EP3SL70F484I3G - Stratix III L FPGA 67.5K LE, 484-FCBGA | Intel / Altera
部品番号: EP3SL70F484I3G ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $330 | $165,000.00 |
| 1,000 | $305 | $305,000.00 |
EP3SL70F484I3G 概要
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric is configured via an SRAM or flash bitstream, enabling parallel hardware acceleration of algorithms that would be too slow on a CPU. The Stratix III family is positioned within Altera's high-end programmable logic portfolio, sitting above Cyclone low-cost FPGAs and below the Stratix V/Stratix 10 flagship generations. It addresses mid- to high-density designs in communications, signal processing, and embedded compute.
Key differentiating specifications of the EP3SL70F484I3G include its 24 transceiver channels, dedicated DSP blocks for high-throughput fixed- and floating-point operations, on-chip triplicated register and lockstep structures for single-event upset mitigation, and support for external memory interfaces including DDR3 SDRAM up to 800 MHz. The 484-pin FCBGA package provides a high-density ball grid that supports the wide I/O count and signal-integrity demands of multi-gigabit serial links.
Architecturally, the Stratix III L family uses a low-power variant of the Stratix III fabric with reduced static power consumption and 1.0V core operation, while retaining the same ALM architecture, MLAB memory blocks, and 8T/9T SRAM. Designers can compile bitstreams in Altera Quartus II and target a broad IP library for memory controllers, Ethernet MACs, PCIe Gen1/Gen2, and DSP kernels.
Typical applications include wireless baseband DSP, serial backplane aggregation, ASIC prototyping, test and measurement instrumentation, and high-speed serial protocol bridging. Designers choose Stratix III L when they need a balanced mix of logic density, transceiver bandwidth, and power efficiency.
When designing with this device, follow the Altera Stratix III handbook guidelines for PCB power-plane stacking, transceiver channel routing, and decoupling - the FCBGA substrate demands matched-length differential pairs and a controlled-impedance stackup. Configuration via JTAG or serial flash is supported.
This page synthesizes distributor pricing, drop-in alternatives within the Stratix III family, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: EP3SL70F484I3G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3SL70F484I3G （同一形状・フットプリント） — 相違点: Speed Grade, Operating Temperature, Package, Family, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
EP3SL70F484I3
✅ ドロップイン✓ 在庫あり
$1013.66 / 個
データシートを見る →EP3SL70F484C4N
✅ ドロップイン✓ 在庫あり
$580 / 個
データシートを見る →EP3SL70F484C4LN
✅ ドロップイン✓ 在庫あり
$380 / 個
データシートを見る →EP3SL70F484C3G
✅ ドロップイン✓ 在庫あり
$985 / 個
データシートを見る →EP3SL70F484C4G
✅ ドロップイン✓ 在庫あり
$1485 / 個
データシートを見る →EP3SL70F484C4LG
✅ ドロップイン✓ 在庫あり
$1450 / 個
データシートを見る →EP3SL70F484I3G 最大定格＆電気的特性
| Series | Stratix III L |
| Family | Stratix III (low-power variant) |
| Logic Elements (LE) | 67,500 |
| Total Memory Bits | 2,699,264 |
| User I/O Pins | 296 |
| Transceivers | 24 |
| Package Type | 484-ball FCBGA (Fine-pitch Chip-Scale BGA) |
| Package Pin Count | 484 |
| Speed Grade | I3 |
| 動作温度範囲 | -40C to +100C (Industrial) |
| Core Voltage | 1.0 V |
| Process Technology | 40 nm TSMC |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| Configuration Interface | JTAG / Serial Passive / Active Serial |
EP3SL70F484I3G 484 ピン配置ガイド
EP3SL70F484I3G (484 パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP3SL70F484I3G.
詳細は データシート をご参照ください。
主な用途
EP3SL70F484I3G の用途: 6 件s: Wireless Baseband DSP, Serial Backplane Aggregation, ASIC Prototyping, Test and Measurement Instrumentation, High-Speed Protocol Bridging, Industrial Automation Controllers.
Wireless Baseband DSP
The EP3SL70F484I3G's 67,500 logic elements combined with its dedicated DSP blocks deliver the parallel multiply-accumulate throughput required for LTE, WiMAX, and proprietary wireless baseband signal chains. The 2,699,264 bits of on-chip SRAM handle symbol buffering and channel-state storage without external memory contention. The 24 transceivers support CPRI/OBSAI fronthaul to remote radio heads, replacing multiple external SERDES chips with on-die channels. Industrial temperature rating -40C to +100C allows outdoor base-station deployments. Designers typically instantiate FFT/iFFT cores, channel encoders/decoders, and crest-factor reduction blocks via the Quartus II IP library; the FCBGA package's matched-length differential pair routing preserves signal integrity on multi-GHz serial links.
おすすめ
Serial Backplane Aggregation
The 24 multi-gigabit transceivers on the EP3SL70F484I3G aggregate serial links across ATCA/AdvancedTCA backplanes, replacing multiple bridge ASICs with a single programmable device. Each channel supports protocol mapping for Ethernet, PCIe, Serial RapidIO, and Aurora, allowing the FPGA to perform protocol conversion between incompatible domains. The 296 user I/O pins provide ample parallel sideband connections to management controllers and timing references. The I3 speed grade and industrial temperature rating suit telco-central-office deployments where ambient temperatures fluctuate with HVAC load. Designers typically pair the device with external SFP+ cages and configure the transceiver reference clocks via the Stratix III L device handbook reference design.
おすすめ
ASIC Prototyping
The EP3SL70F484I3G serves as an in-system ASIC prototype because its ALM-based architecture maps efficiently to synthesized ASIC netlists. Designers partition large ASIC designs across multiple Stratix III L devices using TDM-based multi-FPGA partitioning tools; the FCBGA package supports high-density board-to-board connectors carrying the partitioning signals. The 24 transceivers model ASIC SERDES channels at near-real throughput, allowing pre-silicon firmware development. Industrial temperature rating supports pre-silicon board bring-up in lab environments that simulate production operating conditions. Quartus II compilation, combined with ASIC-equivalent synthesis libraries, enables accurate timing closure analysis well before silicon tape-out.
おすすめ
Test and Measurement Instrumentation
The EP3SL70F484I3G's high transceiver count and parallel processing capability suit it for digital oscilloscopes, protocol analyzers, and logic analyzers that capture multi-Gbps signals in real time. The 2,699,264 bits of on-chip SRAM serve as deep acquisition buffers, while the 296 I/O pins accommodate wide probe bus interfaces. The I3 industrial speed grade provides deterministic timing for high-accuracy trigger alignment, and the FCBGA package's signal integrity is essential for capturing fast edges without jitter degradation. Designers use the FPGA's DSP blocks to perform real-time FFT, eye-diagram analysis, and protocol decoding in-line with data acquisition.
おすすめ
High-Speed Protocol Bridging
The EP3SL70F484I3G bridges between serial protocols such as PCIe, Ethernet, SATA, and Serial RapidIO by instantiating multiple soft IP controllers in parallel on a single FPGA. The 24 transceivers handle multiple lanes of each protocol simultaneously, eliminating the need for external bridge chips. The 296 I/O pins expose parallel system buses for legacy device interfaces, supporting hybrid designs that mix modern and legacy connectivity. Industrial temperature rating makes the device suitable for factory-floor and outdoor equipment. Quartus II IP cores provide pre-validated controller implementations, reducing time-to-market.
おすすめ
Industrial Automation Controllers
The EP3SL70F484I3G operates reliably in -40C to +100C environments typical of industrial automation cabinets, with deterministic I/O timing required for motion control and servo loops. The 24 transceivers support industrial fieldbus protocols such as EtherCAT, Profinet, and CC-Link IE while 296 I/O pins connect to encoders, sensors, and safety relays. The device's 67,500 logic elements allow implementation of complete control law algorithms - PID loops, state machines, and trajectory planning - in parallel hardware rather than sequential firmware. The FCBGA package's robust thermal performance ensures long-term reliability in vibration-prone factory environments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3SL70F484I3G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3SL70F484I3 | EP3SL70F484C4N | EP3SL70F484C4LN | EP3SL70F484C3G | EP3SL70F484C4G | EP3SL70F484C4LG |
|---|---|---|---|---|---|---|---|
| Package | 484-Ball FCBGA | 484-Ball FCBGA - same | 484-Ball FCBGA - same | 484-Ball FCBGA - same | 484-Ball FCBGA - same | 484-Ball FCBGA - same | 484-Ball FCBGA - same |
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) |
| Logic Elements | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 |
| Memory Bits | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 |
| User I/O | 296 | 296 | 296 | 296 | 296 | 296 | 296 |
| Transceivers | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Speed Grade | I3 | I3 | C4 (slower, commercial) | C4L (slower, low-power) | C3 (commercial) | C4 (commercial) | C4L (low-power) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Core Voltage | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V |
主な差別化要因
- Industrial temperature rating with I3 speed grade （vs EP3SL70F484C4N (commercial))
- Lead-free 'G' suffix variant (RoHS compliant) （vs EP3SL70F484I3 (no 'G'))
- Same-density drop-in within Stratix III L family （vs EP3SL50F484I3G (50K LE variant))
設計ノート
The 484-ball FCBGA package demands a controlled-impedance PCB stackup with matched-length differential pairs for transceiver channels. Follow the Stratix III L device handbook reference layout: 1.0V and 1.5V/2.5V/3.3V supply planes must be decoupled with a dense array of 0.1uF and 10uF capacitors within 100 mils of each ball. Thermal vias (8-12 per supply ball cluster) under the package spreader are required for industrial temperature operation. Estimated: at maximum toggle rate the device draws approximately 3-5W, manageable with 4-layer copper pours but requiring attention in high-density designs.
Transceiver channel routing must comply with the Stratix III L PCB design guidelines: 85 ohm differential impedance, 100 ohm common-mode, and intra-pair skew under 5 mils for 6 Gbps operation. Reference clock routes must be length-matched to within 50 mils. Use GND-coplanar waveguides with stitch vias every 200 mils for high-speed serial channels. Avoid routing high-speed signals over plane splits - reference planes must be solid beneath all transceiver traces.
Do not assume pin compatibility between I3 (industrial) and C3/C4 (commercial) speed grades - timing models differ significantly. Configuration mode selection via MSEL pins must match the boot memory interface (JTAG/AS/PS/FPP). Quartus II compilation requires the device-specific speed-grade settings; reusing bitstreams between grades is not allowed. When migrating from industrial to commercial, validate the application's worst-case timing closure at the higher (commercial) junction temperatures.
コンプライアンス情報
RoHS/REACH compliant per Altera/Intel product declaration. AEC-Q100 does not apply to FPGAs (industrial-grade only). Lead-free (Pb-free) terminal finish per 'G' suffix.
