EPF10K200SRC240-2X - FLEX 10K 200K Gates 9984 Cells FPGA | Altera
Référence : EPF10K200SRC240-2X ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $91.56 | $91,56 |
| 10 | $86.98 | $869,80 |
| 100 | $79.42 | $7 942,00 |
| 250 | $74.1 | $18 525,00 |
| 500 | $70.05 | $35 025,00 |
EPF10K200SRC240-2X Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit designed to be configured by the customer or designer after manufacturing—hence "field-programmable". The FLEX 10K family specifically pioneered the embedded array architecture, where rows of logic elements are interleaved with columns of embedded array blocks (EABs), each EAB providing up to 2048 bits of RAM or a small ROM/DSP function. This positions FLEX 10K as a hybrid between classical FPGAs and early system-on-chip (SoC) devices, often referred to as system-on-a-programmable-chip (SOPC) integration. In the broader taxonomy, FPGAs sit under programmable logic devices (PLDs), which include SPLDs, CPLDs, and FPGAs, all of which fall under digital logic ICs and ultimately integrated circuits.
Key features of the EPF10K200SRC240-2X include 200K equivalent gates, 9984 logic elements/cells, embedded array blocks providing up to approximately 98 Kbits of RAM, JTAG-compliant boundary-scan test (IEEE 1149.1) support, multi-voltage I/O standards, and a core supply of 2.5 V with I/O banks supporting 3.3 V, 5 V tolerant interfaces. The -2X speed grade denotes an industrial-temperature-grade device optimized for higher clock rates compared to -3 or -1N grades. The 240-pin RQFP-240 package (34.6 mm x 34.6 mm body, 0.5 mm pitch, gull-wing leads) is designed for surface-mount assembly on high-layer-count PCBs with thermal management via the exposed pad.
Typical applications for the EPF10K200SRC240-2X include telecom switching equipment, ASIC prototyping, high-speed data-acquisition front-ends, industrial control systems, military and aerospace logic integration, glue logic for embedded motherboards, and legacy MRO (maintenance, repair, overhaul) programs where long-life-cycle parts are required. The device is widely used in PCI interface bridging, custom bus architectures, and DSP pre/post-processing pipelines. Compared to its sibling grades (-1N, -2, -3N), the -2X places in the upper-mid speed range with improved timing margin.
Designers should pay close attention to I/O bank partitioning and VCCIO rail planning—each of the multiple I/O banks must be tied to a single VCCIO voltage (3.3 V typical, but 2.5 V and 5 V-tolerant inputs also supported on dedicated banks). Decoupling requirements call for multiple low-ESR 0.1 µF and 10 µF capacitors placed as close as possible to each VCC/VCCIO pin pair. Programming uses the Altera ByteBlaster or BitBlaster cable via JTAG or the legacy PS (passive serial) configuration mode.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives (including speed-grade variants in the same RQFP-240 footprint), parametric comparisons, and practical design notes not collated in any single manufacturer datasheet—giving sourcing engineers and program managers a one-stop reference for this long-life-cycle FPGA.
Alternatives de remplacement direct pour EPF10K200SRC240-2X — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K200SRC240-2X (même facteur de forme et même empreinte) — différant par Process Technology, Operating Temperature, Speed Grade, Family, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K200SRC240-2
✅ Remplacement direct✓ En stock
$62.5 / unité
Voir la fiche technique →EPF10K200SRC240-1X
✅ Remplacement direct✓ En stock
$540 / unité
Voir la fiche technique →EPF10K200SRC240-1N
✅ Remplacement direct✓ En stock
$68.4 / unité
Voir la fiche technique →EPF10K200SRC240-1
✅ Remplacement direct✓ En stock
$112 / unité
Voir la fiche technique →EPF10K200SRC240-1X
✅ Remplacement direct✓ En stock
$540 / unité
Voir la fiche technique →EPF10K200SRC240-2X Valeurs maximales et caractéristiques électriques
| Series | FLEX 10KS |
| Family | FLEX 10KE |
| Logic Cells | 9984 |
| Logic Array Blocks (LABs) | 1248 |
| Equivalent Gates | 200,000 |
| Embedded RAM (approx.) | 98 Kbits |
| User I/Os (max in family) | 470 |
| User I/Os (this package) | 182 |
| Propagation Delay | 0.4 ns to 0.8 ns |
| Max Internal Frequency | 200 MHz |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | 3.3 V (banks; 5 V tolerant inputs) |
| Boîtier | RQFP-240 (240-pin Power Quad Flat Pack, 34.6 x 34.6 mm, 0.5 mm pitch) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0 C to +70 C (Commercial) |
| Process Technology | CMOS |
| Configuration Method | JTAG / Passive Serial (PS) |
| Boundary-Scan (JTAG) | IEEE 1149.1 compliant |
| Speed Grade | -2X (industrial, upper-mid speed) |
Configuration des broches de EPF10K200SRC240-2X
| Broche 1 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 2 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 3 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 4 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 5 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 6 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 7 | GND — Ground |
| Broche 8 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 9 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 10 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 11 | VCCINT — Core supply voltage (2.5 V) |
| Broche 12 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 13 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 14 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 15 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 16 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 17 | GND — Ground |
| Broche 18 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 19 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 20 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 21 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Broche 22 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 23 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 24 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 25 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 26 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 27 | GND — Ground |
| Broche 28 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 29 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 30 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 31 | VCCINT — Core supply voltage (2.5 V) |
| Broche 32 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 33 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 34 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 35 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 36 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 37 | GND — Ground |
| Broche 38 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 39 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 40 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 41 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Broche 42 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 43 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 44 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 45 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 46 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 47 | GND — Ground |
| Broche 48 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 49 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 50 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 51 | VCCINT — Core supply voltage (2.5 V) |
| Broche 52 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 53 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 54 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 55 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 56 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 57 | GND — Ground |
| Broche 58 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 59 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 60 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 61 | TDI — JTAG Test Data In (dedicated) |
| Broche 62 | TMS — JTAG Test Mode Select (dedicated) |
| Broche 63 | TCK — JTAG Test Clock (dedicated) |
| Broche 64 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 65 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 66 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 67 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 68 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 69 | GND — Ground |
| Broche 70 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 71 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 72 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 73 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Broche 74 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 75 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 76 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 77 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 78 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 79 | GND — Ground |
| Broche 80 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 81 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 82 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 83 | VCCINT — Core supply voltage (2.5 V) |
| Broche 84 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 85 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 86 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 87 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 88 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 89 | GND — Ground |
| Broche 90 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 91 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 92 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 93 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Broche 94 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 95 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 96 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 97 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 98 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 99 | GND — Ground |
| Broche 100 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 101 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 102 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 103 | VCCINT — Core supply voltage (2.5 V) |
| Broche 104 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 105 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 106 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 107 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 108 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 109 | GND — Ground |
| Broche 110 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 111 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 112 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 113 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Broche 114 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 115 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 116 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 117 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 118 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 119 | GND — Ground |
| Broche 120 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 121 | nCONFIG — Configuration start (dedicated, active-low) |
| Broche 122 | nSTATUS — Configuration status (dedicated, active-low) |
| Broche 123 | DCLK — Configuration clock (dedicated) |
| Broche 124 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 125 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 126 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 127 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 128 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 129 | GND — Ground |
| Broche 130 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 131 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 132 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 133 | VCCINT — Core supply voltage (2.5 V) |
| Broche 134 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 135 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 136 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 137 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 138 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 139 | GND — Ground |
| Broche 140 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 141 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 142 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 143 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Broche 144 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 145 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 146 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 147 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 148 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 149 | GND — Ground |
| Broche 150 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 151 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 152 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 153 | VCCINT — Core supply voltage (2.5 V) |
| Broche 154 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 155 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 156 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 157 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 158 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 159 | GND — Ground |
| Broche 160 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 161 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 162 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 163 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Broche 164 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 165 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 166 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 167 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 168 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 169 | GND — Ground |
| Broche 170 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 171 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 172 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 173 | VCCINT — Core supply voltage (2.5 V) |
| Broche 174 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 175 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 176 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 177 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 178 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 179 | GND — Ground |
| Broche 180 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 181 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 182 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 183 | TDO — JTAG Test Data Out (dedicated) |
| Broche 184 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 185 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 186 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 187 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 188 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 189 | GND — Ground |
| Broche 190 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 191 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 192 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 193 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Broche 194 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 195 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 196 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 197 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 198 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 199 | GND — Ground |
| Broche 200 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 201 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 202 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 203 | VCCINT — Core supply voltage (2.5 V) |
| Broche 204 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 205 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 206 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 207 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 208 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 209 | GND — Ground |
| Broche 210 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 211 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 212 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 213 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Broche 214 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 215 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 216 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 217 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 218 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 219 | GND — Ground |
| Broche 220 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 221 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 222 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 223 | VCCINT — Core supply voltage (2.5 V) |
| Broche 224 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 225 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 226 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 227 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 228 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 229 | GND — Ground |
| Broche 230 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 231 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 232 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 233 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Broche 234 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 235 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 236 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 237 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 238 | I/O — User I/O (bank-dependent VCCIO) |
| Broche 239 | GND — Ground |
| Broche 240 | I/O — User I/O (bank-dependent VCCIO) |
Applications typiques
EPF10K200SRC240-2X convient pour 6 applications: Telecom Switching and Routing Equipment, ASIC Prototyping and Emulation, Industrial Control and Machine Automation, PCI/ISA Bridge and Custom Bus Architecture, Military and Aerospace Legacy Avionics, DSP Pre- and Post-Processing Pipelines.
Telecom Switching and Routing Equipment
The EPF10K200SRC240-2X is well suited to legacy telecom switching equipment where it implements custom bus arbiters, time-slot interchangers, and protocol-conversion glue logic. Its 200K-gate density and 9984 logic cells comfortably handle T1/E1 framers, HDLC controllers, and ATM cell-processing datapaths, while the 240-pin RQFP package exposes enough I/O for 32-bit parallel backplane interfaces. The 2.5 V core / 3.3 V I/O bank architecture integrates directly with late-1990s telecom ASICs without level shifters, reducing BOM cost and board area in central-office line cards and DSLAM designs.
Recommandé
ASIC Prototyping and Emulation
Engineers historically used the EPF10K200SRC240-2X as an ASIC prototype vehicle, partitioning a large ASIC design across multiple FLEX 10K devices for pre-silicon validation. The 200K-gate capacity maps directly onto mid-complexity ASICs of its era, and the RQFP-240 footprint with 182 user I/Os allows full visibility into internal nets via JTAG (IEEE 1149.1) boundary-scan. The -2X speed grade delivers realistic timing correlation with the target ASIC, reducing the risk of post-silicon re-spins in custom chip programs for storage controllers and networking silicon.
Recommandé
Industrial Control and Machine Automation
The EPF10K200SRC240-2X is widely deployed in PLCs, motor-control boards, and SCADA interface cards where its 200K-gate logic capacity accommodates custom state machines, encoder counters, and fieldbus protocol stacks (Profibus, DeviceNet, Modbus). The 0 C to +70 C commercial temperature range and 3.3 V I/O tolerance to 5 V inputs simplify integration with industrial sensors and 24 V optoisolated I/O. The RQFP-240's exposed pad allows direct soldering on heavy-copper industrial PCBs without heatsinks, supporting long-lifecycle machinery in factory-automation lines.
Recommandé
PCI/ISA Bridge and Custom Bus Architecture
The EPF10K200SRC240-2X excels as a PCI-to-local-bus bridge and custom backplane arbiter in embedded motherboards, VME/cPCI cards, and industrial PCs. Its 182 user I/Os in RQFP-240 comfortably support 32-bit PCI signals plus local address/data buses, interrupt steering, and DMA handshaking. The 200 MHz internal Fmax and 0.4-0.8 ns propagation delay handle 33 MHz PCI timing with substantial margin, while the embedded array blocks (EABs) provide on-chip FIFOs for bus-master DMA buffers, eliminating external SRAM and reducing BOM cost.
Recommandé
Military and Aerospace Legacy Avionics
The EPF10K200SRC240-2X continues to serve in military and aerospace programs requiring long-lifecycle, qualified FPGAs in MIL-PRF-grade housings. Its high gate count supports radar signal pre-processing, flight-control interface logic, and MIL-STD-1553 databus bridging, while the CMOS process technology provides radiation tolerance acceptable for non-space applications. The RQFP-240 ceramic-compatible variant withstands the thermal cycling of avionics bays, and the IEEE 1149.1 JTAG interface simplifies factory and depot-level boundary-scan test on legacy platforms.
Recommandé
DSP Pre- and Post-Processing Pipelines
The EPF10K200SRC240-2X functions as a high-speed pre-/post-processor alongside dedicated DSP chips in sonar, ultrasound, and software-defined-radio front-ends. Its embedded array blocks (EABs) provide configurable multipliers, FIR filter coefficient memory, and sample-rate-conversion FIFOs that offload the host DSP, freeing CPU cycles for algorithm execution. The 2.5 V core and 200 MHz internal frequency sustain real-time decimation, interpolation, and channelization pipelines, while the RQFP-240 package's 182 I/Os interface directly to multi-channel ADC/DAC data buses without external buffers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K200SRC240-2X — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K200SRC240-2 | EPF10K200SRC240-1X | EPF10K200SRC240-1N | EPF10K200SRC240-1 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | RQFP-240 (240-pin Power QFP) | RQFP-240 (240-pin Power QFP) | RQFP-240 (240-pin Power QFP) | RQFP-240 (240-pin Power QFP) | RQFP-240 (240-pin Power QFP) |
| Logic Cells | 9984 | 9984 | 9984 | 9984 | 9984 |
| Speed Grade | -2X (upper-mid) | -2 (leaded, same perf as -2X) | -1X (slower than -2X) | -1N (slowest) | -1 (slowest, leaded) |
| Equivalent Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| LABs | 1248 | 1248 | 1248 | 1248 | 1248 |
| User I/Os | 182 | 182 | 182 | 182 | 182 |
| Lead-Free / RoHS | -X suffix (Pb-free) | Leaded SnPb | Pb-free | Leaded (N suffix) | Leaded SnPb |
| Operating Temperature | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) |
Principaux différenciateurs
- Pb-free lead finish for RoHS-compliant assemblies (vs EPF10K200SRC240-2 (leaded SnPb))
- Upper-mid speed grade for tighter timing margin (vs EPF10K200SRC240-1N (slowest grade))
- RQFP-240 footprint with 182 user I/Os (vs EPF10K200SFC484-2 (BGA-484))
Notes de conception
Estimated: at 200 MHz internal Fmax with ~80% LUT utilization, the EPF10K200SRC240-2X draws approximately 200-400 mA from VCCINT (2.5 V) plus 50-150 mA per active VCCIO bank. Place one 0.1 µF X7R ceramic and one 10 µF tantalum/ceramic bulk capacitor within 5 mm of every VCCINT/VCCIO/GND pin pair. Star-ground the 2.5 V and 3.3 V rails back to a common ground via separate traces to avoid ground bounce during simultaneous switching of multiple I/O banks.
Estimated: at full 200 MHz utilization the device dissipates 1-2 W. The RQFP-240 has a θJA of ~25-30 C/W on a standard 4-layer PCB with the exposed pad soldered to a 1 sq inch copper pour. Junction-temperature rise over ambient is ~25-60 C, well within the 0-70 C commercial range. Forced airflow is generally not required, but the exposed pad must be soldered to a contiguous copper pour with thermal vias (4-8 vias, 0.3 mm drill) for adequate heat spreading. Do not rely on lead-only conduction for cooling.
Route all four dedicated JTAG pins (TCK, TMS, TDI, TDO) and the configuration pins (nCONFIG, nSTATUS, DCLK) as short, 50-ohm-controlled traces to the Altera ByteBlaster header. Keep nCONFIG pulled high through a 10 kΩ resistor and decoupled with 0.1 µF to ground to suppress false configuration triggers during power-up. Place the configuration EEPROM (e.g., EPC2 or EPC8) within 50 mm of the FPGA to keep PS-mode DCLK/nCONFIG signal integrity under spec.
For 33 MHz PCI or 50 MHz external bus interfaces, constrain the I/O bank to 3.3 V VCCIO with slew-rate control enabled in the Quartus/MAX+PLUS II assignment editor. Use series termination (22-33 Ω) on clock outputs and source-synchronous data signals longer than 50 mm to dampen reflections. Avoid routing 5 V-tolerant input signals into banks not configured for 5 V tolerance—check the I/O standard assignment before layout finalization.
Do not exceed 200 MHz internal Fmax or 250 MHz I/O toggle—derate by 15-20% in production for voltage/temperature margin. Never leave VCCINT or VCCIO floating during power-up: power-up sequencing must satisfy tRAMP < 100 ms to avoid latch-up. When migrating from the -1N to -2X speed grade, re-run static timing analysis because hold-time margins tighten; conversely, when migrating from -2X to -1N, re-validate Fmax-limited paths.
Informations de conformité
Pb-free (X suffix) finish per Altera nomenclature. RoHS compliance inferred from -X suffix; not separately documented in current web sources. AEC-Q100 not applicable (commercial-grade plastic package, not automotive-qualified).