EP4CE55F23C8N - Cyclone IV E 55K LE FPGA, 484-FBGA | Intel
부품 번호: EP4CE55F23C8N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $89.5 | $895.00 |
| 100 | $84.25 | $8,425.00 |
| 500 | $79.1 | $39,550.00 |
| 1,000 | $74 | $74,000.00 |
EP4CE55F23C8N 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), embedded memory blocks, multipliers, and programmable I/O cells interconnected by a programmable routing fabric. FPGAs belong to the broader class of programmable logic devices (PLDs) and occupy the high-performance tier above CPLDs, enabling hardware-level parallelism for digital signal processing, custom interfaces, and glue-logic consolidation. Cyclone IV E is a low-power, cost-optimized family within Intel's Cyclone IV portfolio, positioned for high-volume, cost-sensitive applications.
Key differentiating features include the dedicated 18x18 multipliers supporting DSP applications at up to 200 MHz, embedded memory blocks (M9K) totaling 2,340 Kbits for FIFO and buffer designs, up to four general-purpose PLLs per device for clock synthesis, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The 324 user I/O pins support LVDS, SSTL, and LVCMOS I/O standards for direct interface to modern memory and high-speed peripherals.
The Cyclone IV E architecture combines the 60 nm process with a low-leakage SRAM cell to deliver low static and dynamic power consumption, typically 30 percent lower than the prior Cyclone III generation. This makes the EP4CE55F23C8N well suited for thermally constrained or fanless industrial enclosures where the 31x31 mm FBGA package offers efficient board area utilization with full signal-integrity performance.
Typical applications span industrial motor control and factory automation (PLL-driven encoder feedback), video processing and image-pipeline preprocessing, communication protocol bridging (PCI Express endpoint, Ethernet MAC, UART/SPI bridges), test and measurement instrumentation (custom trigger logic, high-speed data acquisition), and display controllers for industrial HMI panels. The 55K LE capacity also supports DSP co-processing for audio codecs and software-defined radio front-ends.
When designing with this device, plan FPGA I/O bank voltage assignment carefully; the EP4CE55F23C8N supports up to eight I/O banks each requiring independent VCCIO rails. For DDR2 interfaces, observe the 1.8 V VCCIO constraint and place decoupling capacitors per the Cyclone IV Device Handbook recommendations. Quartus Prime design software is the primary development toolchain.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a one-stop reference for the EP4CE55F23C8N in 484-FBGA.
드롭인 대체품: EP4CE55F23C8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CE55F23C8N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Embedded Memory, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CE55F23C8LN
✅ 드롭인✓ 재고 있음
$105 / 개
데이터시트 보기 →EP4CE55F23C8L
✅ 드롭인✓ 재고 있음
$112.9 / 개
데이터시트 보기 →EP4CE55F23C8
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EP4CE55F23C7N
✅ 드롭인✓ 재고 있음
$56.4 / 개
데이터시트 보기 →EP4CE55F23C6N
✅ 드롭인✓ 재고 있음
$54.92 / 개
데이터시트 보기 →EP4CE55F23A7N
✅ 드롭인✓ 재고 있음
$134.4 / 개
데이터시트 보기 →EP4CE55F23C8N 최대 정격 & 전기적 특성
| Family | Cyclone IV E |
| Logic Elements | 55,856 LE |
| Embedded Memory | 2,340 Kbit (M9K blocks) |
| Embedded Multipliers | 156 (18x18) |
| Maximum User I/O Pins | 324 |
| 패키지 | 484-ball FBGA (F23) |
| Process Technology | 60 nm low-power CMOS |
| Core Voltage | 1.2 V |
| 동작 온도 | 0 C to +85 C (Commercial, C8) |
| Speed Grade | 8 (Commercial) |
| PLLs | 4 general-purpose |
| Global Clock Networks | 20 |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant (Pb-free) |
| Lead-Free Finish | Yes (N suffix) |
EP4CE55F23C8N 484-ball fbga (f23) 핀 구성 가이드
EP4CE55F23C8N(484-ball fbga (f23) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CE55F23C8N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CE55F23C8N 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Processing and Image Pipeline, Communication Protocol Bridging, Test and Measurement Instrumentation, Industrial HMI Display Controllers, Audio DSP Co-Processing.
Industrial Motor Control
The EP4CE55F23C8N fits industrial motor control because it integrates 156 18x18 hardware multipliers running up to 200 MHz, enough throughput for field-oriented control (FOC) loops in PMSM and induction motor drives. The four on-chip PLLs cleanly derive high-resolution PWM carrier frequencies and encoder sample clocks from a single crystal, while the 324 user I/O pins accept multiple quadrature encoder inputs, Hall sensors, and gate-driver signals. Compared with a DSP-plus-MCU architecture, a single Cyclone IV E 55K eliminates inter-processor latency and lets the control loop run as parallel hardware. Use the M9K memory blocks for current/torque lookup tables and PI controller state retention between PWM ticks.
추천
Video Processing and Image Pipeline
The EP4CE55F23C8N is well matched to video processing because its 2,340 Kbits of M9K memory buffer at least one full 720p frame plus line buffers, and the 156 multipliers handle real-time color-space conversion, scaling, and 2D filtering. The Cyclone IV E family supports DDR/DDR2 SDRAM controllers in core logic, so the FPGA streams pixel data into external memory for downstream display panels or compression blocks. Its 324 I/O pins accommodate parallel RGB/TTL camera inputs or LVDS display outputs without an external bridge chip. Compared with a micro-DSP approach, the FPGA offers deterministic latency for synchronized multi-camera capture.
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Communication Protocol Bridging
The EP4CE55F23C8N is widely deployed in protocol bridging because its 55,856 LE accommodate concurrent Ethernet MAC, UART, SPI, I2C, and PCIe soft cores without timing closure issues. The four PLLs synthesize independent reference clocks for each interface domain, while 20 global clock networks distribute them across the fabric with low skew. Industrial protocols such as EtherCAT, PROFINET, and Modbus TCP fit comfortably in the available logic and M9K FIFO memory. Compared with a microcontroller, the FPGA's hardware parallelism handles line-rate traffic on multiple ports simultaneously.
추천
Test and Measurement Instrumentation
The EP4CE55F23C8N fits test and measurement because its 55K LE implement custom trigger logic, deep pattern generators, and high-speed data acquisition state machines that fixed-function ASICs cannot match. The 156 dedicated multipliers accelerate FFT and digital down-conversion blocks used in spectrum analysis. M9K memory blocks serve as deep sample buffers, and the four PLLs provide fine-frequency resolution for clock synthesis. Compared with benchtop instruments built from commercial FPGAs, the Cyclone IV E 55K reduces unit cost while preserving the determinism needed for repeatable measurements.
추천
Industrial HMI Display Controllers
The EP4CE55F23C8N suits HMI display controllers because it can drive LVDS or parallel RGB panels directly through its 324 user I/O pins, run a soft display controller and touch-screen interface core concurrently, and still leave logic headroom for application-layer glue logic. The 2,340 Kbits of embedded RAM hold multiple frame buffers without external memory for smaller QVGA/WVGA panels, while DDR2 SDRAM controllers handle larger 1080p HMI displays. Compared with an ARM Cortex-A SoC, the FPGA offers deterministic refresh timing critical for industrial operator panels.
추천
Audio DSP Co-Processing
The EP4CE55F23C8N is appropriate for audio DSP co-processing because the 156 hardware 18x18 multipliers deliver roughly 50 GMACs of FIR/IIR throughput, sufficient for multi-channel audio sample-rate conversion, EQ, and active noise cancellation. M9K memory blocks implement delay lines and ring buffers with deterministic latency. Compared with a dedicated DSP chip, the FPGA allows parameter updates in real time and supports multiple audio standards (I2S, TDM, S/PDIF) as soft cores. The 1.2 V core keeps power dissipation low for fanless audio products.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CE55F23C8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CE55F23C8LN | EP4CE55F23C8L | EP4CE55F23C8 | EP4CE55F23C7N | EP4CE55F23A7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA (F23) | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same |
| Logic Elements | 55,856 LE | 55,856 LE | 55,856 LE | 55,856 LE | 55,856 LE | 55,856 LE |
| Embedded Memory | 2,340 Kbit | 2,340 Kbit | 2,340 Kbit | 2,340 Kbit | 2,340 Kbit | 2,340 Kbit |
| Embedded Multipliers | 156 (18x18) | 156 | 156 | 156 | 156 | 156 |
| Maximum User I/O | 324 | 324 | 324 | 324 | 324 | 324 |
| Speed Grade | 8 (Commercial) | 8 | 8 | 8 | 7 | 7 |
| Operating Temperature | 0 C to +85 C (C suffix) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | Automotive grade |
| RoHS / Pb-free | Pb-free (N suffix) | Pb-free | Pb-free | Pb-finish (no N) | Pb-free | Pb-free |
| Approx. Unit Price (USD, qty 100) | 84.25 | 84.25 | 84.25 | 83.50 | 76.40 | 92.10 |
주요 차별점
- Speed grade 8 offers highest Fmax in the Cyclone IV E 55K family (vs EP4CE55F23C7N)
- Commercial temperature grade is lowest-cost 484-FBGA 55K option (vs EP4CE55F23A7N)
- Maximum logic capacity at this price point in Cyclone IV E (vs EP4CE40F23C8N)
설계 노트
The 484-FBGA F23 package uses a 1.0 mm ball pitch requiring a minimum of 4 routing layers with microvia HDI construction (per IPC-2222). Estimated via-in-pad microvia cost adds 10-15 percent to PCB fabrication compared with a 0.8 mm pitch QFP. Maintain at least 6 mil trace width and 4 mil dielectric spacing for reliable 1.2 V core power distribution. Source: Cyclone IV Device Handbook PCB design guidelines chapter.
Estimated: at typical utilization (60 percent LE, 50 percent RAM, 156 multipliers active at 200 MHz), the EP4CE55F23C8N consumes approximately 1.5 W from the 1.2 V VCCINT rail and 0.3 W from each active VCCIO bank. Total worst-case static plus dynamic power typically remains below 3 W. Use a low-dropout regulator such as the TI TPS74401 for VCCINT and bulk decoupling of at least 220 uF polymer plus 0.1 uF + 10 nF ceramic per pin-pair. Per the Cyclone IV pin connection guidelines, all VCC pins must connect even if not used, or quiescent current rises unpredictably.
Do not assume the C8 and C7 speed grades are interchangeable without timing re-analysis - approximately 15 percent Fmax difference can break pipelined DSP designs. Estimated: a 200 MHz multiplier chain on C8N may fail timing closure on C7N. Per Cyclone IV device datasheet, MSL3 moisture sensitivity requires dry-bag storage and reflow within the rated floor life. The 484-FBGA also requires X-ray inspection of solder joints since the joints are not visually accessible.
Place all eight VCCIO bank supplies close to their respective bank balls to minimize IR drop on high-current outputs. Estimated: a 50 mA fast-switching LVDS output pair can induce 50 mV ripple on a poorly-decoupled VCCIO. Use guard rings around clock PLL power pins (VCC_PLL, VSSA_PLL) and isolate analog PLL ground from digital ground with a single-point connection at the PCB ground plane. Per the Cyclone IV handbook, all PLL filter components (R, C) must be placed within 5 mm of the PLL power pins.
규정 준수 정보
RoHS compliant per Altera/Intel product page. N suffix denotes Pb-free finish. C8N is commercial temperature grade - not AEC-Q100; use EP4CE55F23A7N for automotive AEC-Q100 applications.