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Altera

EPF10K200SRC240-2X - FLEX 10K 200K Gates 9984 Cells FPGA | Altera

Référence : EPF10K200SRC240-2X ⚠ Dernier achat
En stock Expédié sous 1 à 3 jours ouvrés
2.5 V Vdss 182 Package 200 MHz Speed
À partir de $70.05 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-11
Tarifs dégressifs
Qté Prix unitaire Total
1 $91.56 $91,56
10 $86.98 $869,80
100 $79.42 $7 942,00
250 $74.1 $18 525,00
500 $70.05 $35 025,00
ℹ️ Tous les prix sont en USD

EPF10K200SRC240-2X Présentation

The Altera EPF10K200SRC240-2X is a high-density FLEX 10K-series Field Programmable Gate Array (FPGA) delivering 200,000 system gates, 9984 logic cells, and 1248 Logic Array Blocks (LABs), housed in a 240-pin PowerQuad Flat Package (RQFP/RQFP-240). It belongs to Intel/Altera's FLEX 10K family of embedded programmable logic devices (PLDs) that combine look-up table (LUT)-based logic with embedded array blocks (EABs) for on-chip memory and DSP functions. The device supports up to 470 user I/Os in some packages and provides typical propagation delays of approximately 0.4 ns to 0.8 ns at room temperature.

A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit designed to be configured by the customer or designer after manufacturing—hence "field-programmable". The FLEX 10K family specifically pioneered the embedded array architecture, where rows of logic elements are interleaved with columns of embedded array blocks (EABs), each EAB providing up to 2048 bits of RAM or a small ROM/DSP function. This positions FLEX 10K as a hybrid between classical FPGAs and early system-on-chip (SoC) devices, often referred to as system-on-a-programmable-chip (SOPC) integration. In the broader taxonomy, FPGAs sit under programmable logic devices (PLDs), which include SPLDs, CPLDs, and FPGAs, all of which fall under digital logic ICs and ultimately integrated circuits.

Key features of the EPF10K200SRC240-2X include 200K equivalent gates, 9984 logic elements/cells, embedded array blocks providing up to approximately 98 Kbits of RAM, JTAG-compliant boundary-scan test (IEEE 1149.1) support, multi-voltage I/O standards, and a core supply of 2.5 V with I/O banks supporting 3.3 V, 5 V tolerant interfaces. The -2X speed grade denotes an industrial-temperature-grade device optimized for higher clock rates compared to -3 or -1N grades. The 240-pin RQFP-240 package (34.6 mm x 34.6 mm body, 0.5 mm pitch, gull-wing leads) is designed for surface-mount assembly on high-layer-count PCBs with thermal management via the exposed pad.

Typical applications for the EPF10K200SRC240-2X include telecom switching equipment, ASIC prototyping, high-speed data-acquisition front-ends, industrial control systems, military and aerospace logic integration, glue logic for embedded motherboards, and legacy MRO (maintenance, repair, overhaul) programs where long-life-cycle parts are required. The device is widely used in PCI interface bridging, custom bus architectures, and DSP pre/post-processing pipelines. Compared to its sibling grades (-1N, -2, -3N), the -2X places in the upper-mid speed range with improved timing margin.

Designers should pay close attention to I/O bank partitioning and VCCIO rail planning—each of the multiple I/O banks must be tied to a single VCCIO voltage (3.3 V typical, but 2.5 V and 5 V-tolerant inputs also supported on dedicated banks). Decoupling requirements call for multiple low-ESR 0.1 µF and 10 µF capacitors placed as close as possible to each VCC/VCCIO pin pair. Programming uses the Altera ByteBlaster or BitBlaster cable via JTAG or the legacy PS (passive serial) configuration mode.

This page synthesizes distributor pricing, drop-in pin-compatible alternatives (including speed-grade variants in the same RQFP-240 footprint), parametric comparisons, and practical design notes not collated in any single manufacturer datasheet—giving sourcing engineers and program managers a one-stop reference for this long-life-cycle FPGA.

Alternatives de remplacement direct pour EPF10K200SRC240-2X — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF10K200SRC240-2X (même facteur de forme et même empreinte) — différant par Process Technology, Operating Temperature, Speed Grade, Family, Package.

Intel
Operating Temperature: -40C to +85C (industrial)
Speed Grade: -1 (fastest)
Family: FLEX 10K Embedded Programmable Logic
Comparer avec EPF10K200SRC240-2X →
Intel
Process Technology: 0.22 µm CMOS
Package: 240-BFQFP Exposed Pad (RQFP-240)
Comparer avec EPF10K200SRC240-2X →
Intel
Process Technology: 0.22 um / 0.3 um CMOS
Operating Temperature: -40C to +85C (industrial)
Speed Grade: -1 (fastest commercial)
Comparer avec EPF10K200SRC240-2X →
Intel
Process Technology: 0.42 micrometer CMOS SRAM
Operating Temperature: 0C to +70C (Commercial, TA)
Speed Grade: -2 (~80 MHz internal, typical)
Comparer avec EPF10K200SRC240-2X →
Intel
Process Technology: 0.22 um CMOS
Operating Temperature: 0 C to 70 C (Commercial)
Package: 240-BFQFP Exposed Pad (RQFP-240)
Comparer avec EPF10K200SRC240-2X →
Intel
Process Technology: 0.22 µm CMOS SRAM
Operating Temperature: 0 °C to +70 °C (Commercial)
Speed Grade: -3 (commercial)
Comparer avec EPF10K200SRC240-2X →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EPF10K200SRC240-2

✅ Remplacement direct
Intel
📦 RQFP-240
FLEX 10KS · FLEX 10KS (FLEX 10KE/10KA generation) · 9984 · 1248 · 98304 · 182 · 513000 · 2.375 V to 2.625 V (nominal 2.5 V)

✓ En stock

$62.5 / unité

Voir la fiche technique →

EPF10K200SRC240-1X

✅ Remplacement direct
Intel
📦 RQFP-240
FLEX-10KS · FLEX 10KS · 9984 · 200,000 · 1248 · 98,304 bits · 182 · 4

✓ En stock

$540 / unité

Voir la fiche technique →

EPF10K200SRC240-1N

✅ Remplacement direct
Intel
📦 RQFP-240
FLEX 10KE · EPF10K200 · 9,984 · 200,000 · 1,248 · 182 · 2.5 V · 250 MHz

✓ En stock

$68.4 / unité

Voir la fiche technique →

EPF10K200SRC240-1

✅ Remplacement direct
Intel
📦 RQFP-240
Intel (formerly Altera) · FLEX-10KS · FLEX 10K Embedded Programmable Logic · FPGA - Field Programmable Gate Array · 9984 · 1248 · 24 · 40960

✓ En stock

$112 / unité

Voir la fiche technique →

EPF10K200SRC240-1X

✅ Remplacement direct
Intel
📦 RQFP-240
FLEX-10KS · FLEX 10KS · 9984 · 200,000 · 1248 · 98,304 bits · 182 · 4

✓ En stock

$540 / unité

Voir la fiche technique →

EPF10K200SRC240-2X Valeurs maximales et caractéristiques électriques

Series FLEX 10KS
Family FLEX 10KE
Logic Cells 9984
Logic Array Blocks (LABs) 1248
Equivalent Gates 200,000
Embedded RAM (approx.) 98 Kbits
User I/Os (max in family) 470
User I/Os (this package) 182
Propagation Delay 0.4 ns to 0.8 ns
Max Internal Frequency 200 MHz
Core Voltage (VCCINT) 2.5 V
I/O Voltage (VCCIO) 3.3 V (banks; 5 V tolerant inputs)
Boîtier RQFP-240 (240-pin Power Quad Flat Pack, 34.6 x 34.6 mm, 0.5 mm pitch)
Type de montage Surface Mount
Température de fonctionnement 0 C to +70 C (Commercial)
Process Technology CMOS
Configuration Method JTAG / Passive Serial (PS)
Boundary-Scan (JTAG) IEEE 1149.1 compliant
Speed Grade -2X (industrial, upper-mid speed)

Configuration des broches de EPF10K200SRC240-2X

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 I/O — User I/O (bank-dependent VCCIO)
Broche 2 I/O — User I/O (bank-dependent VCCIO)
Broche 3 I/O — User I/O (bank-dependent VCCIO)
Broche 4 I/O — User I/O (bank-dependent VCCIO)
Broche 5 I/O — User I/O (bank-dependent VCCIO)
Broche 6 I/O — User I/O (bank-dependent VCCIO)
Broche 7 GND — Ground
Broche 8 I/O — User I/O (bank-dependent VCCIO)
Broche 9 I/O — User I/O (bank-dependent VCCIO)
Broche 10 I/O — User I/O (bank-dependent VCCIO)
Broche 11 VCCINT — Core supply voltage (2.5 V)
Broche 12 I/O — User I/O (bank-dependent VCCIO)
Broche 13 I/O — User I/O (bank-dependent VCCIO)
Broche 14 I/O — User I/O (bank-dependent VCCIO)
Broche 15 I/O — User I/O (bank-dependent VCCIO)
Broche 16 I/O — User I/O (bank-dependent VCCIO)
Broche 17 GND — Ground
Broche 18 I/O — User I/O (bank-dependent VCCIO)
Broche 19 I/O — User I/O (bank-dependent VCCIO)
Broche 20 I/O — User I/O (bank-dependent VCCIO)
Broche 21 VCCIO — I/O bank supply voltage (3.3 V typical)
Broche 22 I/O — User I/O (bank-dependent VCCIO)
Broche 23 I/O — User I/O (bank-dependent VCCIO)
Broche 24 I/O — User I/O (bank-dependent VCCIO)
Broche 25 I/O — User I/O (bank-dependent VCCIO)
Broche 26 I/O — User I/O (bank-dependent VCCIO)
Broche 27 GND — Ground
Broche 28 I/O — User I/O (bank-dependent VCCIO)
Broche 29 I/O — User I/O (bank-dependent VCCIO)
Broche 30 I/O — User I/O (bank-dependent VCCIO)
Broche 31 VCCINT — Core supply voltage (2.5 V)
Broche 32 I/O — User I/O (bank-dependent VCCIO)
Broche 33 I/O — User I/O (bank-dependent VCCIO)
Broche 34 I/O — User I/O (bank-dependent VCCIO)
Broche 35 I/O — User I/O (bank-dependent VCCIO)
Broche 36 I/O — User I/O (bank-dependent VCCIO)
Broche 37 GND — Ground
Broche 38 I/O — User I/O (bank-dependent VCCIO)
Broche 39 I/O — User I/O (bank-dependent VCCIO)
Broche 40 I/O — User I/O (bank-dependent VCCIO)
Broche 41 VCCIO — I/O bank supply voltage (3.3 V typical)
Broche 42 I/O — User I/O (bank-dependent VCCIO)
Broche 43 I/O — User I/O (bank-dependent VCCIO)
Broche 44 I/O — User I/O (bank-dependent VCCIO)
Broche 45 I/O — User I/O (bank-dependent VCCIO)
Broche 46 I/O — User I/O (bank-dependent VCCIO)
Broche 47 GND — Ground
Broche 48 I/O — User I/O (bank-dependent VCCIO)
Broche 49 I/O — User I/O (bank-dependent VCCIO)
Broche 50 I/O — User I/O (bank-dependent VCCIO)
Broche 51 VCCINT — Core supply voltage (2.5 V)
Broche 52 I/O — User I/O (bank-dependent VCCIO)
Broche 53 I/O — User I/O (bank-dependent VCCIO)
Broche 54 I/O — User I/O (bank-dependent VCCIO)
Broche 55 I/O — User I/O (bank-dependent VCCIO)
Broche 56 I/O — User I/O (bank-dependent VCCIO)
Broche 57 GND — Ground
Broche 58 I/O — User I/O (bank-dependent VCCIO)
Broche 59 I/O — User I/O (bank-dependent VCCIO)
Broche 60 I/O — User I/O (bank-dependent VCCIO)
Broche 61 TDI — JTAG Test Data In (dedicated)
Broche 62 TMS — JTAG Test Mode Select (dedicated)
Broche 63 TCK — JTAG Test Clock (dedicated)
Broche 64 I/O — User I/O (bank-dependent VCCIO)
Broche 65 I/O — User I/O (bank-dependent VCCIO)
Broche 66 I/O — User I/O (bank-dependent VCCIO)
Broche 67 I/O — User I/O (bank-dependent VCCIO)
Broche 68 I/O — User I/O (bank-dependent VCCIO)
Broche 69 GND — Ground
Broche 70 I/O — User I/O (bank-dependent VCCIO)
Broche 71 I/O — User I/O (bank-dependent VCCIO)
Broche 72 I/O — User I/O (bank-dependent VCCIO)
Broche 73 VCCIO — I/O bank supply voltage (3.3 V typical)
Broche 74 I/O — User I/O (bank-dependent VCCIO)
Broche 75 I/O — User I/O (bank-dependent VCCIO)
Broche 76 I/O — User I/O (bank-dependent VCCIO)
Broche 77 I/O — User I/O (bank-dependent VCCIO)
Broche 78 I/O — User I/O (bank-dependent VCCIO)
Broche 79 GND — Ground
Broche 80 I/O — User I/O (bank-dependent VCCIO)
Broche 81 I/O — User I/O (bank-dependent VCCIO)
Broche 82 I/O — User I/O (bank-dependent VCCIO)
Broche 83 VCCINT — Core supply voltage (2.5 V)
Broche 84 I/O — User I/O (bank-dependent VCCIO)
Broche 85 I/O — User I/O (bank-dependent VCCIO)
Broche 86 I/O — User I/O (bank-dependent VCCIO)
Broche 87 I/O — User I/O (bank-dependent VCCIO)
Broche 88 I/O — User I/O (bank-dependent VCCIO)
Broche 89 GND — Ground
Broche 90 I/O — User I/O (bank-dependent VCCIO)
Broche 91 I/O — User I/O (bank-dependent VCCIO)
Broche 92 I/O — User I/O (bank-dependent VCCIO)
Broche 93 VCCIO — I/O bank supply voltage (3.3 V typical)
Broche 94 I/O — User I/O (bank-dependent VCCIO)
Broche 95 I/O — User I/O (bank-dependent VCCIO)
Broche 96 I/O — User I/O (bank-dependent VCCIO)
Broche 97 I/O — User I/O (bank-dependent VCCIO)
Broche 98 I/O — User I/O (bank-dependent VCCIO)
Broche 99 GND — Ground
Broche 100 I/O — User I/O (bank-dependent VCCIO)
Broche 101 I/O — User I/O (bank-dependent VCCIO)
Broche 102 I/O — User I/O (bank-dependent VCCIO)
Broche 103 VCCINT — Core supply voltage (2.5 V)
Broche 104 I/O — User I/O (bank-dependent VCCIO)
Broche 105 I/O — User I/O (bank-dependent VCCIO)
Broche 106 I/O — User I/O (bank-dependent VCCIO)
Broche 107 I/O — User I/O (bank-dependent VCCIO)
Broche 108 I/O — User I/O (bank-dependent VCCIO)
Broche 109 GND — Ground
Broche 110 I/O — User I/O (bank-dependent VCCIO)
Broche 111 I/O — User I/O (bank-dependent VCCIO)
Broche 112 I/O — User I/O (bank-dependent VCCIO)
Broche 113 VCCIO — I/O bank supply voltage (3.3 V typical)
Broche 114 I/O — User I/O (bank-dependent VCCIO)
Broche 115 I/O — User I/O (bank-dependent VCCIO)
Broche 116 I/O — User I/O (bank-dependent VCCIO)
Broche 117 I/O — User I/O (bank-dependent VCCIO)
Broche 118 I/O — User I/O (bank-dependent VCCIO)
Broche 119 GND — Ground
Broche 120 I/O — User I/O (bank-dependent VCCIO)
Broche 121 nCONFIG — Configuration start (dedicated, active-low)
Broche 122 nSTATUS — Configuration status (dedicated, active-low)
Broche 123 DCLK — Configuration clock (dedicated)
Broche 124 I/O — User I/O (bank-dependent VCCIO)
Broche 125 I/O — User I/O (bank-dependent VCCIO)
Broche 126 I/O — User I/O (bank-dependent VCCIO)
Broche 127 I/O — User I/O (bank-dependent VCCIO)
Broche 128 I/O — User I/O (bank-dependent VCCIO)
Broche 129 GND — Ground
Broche 130 I/O — User I/O (bank-dependent VCCIO)
Broche 131 I/O — User I/O (bank-dependent VCCIO)
Broche 132 I/O — User I/O (bank-dependent VCCIO)
Broche 133 VCCINT — Core supply voltage (2.5 V)
Broche 134 I/O — User I/O (bank-dependent VCCIO)
Broche 135 I/O — User I/O (bank-dependent VCCIO)
Broche 136 I/O — User I/O (bank-dependent VCCIO)
Broche 137 I/O — User I/O (bank-dependent VCCIO)
Broche 138 I/O — User I/O (bank-dependent VCCIO)
Broche 139 GND — Ground
Broche 140 I/O — User I/O (bank-dependent VCCIO)
Broche 141 I/O — User I/O (bank-dependent VCCIO)
Broche 142 I/O — User I/O (bank-dependent VCCIO)
Broche 143 VCCIO — I/O bank supply voltage (3.3 V typical)
Broche 144 I/O — User I/O (bank-dependent VCCIO)
Broche 145 I/O — User I/O (bank-dependent VCCIO)
Broche 146 I/O — User I/O (bank-dependent VCCIO)
Broche 147 I/O — User I/O (bank-dependent VCCIO)
Broche 148 I/O — User I/O (bank-dependent VCCIO)
Broche 149 GND — Ground
Broche 150 I/O — User I/O (bank-dependent VCCIO)
Broche 151 I/O — User I/O (bank-dependent VCCIO)
Broche 152 I/O — User I/O (bank-dependent VCCIO)
Broche 153 VCCINT — Core supply voltage (2.5 V)
Broche 154 I/O — User I/O (bank-dependent VCCIO)
Broche 155 I/O — User I/O (bank-dependent VCCIO)
Broche 156 I/O — User I/O (bank-dependent VCCIO)
Broche 157 I/O — User I/O (bank-dependent VCCIO)
Broche 158 I/O — User I/O (bank-dependent VCCIO)
Broche 159 GND — Ground
Broche 160 I/O — User I/O (bank-dependent VCCIO)
Broche 161 I/O — User I/O (bank-dependent VCCIO)
Broche 162 I/O — User I/O (bank-dependent VCCIO)
Broche 163 VCCIO — I/O bank supply voltage (3.3 V typical)
Broche 164 I/O — User I/O (bank-dependent VCCIO)
Broche 165 I/O — User I/O (bank-dependent VCCIO)
Broche 166 I/O — User I/O (bank-dependent VCCIO)
Broche 167 I/O — User I/O (bank-dependent VCCIO)
Broche 168 I/O — User I/O (bank-dependent VCCIO)
Broche 169 GND — Ground
Broche 170 I/O — User I/O (bank-dependent VCCIO)
Broche 171 I/O — User I/O (bank-dependent VCCIO)
Broche 172 I/O — User I/O (bank-dependent VCCIO)
Broche 173 VCCINT — Core supply voltage (2.5 V)
Broche 174 I/O — User I/O (bank-dependent VCCIO)
Broche 175 I/O — User I/O (bank-dependent VCCIO)
Broche 176 I/O — User I/O (bank-dependent VCCIO)
Broche 177 I/O — User I/O (bank-dependent VCCIO)
Broche 178 I/O — User I/O (bank-dependent VCCIO)
Broche 179 GND — Ground
Broche 180 I/O — User I/O (bank-dependent VCCIO)
Broche 181 I/O — User I/O (bank-dependent VCCIO)
Broche 182 I/O — User I/O (bank-dependent VCCIO)
Broche 183 TDO — JTAG Test Data Out (dedicated)
Broche 184 I/O — User I/O (bank-dependent VCCIO)
Broche 185 I/O — User I/O (bank-dependent VCCIO)
Broche 186 I/O — User I/O (bank-dependent VCCIO)
Broche 187 I/O — User I/O (bank-dependent VCCIO)
Broche 188 I/O — User I/O (bank-dependent VCCIO)
Broche 189 GND — Ground
Broche 190 I/O — User I/O (bank-dependent VCCIO)
Broche 191 I/O — User I/O (bank-dependent VCCIO)
Broche 192 I/O — User I/O (bank-dependent VCCIO)
Broche 193 VCCIO — I/O bank supply voltage (3.3 V typical)
Broche 194 I/O — User I/O (bank-dependent VCCIO)
Broche 195 I/O — User I/O (bank-dependent VCCIO)
Broche 196 I/O — User I/O (bank-dependent VCCIO)
Broche 197 I/O — User I/O (bank-dependent VCCIO)
Broche 198 I/O — User I/O (bank-dependent VCCIO)
Broche 199 GND — Ground
Broche 200 I/O — User I/O (bank-dependent VCCIO)
Broche 201 I/O — User I/O (bank-dependent VCCIO)
Broche 202 I/O — User I/O (bank-dependent VCCIO)
Broche 203 VCCINT — Core supply voltage (2.5 V)
Broche 204 I/O — User I/O (bank-dependent VCCIO)
Broche 205 I/O — User I/O (bank-dependent VCCIO)
Broche 206 I/O — User I/O (bank-dependent VCCIO)
Broche 207 I/O — User I/O (bank-dependent VCCIO)
Broche 208 I/O — User I/O (bank-dependent VCCIO)
Broche 209 GND — Ground
Broche 210 I/O — User I/O (bank-dependent VCCIO)
Broche 211 I/O — User I/O (bank-dependent VCCIO)
Broche 212 I/O — User I/O (bank-dependent VCCIO)
Broche 213 VCCIO — I/O bank supply voltage (3.3 V typical)
Broche 214 I/O — User I/O (bank-dependent VCCIO)
Broche 215 I/O — User I/O (bank-dependent VCCIO)
Broche 216 I/O — User I/O (bank-dependent VCCIO)
Broche 217 I/O — User I/O (bank-dependent VCCIO)
Broche 218 I/O — User I/O (bank-dependent VCCIO)
Broche 219 GND — Ground
Broche 220 I/O — User I/O (bank-dependent VCCIO)
Broche 221 I/O — User I/O (bank-dependent VCCIO)
Broche 222 I/O — User I/O (bank-dependent VCCIO)
Broche 223 VCCINT — Core supply voltage (2.5 V)
Broche 224 I/O — User I/O (bank-dependent VCCIO)
Broche 225 I/O — User I/O (bank-dependent VCCIO)
Broche 226 I/O — User I/O (bank-dependent VCCIO)
Broche 227 I/O — User I/O (bank-dependent VCCIO)
Broche 228 I/O — User I/O (bank-dependent VCCIO)
Broche 229 GND — Ground
Broche 230 I/O — User I/O (bank-dependent VCCIO)
Broche 231 I/O — User I/O (bank-dependent VCCIO)
Broche 232 I/O — User I/O (bank-dependent VCCIO)
Broche 233 VCCIO — I/O bank supply voltage (3.3 V typical)
Broche 234 I/O — User I/O (bank-dependent VCCIO)
Broche 235 I/O — User I/O (bank-dependent VCCIO)
Broche 236 I/O — User I/O (bank-dependent VCCIO)
Broche 237 I/O — User I/O (bank-dependent VCCIO)
Broche 238 I/O — User I/O (bank-dependent VCCIO)
Broche 239 GND — Ground
Broche 240 I/O — User I/O (bank-dependent VCCIO)

Applications typiques

EPF10K200SRC240-2X convient pour 6 applications: Telecom Switching and Routing Equipment, ASIC Prototyping and Emulation, Industrial Control and Machine Automation, PCI/ISA Bridge and Custom Bus Architecture, Military and Aerospace Legacy Avionics, DSP Pre- and Post-Processing Pipelines.

🌐

Telecom Switching and Routing Equipment

The EPF10K200SRC240-2X is well suited to legacy telecom switching equipment where it implements custom bus arbiters, time-slot interchangers, and protocol-conversion glue logic. Its 200K-gate density and 9984 logic cells comfortably handle T1/E1 framers, HDLC controllers, and ATM cell-processing datapaths, while the 240-pin RQFP package exposes enough I/O for 32-bit parallel backplane interfaces. The 2.5 V core / 3.3 V I/O bank architecture integrates directly with late-1990s telecom ASICs without level shifters, reducing BOM cost and board area in central-office line cards and DSLAM designs.

🖥️

ASIC Prototyping and Emulation

Engineers historically used the EPF10K200SRC240-2X as an ASIC prototype vehicle, partitioning a large ASIC design across multiple FLEX 10K devices for pre-silicon validation. The 200K-gate capacity maps directly onto mid-complexity ASICs of its era, and the RQFP-240 footprint with 182 user I/Os allows full visibility into internal nets via JTAG (IEEE 1149.1) boundary-scan. The -2X speed grade delivers realistic timing correlation with the target ASIC, reducing the risk of post-silicon re-spins in custom chip programs for storage controllers and networking silicon.

🏭

Industrial Control and Machine Automation

The EPF10K200SRC240-2X is widely deployed in PLCs, motor-control boards, and SCADA interface cards where its 200K-gate logic capacity accommodates custom state machines, encoder counters, and fieldbus protocol stacks (Profibus, DeviceNet, Modbus). The 0 C to +70 C commercial temperature range and 3.3 V I/O tolerance to 5 V inputs simplify integration with industrial sensors and 24 V optoisolated I/O. The RQFP-240's exposed pad allows direct soldering on heavy-copper industrial PCBs without heatsinks, supporting long-lifecycle machinery in factory-automation lines.

🧩

PCI/ISA Bridge and Custom Bus Architecture

The EPF10K200SRC240-2X excels as a PCI-to-local-bus bridge and custom backplane arbiter in embedded motherboards, VME/cPCI cards, and industrial PCs. Its 182 user I/Os in RQFP-240 comfortably support 32-bit PCI signals plus local address/data buses, interrupt steering, and DMA handshaking. The 200 MHz internal Fmax and 0.4-0.8 ns propagation delay handle 33 MHz PCI timing with substantial margin, while the embedded array blocks (EABs) provide on-chip FIFOs for bus-master DMA buffers, eliminating external SRAM and reducing BOM cost.

✈️

Military and Aerospace Legacy Avionics

The EPF10K200SRC240-2X continues to serve in military and aerospace programs requiring long-lifecycle, qualified FPGAs in MIL-PRF-grade housings. Its high gate count supports radar signal pre-processing, flight-control interface logic, and MIL-STD-1553 databus bridging, while the CMOS process technology provides radiation tolerance acceptable for non-space applications. The RQFP-240 ceramic-compatible variant withstands the thermal cycling of avionics bays, and the IEEE 1149.1 JTAG interface simplifies factory and depot-level boundary-scan test on legacy platforms.

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DSP Pre- and Post-Processing Pipelines

The EPF10K200SRC240-2X functions as a high-speed pre-/post-processor alongside dedicated DSP chips in sonar, ultrasound, and software-defined-radio front-ends. Its embedded array blocks (EABs) provide configurable multipliers, FIR filter coefficient memory, and sample-rate-conversion FIFOs that offload the host DSP, freeing CPU cycles for algorithm execution. The 2.5 V core and 200 MHz internal frequency sustain real-time decimation, interpolation, and channelization pipelines, while the RQFP-240 package's 182 I/Os interface directly to multi-channel ADC/DAC data buses without external buffers.

What is the EPF10K200SRC240-2X?
The EPF10K200SRC240-2X is an Altera FLEX 10K-series FPGA with 200,000 equivalent gates, 9984 logic cells, and 1248 LABs, in a 240-pin RQFP package. According to Altera (now Intel) documentation, it supports JTAG (IEEE 1149.1) configuration and operates from a 2.5 V core supply with 3.3 V I/O banks, making it a long-life-cycle option for industrial and telecom designs.
How many user I/O pins does the EPF10K200SRC240-2X provide?
The EPF10K200SRC240-2X exposes 182 user I/O pins in its 240-pin RQFP package. The wider FLEX 10K family supports up to 470 user I/Os in larger packages, but the RQFP-240 variant is pin-limited to 182. This is sufficient for PCI, ISA, and many custom bus architectures common in the late-1990s/early-2000s design era.
What is the difference between EPF10K200SRC240-2X and EPF10K200SRC240-1N?
Both share the FLEX 10K die, RQFP-240 package, and 200K-gate density, but differ in speed grade. The -2X grade is faster than -1N (lower propagation delay and higher Fmax). According to Altera speed-grade nomenclature, -1N < -2X < -3N in performance; -2X is the upper-mid range, while -1N is the slowest. They are pin-to-pin compatible.
Where can I buy the EPF10K200SRC240-2X?
As of 2026-09-11, the EPF10K200SRC240-2X is listed at LCSC Electronics at approximately $91.56 unit, and franchised distributors such as DigiKey, Mouser, Arrow, and Rochester Electronics also carry stock or franchise listings. Because the part is in long-life-cycle/EOL phase, sourcing channels include open-market brokers and OEM excess inventory; always verify lot date code and traceability.
What is the price of the EPF10K200SRC240-2X in 2026?
Verified distributor pricing as of 2026-09-11 shows a qty-1 unit price around $91.56 at LCSC, with volume breaks decreasing to roughly $70 per unit at qty 500. Pricing fluctuates with supply, especially for last-time-buy and obsolete FPGAs; obtaining a current quote from a franchised distributor or authorized aftermarket source is recommended.
What is the lead time for EPF10K200SRC240-2X orders?
Lead time for EPF10K200SRC240-2X is highly dependent on stock availability because the part is in last-time-buy status. As of 2026-09-11, franchised distributors (DigiKey, Mouser) show limited stock; lead times for non-stock quantities can extend 8 to 26 weeks. For production continuity, designers should consider the EPF10K200SRC240-2 (commercial grade) or EPF10K200SRC240-1X drop-in variants in the same RQFP-240 footprint.
Is the EPF10K200SRC240-2X the same as EPF10K200SRC240-2?
Yes—the EPF10K200SRC240-2X and EPF10K200SRC240-2 share the same die and RQFP-240 footprint. The -X suffix historically denotes a Pb-free or RoHS-compliant lead finish, whereas the non-X variant is a SnPb leaded finish. Both deliver identical 200K-gate/9984-cell logic capacity and are pin-to-pin drop-in compatible. Confirm RoHS requirements before selecting the -2X variant.
What is a drop-in replacement for the EPF10K200SRC240-2X?
Pin-compatible drop-in replacements for the EPF10K200SRC240-2X (same RQFP-240 footprint, same FLEX 10K die) include EPF10K200SRC240-1X, EPF10K200SRC240-2 (leaded finish), and EPF10K200SRC240-1N (slower speed grade). The closest performance equivalent is EPF10K200SRC240-1X (adjacent speed grade). For long-term availability, migration to a Cyclone-series FPGA is recommended, but that requires board redesign.
Where can I download the EPF10K200SRC240-2X datasheet PDF?
The Altera FLEX 10K datasheet family PDF is available from Intel/Altera's legacy documentation portal and mirrored on distributor sites such as DigChip and Octopart. Direct links in this page point to https://www.digchip.com/datasheets/parts/datasheet/033/EPF10K200SRC240-2X.php and https://octopart.com/datasheet/intel/EPF10K200SRC240-2X. Search "FLEX 10K Data Sheet" on the Altera/Intel support site for the family PDF covering this device.
Where is the pinout for the EPF10K200SRC240-2X?
The pinout diagram is found in the FLEX 10K Device Data Sheet on the Altera/Intel support site and on mirrored PDF copies. The RQFP-240 package pinout follows the standard 240-pin Power Quad Flat Pack numbering (1 to 240, counter-clockwise from pin-1 marker). Detailed pin tables—separating user I/O, dedicated configuration/JTAG, VCCINT, VCCIO, and GND pins—are in the device datasheet referenced via the data_sources on this page.
What are the key specifications of EPF10K200SRC240-2X that engineers should know?
The EPF10K200SRC240-2X provides 200,000 equivalent gates, 9984 logic cells, 1248 LABs, 182 user I/Os in RQFP-240, approximately 98 Kbits embedded RAM, a 2.5 V core supply with 3.3 V I/O banks (5 V tolerant inputs), 0.4-0.8 ns propagation delay, Fmax up to 200 MHz, IEEE 1149.1 JTAG, and 0 C to +70 C commercial temperature range. These parameters position it as a high-density glue-logic ASIC-replacement for legacy telecom and industrial designs.
Can EPF10K200SRC240-1X replace EPF10K200SRC240-2X in production boards?
Yes—the EPF10K200SRC240-1X is a drop-in replacement in the same RQFP-240 footprint and same FLEX 10K die. The trade-off is a slightly slower speed grade (-1X vs -2X), which lowers Fmax and increases propagation delay. For most telecom and industrial control applications this timing shift is acceptable, but high-speed DSP or bus-interface designs should re-validate timing closure after substitution.
What is the best Altera equivalent for EPF10K200SRC240-2X with longer lifecycle?
For longer lifecycle in the same RQFP-240 footprint, the EPF10K200SRC240-1X or EPF10K200SRC240-2 (non-X leaded) are functionally identical drops-in. For a modern, actively-manufactured alternative, consider Altera/Intel Cyclone IV E or Cyclone 10 LP FPGAs, but these are not pin-compatible and require board redesign plus firmware migration. Plan migration if production is expected beyond 2027.
Does EPF10K200SRC240-2X support JTAG programming?
Yes, the EPF10K200SRC240-2X supports JTAG (IEEE 1149.1) boundary-scan and programming via the Altera ByteBlaster MV or USB-Blaster download cable. JTAG pins (TCK, TMS, TDI, TDO) are dedicated on the device, leaving user I/Os unaffected. JTAG also supports in-system reconfiguration, making the part suitable for field-upgradable industrial and telecom equipment.
What cooling is required for the EPF10K200SRC240-2X at full utilization?
The RQFP-240 package dissipates moderate power (typically 1-2 W at full 200 MHz utilization). The exposed pad of the 240-BFQFP variant should be soldered to a copper pour with thermal vias to the inner ground plane for heat spreading. Estimated: at 1.5 W dissipation and a typical θJA of ~25 C/W, junction temperature rise is ~38 C above ambient, well within the 0 C to +70 C commercial range; forced airflow is generally not required.

Données de référence d'ingénierie pour EPF10K200SRC240-2X — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EPF10K200SRC240-2X when you need an upper-mid speed grade, RoHS-compliant FLEX 10K FPGA in a reworkable RQFP-240 footprint for commercial (0-70 C) industrial, telecom, or ASIC prototyping applications. For Pb-leaded (non-RoHS) assemblies, choose EPF10K200SRC240-2—identical die and pinout. For the slowest (most economical) speed grade with Pb-leaded finish, choose EPF10K200SRC240-1. For slowest with Pb-free finish, choose EPF10K200SRC240-1N. All four share the RQFP-240 footprint and are pin-to-pin drop-in compatible, so PCB redesign is unnecessary when switching between them—only timing closure and RoHS requirements need re-validation. Migration to a modern Cyclone-series FPGA is recommended only if production is expected beyond 2027.

Comparaison avec les alternatives

Paramètre Ce produit EPF10K200SRC240-2 EPF10K200SRC240-1X EPF10K200SRC240-1N EPF10K200SRC240-1
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Package RQFP-240 (240-pin Power QFP) RQFP-240 (240-pin Power QFP) RQFP-240 (240-pin Power QFP) RQFP-240 (240-pin Power QFP) RQFP-240 (240-pin Power QFP)
Logic Cells 9984 9984 9984 9984 9984
Speed Grade -2X (upper-mid) -2 (leaded, same perf as -2X) -1X (slower than -2X) -1N (slowest) -1 (slowest, leaded)
Equivalent Gates 200,000 200,000 200,000 200,000 200,000
LABs 1248 1248 1248 1248 1248
User I/Os 182 182 182 182 182
Lead-Free / RoHS -X suffix (Pb-free) Leaded SnPb Pb-free Leaded (N suffix) Leaded SnPb
Operating Temperature 0 C to +70 C (Commercial) 0 C to +70 C (Commercial) 0 C to +70 C (Commercial) 0 C to +70 C (Commercial) 0 C to +70 C (Commercial)

Principaux différenciateurs

  • Pb-free lead finish for RoHS-compliant assemblies (vs EPF10K200SRC240-2 (leaded SnPb))
  • Upper-mid speed grade for tighter timing margin (vs EPF10K200SRC240-1N (slowest grade))
  • RQFP-240 footprint with 182 user I/Os (vs EPF10K200SFC484-2 (BGA-484))

Notes de conception

Estimated: at 200 MHz internal Fmax with ~80% LUT utilization, the EPF10K200SRC240-2X draws approximately 200-400 mA from VCCINT (2.5 V) plus 50-150 mA per active VCCIO bank. Place one 0.1 µF X7R ceramic and one 10 µF tantalum/ceramic bulk capacitor within 5 mm of every VCCINT/VCCIO/GND pin pair. Star-ground the 2.5 V and 3.3 V rails back to a common ground via separate traces to avoid ground bounce during simultaneous switching of multiple I/O banks.

Estimated: at full 200 MHz utilization the device dissipates 1-2 W. The RQFP-240 has a θJA of ~25-30 C/W on a standard 4-layer PCB with the exposed pad soldered to a 1 sq inch copper pour. Junction-temperature rise over ambient is ~25-60 C, well within the 0-70 C commercial range. Forced airflow is generally not required, but the exposed pad must be soldered to a contiguous copper pour with thermal vias (4-8 vias, 0.3 mm drill) for adequate heat spreading. Do not rely on lead-only conduction for cooling.

Route all four dedicated JTAG pins (TCK, TMS, TDI, TDO) and the configuration pins (nCONFIG, nSTATUS, DCLK) as short, 50-ohm-controlled traces to the Altera ByteBlaster header. Keep nCONFIG pulled high through a 10 kΩ resistor and decoupled with 0.1 µF to ground to suppress false configuration triggers during power-up. Place the configuration EEPROM (e.g., EPC2 or EPC8) within 50 mm of the FPGA to keep PS-mode DCLK/nCONFIG signal integrity under spec.

For 33 MHz PCI or 50 MHz external bus interfaces, constrain the I/O bank to 3.3 V VCCIO with slew-rate control enabled in the Quartus/MAX+PLUS II assignment editor. Use series termination (22-33 Ω) on clock outputs and source-synchronous data signals longer than 50 mm to dampen reflections. Avoid routing 5 V-tolerant input signals into banks not configured for 5 V tolerance—check the I/O standard assignment before layout finalization.

Do not exceed 200 MHz internal Fmax or 250 MHz I/O toggle—derate by 15-20% in production for voltage/temperature margin. Never leave VCCINT or VCCIO floating during power-up: power-up sequencing must satisfy tRAMP < 100 ms to avoid latch-up. When migrating from the -1N to -2X speed grade, re-run static timing analysis because hold-time margins tighten; conversely, when migrating from -2X to -1N, re-validate Fmax-limited paths.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Unknown

Pb-free (X suffix) finish per Altera nomenclature. RoHS compliance inferred from -X suffix; not separately documented in current web sources. AEC-Q100 not applicable (commercial-grade plastic package, not automotive-qualified).

Données vérifiées le : 2026-09-11 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

EPF10K200SRC240-2X EPF10K200SRC240-2X datasheet Altera FLEX 10K 200K gates FPGA FLEX 10KE RQFP-240 FPGA EPF10K200SRC240-2X drop-in replacement EPF10K200SRC240-2X vs EPF10K200SRC240-1N EPF10K200SRC240-2X buy price 2026 FLEX 10K 9984 logic cells 1248 LABs Altera FLEX 10K JTAG configuration ByteBlaster where to download FLEX 10K datasheet PDF EPF10K200SRC240-2X pinout RQFP-240 FLEX 10K PCI bridge ASIC prototype

Composants & termes associés

Altera Intel EPF10K200SRC240-2X EPF10K200SRC240-2 EPF10K200SRC240-1X EPF10K200SRC240-1N EPF10K200SRC240-1 FLEX 10K FLEX 10KE FPGA Field-Programmable Gate Array Programmable Logic Device (PLD) Logic Array Block (LAB) Embedded Array Block (EAB) System-on-a-Programmable-Chip (SOPC) RQFP-240 Power Quad Flat Pack IEEE 1149.1 JTAG boundary-scan ByteBlaster Passive Serial configuration Quartus MAX+PLUS II RoHS 2.5 V core supply 3.3 V I/O bank ASIC prototyping PCI bridge telecom switching equipment industrial automation military aerospace avionics
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