EPF10K200SRC240-2X - FLEX 10K 200K Gates 9984 Cells FPGA | Altera
N.º da peça: EPF10K200SRC240-2X ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $91.56 | $91,56 |
| 10 | $86.98 | $869,80 |
| 100 | $79.42 | $7.942,00 |
| 250 | $74.1 | $18.525,00 |
| 500 | $70.05 | $35.025,00 |
EPF10K200SRC240-2X Visão geral
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit designed to be configured by the customer or designer after manufacturing—hence "field-programmable". The FLEX 10K family specifically pioneered the embedded array architecture, where rows of logic elements are interleaved with columns of embedded array blocks (EABs), each EAB providing up to 2048 bits of RAM or a small ROM/DSP function. This positions FLEX 10K as a hybrid between classical FPGAs and early system-on-chip (SoC) devices, often referred to as system-on-a-programmable-chip (SOPC) integration. In the broader taxonomy, FPGAs sit under programmable logic devices (PLDs), which include SPLDs, CPLDs, and FPGAs, all of which fall under digital logic ICs and ultimately integrated circuits.
Key features of the EPF10K200SRC240-2X include 200K equivalent gates, 9984 logic elements/cells, embedded array blocks providing up to approximately 98 Kbits of RAM, JTAG-compliant boundary-scan test (IEEE 1149.1) support, multi-voltage I/O standards, and a core supply of 2.5 V with I/O banks supporting 3.3 V, 5 V tolerant interfaces. The -2X speed grade denotes an industrial-temperature-grade device optimized for higher clock rates compared to -3 or -1N grades. The 240-pin RQFP-240 package (34.6 mm x 34.6 mm body, 0.5 mm pitch, gull-wing leads) is designed for surface-mount assembly on high-layer-count PCBs with thermal management via the exposed pad.
Typical applications for the EPF10K200SRC240-2X include telecom switching equipment, ASIC prototyping, high-speed data-acquisition front-ends, industrial control systems, military and aerospace logic integration, glue logic for embedded motherboards, and legacy MRO (maintenance, repair, overhaul) programs where long-life-cycle parts are required. The device is widely used in PCI interface bridging, custom bus architectures, and DSP pre/post-processing pipelines. Compared to its sibling grades (-1N, -2, -3N), the -2X places in the upper-mid speed range with improved timing margin.
Designers should pay close attention to I/O bank partitioning and VCCIO rail planning—each of the multiple I/O banks must be tied to a single VCCIO voltage (3.3 V typical, but 2.5 V and 5 V-tolerant inputs also supported on dedicated banks). Decoupling requirements call for multiple low-ESR 0.1 µF and 10 µF capacitors placed as close as possible to each VCC/VCCIO pin pair. Programming uses the Altera ByteBlaster or BitBlaster cable via JTAG or the legacy PS (passive serial) configuration mode.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives (including speed-grade variants in the same RQFP-240 footprint), parametric comparisons, and practical design notes not collated in any single manufacturer datasheet—giving sourcing engineers and program managers a one-stop reference for this long-life-cycle FPGA.
Alternativas drop-in para EPF10K200SRC240-2X — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF10K200SRC240-2X (mesmo formato e footprint) — diferindo em Process Technology, Operating Temperature, Speed Grade, Family, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF10K200SRC240-2
✅ Drop-In✓ Em estoque
$62.5 / unidade
Ver ficha técnica →EPF10K200SRC240-1X
✅ Drop-In✓ Em estoque
$540 / unidade
Ver ficha técnica →EPF10K200SRC240-1N
✅ Drop-In✓ Em estoque
$68.4 / unidade
Ver ficha técnica →EPF10K200SRC240-1
✅ Drop-In✓ Em estoque
$112 / unidade
Ver ficha técnica →EPF10K200SRC240-1X
✅ Drop-In✓ Em estoque
$540 / unidade
Ver ficha técnica →EPF10K200SRC240-2X Classificações máximas e características elétricas
| Series | FLEX 10KS |
| Family | FLEX 10KE |
| Logic Cells | 9984 |
| Logic Array Blocks (LABs) | 1248 |
| Equivalent Gates | 200,000 |
| Embedded RAM (approx.) | 98 Kbits |
| User I/Os (max in family) | 470 |
| User I/Os (this package) | 182 |
| Propagation Delay | 0.4 ns to 0.8 ns |
| Max Internal Frequency | 200 MHz |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | 3.3 V (banks; 5 V tolerant inputs) |
| Encapsulamento | RQFP-240 (240-pin Power Quad Flat Pack, 34.6 x 34.6 mm, 0.5 mm pitch) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0 C to +70 C (Commercial) |
| Process Technology | CMOS |
| Configuration Method | JTAG / Passive Serial (PS) |
| Boundary-Scan (JTAG) | IEEE 1149.1 compliant |
| Speed Grade | -2X (industrial, upper-mid speed) |
Configuração de pinos do EPF10K200SRC240-2X
| Pino 1 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 2 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 3 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 4 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 5 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 6 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 7 | GND — Ground |
| Pino 8 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 9 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 10 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 11 | VCCINT — Core supply voltage (2.5 V) |
| Pino 12 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 13 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 14 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 15 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 16 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 17 | GND — Ground |
| Pino 18 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 19 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 20 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 21 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Pino 22 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 23 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 24 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 25 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 26 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 27 | GND — Ground |
| Pino 28 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 29 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 30 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 31 | VCCINT — Core supply voltage (2.5 V) |
| Pino 32 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 33 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 34 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 35 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 36 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 37 | GND — Ground |
| Pino 38 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 39 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 40 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 41 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Pino 42 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 43 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 44 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 45 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 46 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 47 | GND — Ground |
| Pino 48 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 49 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 50 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 51 | VCCINT — Core supply voltage (2.5 V) |
| Pino 52 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 53 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 54 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 55 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 56 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 57 | GND — Ground |
| Pino 58 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 59 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 60 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 61 | TDI — JTAG Test Data In (dedicated) |
| Pino 62 | TMS — JTAG Test Mode Select (dedicated) |
| Pino 63 | TCK — JTAG Test Clock (dedicated) |
| Pino 64 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 65 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 66 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 67 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 68 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 69 | GND — Ground |
| Pino 70 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 71 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 72 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 73 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Pino 74 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 75 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 76 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 77 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 78 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 79 | GND — Ground |
| Pino 80 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 81 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 82 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 83 | VCCINT — Core supply voltage (2.5 V) |
| Pino 84 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 85 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 86 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 87 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 88 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 89 | GND — Ground |
| Pino 90 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 91 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 92 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 93 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Pino 94 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 95 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 96 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 97 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 98 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 99 | GND — Ground |
| Pino 100 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 101 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 102 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 103 | VCCINT — Core supply voltage (2.5 V) |
| Pino 104 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 105 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 106 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 107 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 108 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 109 | GND — Ground |
| Pino 110 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 111 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 112 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 113 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Pino 114 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 115 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 116 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 117 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 118 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 119 | GND — Ground |
| Pino 120 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 121 | nCONFIG — Configuration start (dedicated, active-low) |
| Pino 122 | nSTATUS — Configuration status (dedicated, active-low) |
| Pino 123 | DCLK — Configuration clock (dedicated) |
| Pino 124 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 125 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 126 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 127 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 128 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 129 | GND — Ground |
| Pino 130 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 131 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 132 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 133 | VCCINT — Core supply voltage (2.5 V) |
| Pino 134 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 135 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 136 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 137 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 138 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 139 | GND — Ground |
| Pino 140 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 141 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 142 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 143 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Pino 144 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 145 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 146 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 147 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 148 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 149 | GND — Ground |
| Pino 150 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 151 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 152 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 153 | VCCINT — Core supply voltage (2.5 V) |
| Pino 154 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 155 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 156 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 157 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 158 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 159 | GND — Ground |
| Pino 160 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 161 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 162 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 163 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Pino 164 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 165 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 166 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 167 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 168 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 169 | GND — Ground |
| Pino 170 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 171 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 172 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 173 | VCCINT — Core supply voltage (2.5 V) |
| Pino 174 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 175 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 176 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 177 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 178 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 179 | GND — Ground |
| Pino 180 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 181 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 182 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 183 | TDO — JTAG Test Data Out (dedicated) |
| Pino 184 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 185 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 186 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 187 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 188 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 189 | GND — Ground |
| Pino 190 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 191 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 192 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 193 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Pino 194 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 195 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 196 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 197 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 198 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 199 | GND — Ground |
| Pino 200 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 201 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 202 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 203 | VCCINT — Core supply voltage (2.5 V) |
| Pino 204 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 205 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 206 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 207 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 208 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 209 | GND — Ground |
| Pino 210 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 211 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 212 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 213 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Pino 214 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 215 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 216 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 217 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 218 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 219 | GND — Ground |
| Pino 220 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 221 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 222 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 223 | VCCINT — Core supply voltage (2.5 V) |
| Pino 224 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 225 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 226 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 227 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 228 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 229 | GND — Ground |
| Pino 230 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 231 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 232 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 233 | VCCIO — I/O bank supply voltage (3.3 V typical) |
| Pino 234 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 235 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 236 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 237 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 238 | I/O — User I/O (bank-dependent VCCIO) |
| Pino 239 | GND — Ground |
| Pino 240 | I/O — User I/O (bank-dependent VCCIO) |
Aplicações típicas
EPF10K200SRC240-2X é adequado para 6 aplicaçãos: Telecom Switching and Routing Equipment, ASIC Prototyping and Emulation, Industrial Control and Machine Automation, PCI/ISA Bridge and Custom Bus Architecture, Military and Aerospace Legacy Avionics, DSP Pre- and Post-Processing Pipelines.
Telecom Switching and Routing Equipment
The EPF10K200SRC240-2X is well suited to legacy telecom switching equipment where it implements custom bus arbiters, time-slot interchangers, and protocol-conversion glue logic. Its 200K-gate density and 9984 logic cells comfortably handle T1/E1 framers, HDLC controllers, and ATM cell-processing datapaths, while the 240-pin RQFP package exposes enough I/O for 32-bit parallel backplane interfaces. The 2.5 V core / 3.3 V I/O bank architecture integrates directly with late-1990s telecom ASICs without level shifters, reducing BOM cost and board area in central-office line cards and DSLAM designs.
Recomendado
ASIC Prototyping and Emulation
Engineers historically used the EPF10K200SRC240-2X as an ASIC prototype vehicle, partitioning a large ASIC design across multiple FLEX 10K devices for pre-silicon validation. The 200K-gate capacity maps directly onto mid-complexity ASICs of its era, and the RQFP-240 footprint with 182 user I/Os allows full visibility into internal nets via JTAG (IEEE 1149.1) boundary-scan. The -2X speed grade delivers realistic timing correlation with the target ASIC, reducing the risk of post-silicon re-spins in custom chip programs for storage controllers and networking silicon.
Recomendado
Industrial Control and Machine Automation
The EPF10K200SRC240-2X is widely deployed in PLCs, motor-control boards, and SCADA interface cards where its 200K-gate logic capacity accommodates custom state machines, encoder counters, and fieldbus protocol stacks (Profibus, DeviceNet, Modbus). The 0 C to +70 C commercial temperature range and 3.3 V I/O tolerance to 5 V inputs simplify integration with industrial sensors and 24 V optoisolated I/O. The RQFP-240's exposed pad allows direct soldering on heavy-copper industrial PCBs without heatsinks, supporting long-lifecycle machinery in factory-automation lines.
Recomendado
PCI/ISA Bridge and Custom Bus Architecture
The EPF10K200SRC240-2X excels as a PCI-to-local-bus bridge and custom backplane arbiter in embedded motherboards, VME/cPCI cards, and industrial PCs. Its 182 user I/Os in RQFP-240 comfortably support 32-bit PCI signals plus local address/data buses, interrupt steering, and DMA handshaking. The 200 MHz internal Fmax and 0.4-0.8 ns propagation delay handle 33 MHz PCI timing with substantial margin, while the embedded array blocks (EABs) provide on-chip FIFOs for bus-master DMA buffers, eliminating external SRAM and reducing BOM cost.
Recomendado
Military and Aerospace Legacy Avionics
The EPF10K200SRC240-2X continues to serve in military and aerospace programs requiring long-lifecycle, qualified FPGAs in MIL-PRF-grade housings. Its high gate count supports radar signal pre-processing, flight-control interface logic, and MIL-STD-1553 databus bridging, while the CMOS process technology provides radiation tolerance acceptable for non-space applications. The RQFP-240 ceramic-compatible variant withstands the thermal cycling of avionics bays, and the IEEE 1149.1 JTAG interface simplifies factory and depot-level boundary-scan test on legacy platforms.
Recomendado
DSP Pre- and Post-Processing Pipelines
The EPF10K200SRC240-2X functions as a high-speed pre-/post-processor alongside dedicated DSP chips in sonar, ultrasound, and software-defined-radio front-ends. Its embedded array blocks (EABs) provide configurable multipliers, FIR filter coefficient memory, and sample-rate-conversion FIFOs that offload the host DSP, freeing CPU cycles for algorithm execution. The 2.5 V core and 200 MHz internal frequency sustain real-time decimation, interpolation, and channelization pipelines, while the RQFP-240 package's 182 I/Os interface directly to multi-channel ADC/DAC data buses without external buffers.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF10K200SRC240-2X — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF10K200SRC240-2 | EPF10K200SRC240-1X | EPF10K200SRC240-1N | EPF10K200SRC240-1 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | RQFP-240 (240-pin Power QFP) | RQFP-240 (240-pin Power QFP) | RQFP-240 (240-pin Power QFP) | RQFP-240 (240-pin Power QFP) | RQFP-240 (240-pin Power QFP) |
| Logic Cells | 9984 | 9984 | 9984 | 9984 | 9984 |
| Speed Grade | -2X (upper-mid) | -2 (leaded, same perf as -2X) | -1X (slower than -2X) | -1N (slowest) | -1 (slowest, leaded) |
| Equivalent Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| LABs | 1248 | 1248 | 1248 | 1248 | 1248 |
| User I/Os | 182 | 182 | 182 | 182 | 182 |
| Lead-Free / RoHS | -X suffix (Pb-free) | Leaded SnPb | Pb-free | Leaded (N suffix) | Leaded SnPb |
| Operating Temperature | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) |
Principais diferenciais
- Pb-free lead finish for RoHS-compliant assemblies (vs EPF10K200SRC240-2 (leaded SnPb))
- Upper-mid speed grade for tighter timing margin (vs EPF10K200SRC240-1N (slowest grade))
- RQFP-240 footprint with 182 user I/Os (vs EPF10K200SFC484-2 (BGA-484))
Notas de projeto
Estimated: at 200 MHz internal Fmax with ~80% LUT utilization, the EPF10K200SRC240-2X draws approximately 200-400 mA from VCCINT (2.5 V) plus 50-150 mA per active VCCIO bank. Place one 0.1 µF X7R ceramic and one 10 µF tantalum/ceramic bulk capacitor within 5 mm of every VCCINT/VCCIO/GND pin pair. Star-ground the 2.5 V and 3.3 V rails back to a common ground via separate traces to avoid ground bounce during simultaneous switching of multiple I/O banks.
Estimated: at full 200 MHz utilization the device dissipates 1-2 W. The RQFP-240 has a θJA of ~25-30 C/W on a standard 4-layer PCB with the exposed pad soldered to a 1 sq inch copper pour. Junction-temperature rise over ambient is ~25-60 C, well within the 0-70 C commercial range. Forced airflow is generally not required, but the exposed pad must be soldered to a contiguous copper pour with thermal vias (4-8 vias, 0.3 mm drill) for adequate heat spreading. Do not rely on lead-only conduction for cooling.
Route all four dedicated JTAG pins (TCK, TMS, TDI, TDO) and the configuration pins (nCONFIG, nSTATUS, DCLK) as short, 50-ohm-controlled traces to the Altera ByteBlaster header. Keep nCONFIG pulled high through a 10 kΩ resistor and decoupled with 0.1 µF to ground to suppress false configuration triggers during power-up. Place the configuration EEPROM (e.g., EPC2 or EPC8) within 50 mm of the FPGA to keep PS-mode DCLK/nCONFIG signal integrity under spec.
For 33 MHz PCI or 50 MHz external bus interfaces, constrain the I/O bank to 3.3 V VCCIO with slew-rate control enabled in the Quartus/MAX+PLUS II assignment editor. Use series termination (22-33 Ω) on clock outputs and source-synchronous data signals longer than 50 mm to dampen reflections. Avoid routing 5 V-tolerant input signals into banks not configured for 5 V tolerance—check the I/O standard assignment before layout finalization.
Do not exceed 200 MHz internal Fmax or 250 MHz I/O toggle—derate by 15-20% in production for voltage/temperature margin. Never leave VCCINT or VCCIO floating during power-up: power-up sequencing must satisfy tRAMP < 100 ms to avoid latch-up. When migrating from the -1N to -2X speed grade, re-run static timing analysis because hold-time margins tighten; conversely, when migrating from -2X to -1N, re-validate Fmax-limited paths.
Informações de conformidade
Pb-free (X suffix) finish per Altera nomenclature. RoHS compliance inferred from -X suffix; not separately documented in current web sources. AEC-Q100 not applicable (commercial-grade plastic package, not automotive-qualified).