C2G

Intel

Operating Temperature: 0 °C to +85 °C (TJ)

Process Technology: 40 nm TSMC low-power CMOS

比較対象 EP3SE50F484C2 →

EP3SE50F484C2N

Intel

Package: 484-ball FCBGA (F484, 23x23 mm, 1.0 mm pitch)

Operating Temperature: 0C to +85C (Commercial)

Family: Stratix III E FPGA

比較対象 EP3SE50F484C2 →

EP3SE50F484C3

Altera

Package: 484-ball FBGA (FineLine BGA)

Operating Temperature: 0C to 85C (Commercial)

Process Technology: 40 nm TSMC

比較対象 EP3SE50F484C2 →

EP3SE50F484C3G

Intel

Package: 484-ball FCBGA (F484), 1.0 mm pitch

Operating Temperature: 0C to +85C (commercial, "C")

Family: Stratix III E

比較対象 EP3SE50F484C2 →

EP3SE50F484C3N

Intel

Package: 484-ball FBGA (FCBGA), 1.0 mm pitch

Operating Temperature: 0C to +85 C (commercial, C suffix)

Family: Stratix III E

比較対象 EP3SE50F484C2 →

EP3SE50F484C4

Intel

Package: FBGA-484 (FCBGA)

Operating Temperature: 0C to 85 C (commercial)

Family: Stratix III E

比較対象 EP3SE50F484C2 →

EP3SE50F484C4G

Intel

Package: 484-BBGA, FCBGA

Embedded Memory: 5.49 Mbit

比較対象 EP3SE50F484C2 →

EP3SE50F484I3

Intel

Package: 484-ball FCBGA (FineLine BGA), 1.0 mm pitch

Family: Stratix III E

Embedded Memory: 5,760 Kbits

比較対象 EP3SE50F484C2 →

EP3SL50F484C2

Intel

Package: 484-BBGA, FCBGA (FineLine BGA)

Operating Temperature: 0 C to 85 C (commercial)

Family: Stratix III L (low-power)

比較対象 EP3SE50F484C2 →

EP3SL50F484C2G

Intel

Package: 484-ball FCBGA (FBGA-484)

Family: Stratix III L

Process Technology: 65 nm CMOS

比較対象 EP3SE50F484C2 →

EP3SL50F484C2N

Altera

Package: 484-ball FC-FBGA (Flip-Chip)

Family: Stratix III

Embedded Memory: 2,184,192 bits

比較対象 EP3SE50F484C2 →

クイック比較ツール — 並列比較する代替部品を選択:

EP3SE50F484C2N

✅ ドロップイン ⚠️ 仕様未検証

Intel

📦 484-ball FC-FBGA

Stratix III E · Stratix III E FPGA · 47,500 · 2,304 Kbits · 264 · 296 · 1,900 · 0.9 V / 1.1 V

✓ 在庫あり

$5934.83 / 個

データシートを見る →

EP3SE50F484C3

✅ ドロップイン ⚠️ 仕様未検証

Altera

📦 484-ball FC-FBGA

Stratix III E (Enhanced) · 47,500 · 19,000 · 5,760 Kbits · 384 · 296

✓ 在庫あり

$820 / 個

データシートを見る →

EP3SE50F484C4

✅ ドロップイン ⚠️ 仕様未検証

Intel

📦 484-ball FC-FBGA

Stratix III E · 47,500 · 5,760 Kbits · 296 · 1900 · FBGA-484 (FCBGA) · 0C to 85 C (commercial)

✓ 在庫あり

$215 / 個

データシートを見る →

EP3SE50F484I3

✅ ドロップイン ⚠️ 仕様未検証

Intel

📦 484-ball FC-FBGA

Stratix III E · 47,500 · 1,900 · 5,760 Kbits · 296 · 65 nm · 1.1 V · 484-ball FCBGA (FineLine BGA), 1.0 mm pitch

✓ 在庫あり

$188 / 個

データシートを見る →

EP3SE110F484C2

✅ ドロップイン

📦 484-ball FC-FBGA

larger 110K LE die in same 484-ball FC-FBGA footprint; 296 I/O, same 1.1V core, same C2 speed grade (logic density +131%)

📋 参考代替品（カタログ未掲載）

ℹ️ 1 異なるパッケージの部品は非表示 — パッケージが異なるとPCBの作り直しが必要で、真のドロップイン代替品ではありません。お問い合わせ異なるパッケージの提案が必要な場合。

EP3SE50F484C2 最大定格＆電気的特性

Family	Stratix III Enhanced (Stratix III E)
Logic Elements (LE)	47,500
Logic Array Blocks (LABs)	1,900
Embedded Memory (M9K + MLAB)	5,760,000 bits
User I/O Pins	296
最大クロック周波数	600 MHz
Process Technology	65 nm
Core Supply Voltage	1.1 V
パッケージ	484-ball FC-FBGA (FCBGA)
Speed Grade	C2 (commercial, fast)
実装タイプ	Surface Mount (BGA)
Configuration Interface	JTAG / Active Serial (AS)
DSP Blocks	18x18 dedicated multipliers
RoHS ステータス	Compliant

EP3SE50F484C2 484-ball fc-fbga (fcbga) ピン配置ガイド

EP3SE50F484C2 (484-ball fc-fbga (fcbga) パッケージ) のピン配置。このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。

EP3SE50F484C2 の 484-ball fc-fbga (fcbga) パッケージピン配置図

詳細なピン配置データはありません: EP3SE50F484C2.

詳細はデータシートをご参照ください。

主な用途

EP3SE50F484C2 の用途: 6 件s: Software-Defined Radio (SDR) Baseband, High-Performance DSP Co-Processing, Video and Image Processing Pipelines, Telecom Protocol Bridging and Aggregation, ASIC Prototyping and Emulation, Industrial Test and Measurement.

🌐

Software-Defined Radio (SDR) Baseband

The EP3SE50F484C2 is well suited for SDR baseband processing where 47,500 logic elements combined with 18x18 dedicated multipliers provide sufficient throughput for symbol-rate demodulation and channel decoding. The 5.76 Mbit embedded memory holds multiple frames of soft-decision samples without external buffer fetches. The 296 user I/Os support parallel ADC/DAC lanes and high-bandwidth CPRI/OBSAI links to the RF front end. Its 600 MHz clock budget enables fast Fourier transforms and turbo-decoder pipelines; in modern designs engineers migrate to Cyclone V/Stratix V for hardened transceivers, but the EP3SE50F484C2 remains a proven workhorse in legacy radio platforms.

おすすめ

🖥️

High-Performance DSP Co-Processing

The EP3SE50F484C2 accelerates DSP kernels such as FIR filtering, FFT/iFFT, and matrix multiplies using its dedicated multiplier blocks, easing the host CPU. With 1,900 LABs and MLAB/M9K memory blocks it can sustain 600 MHz DSP clock rates, and the 1.1 V core voltage reduces dynamic power versus older Stratix II platforms. The 296 I/Os host multiple standard parallel LVDS pairs for high-speed bus interfaces, and the 484-ball FC-FBGA package supports clean power-delivery network design. This part targets DSP-rich data-acquisition pipelines and is now deployed in industrial instrumentation and defense signal-intelligence systems.

おすすめ

EP3SE260F1152C2 · Intel EP3C80F484C8 · Intel

📺

Video and Image Processing Pipelines

The EP3SE50F484C2 handles real-time video processing such as de-interlacing, scaling, color-space conversion, and edge detection. The M9K memory blocks hold multiple scan-line buffers for 2D filters, and the 18x18 multipliers handle pixel-rate DSP kernels like Sobel or convolution. The 296 I/Os accept parallel RGB/YUV buses from HD-SDI decoders and feed HDMI/DVI transmitters. The 484-ball FC-FBGA package offers the high pin-count needed for parallel digital video plus an external DDR2/DDR3 memory interface. Use cases include broadcast equipment, medical imaging pipelines, and industrial machine-vision platforms.

おすすめ

EP3CLS150F484C8 · Intel EP3C55U484I7 · Altera

🌐

Telecom Protocol Bridging and Aggregation

The EP3SE50F484C2 bridges between telecom interfaces - for example, mapping 10G CPRI packets into Ethernet, or aggregating E1/T1 streams into packet networks. The 47,500 logic elements plus embedded memory accommodate deep packet buffers, while the 600 MHz clock and 296 I/Os handle multi-lane LVDS bus interfaces. The 484-ball FC-FBGA footprint supports DDR3 external memory needed for packet store-and-forward operation. This FPGA remains deployed in legacy telecom backhaul equipment, where migration to newer ASICs is uneconomic. Industrial-grade EP3SE50F484I3/I4 variants extend operation to outdoor cabinets.

おすすめ

EP3SE260H780C4 · Intel EP3SE110F1152C2 · Intel

🔧

ASIC Prototyping and Emulation

The EP3SE50F484C2 is used to prototype and validate ASIC designs before tape-out, leveraging Quartus II synthesis, fast iteration cycles, and abundant logic for bring-up and debug. Its 47,500 logic elements emulate mid-range SoC glue logic, DSP accelerators, and peripheral controllers. The 484-ball FC-FBGA exposes many I/Os for connecting to the prototype target board, and 5.76 Mbit embedded memory serves as scratch registers between FPGA and host. For very large ASICs, multiple EP3SE50F484C2 parts are stacked via an FPGA-to-FPGA interconnect or partitioned across a debug logic analyzer.

おすすめ

EP3SE260F1517C2 · Altera EP3CLS200F780C7 · Altera

🏭

Industrial Test and Measurement

The EP3SE50F484C2 drives real-time test equipment such as protocol analyzers, radar simulator back-ends, and precision measurement instruments. Its 600 MHz clock and 18x18 multipliers handle high-speed correlation and FFT routines, while the 5.76 Mbit embedded memory holds deep sample captures. The 296 I/Os accept multiple LVDS sensor inputs in parallel, and the 1.1 V core plus robust clock-management PLL simplify frequency synthesis. Industrial temp grades (EP3SE50F484I3/I4) enable use in outdoor and ruggedized equipment. Quartus II IDE delivers deterministic timing closure with TimeQuest, supporting repeatable instrumentation.

おすすめ

EP3SE110F780C2 · Intel EP3C80U484C6 · Intel

おすすめ製品の概要

EP3SE110F780C2 Intel 使用用途: Software-Defined Radio (SDR) Baseband, Industrial Test and Measurement EP3CLS200F780C8 Altera 使用用途: Software-Defined Radio (SDR) Baseband EP3SE260F1152C2 Intel 使用用途: High-Performance DSP Co-Processing EP3C80F484C8 Intel 使用用途: High-Performance DSP Co-Processing EP3CLS150F484C8 Intel 使用用途: Video and Image Processing Pipelines EP3C55U484I7 Altera 使用用途: Video and Image Processing Pipelines EP3SE260H780C4 Intel 使用用途: Telecom Protocol Bridging and Aggregation EP3SE110F1152C2 Intel 使用用途: Telecom Protocol Bridging and Aggregation EP3SE260F1517C2 Altera 使用用途: ASIC Prototyping and Emulation EP3CLS200F780C7 Altera 使用用途: ASIC Prototyping and Emulation EP3C80U484C6 Intel 使用用途: Industrial Test and Measurement

What is the logic element count of EP3SE50F484C2?

The EP3SE50F484C2 contains 47,500 logic elements organized into 1,900 Logic Array Blocks (LABs). According to the Intel Stratix III device datasheet, the ALM-based architecture delivers up to 2x the register density per 6-input LUT versus the prior Stratix II generation. This LE capacity suits mid-complexity DSP and signal processing designs.

What package does EP3SE50F484C2 use?

The EP3SE50F484C2 is housed in a 484-ball FC-FBGA (FineLine BGA, FCBGA) package. The FCBGA variant supports high pin-count, high-speed designs with low inductance interconnects. Surface-mount PCB assembly and BGA-grade X-ray inspection are required. Package thickness, ball diameter, and pitch should be confirmed against the Intel package specification.

What is the maximum user I/O count of EP3SE50F484C2?

The EP3SE50F484C2 provides 296 user I/O pins. The 484-ball FCBGA package reserves the remainder of balls for power, ground, and configuration pins. Sufficient I/O count supports parallel memory buses, video links, and multiple high-speed peripheral interfaces in a single device.

What process node and core voltage does EP3SE50F484C2 use?

The EP3SE50F484C2 is fabricated on a 65 nm CMOS process with a 1.1 V core supply. According to Intel Stratix III documentation, the 1.1 V core reduces dynamic power versus the 1.2 V Stratix II at comparable performance. The 65 nm node balances speed with leakage for mid-density programmable logic.

What is the embedded memory capacity of EP3SE50F484C2?

The EP3SE50F484C2 integrates 5,760,000 bits of embedded memory in M9K blocks plus MLAB (Memory Logic Array Block) resources. According to the Stratix III datasheet, M9K blocks can be configured as single-port, simple dual-port, or true dual-port RAM, supporting FIFO, shift register, and lookup table operations critical for DSP pipelines.

Is EP3SE50F484C2 still in production?

The EP3SE50F484C2 has reached last-time-buy status, meaning Intel/Altera has announced EOL for the Stratix III family. New orders are typically accepted only during a final window, with no guaranteed future supply. Designers of new products should consider Stratix IV, Stratix V, or Cyclone V E equivalents. Check authorized distributors for remaining stock.

Where to buy EP3SE50F484C2 online?

The EP3SE50F484C2 can be purchased from authorized distributors including DigiKey, Mouser, and authorized aftermarket brokers such as Lisleapex, Xecor, and Jotrin Electronics. As of 2026-09-09, stock is limited due to last-time-buy status. Buyers should verify lot date codes and request traceability certificates to avoid counterfeit parts.

What is the price of EP3SE50F484C2?

As of 2026-09-09, the EP3SE50F484C2 lists at approximately 1250 USD per unit for qty 1 at distributors carrying remaining stock. Bulk pricing tiers at qty 10, 100, 500, and 1000 reduce unit cost significantly. Due to EOL/last-time-buy status, aftermarket prices may vary widely; request multiple quotes.

What is the lead time for EP3SE50F484C2?

Lead time for EP3SE50F484C2 is variable because the part is in last-time-buy status. Authorized distributors may have limited stock with same-day shipment, while aftermarket brokers typically quote 4-12 weeks depending on factory inventory. As of 2026-09-09, design teams should plan for reduced inventory and consider migration to active FPGA families.

EP3SE50F484C2 vs EP3SE50F780C2 - which is better?

The EP3SE50F484C2 (484-ball FCBGA) and EP3SE50F780C2 (780-ball FCBGA) share identical silicon and 47,500 logic elements but differ in package pin count. The 780-ball version provides more I/O and external memory interface pins; the 484-ball version suits space-constrained boards. Both share the same -C2 commercial speed grade and identical silicon performance.

When should I choose EP3SE50F484C2 over a newer Stratix V?

The EP3SE50F484C2 should be chosen only when extending an existing Stratix III design or holding a long-lifecycle BOM in inventory. For new designs, the Stratix V, Cyclone V, or Cyclone 10 LP families offer lower core voltages, hardened transceivers, higher logic density, and active lifecycle support. Migration tools in Quartus Prime ease porting.

What is the best drop-in replacement for EP3SE50F484C2?

There is no direct drop-in equivalent to EP3SE50F484C2, but the EP3SE50F780C2 in the 780-ball FCBGA offers identical silicon with more I/O, while industrial-grade EP3SE50F484I3/I4 variants share the 484-ball FCBGA footprint. For modern designs, the Cyclone V E 5CEFA7F23 (similar LE count, FBGA package) is a functional migration path with PCB rework.

Where to download EP3SE50F484C2 datasheet PDF?

The EP3SE50F484C2 datasheet is available from the Intel Programmable Solutions Group website under the Stratix III device handbook. The datasheet covers DC/AC switching characteristics, pin connections, configuration schemes, and timing models. Authorized distributors such as DigiKey and Mouser also host a copy in their product detail pages.

Where to find EP3SE50F484C2 pinout (ball map)?

The EP3SE50F484C2 pinout (ball map) is published in the Stratix III device handbook chapter covering the 484-ball FineLine BGA package. The handbook provides pad-by-pad ball coordinates, differential-pair assignments, and bank diagrams. Designers should consult the latest revision before PCB layout to verify signal integrity assignments.

What are the key specifications engineers should know about EP3SE50F484C2?

The EP3SE50F484C2 integrates 47,500 logic elements, 1,900 LABs, 5.76 Mbits embedded memory, 296 user I/Os, 18x18 multipliers, and a 600 MHz maximum clock, fabricated on a 65 nm process with a 1.1 V core, housed in a 484-ball FC-FBGA. The -C2 suffix denotes the commercial fast speed grade. The part is now in last-time-buy status. Source: Intel Stratix III datasheet.

エンジニアリング参考データ: EP3SE50F484C2 — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose EP3SE50F484C2 when extending an existing Stratix III design that requires the -C2 commercial fast speed grade and 47.5K logic elements. For industrial or extended-temp deployments, prefer the EP3SE50F484I3/I4 with the same package. Choose the EP3SE110F484C2 if your design exceeds 47.5K logic elements while keeping the same 484-ball FC-FBGA footprint. For new designs, evaluate Stratix V, Cyclone V, or Cyclone 10 LP - these active families offer lower core voltages, hardened transceivers, and longer lifecycle support. Always check current lifecycle status with authorized distributors before committing to a BOM.

代替品との比較

パラメータ	この製品	EP3SE50F484C2N	EP3SE50F484C3	EP3SE50F484C4	EP3SE50F484I3	EP3SE110F484C2
Brand	Intel (formerly Altera)	Intel	Intel	Intel	Intel	Intel
Package	484-ball FC-FBGA	484-ball FC-FBGA - same	484-ball FC-FBGA - same	484-ball FC-FBGA - same	484-ball FC-FBGA - same	484-ball FC-FBGA - same
Logic Elements	47,500	47,500	47,500	47,500	47,500	110,000
Speed Grade	C2	C2	C3	C4	I3	C2
Temperature Grade	Commercial	Commercial	Commercial	Commercial	Industrial	Commercial
User I/O	296	296	296	296	296	296
Core Voltage	1.1 V	1.1 V	1.1 V	1.1 V	1.1 V	1.1 V
Lifecycle	Last-time-buy	Last-time-buy	Last-time-buy	Last-time-buy	Last-time-buy	Last-time-buy

主な差別化要因

Same silicon as EP3SE110F484C2 with smaller LE count, freeing logic resources for lower-cost designs （vs EP3SE110F484C2)
Faster speed bin (C2) versus C3/C4 alternatives （vs EP3SE50F484C3 / EP3SE50F484C4)
Commercial temp range versus industrial-grade alternatives （vs EP3SE50F484I3 / EP3SE50F484I4)

設計ノート

The 484-ball FC-FBGA package requires PCB stackup planning for controlled-impedance signal traces, microvia-in-pad technology, and proper BGA pad geometry. Verify escape routing density against the BGA pitch (consult the package spec sheet). Use 0.8 mm or 1.0 mm pitch escape per Intel layout guidelines. Place decoupling capacitors within the BGA footprint on the opposite PCB layer for low PDN impedance, and use the largest possible number of GND balls in the center field.

The Stratix III E family requires multiple power rails: 1.1 V core, 2.5 V/3.3 V I/O banks, and a 1.2 V PLL supply. Estimate the core current using the PowerPlay Early Power Estimator (EPE) before finalizing the regulator selection. Use a multi-phase buck regulator for the 1.1 V rail to meet transient response under dynamic load. Decouple each power ball with 0.1 uF + 10 uF bulk ceramic, and add a ferrite bead on analog supply lines.

For high-speed DDR3/DDR2/QDRII+ external memory interfaces, route signal traces with matched length and controlled 50 ohm impedance; use fly-by topology with proper termination VTT at the memory bus. Differential pairs (LVDS) require 100 ohm differential impedance and 0.5 mm-1 mm intra-pair skew control. Validate via TimeQuest timing analyzer in Quartus II before sign-off, and follow Intel Stratix III device handbook pinout guidelines for optimal bank placement.

Do not exceed the maximum I/O voltage (3.3 V LVTTL/LVCMOS) on user I/O banks; 1.5 V/1.8 V HSTL/SSTL memory interfaces require proper bank VCCIO selection. When migrating between speed grades (C2/C4/I3/I4), verify timing closure on critical paths - a slower grade may not meet frequency targets. Confirm configuration mode (AS / JTAG) and pull-up on MSEL pins before PCB build. Check that the JTAG chain order matches the Quartus II programming file.