Intel

EPM570GF256C4 - MAX II CPLD 570 LE 256-FBGA 5.4ns | Intel

Name: EPM570GF256C4 - MAX II CPLD 570 LE 256-FBGA 5.4ns | Intel
Brand: Intel
SKU: EPM570GF256C4
Price: 29.85 USD
Availability: InStock

MPN: EPM570GF256C4 ✓ Active

In Stock Ships in 1-3 business days

1.71 V to 1.89 V (core, derived from 2.5/3.3 V) Vdss 256-ball FBGA (FineLine BGA) Package Non-volatile flash (instant-on, no boot PROM) Memory

From $29.85 USD / Unit

MOQ: 1 |

Price updated: 2026-09-12

Volume Pricing

Qty	Unit Price	Extended
1	$45.57	$45.57
10	$41.01	$410.10
100	$36.45	$3,645.00
500	$32.8	$16,400.00
1,000	$29.85	$29,850.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for EPM570GF256C4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EPM570GF256C5

✅ Drop-In

Intel

📦 FBGA-256

MAX II · 570 · 440 · 76 · 8 Kbits · 5.4 ns (tPD1, -5 speed grade) · 201.1 MHz (fCNT, internal) · 1.8 V (internal LDO)

✓ In Stock

$18.95 / Unit

View Datasheet →

EPM570F256C4N

✅ Drop-In

Intel

📦 FBGA-256

MAX II · 570 LE · 440 · 57 · 160 · 8 Kbit · 256-ball FineLine BGA (FBGA) · 17 mm × 17 mm

✓ In Stock

$26.85 / Unit

View Datasheet →

EPM570GF256C3

✅ Drop-In

Altera

📦 FBGA-256

MAX II · EPM570 · 570 · 440 · 212 · 8 Kbit · 8.7 ns (C3 speed grade) · 300 MHz

✓ In Stock

$10.4 / Unit

View Datasheet →

EPM570GF256C3N

✅ Drop-In

Altera

📦 FBGA-256

MAX II G · CPLD (Complex Programmable Logic Device) · 570 · 76 · 8 Kbit · CMOS · 3.3 V (core) · 1.5 V / 1.8 V / 2.5 V / 3.3 V

✓ In Stock

$9.4 / Unit

View Datasheet →

EPM570F256C5

✅ Drop-In

Intel

📦 FBGA-256

MAX II · 570 · 440 · 160 · 8 Kbit · 0.18 µm · 2.5 V / 3.3 V · 201.1 MHz

✓ In Stock

$7.1 / Unit

View Datasheet →

EPM570GF256C4 Maximum Ratings & Electrical Characteristics

Family	MAX II
Logic Elements (LEs)	570
Macrocells	440
Maximum User I/Os	212
Pin-to-Pin Delay (tPD)	5.4 ns
Supply Voltage VCCINT	1.71 V to 1.89 V (core, derived from 2.5/3.3 V)
I/O Bank Voltage VCCIO	1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL)
Operating Temperature	0 °C to +85 °C (commercial)
Package	256-ball FBGA (FineLine BGA)
Ball Pitch	1.0 mm
Mounting Type	Surface Mount
Process Technology	0.18 µm CMOS, flash-based configuration
JTAG Support	IEEE 1149.1 boundary-scan + ISP
Configuration Memory	Non-volatile flash (instant-on, no boot PROM)
RoHS Status	Lead-free, RoHS compliant

EPM570GF256C4 256-ball fbga (fineline bga) Pin Configuration Guide

Complete pinout information for EPM570GF256C4 (256-ball fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

256-ball fbga (fineline bga) package pinout diagram for EPM570GF256C4

No detailed pinout data available for EPM570GF256C4.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EPM570GF256C4 is suitable for 6 applications: I/O Expansion and Voltage Translation, Power-Sequencing and Reset Distribution, Bus Bridging and Glue Logic Replacement, Industrial Control Panel Logic, FPGA Configuration and Boot Assistance, LED Display and Signage Control.

🔧

I/O Expansion and Voltage Translation

The EPM570GF256C4 is well suited to MCU I/O expansion and voltage translation because it provides up to 212 user I/Os split across 4 to 8 VCCIO banks that can independently run at 1.5 V, 1.8 V, 2.5 V, or 3.3 V. The flash-based, instant-on fabric eliminates external boot PROMs and the deterministic 5.4 ns pin-to-pin delay simplifies timing closure. Typical use: bridge a 1.8 V Cortex-M0+ MCU to legacy 3.3 V peripherals without discrete level-shifters.

Recommended

EPM570GF256C5 · Intel STM32F030C8T6 (Example low-voltage MCU host (1.8 V VDD)) 74LVC245 (Discrete alternative translator for very low-channel-count designs)

⚡

Power-Sequencing and Reset Distribution

The EPM570GF256C4 is widely used for board-level power sequencing in industrial and telecom hardware where multiple rails must come up in a deterministic order before releasing the host ASIC or FPGA. Its 5.4 ns tPD and 440 macrocells let designers implement multiple independent sequencer state machines with combinational AND/OR glue for fault handling. The flash-based instant-on avoids the boot-PROM delay seen in SRAM FPGAs, ensuring rails are stable within microseconds of VCC ramp.

Recommended

EPM570F256C4N · Intel TPS3808G33 (Voltage supervisor companion for reset generation) TPS7A4701RGWR · Texas Instruments TPS7A4701RGWR · Texas Instruments

️

Bus Bridging and Glue Logic Replacement

The EPM570GF256C4 replaces dozens of 74-series glue-logic packages on legacy boards by absorbing address-latch, chip-select, bus-arbiter, and timing-generator functions in a single BGA. With 570 LEs and 440 macrocells, the device can hold multiple parallel-state machines and combinational decoder trees. The JTAG ISP port allows board-level rework without hot-air rework of the BGA, since logic changes are flashed directly into the device.

Recommended

EPM570GF256C3N · Altera 74LVC138 (Discrete decoder reference for the CPLD-based replacement) CY7C68013A (Example high-speed parallel target bridged via the CPLD)

🏭

Industrial Control Panel Logic

The EPM570GF256C4's 256-ball FBGA package and multi-voltage I/O make it suitable for industrial control panels where it scans key-matrix inputs, drives 7-segment or LED indicators, and arbitrates between PLC scan cycles and operator pushbuttons. Its 0 to +85 °C commercial temperature range covers most factory-floor enclosures, and the flash configuration retains its logic image across power-cycles for unattended control panels.

Recommended

EPM570GF256C5 · Intel STM32F407VGT6 (Companion MCU running the panel HMI logic) TLP181 (Optocoupler for isolated industrial inputs)

🧩

FPGA Configuration and Boot Assistance

The EPM570GF256C4 is commonly paired with SRAM-based FPGAs to provide the configuration-PROM function, multi-mode boot selection, and partial reconfiguration control. The CPLD's instant-on behavior lets it hold the FPGA in RESET until all rails are stable, then release RESET, drive DONE, and load the bitstream via slave-serial or slave-parallel mode. This pattern is common in Cyclone IV / Cyclone 10 LP reference designs.

Recommended

EPM570F256C5 · Intel EP4CE6E22C8N · Intel EPCS4SI8N (Alternative discrete configuration PROM)

💡

LED Display and Signage Control

The EPM570GF256C4 drives large LED-matrix displays by generating the row-multiplex timing, PWM dimming waveforms, and refresh-address counters in parallel logic rather than firmware. The 5.4 ns tPD supports high refresh rates with minimal motion-blur, and the 440 macrocells fit multiple PWM channels plus a serial-receive port for incoming video data. Designers typically place the CPLD between a video processor and the LED driver chain.

Recommended

EPM570GF256C3 · Altera MBI5024 (16-channel constant-current LED driver driven by the CPLD) SN65HVS882 (8-channel digital input serializer for sensor data)

Recommended Products Summary

EPM570GF256C5 Intel Used in: I/O Expansion and Voltage Translation, Industrial Control Panel Logic STM32F030C8T6 Example low-voltage MCU host (1.8 V VDD) Used in: I/O Expansion and Voltage Translation 74LVC245 Discrete alternative translator for very low-channel-count designs Used in: I/O Expansion and Voltage Translation EPM570F256C4N Intel Used in: Power-Sequencing and Reset Distribution TPS3808G33 Voltage supervisor companion for reset generation Used in: Power-Sequencing and Reset Distribution TPS7A4701RGWR Texas Instruments Used in: Power-Sequencing and Reset Distribution, Power-Sequencing and Reset Distribution EPM570GF256C3N Altera Used in: Bus Bridging and Glue Logic Replacement 74LVC138 Discrete decoder reference for the CPLD-based replacement Used in: Bus Bridging and Glue Logic Replacement CY7C68013A Example high-speed parallel target bridged via the CPLD Used in: Bus Bridging and Glue Logic Replacement STM32F407VGT6 Companion MCU running the panel HMI logic Used in: Industrial Control Panel Logic TLP181 Optocoupler for isolated industrial inputs Used in: Industrial Control Panel Logic EPM570F256C5 Intel Used in: FPGA Configuration and Boot Assistance EP4CE6E22C8N Intel Used in: FPGA Configuration and Boot Assistance EPCS4SI8N Alternative discrete configuration PROM Used in: FPGA Configuration and Boot Assistance EPM570GF256C3 Altera Used in: LED Display and Signage Control MBI5024 16-channel constant-current LED driver driven by the CPLD Used in: LED Display and Signage Control SN65HVS882 8-channel digital input serializer for sensor data Used in: LED Display and Signage Control

What is the operating voltage of EPM570GF256C4?

The EPM570GF256C4 operates from a 2.5 V or 3.3 V external VCCINT supply that an internal regulator derives to 1.8 V for the core, and from VCCIO rails of 1.5 V, 1.8 V, 2.5 V, or 3.3 V per I/O bank. According to the MAX II datasheet chapter on DC & Switching Characteristics, mixing these rails lets the device bridge between modern low-voltage MCUs and legacy 3.3 V peripherals without external level shifters.

How many logic elements and macrocells does EPM570GF256C4 have?

The EPM570GF256C4 contains 570 Logic Elements (LEs) implemented as 4-input look-up tables with a programmable register, organized into 16 Logic Array Blocks (LABs) of 16 LEs each. The equivalent macrocell count is 440 when used in registered logic mode. According to the MAX II Family datasheet, this LE count positions EPM570 between the smaller EPM240 and the larger EPM1270/2210 MAX II devices.

Does EPM570GF256C4 require an external configuration PROM?

No. The EPM570GF256C4 uses on-chip non-volatile flash to store its configuration, so the device is instant-on at power-up without an external boot PROM, EPCS, or microcontroller hand-off. This is a key advantage over SRAM-based FPGAs and simplifies board design; the trade-off is that the flash-based fabric is one-time-user-programmable through JTAG rather than reloaded on every power cycle.

What is the difference between EPM570GF256C4 and EPM570GF256C5?

The EPM570GF256C4 is the 5.4 ns speed grade, while the EPM570GF256C5 is the faster 5.0 ns pin-to-pin delay grade in the same 256-ball FBGA. Both share identical LE count, package, and pinout, so they are pin-compatible drop-in alternatives. Choose C4 when timing margin is adequate and unit cost matters; choose C5 when you need the additional 0.4 ns of timing margin for high-speed interfaces.

Where can I download the EPM570GF256C4 datasheet PDF?

The official EPM570GF256C4 datasheet and MAX II device handbook can be downloaded from the Intel (formerly Altera) FPGA documentation portal at intel.com/content/www/us/en/programmable/products/cpld/max2/overview.html. The handbook contains the DC/AC specifications, pinout, JTAG BSDL file, package thermal data, and IBIS models needed for board-level design and signal-integrity simulation.

Is EPM570GF256C4 in stock at distributors?

As of 2026-09-12, the EPM570GF256C4 is listed at DigiKey (DigiKey part number 544-1304-ND) and at Heisener, which shows approximately 7,392 pieces available. Lead time on second-tier distributors is approximately 1 to 2 weeks when in stock, but for high-volume orders a quote is recommended because the MAX II family has been in production for over a decade and inventory is fragmenting across the channel.

What is the lead time for EPM570GF256C4?

As of 2026-09-12, Heisener lists a lead time of approximately 1 to 2 weeks for in-stock orders of the EPM570GF256C4, with estimated delivery between 2026-09-07 and 2026-09-12 for expedited shipments. For larger quantities the manufacturer-recommended channel is Mouser or DigiKey, where lead time varies with distributor stock and may extend to 6 to 8 weeks on factory-direct orders.

How much does EPM570GF256C4 cost?

As of 2026-09-12, the EPM570GF256C4 unit price starts at approximately $45.57 at the qty-1 tier on second-tier distributors like Heisener, scaling down to roughly $29.85 at the qty-1000 break. Authorized distributors such as DigiKey and Mouser typically price slightly higher due to traceability documentation, but provide full warranty and franchised stock.

Can EPM570GF256C4 be used for I/O voltage translation?

Yes. The EPM570GF256C4 supports four independent VCCIO banks at 1.5 V, 1.8 V, 2.5 V, and 3.3 V, making it well suited for voltage-level translation between, for example, a 1.8 V MCU and a 3.3 V peripheral bus. According to the MAX II datasheet, each bank can be configured independently with LVCMOS or LVTTL I/O standards, and the MultiTrack interconnect provides deterministic timing across bank crossings.

What is the best drop-in replacement for EPM570GF256C4?

The best drop-in replacements for EPM570GF256C4 are the same-package MAX II family variants EPM570GF256C5 (5.0 ns speed grade) and EPM570F256C4N (lead-free, RoHS), both in the 256-ball FBGA footprint. These parts share the same JTAG pinout, VCCIO/VCCINT ball map, and LAB architecture, and can be swapped on an existing PCB without rework. For a faster speed grade use EPM570GF256C5; for an industrial temperature range use EPM570GF256I5.

EPM570GF256C4 vs EPM570GF256C5 - which is better?

The EPM570GF256C4 (5.4 ns) and EPM570GF256C5 (5.0 ns) are pin-compatible in the same 256-ball FBGA, so the choice is purely timing-margin versus cost. The C5 grade gives 0.4 ns of additional pin-to-pin margin for high-speed glue logic or fast-memory interfaces, while the C4 is typically priced 5 to 10 percent lower. For designs where timing closure is achievable at 5.4 ns, prefer C4 to reduce BOM cost.

When should I choose EPM570GF256C4 over an FPGA?

Choose the EPM570GF256C4 over a small FPGA when you need instant-on behavior without an external boot PROM, deterministic fixed-delay timing for glue logic, or multi-voltage I/O bank support without external level shifters. The MAX II CPLD is well suited to bus-bridging, power sequencing, and I/O expansion. Choose an FPGA such as Cyclone IV or Cyclone 10 LP when you need more than 570 LEs, embedded memory blocks, or DSP hardware.

What software is used to program EPM570GF256C4?

The EPM570GF256C4 is programmed using Altera/Intel Quartus II (legacy versions 13.0 and earlier for MAX II) or the maintained Quartus Prime Lite Edition, which retains MAX II device support. Design entry is via VHDL, Verilog, or schematic capture, and the programmer uses the built-in JTAG server with a USB-Blaster or ByteBlaster cable to load the flash configuration through the JTAG pins.

What is the package pin count of EPM570GF256C4?

The EPM570GF256C4 is supplied in a 256-ball FineLine BGA (FBGA-256) with 1.0 mm ball pitch, providing 212 maximum user I/Os plus power, ground, JTAG, and configuration pins. The 256-ball FBGA package is one of the largest in the MAX II family and is preferred when the design requires high I/O count with multi-voltage bank support.

What cross-brand equivalent exists for EPM570GF256C4?

There is no direct pin-compatible cross-brand equivalent for EPM570GF256C4 because the MAX II flash-based CPLD architecture is unique to Intel/Altera. Cross-brand alternatives such as Lattice ispMACH 4000 or Xilinx CoolRunner-II require PCB rework because their BGA pinouts differ. For true drop-in replacement without PCB changes, stay within the Intel MAX II family (EPM570GF256C5, EPM570F256C4N, EPM570GF256I5).

Engineering reference data for EPM570GF256C4 — comparison, design guidance, and compliance information.

Selection Guide

Choose EPM570GF256C4 when your design needs up to 570 Logic Elements with 5.4 ns pin-to-pin delay and the multi-voltage I/O flexibility of MAX II in a 256-ball FBGA. It is the right part for I/O expansion, voltage translation, and glue-logic consolidation in commercial-temperature industrial and consumer products where instant-on behavior without a boot PROM is required. Choose the faster EPM570GF256C5 if your timing closure needs 5.0 ns; choose EPM570GF256C3 or EPM570GF256C3N if a slower 6.2 ns tPD is acceptable and you want the lowest unit cost. Choose EPM570F256C4N or EPM570F256C5 for RoHS-critical designs. For higher logic capacity, move to EPM1270 or EPM2210 in the same MAX II family; for industrial temperature range, look for the I-suffix variants (EPM570GF256I5). All five alternatives above share the FBGA-256 footprint, so any of them can be substituted on an existing PCB without layout changes.

Comparison with Alternatives

Parameter	This Product	EPM570GF256C5	EPM570F256C4N	EPM570GF256C3	EPM570GF256C3N	EPM570F256C5
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Package	FBGA-256 (1.0 mm pitch)	FBGA-256 (1.0 mm pitch) - same	FBGA-256 (1.0 mm pitch) - same	FBGA-256 (1.0 mm pitch) - same	FBGA-256 (1.0 mm pitch) - same	FBGA-256 (1.0 mm pitch) - same
Logic Elements (LEs)	570	570	570	570	570	570
Macrocells	440	440	440	440	440	440
Pin-to-Pin Delay (tPD)	5.4 ns	5.0 ns	5.4 ns	6.2 ns	6.2 ns	5.0 ns
Core Voltage VCCINT	1.71 V to 1.89 V (from 2.5/3.3 V)	1.71 V to 1.89 V (from 2.5/3.3 V)	1.71 V to 1.89 V (from 2.5/3.3 V)	1.71 V to 1.89 V (from 2.5/3.3 V)	1.71 V to 1.89 V (from 2.5/3.3 V)	1.71 V to 1.89 V (from 2.5/3.3 V)
Operating Temperature	0 °C to +85 °C (commercial)	0 °C to +85 °C	0 °C to +85 °C	0 °C to +85 °C	0 °C to +85 °C	0 °C to +85 °C
RoHS / Lead-Free	Lead-free, RoHS compliant	Lead-free, RoHS compliant	Lead-free, RoHS compliant	Lead-free, RoHS compliant	Lead-free, RoHS compliant	Lead-free, RoHS compliant
Approx. Unit Price (qty 1, USD)	45.57	[DATA_NEEDED]	[DATA_NEEDED]	[DATA_NEEDED]	[DATA_NEEDED]	[DATA_NEEDED]

Key Differentiators

Pin-compatible faster speed grade available for tight timing margins (vs EPM570GF256C5)
Lead-free variant with identical silicon (vs EPM570F256C4N)
Multi-voltage I/O banks eliminate external level shifters (vs Discrete 74LVC245 + 74LVC8T245 translators)

Design Notes

Estimated: the EPM570GF256C4 draws approximately 30 to 55 mA quiescent current from VCCINT (2.5 V or 3.3 V) depending on configuration and toggle rate, plus I/O current that scales with VCCIO and switching frequency. Each of the eight VCCIO banks requires a 100 nF decoupling capacitor placed within 3 mm of the ball. Add a bulk 10 µF ceramic or tantalum capacitor on the VCCINT plane and avoid routing high-speed signals across VCCIO bank gaps to maintain signal integrity.

The 256-ball FBGA uses a 1.0 mm pitch, which requires laser-drilled microvias or 0.4 mm via-in-pad technology for reliable fan-out. Recommended stackup is a 4-layer board with continuous GND plane on layer 2 and split VCCINT/VCCIO power planes on layer 3. Keep JTAG TCK/TMS/TDO/TDI traces short and series-terminate TCK at the driver when the trace length exceeds 25 mm to avoid ringing on the boundary-scan clock.

Do not leave any VCCIO bank floating; even unused banks must be tied to a valid 1.5/1.8/2.5/3.3 V rail or the input buffers can draw excess current and produce I/O contention. Avoid mixing LVTTL 3.3 V and LVCMOS 1.8 V on adjacent balls without proper GND via fencing. When migrating from EPM570GF256C4 to EPM570GF256C5 (faster speed grade) re-validate static timing because hold-time violations may appear on short paths that were masked by the slower tPD.

Compliance Information

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Lead Free

Yes

Halogen Free

Unknown

Conflict Minerals

Compliant

Lead-free and RoHS compliant per distributor listings. MAX II CPLDs are not AEC-Q100 qualified; for automotive applications a different Intel/Altera CPLD family should be considered.

Data verified on: 2026-09-12 — data verified and curated by XAIPART's component engineering team

Sources: Distributor, Distributor, Distributor, Octopart, Manufacturer_Product_Page, Distributor

Related Components & Terms

Intel Altera EPM570GF256C4 MAX II CPLD Complex Programmable Logic Device Logic Element macrocell Logic Array Block MultiTrack interconnect FBGA-256 FineLine BGA JTAG IEEE 1149.1 Quartus II Quartus Prime LVCMOS LVTTL VCCINT VCCIO flash-based configuration I/O expansion voltage translation power sequencing glue logic