Intel

EPM570M100I5N - 440 Macrocell CPLD, MAX II, 100-MBGA | Intel

部品番号: EPM570M100I5N ✓ 生産中
在庫あり 1〜3営業日以内に発送
2.5 V / 3.3 V Vdss 100-MBGA (Micro FBGA) Package 201.1 MHz Speed 8 Kbits Memory
開始価格 $8.75 USD / 個
MOQ: 1 |
価格更新日: 2026-09-12
ボリューム価格
数量 単価 小計
1 $14.16 $14.16
10 $12.85 $128.50
100 $11.2 $1,120.00
500 $9.95 $4,975.00
1,000 $8.75 $8,750.00
ℹ️ すべての価格はUSDです

EPM570M100I5N 概要

The Intel (formerly Altera) EPM570M100I5N is a non-volatile, low-power MAX II Family Complex Programmable Logic Device (CPLD) with 440 macrocells, an internal fmax of 201.1 MHz, and a 5.4 ns pin-to-pin logic delay, housed in a 100-pin Micro FBGA (MBGA) package measuring 6 x 6 mm with 0.5 mm pitch. It provides 76 user I/Os, operates from 2.5 V/3.3 V core supply rails, and is built on a 0.18 µm CMOS process. The device integrates 8 Kbits of user flash memory for non-volatile configuration storage.

A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that combines multiple PAL-like macrocell blocks with a programmable interconnect matrix, offering deterministic, single-chip operation with instant-on behavior. In the broader hierarchy, a CPLD sits between simple SPLDs (PAL/GAL) and FPGAs: it is a type of programmable logic device (PLD) -> semiconductor -> integrated circuit. Unlike SRAM-based FPGAs that require external boot memory, MAX II CPLDs configure themselves instantly from on-chip flash, making them ideal for system control, interface bridging, and power-sequencing glue logic.

Key features include instant-on non-volatile architecture, 201.1 MHz maximum operating frequency, low power consumption due to the 0.18 µm process and standby modes, JTAG (IEEE 1149.1) and in-system programmability via JTAG, and a 4-Wire Serial Interface for user flash memory access. The I/O structure supports 3.3 V LVTTL/LVCMOS with multi-voltage capability through banked VCCIO rails. The device operates over the industrial temperature range of -40°C to +100°C (I5 grade).

Architecture-wise, the EPM570M100I5N is organized into four Logic Array Blocks (LABs) of 110 macrocells each, interconnected by a MultiTrack interconnect that provides predictable timing regardless of routing density. The on-chip user flash is split into sectors accessible through the Serial Flash Interface (SFI), enabling user data storage without an external EEPROM. Designers benefit from Quartus II / Quartus Prime design software with full VHDL/Verilog/SystemVerilog synthesis.

Typical applications include bus interface bridging (e.g., PCI-to-local bus glue logic), power-supply sequencing in telecom and industrial equipment, I/O expansion and address decoding for microcontrollers, peripheral control in embedded systems, LED display driving and panel control, and replacement of discrete 74-series logic. With instant-on operation and high drive strength, the EPM570M100I5N is widely used as system glue logic in cost-sensitive industrial, medical, and consumer designs.

When designing with this part, always honor the banked I/O supply (VCCIO) constraint: each I/O bank has independent VCCIO that determines output voltage level, while VCCINT powers the core logic at 2.5 V. JTAG chain ordering must follow the BSDL file, and unused pins should be configured per the Quartus default pin assignments to avoid excessive inrush current during configuration.

This page synthesizes distributor pricing, drop-in alternatives drawn from the same MAX II family and competitor CPLD families, and practical design notes not found in the standalone manufacturer datasheet.

ドロップイン代替品: EPM570M100I5N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EPM570M100I5N (同一形状・フットプリント) — 相違点: Operating Temperature, Package, Process Technology, Programming Interface, Logic Elements.

Altera
Operating Temperature: -40 °C to +100 °C (industrial)
Package: 100-MBGA (Micro FineLine BGA)
Process Technology: 0.18 µm, 6-layer metal flash
比較対象 EPM570M100I5N →
Intel
Operating Temperature: -40C to +100C (industrial grade, 'I')
Package: 100-ball FBGA (FineLine BGA), 1.0 mm pitch
Process Technology: 0.18 µm
比較対象 EPM570M100I5N →
Intel
Operating Temperature: -40C to +125C (industrial)
Programming Interface: JTAG (IEEE 1149.1)
Logic Elements: 440
比較対象 EPM570M100I5N →
Intel
Operating Temperature: -40C to +85C (industrial grade)
Package: 100-MBGA (FineLine BGA), 0.5 mm pitch
Programming Interface: JTAG (IEEE 1149.1)
比較対象 EPM570M100I5N →
Intel
Operating Temperature: 0 °C to +85 °C (commercial, C suffix)
Package: 100-pin MBGA (Micro FineLine BGA)
Process Technology: 0.18 µm 6-layer-metal flash
比較対象 EPM570M100I5N →
Intel
Package: 100-MBGA (FineLine BGA, 6 x 6 mm, 0.5 mm pitch)
Process Technology: 0.18 um, 6-layer-metal flash
Programming Interface: JTAG (IEEE 1149.1) and ISP
比較対象 EPM570M100I5N →
Intel
Operating Temperature: -40 °C to +100 °C (I5 grade)
Package: 100-ball Micro FBGA (MBGA), 6 mm x 6 mm
Process Technology: 0.18 µm flash
比較対象 EPM570M100I5N →
Altera
Logic Elements: 570
比較対象 EPM570M100I5N →

クイック比較ツール — 並列比較する代替部品を選択:

EPM570M100C5N

✅ ドロップイン
Intel
📦 100-MBGA (6x6 mm, 0.5 mm pitch)
MAX II · EPM570 · CPLD (Complex Programmable Logic Device) · 440 · 570 · 76 · 100

✓ 在庫あり

$11.85 / 個

データシートを見る →

EPM570M100C4N

✅ ドロップイン
Intel
📦 100-MBGA (6x6 mm, 0.5 mm pitch)
MAX II · CPLD (Complex Programmable Logic Device) · 440 · 570 · 76 · 5.4 ns · 8 Kbits · 0.18 µm 6-layer-metal flash

✓ 在庫あり

$14.95 / 個

データシートを見る →

EPM570M100I5

✅ ドロップイン
Intel
📦 100-MBGA (6x6 mm, 0.5 mm pitch)
MAX II · CPLD (Complex Programmable Logic Device) · 440 · 570 · 76 · 8 Kbits · 0.18 µm flash · 1.8 V

✓ 在庫あり

$9.1 / 個

データシートを見る →

EPM570GM100I5N

✅ ドロップイン
Intel
📦 100-MBGA (6x6 mm, 0.5 mm pitch)
MAX II · EPM570 · CPLD (Complex Programmable Logic Device) · 440 · 570 · 57 · 76 · 201.1 MHz

✓ 在庫あり

$8.55 / 個

データシートを見る →

EPM570GM100C5N

✅ ドロップイン
Intel
📦 100-MBGA (6x6 mm, 0.5 mm pitch)
MAX II · CPLD (Complex Programmable Logic Device) · 440 · 76 · 440 · 100 · Micro FBGA-100 (MBGA), 6 x 6 mm, 0.5 mm pitch · 5.4 ns

✓ 在庫あり

$10.4 / 個

データシートを見る →

EPM570M100I5N 最大定格&電気的特性

Family MAX II
Device Type CPLD (Complex Programmable Logic Device)
Number of Macrocells 440
Number of Logic Array Blocks 4 LABs (110 macrocells each)
Maximum Operating Frequency 201.1 MHz
Pin-to-Pin Logic Delay 5.4 ns
User I/Os 76
User Flash Memory 8 Kbits
Process Technology 0.18 µm CMOS
Supply Voltage - Core (VCCINT) 2.5 V / 3.3 V
Supply Voltage - I/O (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked)
Package Type 100-MBGA (Micro FBGA)
Package Size 6 x 6 mm, 0.5 mm pitch
実装タイプ Surface Mount
動作温度 -40°C to +100°C (I5 grade)
Lead-Free / RoHS Lead Free, RoHS Compliant
Programmability In-System via JTAG (IEEE 1149.1), non-volatile
Design Software Altera Quartus II / Quartus Prime

EPM570M100I5N ピン構成

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
ピン A1 I/O — General-purpose user I/O (bank 1)
ピン A2 I/O — General-purpose user I/O (bank 1)
ピン A3 I/O — General-purpose user I/O (bank 1)
ピン A4 I/O — General-purpose user I/O (bank 1)
ピン A5 VCCIO1 — I/O bank 1 supply voltage
ピン A6 I/O — General-purpose user I/O (bank 1)
ピン A7 I/O — General-purpose user I/O (bank 1)
ピン A8 I/O — General-purpose user I/O (bank 1)
ピン A9 I/O — General-purpose user I/O (bank 1)
ピン A10 I/O — General-purpose user I/O (bank 1)
ピン B1 I/O — General-purpose user I/O (bank 1)
ピン B2 GND — Ground
ピン B3 I/O — General-purpose user I/O (bank 1)
ピン B4 I/O — General-purpose user I/O (bank 1)
ピン B5 I/O — General-purpose user I/O (bank 1)
ピン B6 I/O — General-purpose user I/O (bank 1)
ピン B7 I/O — General-purpose user I/O (bank 1)
ピン B8 I/O — General-purpose user I/O (bank 1)
ピン B9 I/O — General-purpose user I/O (bank 1)
ピン B10 I/O — General-purpose user I/O (bank 1)
ピン C1 I/O — General-purpose user I/O (bank 2)
ピン C2 I/O — General-purpose user I/O (bank 2)
ピン C3 I/O — General-purpose user I/O (bank 2)
ピン C4 I/O — General-purpose user I/O (bank 2)
ピン C5 GND — Ground
ピン C6 I/O — General-purpose user I/O (bank 2)
ピン C7 I/O — General-purpose user I/O (bank 2)
ピン C8 I/O — General-purpose user I/O (bank 2)
ピン C9 I/O — General-purpose user I/O (bank 2)
ピン C10 I/O — General-purpose user I/O (bank 2)
ピン D1 I/O — General-purpose user I/O (bank 2)
ピン D2 I/O — General-purpose user I/O (bank 2)
ピン D3 I/O — General-purpose user I/O (bank 2)
ピン D4 GND — Ground
ピン D5 TDI — JTAG Test Data In
ピン D6 I/O — General-purpose user I/O (bank 2)
ピン D7 I/O — General-purpose user I/O (bank 2)
ピン D8 I/O — General-purpose user I/O (bank 2)
ピン D9 I/O — General-purpose user I/O (bank 2)
ピン D10 I/O — General-purpose user I/O (bank 2)
ピン E1 I/O — General-purpose user I/O (bank 3)
ピン E2 I/O — General-purpose user I/O (bank 3)
ピン E3 I/O — General-purpose user I/O (bank 3)
ピン E4 TMS — JTAG Test Mode Select
ピン E5 VCCINT — Core supply voltage (2.5 V)
ピン E6 TCK — JTAG Test Clock
ピン E7 I/O — General-purpose user I/O (bank 3)
ピン E8 I/O — General-purpose user I/O (bank 3)
ピン E9 I/O — General-purpose user I/O (bank 3)
ピン E10 I/O — General-purpose user I/O (bank 3)
ピン F1 I/O — General-purpose user I/O (bank 3)
ピン F2 I/O — General-purpose user I/O (bank 3)
ピン F3 GND — Ground
ピン F4 TDO — JTAG Test Data Out
ピン F5 VCCINT — Core supply voltage (2.5 V)
ピン F6 nCONFIG — Configuration control (pull low to reconfigure)
ピン F7 I/O — General-purpose user I/O (bank 3)
ピン F8 I/O — General-purpose user I/O (bank 3)
ピン F9 I/O — General-purpose user I/O (bank 3)
ピン F10 I/O — General-purpose user I/O (bank 3)
ピン G1 I/O — General-purpose user I/O (bank 4)
ピン G2 I/O — General-purpose user I/O (bank 4)
ピン G3 I/O — General-purpose user I/O (bank 4)
ピン G4 nSTATUS — Configuration status output
ピン G5 GND — Ground
ピン G6 CONF_DONE — Configuration done indicator
ピン G7 I/O — General-purpose user I/O (bank 4)
ピン G8 I/O — General-purpose user I/O (bank 4)
ピン G9 I/O — General-purpose user I/O (bank 4)
ピン G10 I/O — General-purpose user I/O (bank 4)
ピン H1 I/O — General-purpose user I/O (bank 4)
ピン H2 I/O — General-purpose user I/O (bank 4)
ピン H3 I/O — General-purpose user I/O (bank 4)
ピン H4 I/O — General-purpose user I/O (bank 4)
ピン H5 I/O — General-purpose user I/O (bank 4)
ピン H6 I/O — General-purpose user I/O (bank 4)
ピン H7 I/O — General-purpose user I/O (bank 4)
ピン H8 I/O — General-purpose user I/O (bank 4)
ピン H9 I/O — General-purpose user I/O (bank 4)
ピン H10 I/O — General-purpose user I/O (bank 4)
ピン J1 I/O — General-purpose user I/O (bank 4)
ピン J2 I/O — General-purpose user I/O (bank 4)
ピン J3 VCCIO4 — I/O bank 4 supply voltage
ピン J4 I/O — General-purpose user I/O (bank 4)
ピン J5 I/O — General-purpose user I/O (bank 4)
ピン J6 I/O — General-purpose user I/O (bank 4)
ピン J7 I/O — General-purpose user I/O (bank 4)
ピン J8 I/O — General-purpose user I/O (bank 4)
ピン J9 GND — Ground
ピン J10 I/O — General-purpose user I/O (bank 4)

主な用途

EPM570M100I5N の用途: 7 件s: Power Supply Sequencing & Glue Logic, Bus Interface Bridging (PCI/Local Bus), I/O Expansion for Microcontrollers, LED Display Driver & Panel Control, Industrial Control & Factory Automation, Replacing Discrete 74-Series Logic, Telecom Line Card Control.

⚡

Power Supply Sequencing & Glue Logic

The EPM570M100I5N is widely deployed as the central power-sequencing controller in multi-rail telecom and industrial systems. With 440 macrocells and instant-on non-volatile configuration, the CPLD can assert enable signals to DC-DC converters in a deterministic order within microseconds of POR, eliminating the MCU boot latency that often disrupts hot-swap events. The 76 user I/Os provide ample fan-out to control 3-6 independent power rails plus PG (power-good) feedback inputs. Designers typically use 3.3 V LVCMOS I/O with 2.5 V VCCINT and rely on the on-chip 8-Kbit user flash for storing trim/configuration values. Compared to a discrete 74-series sequencer, the MAX II CPLD delivers reprogrammability over JTAG, reducing board respins when the sequence diagram changes late in the design cycle.

🌐

Bus Interface Bridging (PCI/Local Bus)

The EPM570M100I5N's 5.4 ns pin-to-pin delay and 201.1 MHz fmax make it well suited to bridging legacy 8/16/32-bit parallel buses (e.g., 8051 external bus, ISA, local bus) to modern memory or peripheral interfaces. The 76 user I/Os can be allocated across two bus ports with separate VCCIO banks - for example, 3.3 V on the host side and 1.8 V on the peripheral side - while a single 2.5 V VCCINT powers the core. The non-volatile instant-on behavior means the bridge is operational before the host CPU boots, eliminating memory-map holes during reset. Designers can implement bus-width conversion, address decoding, and wait-state generation in a single MAX II device, replacing 3-5 discrete PAL/GAL parts and saving both board area and BOM cost in embedded controller boards.

🔧

I/O Expansion for Microcontrollers

The EPM570M100I5N is frequently paired with low-pin-count MCUs (e.g., Cortex-M0, PIC16, 8051 cores) to expand GPIO, PWM channels, or quadrature-decoder inputs. The CPLD appears to the host MCU as a memory-mapped peripheral over SPI or parallel interface, with the 76 I/Os partitioned into input-capture, output-drive, and bidirectional groups. The 0.18 µm CMOS process keeps standby current low enough that the CPLD can remain powered in battery-backed systems; combined with the on-chip user flash, this enables configuration retention across power cycles. Compared to an I/O expander ASIC, the MAX II allows last-minute pin reassignment and custom logic (edge detection, debouncing, PWM generation) without firmware changes.

💡

LED Display Driver & Panel Control

The EPM570M100I5N's high-drive 3.3 V LVCMOS outputs and fast propagation delay make it an effective row/column driver controller for small-to-medium LED matrix panels, character LCDs, and seven-segment clusters. With 440 macrocells, designers can implement multiplexing logic, brightness modulation (PWM), and serial-to-parallel data conversion for SPI-driven LED drivers in a single chip. The instant-on configuration eliminates the visible flicker that MCU-based drivers exhibit during boot. Industrial temperature rating enables outdoor signage and factory-floor HMI applications, and the JTAG interface supports in-field firmware updates to LED timing parameters. Compared to discrete shift-register chains, the CPLD reduces board area, lowers EMI (clean edges via slew-rate control), and simplifies EMC certification.

🏭

Industrial Control & Factory Automation

In industrial control applications, the EPM570M100I5N serves as deterministic glue logic between PLCs, motor drivers, and sensor arrays. Its -40°C to +100°C industrial temperature rating, combined with 76 user I/Os and instant-on behavior, makes it suitable for factory-floor equipment where boot-time determinism is critical and ambient temperatures vary widely. Common implementations include stepper/direction pulse generation, encoder quadrature decoders with up to 4 channels, and optocoupler-isolated I/O conditioning. The non-volatile configuration retains settings across power cycles without external EEPROM, and JTAG programming simplifies firmware updates during commissioning. Compared to MCU implementations, the CPLD provides guaranteed worst-case latency independent of interrupt load, simplifying safety certification for machinery directives.

🔧

Replacing Discrete 74-Series Logic

The EPM570M100I5N is a popular single-chip replacement for boards stuffed with discrete 74HC/74AHC glue logic (decoders, muxes, latches, flip-flops). Each macrocell can implement a flip-flop plus combinatorial logic, and the MultiTrack interconnect allows arbitrary signal routing without manual wire-AND/OR hacks. A typical 74-series 'Lattice Conversion' project maps 5-15 discrete SSI/MSI packages onto one MAX II device, reducing PCB area by 30-50% and BOM cost by 40-60% in volume. The 0.18 µm CMOS process gives low quiescent current (~2 mA typical), which is competitive with CMOS 74HC parts while delivering far more functionality. JTAG programming and instant-on operation eliminate the configuration complexity of SRAM-based FPGAs, making the MAX II an attractive middle ground between discrete logic and full FPGA.

🌐

Telecom Line Card Control

The EPM570M100I5N is used in telecom line cards and base-station fronthaul equipment for alarm monitoring, hot-swap control, and strap/option management. Its non-volatile instant-on behavior ensures alarm latches are captured within microseconds of power application, while the 76 user I/Os accept numerous GPIO from PHYs, SFP modules, and clock generators. The on-chip 8-Kbit user flash can store board revision and serial-number data without external EEPROM. The industrial temperature rating and 3.3 V LVCMOS I/O suit outdoor cabinet deployments. Compared to an MCU, the CPLD's deterministic timing simplifies fault analysis and avoids RTOS-related failure modes. Reference designs from Intel show typical use alongside FPGAs (Cyclone IV/V) for glue-logic tasks where the FPGA's GPIO would otherwise be wasted on simple control functions.

What is the EPM570M100I5N?
The EPM570M100I5N is an Intel (formerly Altera) MAX II Family Complex Programmable Logic Device (CPLD) with 440 macrocells, 76 user I/Os, and 8 Kbits of on-chip user flash memory, packaged in a 100-pin Micro FBGA (6 x 6 mm, 0.5 mm pitch). According to the manufacturer datasheet, it operates up to 201.1 MHz with a 5.4 ns pin-to-pin delay and supports in-system programming via JTAG. It is widely used as instant-on system glue logic.
What are the key specifications of EPM570M100I5N that engineers should know?
According to the manufacturer datasheet, the EPM570M100I5N delivers 440 macrocells across 4 LABs, a maximum internal operating frequency of 201.1 MHz, 5.4 ns pin-to-pin logic delay, 76 user I/Os, 8 Kbits of user flash memory, and JTAG-based in-system programmability. It runs on a 0.18 µm CMOS process, supports VCCINT of 2.5 V/3.3 V, and operates from -40°C to +100°C in the 100-MBGA package.
What is the price of EPM570M100I5N?
As of 2026-09-12, the EPM570M100I5N is listed at approximately $14.16 at qty-1, dropping to $8.75 at qty-1000 per distributor pricing on LCSC and Octopart. Pricing varies by reel/tray packaging and distributor lead time; volume quotes are available on Octopart and DigiKey (DigiKey part 544-1714-ND). The MAX II family is mature, so volume pricing is stable.
Where to buy EPM570M100I5N online?
As of 2026-09-12, EPM570M100I5N is in stock at LCSC ($14.16 single-unit, free datasheet access), DigiKey (part 544-1714-ND), Mouser, and Octopart-indexed distributors including Heisener and Lisleapex. The Heisener listing shows in stock with a 12-week factory lead time. Authorized distributors are recommended over broker inventory for production builds.
Is the EPM570M100I5N in stock and what is the lead time?
As of 2026-09-12, the EPM570M100I5N is listed as in stock at LCSC and Heisener (15,660 pieces), with a 12-week factory lead time per Ventronchip distributor data. Lead times for production-volume orders should be confirmed with authorized Intel distributors, as MAX II family allocation can stretch during supply tightness. The device remains in active production per Intel product lifecycle.
EPM570M100I5N vs EPM570F100C5N - which is better for industrial designs?
The EPM570M100I5N uses a 100-MBGA Micro FBGA package (6 x 6 mm, 76 user I/Os) and is rated -40°C to +100°C, while the EPM570F100C5N uses a 100-pin TQFP/EQFP package with a similar I/O count and a commercial temperature grade. Both share 440 macrocells, 201.1 MHz fmax, and 5.4 ns logic delay. Choose the M100I5N for industrial or rugged applications; choose the F100C5N when TQFP soldering/rework is preferred over BGA.
What is the difference between EPM570M100I5N and EPM570T100C3N?
The EPM570M100I5N is a 100-MBGA BGA package in the -I5 (industrial, -40°C to +100°C) speed/power grade, while the EPM570T100C3N is a 100-pin TQFP package in the -C3 (commercial, faster timing) grade. Both deliver 440 macrocells and 76 user I/Os. According to Xecor cross-reference data, the M100I5N targets BGA-based industrial applications, while the T100C3N targets TQFP-based commercial designs with tighter timing.
When should I choose EPM570M100I5N over an FPGA?
Choose the EPM570M100I5N when you need instant-on non-volatile logic (no external boot flash), deterministic timing for glue logic, low unit cost in small-to-medium volumes, and a simple 0.18 µm CMOS architecture that does not need a separate boot PROM. FPGAs win for high logic density, parallel DSP blocks, or transceivers. MAX II is purpose-built for power-sequencing, bus-bridging, and I/O-expansion tasks where FPGAs would be overkill.
Can EPM570F100C5N replace EPM570M100I5N?
No, the EPM570F100C5N is not a drop-in replacement for the EPM570M100I5N because the package differs: the F100C5N is a 100-pin TQFP while the M100I5N is a 100-MBGA Micro FBGA (6 x 6 mm). PCB land patterns are completely different, so BGA replacement with a TQFP requires board rework. Within the same 100-MBGA package, the EPM570M100C5N (commercial grade) is a drop-in alternative for non-industrial designs.
What is the best drop-in replacement for EPM570M100I5N?
The best drop-in replacements for the EPM570M100I5N (100-MBGA, 440 macrocells, -I5 grade) come from the same MAX II family with the same 100-MBGA package: the EPM570M100C5N (commercial temperature grade, same package), the EPM570M100C4N (commercial, slightly slower speed grade), and the EPM570M100I5 (industrial, tray packaging variant). All share the 6 x 6 mm MBGA footprint and pinout, enabling direct PCB substitution.
Where to download EPM570M100I5N datasheet PDF?
The EPM570M100I5N datasheet PDF can be downloaded from Alldatasheet (alldatasheet.com/datasheet-pdf/pdf/1575870/ALTERA/EPM570M100I5N.html) and from the official Altera/Intel MAX II device handbook on the Intel FPGA website. Datasheets.com also hosts a copy. For the BSDL file and pinout diagram, search the Intel FPGA download center using the device name EPM570M100I5N.
Where can I find the EPM570M100I5N pinout?
The EPM570M100I5N pinout is documented in the manufacturer datasheet and in the BSDL file (boundary-scan description) downloadable from the Intel FPGA website. The 100-MBGA package uses a 10 x 10 array of balls at 0.5 mm pitch on a 6 x 6 mm substrate; pin 1 is at the A1 corner per JEDEC BGA convention. LCSC and Octopart host interactive pinout diagrams for this part.
Is EPM570M100I5N the same as EPM570T100I5N?
No, the EPM570M100I5N and EPM570T100I5N are different parts even though they share 440 macrocells, 100 pins, and the -I5 grade. The M-suffix denotes the 100-MBGA Micro FBGA package (6 x 6 mm), while the T-suffix denotes the 100-pin TQFP/EQFP package. Per the ETEI cross-reference database, the pinout differs, so the two are not pin-compatible. Choose based on your PCB assembly process: BGA for size-critical designs, TQFP for hand-reworkable prototypes.
What is the operating temperature of EPM570M100I5N?
The EPM570M100I5N operates over the industrial temperature range of -40°C to +100°C, indicated by the 'I5' suffix in the part number (I = industrial, 5 = speed/power grade per the MAX II nomenclature). The device is rated for 2.5 V or 3.3 V VCCINT supply across this temperature range. The DigiChip datasheet listing also confirms the -40 to 125°C datasheet operating limit reference.

エンジニアリング参考データ: EPM570M100I5N — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the EPM570M100I5N when you need a non-volatile, instant-on, 440-macrocell CPLD in a compact 100-MBGA (6x6 mm) package for industrial temperature (-40°C to +100°C) applications. It is ideal for power-sequencing, bus-bridging, I/O-expansion, and 74-series logic consolidation. Choose the EPM570M100C5N for commercial-temperature (0 to +85°C) cost-sensitive designs in the same footprint. Choose the EPM570M100C4N when slightly slower timing is acceptable and price is paramount. Choose the EPM570T100I5N (TQFP) for hand-reworkable prototypes or boards where BGA assembly is unavailable. Choose the EPM570F100I5N (TQFP) for new designs where TQFP is preferred for assembly reasons but note it is not pin-compatible with the M100 BGA package - PCB redesign required.

代替品との比較

パラメータ この製品 EPM570M100C5N EPM570M100C4N EPM570M100I5 EPM570GM100I5N EPM570GM100C5N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 100-MBGA (6x6 mm, 0.5 mm pitch) 100-MBGA (6x6 mm, 0.5 mm pitch) - same 100-MBGA (6x6 mm, 0.5 mm pitch) - same 100-MBGA (6x6 mm, 0.5 mm pitch) - same 100-MBGA (6x6 mm, 0.5 mm pitch) - same 100-MBGA (6x6 mm, 0.5 mm pitch) - same
Macrocells 440 440 440 440 440 440
User I/Os 76 76 76 76 76 76
Temperature Grade -40°C to +100°C (I5 industrial) 0°C to +85°C (C5 commercial) 0°C to +85°C (C4 commercial) -40°C to +100°C (I5 industrial) -40°C to +100°C (I5 industrial) 0°C to +85°C (C5 commercial)
Speed/Power Grade I5 (industrial, fastest at -I5 grade) C5 (commercial, fastest) C4 (commercial, slower) I5 (same as this part) I5 (MAX II G variant) C5 (MAX II G variant)

主な差別化要因

  • Industrial temperature grade with same speed as commercial C5 part (vs EPM570M100C5N)
  • Smaller board footprint than TQFP variants (vs EPM570F100I5N (TQFP))
  • On-chip non-volatile configuration eliminates external boot memory (vs SRAM-based FPGAs (e.g., Cyclone IV))
  • Drop-in compatibility with EPM570GM100I5N G variant (vs EPM570GM100I5N)

設計ノート

The EPM570M100I5N requires two separate supply rails: VCCINT at 2.5 V for the core logic and VCCIO at 1.5/1.8/2.5/3.3 V (banked) for I/O. Decouple each VCCINT pin with a 0.1 µF X7R ceramic capacitor placed within 3 mm of the ball, plus a 10 µF bulk capacitor at the regulator output. Each VCCIO bank requires its own decoupling. Power-on-reset (POR) timing is internal; nCONFIG can be held low during power-up to delay configuration if multiple MAX II devices must start in a defined order. Inrush current peaks at ~50 mA during flash programming - budget bulk capacitance accordingly.

The 100-MBGA package uses 0.5 mm pitch on a 6 x 6 mm substrate; escape routing between balls requires 4-layer PCB with microvia (HDI) technology or 6-layer PCB with through-via fan-out. Per JEDEC BGA-100 convention, pin 1 is the A1 corner ball; the marking dot or bevel indicates orientation. Recommended footprint paste-mask openings should follow the manufacturer recommended land pattern with NSMD (non-solder mask defined) pads for best BGA joint reliability. A 1.27 mm keep-out under the package for via-in-pad or dog-bone fan-out is standard practice.

Do not connect JTAG TDI directly to VCCIO without a pull-up; the IEEE 1149.1 spec recommends 10 kΩ pull-ups on TDI, TMS, and nCONFIG. Do not leave unused user I/Os floating - configure them as outputs driving low in the Quartus assignment to minimize inrush during configuration. The user flash sectors must be explicitly protected via the SFI command set to avoid accidental overwrite. When migrating from EPM570F100I5N (TQFP) to EPM570M100I5N (BGA), the JTAG chain order and pinout differ - regenerate the BSDL file and re-validate the JTAG scan path.

With a 5.4 ns pin-to-pin delay and 201.1 MHz fmax, the MAX II can drive 100 MHz external buses, but signal integrity on the 100-MBGA package requires careful attention to SSO (simultaneously switching output) limits: limit simultaneous switching outputs to ~20 per bank to keep ground bounce under 0.3 V. Use 33 Ω series damping resistors on heavily loaded nets (e.g., address/data buses). For clock outputs, prefer the dedicated global clock network (CLK pins) over regular I/O to minimize skew; the device supports up to 4 global clocks.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
鉛フリー
Yes
ハロゲンフリー
Unknown
紛争鉱物
Compliant

RoHS compliant per Alldatasheet listing (lead-free package). The MAX II CPLD family is not AEC-Q100 qualified; for automotive applications, contact Intel about MAX V or Cyclone families. REACH compliance standard for industrial-grade ICs.

データ検証日: 2026-09-12 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

EPM570M100I5N datasheet EPM570M100I5N price EPM570M100I5N buy online MAX II CPLD 440 macrocells Altera EPM570M100I5N pinout EPM570M100I5N vs EPM570T100I5N EPM570M100I5N drop-in replacement 100-MBGA CPLD industrial EPM570M100I5N power sequencing application Intel MAX II CPLD what is EPM570M100I5N used for EPM570M100I5N in stock distributor MAX II CPLD 201 MHz 5.4ns EPM570M100I5N lead time CPLD replacing 74-series logic

関連部品&用語

Intel Altera EPM570M100I5N MAX II CPLD Complex Programmable Logic Device FPGA Programmable Logic Device PLD 440 macrocells Logic Array Block LAB JTAG IEEE 1149.1 100-MBGA Micro FBGA BGA surface mount industrial temperature grade Quartus II Quartus Prime VCCINT VCCIO 3.3 V LVCMOS 0.18 µm CMOS user flash memory multi-track interconnect instant-on non-volatile configuration RoHS lead-free power sequencing glue logic bus bridge industrial automation
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