EPF10K200SRC240-2X - FLEX 10K 200K Gates 9984 Cells FPGA | Altera
部品番号: EPF10K200SRC240-2X ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $91.56 | $91.56 |
| 10 | $86.98 | $869.80 |
| 100 | $79.42 | $7,942.00 |
| 250 | $74.1 | $18,525.00 |
| 500 | $70.05 | $35,025.00 |
EPF10K200SRC240-2X 概要
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit designed to be configured by the customer or designer after manufacturing—hence "field-programmable". The FLEX 10K family specifically pioneered the embedded array architecture, where rows of logic elements are interleaved with columns of embedded array blocks (EABs), each EAB providing up to 2048 bits of RAM or a small ROM/DSP function. This positions FLEX 10K as a hybrid between classical FPGAs and early system-on-chip (SoC) devices, often referred to as system-on-a-programmable-chip (SOPC) integration. In the broader taxonomy, FPGAs sit under programmable logic devices (PLDs), which include SPLDs, CPLDs, and FPGAs, all of which fall under digital logic ICs and ultimately integrated circuits.
Key features of the EPF10K200SRC240-2X include 200K equivalent gates, 9984 logic elements/cells, embedded array blocks providing up to approximately 98 Kbits of RAM, JTAG-compliant boundary-scan test (IEEE 1149.1) support, multi-voltage I/O standards, and a core supply of 2.5 V with I/O banks supporting 3.3 V, 5 V tolerant interfaces. The -2X speed grade denotes an industrial-temperature-grade device optimized for higher clock rates compared to -3 or -1N grades. The 240-pin RQFP-240 package (34.6 mm x 34.6 mm body, 0.5 mm pitch, gull-wing leads) is designed for surface-mount assembly on high-layer-count PCBs with thermal management via the exposed pad.
Typical applications for the EPF10K200SRC240-2X include telecom switching equipment, ASIC prototyping, high-speed data-acquisition front-ends, industrial control systems, military and aerospace logic integration, glue logic for embedded motherboards, and legacy MRO (maintenance, repair, overhaul) programs where long-life-cycle parts are required. The device is widely used in PCI interface bridging, custom bus architectures, and DSP pre/post-processing pipelines. Compared to its sibling grades (-1N, -2, -3N), the -2X places in the upper-mid speed range with improved timing margin.
Designers should pay close attention to I/O bank partitioning and VCCIO rail planning—each of the multiple I/O banks must be tied to a single VCCIO voltage (3.3 V typical, but 2.5 V and 5 V-tolerant inputs also supported on dedicated banks). Decoupling requirements call for multiple low-ESR 0.1 µF and 10 µF capacitors placed as close as possible to each VCC/VCCIO pin pair. Programming uses the Altera ByteBlaster or BitBlaster cable via JTAG or the legacy PS (passive serial) configuration mode.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives (including speed-grade variants in the same RQFP-240 footprint), parametric comparisons, and practical design notes not collated in any single manufacturer datasheet—giving sourcing engineers and program managers a one-stop reference for this long-life-cycle FPGA.
ドロップイン代替品: EPF10K200SRC240-2X — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPF10K200SRC240-2X （同一形状・フットプリント） — 相違点: Process Technology, Operating Temperature, Speed Grade, Family, Package.
クイック比較ツール — 並列比較する代替部品を選択:
EPF10K200SRC240-2
✅ ドロップイン✓ 在庫あり
$62.5 / 個
データシートを見る →EPF10K200SRC240-1X
✅ ドロップイン✓ 在庫あり
$540 / 個
データシートを見る →EPF10K200SRC240-1N
✅ ドロップイン✓ 在庫あり
$68.4 / 個
データシートを見る →EPF10K200SRC240-1
✅ ドロップイン✓ 在庫あり
$112 / 個
データシートを見る →EPF10K200SRC240-1X
✅ ドロップイン✓ 在庫あり
$540 / 個
データシートを見る →EPF10K200SRC240-2X 最大定格＆電気的特性
| Series | FLEX 10KS |
| Family | FLEX 10KE |
| Logic Cells | 9984 |
| Logic Array Blocks (LABs) | 1248 |
| Equivalent Gates | 200,000 |
| Embedded RAM (approx.) | 98 Kbits |
| User I/Os (max in family) | 470 |
| User I/Os (this package) | 182 |
| Propagation Delay | 0.4 ns to 0.8 ns |
| Max Internal Frequency | 200 MHz |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | 3.3 V (banks; 5 V tolerant inputs) |
| パッケージ | RQFP-240 (240-pin Power Quad Flat Pack, 34.6 x 34.6 mm, 0.5 mm pitch) |
| 実装タイプ | Surface Mount |
| 動作温度 | 0 C to +70 C (Commercial) |
| Process Technology | CMOS |
| Configuration Method | JTAG / Passive Serial (PS) |
| Boundary-Scan (JTAG) | IEEE 1149.1 compliant |
| Speed Grade | -2X (industrial, upper-mid speed) |
EPF10K200SRC240-2X ピン構成
| ピン 1 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 2 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 3 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 4 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 5 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 6 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 7 | GND — Ground |
| ピン 8 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 9 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 10 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 11 | VCCINT — Core supply voltage (2.5 V) |
| ピン 12 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 13 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 14 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 15 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 16 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 17 | GND — Ground |
| ピン 18 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 19 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 20 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 21 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| ピン 22 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 23 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 24 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 25 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 26 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 27 | GND — Ground |
| ピン 28 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 29 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 30 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 31 | VCCINT — Core supply voltage (2.5 V) |
| ピン 32 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 33 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 34 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 35 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 36 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 37 | GND — Ground |
| ピン 38 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 39 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 40 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 41 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| ピン 42 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 43 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 44 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 45 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 46 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 47 | GND — Ground |
| ピン 48 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 49 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 50 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 51 | VCCINT — Core supply voltage (2.5 V) |
| ピン 52 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 53 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 54 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 55 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 56 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 57 | GND — Ground |
| ピン 58 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 59 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 60 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 61 | TDI — JTAG Test Data In (dedicated) |
| ピン 62 | TMS — JTAG Test Mode Select (dedicated) |
| ピン 63 | TCK — JTAG Test Clock (dedicated) |
| ピン 64 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 65 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 66 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 67 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 68 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 69 | GND — Ground |
| ピン 70 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 71 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 72 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 73 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| ピン 74 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 75 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 76 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 77 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 78 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 79 | GND — Ground |
| ピン 80 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 81 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 82 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 83 | VCCINT — Core supply voltage (2.5 V) |
| ピン 84 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 85 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 86 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 87 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 88 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 89 | GND — Ground |
| ピン 90 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 91 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 92 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 93 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| ピン 94 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 95 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 96 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 97 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 98 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 99 | GND — Ground |
| ピン 100 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 101 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 102 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 103 | VCCINT — Core supply voltage (2.5 V) |
| ピン 104 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 105 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 106 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 107 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 108 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 109 | GND — Ground |
| ピン 110 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 111 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 112 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 113 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| ピン 114 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 115 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 116 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 117 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 118 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 119 | GND — Ground |
| ピン 120 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 121 | nCONFIG — Configuration start (dedicated, active-low) |
| ピン 122 | nSTATUS — Configuration status (dedicated, active-low) |
| ピン 123 | DCLK — Configuration clock (dedicated) |
| ピン 124 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 125 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 126 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 127 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 128 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 129 | GND — Ground |
| ピン 130 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 131 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 132 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 133 | VCCINT — Core supply voltage (2.5 V) |
| ピン 134 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 135 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 136 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 137 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 138 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 139 | GND — Ground |
| ピン 140 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 141 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 142 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 143 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| ピン 144 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 145 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 146 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 147 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 148 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 149 | GND — Ground |
| ピン 150 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 151 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 152 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 153 | VCCINT — Core supply voltage (2.5 V) |
| ピン 154 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 155 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 156 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 157 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 158 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 159 | GND — Ground |
| ピン 160 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 161 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 162 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 163 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| ピン 164 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 165 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 166 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 167 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 168 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 169 | GND — Ground |
| ピン 170 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 171 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 172 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 173 | VCCINT — Core supply voltage (2.5 V) |
| ピン 174 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 175 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 176 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 177 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 178 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 179 | GND — Ground |
| ピン 180 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 181 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 182 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 183 | TDO — JTAG Test Data Out (dedicated) |
| ピン 184 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 185 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 186 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 187 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 188 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 189 | GND — Ground |
| ピン 190 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 191 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 192 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 193 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| ピン 194 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 195 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 196 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 197 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 198 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 199 | GND — Ground |
| ピン 200 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 201 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 202 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 203 | VCCINT — Core supply voltage (2.5 V) |
| ピン 204 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 205 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 206 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 207 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 208 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 209 | GND — Ground |
| ピン 210 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 211 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 212 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 213 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| ピン 214 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 215 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 216 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 217 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 218 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 219 | GND — Ground |
| ピン 220 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 221 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 222 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 223 | VCCINT — Core supply voltage (2.5 V) |
| ピン 224 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 225 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 226 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 227 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 228 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 229 | GND — Ground |
| ピン 230 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 231 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 232 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 233 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| ピン 234 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 235 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 236 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 237 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 238 | I/O — User I/O (bank-dependent VCCIO) |
| ピン 239 | GND — Ground |
| ピン 240 | I/O — User I/O (bank-dependent VCCIO) |
主な用途
EPF10K200SRC240-2X の用途: 6 件s: Telecom Switching and Routing Equipment, ASIC Prototyping and Emulation, Industrial Control and Machine Automation, PCI/ISA Bridge and Custom Bus Architecture, Military and Aerospace Legacy Avionics, DSP Pre- and Post-Processing Pipelines.
Telecom Switching and Routing Equipment
The EPF10K200SRC240-2X is well suited to legacy telecom switching equipment where it implements custom bus arbiters, time-slot interchangers, and protocol-conversion glue logic. Its 200K-gate density and 9984 logic cells comfortably handle T1/E1 framers, HDLC controllers, and ATM cell-processing datapaths, while the 240-pin RQFP package exposes enough I/O for 32-bit parallel backplane interfaces. The 2.5 V core / 3.3 V I/O bank architecture integrates directly with late-1990s telecom ASICs without level shifters, reducing BOM cost and board area in central-office line cards and DSLAM designs.
おすすめ
ASIC Prototyping and Emulation
Engineers historically used the EPF10K200SRC240-2X as an ASIC prototype vehicle, partitioning a large ASIC design across multiple FLEX 10K devices for pre-silicon validation. The 200K-gate capacity maps directly onto mid-complexity ASICs of its era, and the RQFP-240 footprint with 182 user I/Os allows full visibility into internal nets via JTAG (IEEE 1149.1) boundary-scan. The -2X speed grade delivers realistic timing correlation with the target ASIC, reducing the risk of post-silicon re-spins in custom chip programs for storage controllers and networking silicon.
おすすめ
Industrial Control and Machine Automation
The EPF10K200SRC240-2X is widely deployed in PLCs, motor-control boards, and SCADA interface cards where its 200K-gate logic capacity accommodates custom state machines, encoder counters, and fieldbus protocol stacks (Profibus, DeviceNet, Modbus). The 0 C to +70 C commercial temperature range and 3.3 V I/O tolerance to 5 V inputs simplify integration with industrial sensors and 24 V optoisolated I/O. The RQFP-240's exposed pad allows direct soldering on heavy-copper industrial PCBs without heatsinks, supporting long-lifecycle machinery in factory-automation lines.
おすすめ
PCI/ISA Bridge and Custom Bus Architecture
The EPF10K200SRC240-2X excels as a PCI-to-local-bus bridge and custom backplane arbiter in embedded motherboards, VME/cPCI cards, and industrial PCs. Its 182 user I/Os in RQFP-240 comfortably support 32-bit PCI signals plus local address/data buses, interrupt steering, and DMA handshaking. The 200 MHz internal Fmax and 0.4-0.8 ns propagation delay handle 33 MHz PCI timing with substantial margin, while the embedded array blocks (EABs) provide on-chip FIFOs for bus-master DMA buffers, eliminating external SRAM and reducing BOM cost.
おすすめ
Military and Aerospace Legacy Avionics
The EPF10K200SRC240-2X continues to serve in military and aerospace programs requiring long-lifecycle, qualified FPGAs in MIL-PRF-grade housings. Its high gate count supports radar signal pre-processing, flight-control interface logic, and MIL-STD-1553 databus bridging, while the CMOS process technology provides radiation tolerance acceptable for non-space applications. The RQFP-240 ceramic-compatible variant withstands the thermal cycling of avionics bays, and the IEEE 1149.1 JTAG interface simplifies factory and depot-level boundary-scan test on legacy platforms.
おすすめ
DSP Pre- and Post-Processing Pipelines
The EPF10K200SRC240-2X functions as a high-speed pre-/post-processor alongside dedicated DSP chips in sonar, ultrasound, and software-defined-radio front-ends. Its embedded array blocks (EABs) provide configurable multipliers, FIR filter coefficient memory, and sample-rate-conversion FIFOs that offload the host DSP, freeing CPU cycles for algorithm execution. The 2.5 V core and 200 MHz internal frequency sustain real-time decimation, interpolation, and channelization pipelines, while the RQFP-240 package's 182 I/Os interface directly to multi-channel ADC/DAC data buses without external buffers.
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おすすめ製品の概要
エンジニアリング参考データ: EPF10K200SRC240-2X — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPF10K200SRC240-2 | EPF10K200SRC240-1X | EPF10K200SRC240-1N | EPF10K200SRC240-1 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | RQFP-240 (240-pin Power QFP) | RQFP-240 (240-pin Power QFP) | RQFP-240 (240-pin Power QFP) | RQFP-240 (240-pin Power QFP) | RQFP-240 (240-pin Power QFP) |
| Logic Cells | 9984 | 9984 | 9984 | 9984 | 9984 |
| Speed Grade | -2X (upper-mid) | -2 (leaded, same perf as -2X) | -1X (slower than -2X) | -1N (slowest) | -1 (slowest, leaded) |
| Equivalent Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| LABs | 1248 | 1248 | 1248 | 1248 | 1248 |
| User I/Os | 182 | 182 | 182 | 182 | 182 |
| Lead-Free / RoHS | -X suffix (Pb-free) | Leaded SnPb | Pb-free | Leaded (N suffix) | Leaded SnPb |
| Operating Temperature | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) |
主な差別化要因
- Pb-free lead finish for RoHS-compliant assemblies （vs EPF10K200SRC240-2 (leaded SnPb))
- Upper-mid speed grade for tighter timing margin （vs EPF10K200SRC240-1N (slowest grade))
- RQFP-240 footprint with 182 user I/Os （vs EPF10K200SFC484-2 (BGA-484))
設計ノート
Estimated: at 200 MHz internal Fmax with ~80% LUT utilization, the EPF10K200SRC240-2X draws approximately 200-400 mA from VCCINT (2.5 V) plus 50-150 mA per active VCCIO bank. Place one 0.1 µF X7R ceramic and one 10 µF tantalum/ceramic bulk capacitor within 5 mm of every VCCINT/VCCIO/GND pin pair. Star-ground the 2.5 V and 3.3 V rails back to a common ground via separate traces to avoid ground bounce during simultaneous switching of multiple I/O banks.
Estimated: at full 200 MHz utilization the device dissipates 1-2 W. The RQFP-240 has a θJA of ~25-30 C/W on a standard 4-layer PCB with the exposed pad soldered to a 1 sq inch copper pour. Junction-temperature rise over ambient is ~25-60 C, well within the 0-70 C commercial range. Forced airflow is generally not required, but the exposed pad must be soldered to a contiguous copper pour with thermal vias (4-8 vias, 0.3 mm drill) for adequate heat spreading. Do not rely on lead-only conduction for cooling.
Route all four dedicated JTAG pins (TCK, TMS, TDI, TDO) and the configuration pins (nCONFIG, nSTATUS, DCLK) as short, 50-ohm-controlled traces to the Altera ByteBlaster header. Keep nCONFIG pulled high through a 10 kΩ resistor and decoupled with 0.1 µF to ground to suppress false configuration triggers during power-up. Place the configuration EEPROM (e.g., EPC2 or EPC8) within 50 mm of the FPGA to keep PS-mode DCLK/nCONFIG signal integrity under spec.
For 33 MHz PCI or 50 MHz external bus interfaces, constrain the I/O bank to 3.3 V VCCIO with slew-rate control enabled in the Quartus/MAX+PLUS II assignment editor. Use series termination (22-33 Ω) on clock outputs and source-synchronous data signals longer than 50 mm to dampen reflections. Avoid routing 5 V-tolerant input signals into banks not configured for 5 V tolerance—check the I/O standard assignment before layout finalization.
Do not exceed 200 MHz internal Fmax or 250 MHz I/O toggle—derate by 15-20% in production for voltage/temperature margin. Never leave VCCINT or VCCIO floating during power-up: power-up sequencing must satisfy tRAMP < 100 ms to avoid latch-up. When migrating from the -1N to -2X speed grade, re-run static timing analysis because hold-time margins tighten; conversely, when migrating from -2X to -1N, re-validate Fmax-limited paths.
コンプライアンス情報
Pb-free (X suffix) finish per Altera nomenclature. RoHS compliance inferred from -X suffix; not separately documented in current web sources. AEC-Q100 not applicable (commercial-grade plastic package, not automotive-qualified).
