EPM570GF256C4 - MAX II CPLD 570 LE 256-FBGA 5.4ns | Intel
部品番号: EPM570GF256C4 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $45.57 | $45.57 |
| 10 | $41.01 | $410.10 |
| 100 | $36.45 | $3,645.00 |
| 500 | $32.8 | $16,400.00 |
| 1,000 | $29.85 | $29,850.00 |
EPM570GF256C4 概要
A Complex Programmable Logic Device (CPLD) is a non-volatile, instantly-on programmable logic device that combines multiple PAL/GAL-like logic blocks with a programmable interconnect matrix. Within the broader taxonomy, a CPLD sits between discrete 74-series glue logic (e.g., 74HC, 74LVT) and FPGAs, providing deterministic timing, instant boot-up, and high drive strength for I/O expansion, bus bridging, power sequencing, and interface glue logic. MAX II CPLDs use a flash-based configuration cell, so the device retains its logic image without an external boot PROM and supports in-system programmability via JTAG.
Key features include 5.4 ns tPD (fastest speed grade in the EPM570 family), 8 dedicated input pins, multi-voltage I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V LVCMOS/LVTTL), 76 to 212 user I/O depending on package, an internal oscillator, and an on-chip voltage regulator that derives the core 1.8 V from an external 2.5 V to 3.3 V VCCINT supply. The 256-ball FBGA provides 212 maximum user I/Os and a 1.0 mm ball pitch.
Architecturally, EPM570GF256C4 partitions its logic into 16 Logic Array Blocks (LABs), each containing 16 Logic Elements with 4-input look-up tables, programmable registers, and a LAB-wide control signal network. The MultiTrack interconnect provides predictable, fixed-delay routing that simplifies static timing closure. JTAG (IEEE 1149.1) is supported for boundary-scan test and in-system programming, and Quartus II (legacy) or Quartus Prime software is used for design entry and device programming.
Typical applications include I/O expansion and voltage translation between 3.3 V MCUs and 1.8 V peripherals, instant-on power sequencing for FPGAs and ASICs, bus interface bridging (e.g., parallel-to-SPI glue), board-level glue logic replacement, and LED/display control in industrial control panels.
When designing with EPM570GF256C4, observe the I/O bank grouping rules in the datasheet: each of the eight I/O banks must be powered by a single VCCIO rail, and unused I/O banks should have their VCCIO tied to a valid voltage to avoid floating inputs. A 100 nF decoupling capacitor should be placed adjacent to every VCCINT/VCCIO pair, and JTAG TCK should be series-terminated when driving long board traces.
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes that complement the manufacturer datasheet.
ドロップイン代替品: EPM570GF256C4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPM570GF256C4 （同一形状・フットプリント） — 相違点: Package, Process Technology, RoHS Status, Operating Temperature, Configuration Memory.
クイック比較ツール — 並列比較する代替部品を選択:
EPM570GF256C5
✅ ドロップイン✓ 在庫あり
$18.95 / 個
データシートを見る →EPM570F256C4N
✅ ドロップイン✓ 在庫あり
$26.85 / 個
データシートを見る →EPM570GF256C3
✅ ドロップイン✓ 在庫あり
$10.4 / 個
データシートを見る →EPM570GF256C3N
✅ ドロップイン✓ 在庫あり
$9.4 / 個
データシートを見る →EPM570F256C5
✅ ドロップイン✓ 在庫あり
$7.1 / 個
データシートを見る →EPM570GF256C4 最大定格＆電気的特性
| Family | MAX II |
| Logic Elements (LEs) | 570 |
| Macrocells | 440 |
| Maximum User I/Os | 212 |
| Pin-to-Pin Delay (tPD) | 5.4 ns |
| Supply Voltage VCCINT | 1.71 V to 1.89 V (core, derived from 2.5/3.3 V) |
| I/O Bank Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL) |
| 動作温度 | 0 °C to +85 °C (commercial) |
| パッケージ | 256-ball FBGA (FineLine BGA) |
| Ball Pitch | 1.0 mm |
| 実装タイプ | Surface Mount |
| Process Technology | 0.18 µm CMOS, flash-based configuration |
| JTAG Support | IEEE 1149.1 boundary-scan + ISP |
| Configuration Memory | Non-volatile flash (instant-on, no boot PROM) |
| RoHS ステータス | Lead-free, RoHS compliant |
EPM570GF256C4 256-ball fbga (fineline bga) ピン配置ガイド
EPM570GF256C4 (256-ball fbga (fineline bga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EPM570GF256C4.
詳細は データシート をご参照ください。
主な用途
EPM570GF256C4 の用途: 6 件s: I/O Expansion and Voltage Translation, Power-Sequencing and Reset Distribution, Bus Bridging and Glue Logic Replacement, Industrial Control Panel Logic, FPGA Configuration and Boot Assistance, LED Display and Signage Control.
I/O Expansion and Voltage Translation
The EPM570GF256C4 is well suited to MCU I/O expansion and voltage translation because it provides up to 212 user I/Os split across 4 to 8 VCCIO banks that can independently run at 1.5 V, 1.8 V, 2.5 V, or 3.3 V. The flash-based, instant-on fabric eliminates external boot PROMs and the deterministic 5.4 ns pin-to-pin delay simplifies timing closure. Typical use: bridge a 1.8 V Cortex-M0+ MCU to legacy 3.3 V peripherals without discrete level-shifters.
おすすめ
Power-Sequencing and Reset Distribution
The EPM570GF256C4 is widely used for board-level power sequencing in industrial and telecom hardware where multiple rails must come up in a deterministic order before releasing the host ASIC or FPGA. Its 5.4 ns tPD and 440 macrocells let designers implement multiple independent sequencer state machines with combinational AND/OR glue for fault handling. The flash-based instant-on avoids the boot-PROM delay seen in SRAM FPGAs, ensuring rails are stable within microseconds of VCC ramp.
おすすめ
Bus Bridging and Glue Logic Replacement
The EPM570GF256C4 replaces dozens of 74-series glue-logic packages on legacy boards by absorbing address-latch, chip-select, bus-arbiter, and timing-generator functions in a single BGA. With 570 LEs and 440 macrocells, the device can hold multiple parallel-state machines and combinational decoder trees. The JTAG ISP port allows board-level rework without hot-air rework of the BGA, since logic changes are flashed directly into the device.
おすすめ
Industrial Control Panel Logic
The EPM570GF256C4's 256-ball FBGA package and multi-voltage I/O make it suitable for industrial control panels where it scans key-matrix inputs, drives 7-segment or LED indicators, and arbitrates between PLC scan cycles and operator pushbuttons. Its 0 to +85 °C commercial temperature range covers most factory-floor enclosures, and the flash configuration retains its logic image across power-cycles for unattended control panels.
おすすめ
FPGA Configuration and Boot Assistance
The EPM570GF256C4 is commonly paired with SRAM-based FPGAs to provide the configuration-PROM function, multi-mode boot selection, and partial reconfiguration control. The CPLD's instant-on behavior lets it hold the FPGA in RESET until all rails are stable, then release RESET, drive DONE, and load the bitstream via slave-serial or slave-parallel mode. This pattern is common in Cyclone IV / Cyclone 10 LP reference designs.
おすすめ
LED Display and Signage Control
The EPM570GF256C4 drives large LED-matrix displays by generating the row-multiplex timing, PWM dimming waveforms, and refresh-address counters in parallel logic rather than firmware. The 5.4 ns tPD supports high refresh rates with minimal motion-blur, and the 440 macrocells fit multiple PWM channels plus a serial-receive port for incoming video data. Designers typically place the CPLD between a video processor and the LED driver chain.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPM570GF256C4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPM570GF256C5 | EPM570F256C4N | EPM570GF256C3 | EPM570GF256C3N | EPM570F256C5 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-256 (1.0 mm pitch) | FBGA-256 (1.0 mm pitch) - same | FBGA-256 (1.0 mm pitch) - same | FBGA-256 (1.0 mm pitch) - same | FBGA-256 (1.0 mm pitch) - same | FBGA-256 (1.0 mm pitch) - same |
| Logic Elements (LEs) | 570 | 570 | 570 | 570 | 570 | 570 |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| Pin-to-Pin Delay (tPD) | 5.4 ns | 5.0 ns | 5.4 ns | 6.2 ns | 6.2 ns | 5.0 ns |
| Core Voltage VCCINT | 1.71 V to 1.89 V (from 2.5/3.3 V) | 1.71 V to 1.89 V (from 2.5/3.3 V) | 1.71 V to 1.89 V (from 2.5/3.3 V) | 1.71 V to 1.89 V (from 2.5/3.3 V) | 1.71 V to 1.89 V (from 2.5/3.3 V) | 1.71 V to 1.89 V (from 2.5/3.3 V) |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
| RoHS / Lead-Free | Lead-free, RoHS compliant | Lead-free, RoHS compliant | Lead-free, RoHS compliant | Lead-free, RoHS compliant | Lead-free, RoHS compliant | Lead-free, RoHS compliant |
主な差別化要因
- Pin-compatible faster speed grade available for tight timing margins （vs EPM570GF256C5)
- Lead-free variant with identical silicon （vs EPM570F256C4N)
- Multi-voltage I/O banks eliminate external level shifters （vs Discrete 74LVC245 + 74LVC8T245 translators)
設計ノート
Estimated: the EPM570GF256C4 draws approximately 30 to 55 mA quiescent current from VCCINT (2.5 V or 3.3 V) depending on configuration and toggle rate, plus I/O current that scales with VCCIO and switching frequency. Each of the eight VCCIO banks requires a 100 nF decoupling capacitor placed within 3 mm of the ball. Add a bulk 10 µF ceramic or tantalum capacitor on the VCCINT plane and avoid routing high-speed signals across VCCIO bank gaps to maintain signal integrity.
The 256-ball FBGA uses a 1.0 mm pitch, which requires laser-drilled microvias or 0.4 mm via-in-pad technology for reliable fan-out. Recommended stackup is a 4-layer board with continuous GND plane on layer 2 and split VCCINT/VCCIO power planes on layer 3. Keep JTAG TCK/TMS/TDO/TDI traces short and series-terminate TCK at the driver when the trace length exceeds 25 mm to avoid ringing on the boundary-scan clock.
Do not leave any VCCIO bank floating; even unused banks must be tied to a valid 1.5/1.8/2.5/3.3 V rail or the input buffers can draw excess current and produce I/O contention. Avoid mixing LVTTL 3.3 V and LVCMOS 1.8 V on adjacent balls without proper GND via fencing. When migrating from EPM570GF256C4 to EPM570GF256C5 (faster speed grade) re-validate static timing because hold-time violations may appear on short paths that were masked by the slower tPD.
コンプライアンス情報
Lead-free and RoHS compliant per distributor listings. MAX II CPLDs are not AEC-Q100 qualified; for automotive applications a different Intel/Altera CPLD family should be considered.
