EP3SL70F780I4N - 67.5K LE Stratix III L FPGA 780-FBGA | Intel
部品番号: EP3SL70F780I4N ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1121.83 | $1,121.83 |
| 10 | $1080.5 | $10,805.00 |
| 100 | $985.2 | $98,520.00 |
| 250 | $920 | $230,000.00 |
| 500 | $875.4 | $437,700.00 |
EP3SL70F780I4N 概要
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources such as block RAM, DSP slices, PLLs, and high-speed I/O serializers. FPGAs occupy the middle ground between ASICs (high NRE, high volume) and microcontrollers (fixed architecture, software-defined); they deliver hardware-level parallelism and reconfigurability, making them ideal for prototyping, low-volume production, and workloads requiring deterministic latency such as digital signal processing, video pipelines, and high-speed protocol bridging.
Key features of the EP3SL70F780I4N include 2,700 Logic Array Blocks (LABs), integrated memory controllers, 24 transceiver channels supporting multi-gigabit serial protocols, and partial reconfiguration capability that allows portions of the logic fabric to be reprogrammed while the rest continues operating. The device supports industrial-grade operating conditions (-40C to +100C junction) and uses Altera's Quartus II design suite for synthesis, place-and-route, and timing closure.
Architecturally, the Stratix III L family uses adaptive logic modules (ALMs) that pack 8-input fracturable look-up tables and registers into flexible logic units, allowing efficient implementation of both arithmetic and random-logic functions. The 65nm process and dedicated low-power modes reduce static leakage compared to the standard Stratix III E family, while preserving I/O bandwidth through LVDS, LVTTL, HSTL, and SSTL support.
Typical applications include high-speed data acquisition, software-defined radio (SDR), video broadcasting equipment, medical imaging front-ends, industrial control with real-time Ethernet, and military/aerospace signal processing. The 780-FBGA package also supports designs requiring high pin count for parallel memory buses or multiple high-speed serial links.
Designers should plan power sequencing (VCCINT before VCCAUX) and thermal dissipation carefully, since a fully utilized EP3SL70 at 500 MHz can dissipate 6-10W, requiring thermal vias under the package and adequate airflow. Quartus II PowerPlay early power estimation is recommended before PCB commitment.
This page synthesizes distributor pricing, same-family drop-in Stratix III L alternatives, and practical FPGA design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: EP3SL70F780I4N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3SL70F780I4N （同一形状・フットプリント） — 相違点: Speed Grade, Package, Core Voltage, Process Technology, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
EP3SL70F780I4LN
✅ ドロップイン✓ 在庫あり
$1245 / 個
データシートを見る →EP3SL70F780I3N
✅ ドロップイン✓ 在庫あり
$1240 / 個
データシートを見る →EP3SL70F780I4
✅ ドロップイン✓ 在庫あり
$1850 / 個
データシートを見る →EP3SL50F780I4N
✅ ドロップイン✓ 在庫あり
$545 / 個
データシートを見る →EP3SL70F780C4N
✅ ドロップイン✓ 在庫あり
$1210 / 個
データシートを見る →EP3SL70F780C3N
✅ ドロップイン✓ 在庫あり
$198 / 個
データシートを見る →EP3SL70F780I4N 最大定格＆電気的特性
| Family | Stratix III L (low-power) |
| Logic Elements (LE) | 67,500 |
| Logic Array Blocks (LABs) | 2,700 |
| Embedded Memory Bits | 2,699,264 |
| User I/Os | 488 |
| パッケージ | 780-Ball FC-FBGA (29x29 mm) |
| Process Technology | 65 nm CMOS |
| Core Voltage (VCCINT) | 1.1 V |
| Auxiliary Voltage (VCCAUX) | 0.9 V |
| Maximum Operating Frequency | 500 MHz |
| Transceivers | 24 channels |
| DSP Blocks | Yes (18x18 multipliers) |
| 動作温度 | -40C to +100C (Industrial) |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| Speed Grade | I4 (faster) |
| Lead-Free | Yes |
EP3SL70F780I4N 780-ball fc-fbga (29x29 mm) ピン配置ガイド
EP3SL70F780I4N (780-ball fc-fbga (29x29 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP3SL70F780I4N.
詳細は データシート をご参照ください。
主な用途
EP3SL70F780I4N の用途: 7 件s: High-Speed Data Acquisition Systems, Software Defined Radio (SDR) Baseband, Video Broadcasting and Image Processing, Industrial Real-Time Ethernet Control, Medical Imaging Front-End Processing, Military and Aerospace Signal Processing, ASIC Prototyping and Emulation.
High-Speed Data Acquisition Systems
The EP3SL70F780I4N's 488 user I/Os, 24 transceiver channels, and 2.7Mbit embedded memory make it well-suited for multi-channel data acquisition front-ends. Its 65nm architecture supports parallel LVDS capture at up to 840 Mbps per channel, allowing aggregate throughput above 10 Gbps into on-chip block RAM buffers. The 780-FBGA package provides ample balls for differential pair routing and separate analog/digital ground domains.
おすすめ
Software Defined Radio (SDR) Baseband
For SDR baseband processing, the EP3SL70F780I4N's DSP blocks (18x18 multipliers) and high-speed transceivers handle multi-carrier digital down-conversion, channelization, and demodulation in a single fabric. The Stratix III L variant reduces static leakage compared to the E family, important in always-on base stations. Its industrial temperature range and 500 MHz Fmax meet outdoor small-cell requirements.
おすすめ
Video Broadcasting and Image Processing
The EP3SL70F780I4N delivers sufficient logic and memory bandwidth for 3G-SDI, HD-SDI, and emerging 4K/UHD video pipelines. Its embedded multipliers accelerate motion estimation and DCT/IDCT transforms, while 488 I/Os accept multiple parallel video streams from sensor arrays. Quartus II Video and Image Processing Suite (VIP) provides ready-to-use IP cores for color space conversion and scaling.
おすすめ
Industrial Real-Time Ethernet Control
With 488 I/Os and industrial temperature grade, the EP3SL70F780I4N handles EtherCAT, PROFINET IRT, or TSN protocol stacks with deterministic sub-microsecond latency. Its 65 nm low-power architecture suits factory-floor PLCs and motor controllers. The 780-FBGA package supports multiple MII/RGMII interfaces for redundant Ethernet ports and fieldbus gateways.
おすすめ
Medical Imaging Front-End Processing
In CT, MRI, and ultrasound systems, the EP3SL70F780I4N's parallel logic fabric performs beamforming, image reconstruction, and real-time filtering. Its industrial temp grade and high reliability suit medical equipment operating 24/7. The 2.7Mbit embedded memory buffers raw ADC samples before DMA to host processors; partial reconfiguration enables mode switching (preview vs diagnostic) without downtime.
おすすめ
Military and Aerospace Signal Processing
The EP3SL70F780I4N industrial temperature grade and high logic density suit ruggedized signal processing in avionics, radar, and electronic warfare subsystems. Its transceivers support protocol-agnostic serial links to RF front-ends and backplane fabrics. The 780-FBGA substrate tolerates conformal coating and the thermal envelopes typical of sealed military enclosures when properly heat-sunk.
おすすめ
ASIC Prototyping and Emulation
The EP3SL70F780I4N's 67.5K LEs provide ample capacity for partitioning and prototyping medium-complexity ASIC designs before tape-out. Quartus II incremental compilation allows multiple engineers to work in parallel on the same device. The 780-FBGA package exposes abundant GPIO for bridging to external test fixtures and logic analyzers during ASIC bring-up.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3SL70F780I4N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3SL70F780I4LN | EP3SL70F780I3N | EP3SL70F780I4 | EP3SL50F780I4N | EP3SL70F780C4N |
|---|---|---|---|---|---|---|
| Package | 780-Ball FC-FBGA (29x29 mm) | 780-Ball FC-FBGA (29x29 mm) - same | 780-Ball FC-FBGA (29x29 mm) - same | 780-Ball FC-FBGA (29x29 mm) - same | 780-Ball FC-FBGA (29x29 mm) - same | 780-Ball FC-FBGA (29x29 mm) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 67,500 | 67,500 - same | 67,500 - same | 67,500 - same | 51,800 (-23%) | 67,500 - same |
| Speed Grade | I4 | I4 - same | I3 (slower) | I4 - same | I4 - same | C4 (commercial temp, I4 speed) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial - same | Industrial - same | Industrial - same | Industrial - same | Commercial (0C to +85C) |
| User I/Os | 488 | 488 - same | 488 - same | 488 - same | 488 - same | 488 - same |
| Embedded Memory (bits) | 2,699,264 | 2,699,264 - same | 2,699,264 - same | 2,699,264 - same | 2,143,872 (-21%) | 2,699,264 - same |
| Process / Core Voltage | 65 nm / 1.1 V | 65 nm / 1.1 V - same | 65 nm / 1.1 V - same | 65 nm / 1.1 V - same | 65 nm / 1.1 V - same | 65 nm / 1.1 V - same |
| Lifecycle | NRND | NRND | NRND | NRND | NRND | NRND |
主な差別化要因
- I4 speed grade provides highest Fmax in Stratix III L 780-FBGA family （vs EP3SL70F780I3N)
- Industrial temperature grade covers widest operating range in same package （vs EP3SL70F780C4N)
- Highest LE count in 780-FBGA I4 industrial speed grade （vs EP3SL50F780I4N)
- Low-power Stratix III L family reduces static leakage vs Stratix III E （vs EP3SE50F780I4N)
設計ノート
Estimated: A fully utilized EP3SL70F780I4N at 500 MHz with high toggle rates can dissipate 6-10 W. The 1.1V VCCINT rail must supply up to 5 A with less than 30 mV peak-to-peak ripple - use a buck converter with at least 20% current headroom (e.g., 6 A rated) and bulk-decoupling of 4x 220 uF polymer plus 20x 100 nF ceramics near the package. Power sequencing (VCCINT before VCCAUX, VCCAUX before VCCIO) is mandatory to prevent latch-up; use a sequencer IC such as the LM3880 or TPS3808.
The 780-FBGA has a typical theta_JB of 4 C/W; with a 7 W dissipation, junction-to-board temperature rise is ~28C. Design PCB with a full thermal-via array (0.3 mm pitch) under the package center connected to internal copper planes; for ambient > 60C or chassis-mounted applications, attach a heatsink with thermal interface material. Quartus II PowerPlay early power estimator should be run with realistic toggle rates before layout commitment.
Use 1.0 mm ball pitch BGA fanout with microvia-in-pad or 8-mil dogbone escape routing. Maintain 100-ohm differential impedance for LVDS pairs (typical 4-mil/8-mil stripline in 0.2 mm stackup). Split ground planes: digital ground for I/O banks and transceivers, analog ground for PLL/JTAG; join at a single point under the package. Match length within 25 mils for high-speed LVDS groups.
Do not use EP3SL70F780I4N for new designs - it is NRND; consider Stratix V (5SGXEA7) or Cyclone V (5CEFA7) instead, but note these require different packages. When migrating a design, re-run timing closure since architecture differences between L and E variants affect DSP block inference. JTAG chain ordering matters: place the EP3SL70 first in the chain for boundary-scan bring-up. Always validate configuration mode (AS, PS, FPP, JTAG) using the actual EPCS/EPCQ flash part number shipped, not the generic Quartus assignment.
Transceiver channels require AC-coupled differential routing with characteristic impedance of 85-100 ohms; reference plane continuity is critical across the entire channel. Place AC-coupling capacitors (10 nF X7R) within 100 mils of the receiver pins. For LVDS inputs at > 600 Mbps, add a 100-ohm differential source termination at the FPGA pin side. Use IBIS or HSpice simulation for critical interfaces, since the Quartus II Fitter does not model transmission-line effects.
コンプライアンス情報
RoHS compliance confirmed per Intel/Altera product declaration. AEC-Q100 not applicable (FPGA is not an automotive-qualified part number; consult Intel auto-grade Cyclone or Arria for AEC-Q100 needs). Halogen-free status not explicitly published for this part - marked unknown.
