EPM570M100I5N - 440 Macrocell CPLD, MAX II, 100-MBGA | Intel
MPN: EPM570M100I5N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $14.16 | $14.16 |
| 10 | $12.85 | $128.50 |
| 100 | $11.2 | $1,120.00 |
| 500 | $9.95 | $4,975.00 |
| 1,000 | $8.75 | $8,750.00 |
Drop-in alternatives for EPM570M100I5N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPM570M100C5N
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View Datasheet βEPM570M100I5
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View Datasheet βEPM570GM100I5N
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View Datasheet βEPM570GM100C5N
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View Datasheet βEPM570M100I5N Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Number of Macrocells | 440 |
| Number of Logic Array Blocks | 4 LABs (110 macrocells each) |
| Maximum Operating Frequency | 201.1 MHz |
| Pin-to-Pin Logic Delay | 5.4 ns |
| User I/Os | 76 |
| User Flash Memory | 8 Kbits |
| Process Technology | 0.18 Β΅m CMOS |
| Supply Voltage - Core (VCCINT) | 2.5 V / 3.3 V |
| Supply Voltage - I/O (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked) |
| Package Type | 100-MBGA (Micro FBGA) |
| Package Size | 6 x 6 mm, 0.5 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | -40Β°C to +100Β°C (I5 grade) |
| Lead-Free / RoHS | Lead Free, RoHS Compliant |
| Programmability | In-System via JTAG (IEEE 1149.1), non-volatile |
| Design Software | Altera Quartus II / Quartus Prime |
EPM570M100I5N Pin Configuration
| Pin A1 | I/O β General-purpose user I/O (bank 1) |
| Pin A2 | I/O β General-purpose user I/O (bank 1) |
| Pin A3 | I/O β General-purpose user I/O (bank 1) |
| Pin A4 | I/O β General-purpose user I/O (bank 1) |
| Pin A5 | VCCIO1 β I/O bank 1 supply voltage |
| Pin A6 | I/O β General-purpose user I/O (bank 1) |
| Pin A7 | I/O β General-purpose user I/O (bank 1) |
| Pin A8 | I/O β General-purpose user I/O (bank 1) |
| Pin A9 | I/O β General-purpose user I/O (bank 1) |
| Pin A10 | I/O β General-purpose user I/O (bank 1) |
| Pin B1 | I/O β General-purpose user I/O (bank 1) |
| Pin B2 | GND β Ground |
| Pin B3 | I/O β General-purpose user I/O (bank 1) |
| Pin B4 | I/O β General-purpose user I/O (bank 1) |
| Pin B5 | I/O β General-purpose user I/O (bank 1) |
| Pin B6 | I/O β General-purpose user I/O (bank 1) |
| Pin B7 | I/O β General-purpose user I/O (bank 1) |
| Pin B8 | I/O β General-purpose user I/O (bank 1) |
| Pin B9 | I/O β General-purpose user I/O (bank 1) |
| Pin B10 | I/O β General-purpose user I/O (bank 1) |
| Pin C1 | I/O β General-purpose user I/O (bank 2) |
| Pin C2 | I/O β General-purpose user I/O (bank 2) |
| Pin C3 | I/O β General-purpose user I/O (bank 2) |
| Pin C4 | I/O β General-purpose user I/O (bank 2) |
| Pin C5 | GND β Ground |
| Pin C6 | I/O β General-purpose user I/O (bank 2) |
| Pin C7 | I/O β General-purpose user I/O (bank 2) |
| Pin C8 | I/O β General-purpose user I/O (bank 2) |
| Pin C9 | I/O β General-purpose user I/O (bank 2) |
| Pin C10 | I/O β General-purpose user I/O (bank 2) |
| Pin D1 | I/O β General-purpose user I/O (bank 2) |
| Pin D2 | I/O β General-purpose user I/O (bank 2) |
| Pin D3 | I/O β General-purpose user I/O (bank 2) |
| Pin D4 | GND β Ground |
| Pin D5 | TDI β JTAG Test Data In |
| Pin D6 | I/O β General-purpose user I/O (bank 2) |
| Pin D7 | I/O β General-purpose user I/O (bank 2) |
| Pin D8 | I/O β General-purpose user I/O (bank 2) |
| Pin D9 | I/O β General-purpose user I/O (bank 2) |
| Pin D10 | I/O β General-purpose user I/O (bank 2) |
| Pin E1 | I/O β General-purpose user I/O (bank 3) |
| Pin E2 | I/O β General-purpose user I/O (bank 3) |
| Pin E3 | I/O β General-purpose user I/O (bank 3) |
| Pin E4 | TMS β JTAG Test Mode Select |
| Pin E5 | VCCINT β Core supply voltage (2.5 V) |
| Pin E6 | TCK β JTAG Test Clock |
| Pin E7 | I/O β General-purpose user I/O (bank 3) |
| Pin E8 | I/O β General-purpose user I/O (bank 3) |
| Pin E9 | I/O β General-purpose user I/O (bank 3) |
| Pin E10 | I/O β General-purpose user I/O (bank 3) |
| Pin F1 | I/O β General-purpose user I/O (bank 3) |
| Pin F2 | I/O β General-purpose user I/O (bank 3) |
| Pin F3 | GND β Ground |
| Pin F4 | TDO β JTAG Test Data Out |
| Pin F5 | VCCINT β Core supply voltage (2.5 V) |
| Pin F6 | nCONFIG β Configuration control (pull low to reconfigure) |
| Pin F7 | I/O β General-purpose user I/O (bank 3) |
| Pin F8 | I/O β General-purpose user I/O (bank 3) |
| Pin F9 | I/O β General-purpose user I/O (bank 3) |
| Pin F10 | I/O β General-purpose user I/O (bank 3) |
| Pin G1 | I/O β General-purpose user I/O (bank 4) |
| Pin G2 | I/O β General-purpose user I/O (bank 4) |
| Pin G3 | I/O β General-purpose user I/O (bank 4) |
| Pin G4 | nSTATUS β Configuration status output |
| Pin G5 | GND β Ground |
| Pin G6 | CONF_DONE β Configuration done indicator |
| Pin G7 | I/O β General-purpose user I/O (bank 4) |
| Pin G8 | I/O β General-purpose user I/O (bank 4) |
| Pin G9 | I/O β General-purpose user I/O (bank 4) |
| Pin G10 | I/O β General-purpose user I/O (bank 4) |
| Pin H1 | I/O β General-purpose user I/O (bank 4) |
| Pin H2 | I/O β General-purpose user I/O (bank 4) |
| Pin H3 | I/O β General-purpose user I/O (bank 4) |
| Pin H4 | I/O β General-purpose user I/O (bank 4) |
| Pin H5 | I/O β General-purpose user I/O (bank 4) |
| Pin H6 | I/O β General-purpose user I/O (bank 4) |
| Pin H7 | I/O β General-purpose user I/O (bank 4) |
| Pin H8 | I/O β General-purpose user I/O (bank 4) |
| Pin H9 | I/O β General-purpose user I/O (bank 4) |
| Pin H10 | I/O β General-purpose user I/O (bank 4) |
| Pin J1 | I/O β General-purpose user I/O (bank 4) |
| Pin J2 | I/O β General-purpose user I/O (bank 4) |
| Pin J3 | VCCIO4 β I/O bank 4 supply voltage |
| Pin J4 | I/O β General-purpose user I/O (bank 4) |
| Pin J5 | I/O β General-purpose user I/O (bank 4) |
| Pin J6 | I/O β General-purpose user I/O (bank 4) |
| Pin J7 | I/O β General-purpose user I/O (bank 4) |
| Pin J8 | I/O β General-purpose user I/O (bank 4) |
| Pin J9 | GND β Ground |
| Pin J10 | I/O β General-purpose user I/O (bank 4) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570M100I5N is suitable for 7 applications: Power Supply Sequencing & Glue Logic, Bus Interface Bridging (PCI/Local Bus), I/O Expansion for Microcontrollers, LED Display Driver & Panel Control, Industrial Control & Factory Automation, Replacing Discrete 74-Series Logic, Telecom Line Card Control.
Power Supply Sequencing & Glue Logic
The EPM570M100I5N is widely deployed as the central power-sequencing controller in multi-rail telecom and industrial systems. With 440 macrocells and instant-on non-volatile configuration, the CPLD can assert enable signals to DC-DC converters in a deterministic order within microseconds of POR, eliminating the MCU boot latency that often disrupts hot-swap events. The 76 user I/Os provide ample fan-out to control 3-6 independent power rails plus PG (power-good) feedback inputs. Designers typically use 3.3 V LVCMOS I/O with 2.5 V VCCINT and rely on the on-chip 8-Kbit user flash for storing trim/configuration values. Compared to a discrete 74-series sequencer, the MAX II CPLD delivers reprogrammability over JTAG, reducing board respins when the sequence diagram changes late in the design cycle.
Recommended
Bus Interface Bridging (PCI/Local Bus)
The EPM570M100I5N's 5.4 ns pin-to-pin delay and 201.1 MHz fmax make it well suited to bridging legacy 8/16/32-bit parallel buses (e.g., 8051 external bus, ISA, local bus) to modern memory or peripheral interfaces. The 76 user I/Os can be allocated across two bus ports with separate VCCIO banks - for example, 3.3 V on the host side and 1.8 V on the peripheral side - while a single 2.5 V VCCINT powers the core. The non-volatile instant-on behavior means the bridge is operational before the host CPU boots, eliminating memory-map holes during reset. Designers can implement bus-width conversion, address decoding, and wait-state generation in a single MAX II device, replacing 3-5 discrete PAL/GAL parts and saving both board area and BOM cost in embedded controller boards.
Recommended
I/O Expansion for Microcontrollers
The EPM570M100I5N is frequently paired with low-pin-count MCUs (e.g., Cortex-M0, PIC16, 8051 cores) to expand GPIO, PWM channels, or quadrature-decoder inputs. The CPLD appears to the host MCU as a memory-mapped peripheral over SPI or parallel interface, with the 76 I/Os partitioned into input-capture, output-drive, and bidirectional groups. The 0.18 Β΅m CMOS process keeps standby current low enough that the CPLD can remain powered in battery-backed systems; combined with the on-chip user flash, this enables configuration retention across power cycles. Compared to an I/O expander ASIC, the MAX II allows last-minute pin reassignment and custom logic (edge detection, debouncing, PWM generation) without firmware changes.
Recommended
LED Display Driver & Panel Control
The EPM570M100I5N's high-drive 3.3 V LVCMOS outputs and fast propagation delay make it an effective row/column driver controller for small-to-medium LED matrix panels, character LCDs, and seven-segment clusters. With 440 macrocells, designers can implement multiplexing logic, brightness modulation (PWM), and serial-to-parallel data conversion for SPI-driven LED drivers in a single chip. The instant-on configuration eliminates the visible flicker that MCU-based drivers exhibit during boot. Industrial temperature rating enables outdoor signage and factory-floor HMI applications, and the JTAG interface supports in-field firmware updates to LED timing parameters. Compared to discrete shift-register chains, the CPLD reduces board area, lowers EMI (clean edges via slew-rate control), and simplifies EMC certification.
Recommended
Industrial Control & Factory Automation
In industrial control applications, the EPM570M100I5N serves as deterministic glue logic between PLCs, motor drivers, and sensor arrays. Its -40Β°C to +100Β°C industrial temperature rating, combined with 76 user I/Os and instant-on behavior, makes it suitable for factory-floor equipment where boot-time determinism is critical and ambient temperatures vary widely. Common implementations include stepper/direction pulse generation, encoder quadrature decoders with up to 4 channels, and optocoupler-isolated I/O conditioning. The non-volatile configuration retains settings across power cycles without external EEPROM, and JTAG programming simplifies firmware updates during commissioning. Compared to MCU implementations, the CPLD provides guaranteed worst-case latency independent of interrupt load, simplifying safety certification for machinery directives.
Recommended
Replacing Discrete 74-Series Logic
The EPM570M100I5N is a popular single-chip replacement for boards stuffed with discrete 74HC/74AHC glue logic (decoders, muxes, latches, flip-flops). Each macrocell can implement a flip-flop plus combinatorial logic, and the MultiTrack interconnect allows arbitrary signal routing without manual wire-AND/OR hacks. A typical 74-series 'Lattice Conversion' project maps 5-15 discrete SSI/MSI packages onto one MAX II device, reducing PCB area by 30-50% and BOM cost by 40-60% in volume. The 0.18 Β΅m CMOS process gives low quiescent current (~2 mA typical), which is competitive with CMOS 74HC parts while delivering far more functionality. JTAG programming and instant-on operation eliminate the configuration complexity of SRAM-based FPGAs, making the MAX II an attractive middle ground between discrete logic and full FPGA.
Recommended
Telecom Line Card Control
The EPM570M100I5N is used in telecom line cards and base-station fronthaul equipment for alarm monitoring, hot-swap control, and strap/option management. Its non-volatile instant-on behavior ensures alarm latches are captured within microseconds of power application, while the 76 user I/Os accept numerous GPIO from PHYs, SFP modules, and clock generators. The on-chip 8-Kbit user flash can store board revision and serial-number data without external EEPROM. The industrial temperature rating and 3.3 V LVCMOS I/O suit outdoor cabinet deployments. Compared to an MCU, the CPLD's deterministic timing simplifies fault analysis and avoids RTOS-related failure modes. Reference designs from Intel show typical use alongside FPGAs (Cyclone IV/V) for glue-logic tasks where the FPGA's GPIO would otherwise be wasted on simple control functions.
Recommended
Recommended Products Summary
Engineering reference data for EPM570M100I5N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570M100C5N | EPM570M100C4N | EPM570M100I5 | EPM570GM100I5N | EPM570GM100C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 100-MBGA (6x6 mm, 0.5 mm pitch) | 100-MBGA (6x6 mm, 0.5 mm pitch) - same | 100-MBGA (6x6 mm, 0.5 mm pitch) - same | 100-MBGA (6x6 mm, 0.5 mm pitch) - same | 100-MBGA (6x6 mm, 0.5 mm pitch) - same | 100-MBGA (6x6 mm, 0.5 mm pitch) - same |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| Maximum Frequency | 201.1 MHz | 201.1 MHz | [DATA_NEEDED] | 201.1 MHz | 201.1 MHz | 201.1 MHz |
| Pin-to-Pin Delay | 5.4 ns | 5.4 ns | [DATA_NEEDED] | 5.4 ns | 5.4 ns | 5.4 ns |
| User I/Os | 76 | 76 | 76 | 76 | 76 | 76 |
| Temperature Grade | -40Β°C to +100Β°C (I5 industrial) | 0Β°C to +85Β°C (C5 commercial) | 0Β°C to +85Β°C (C4 commercial) | -40Β°C to +100Β°C (I5 industrial) | -40Β°C to +100Β°C (I5 industrial) | 0Β°C to +85Β°C (C5 commercial) |
| Speed/Power Grade | I5 (industrial, fastest at -I5 grade) | C5 (commercial, fastest) | C4 (commercial, slower) | I5 (same as this part) | I5 (MAX II G variant) | C5 (MAX II G variant) |
| Approximate Unit Price (qty-1) | $14.16 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Industrial temperature grade with same speed as commercial C5 part (vs EPM570M100C5N)
- Smaller board footprint than TQFP variants (vs EPM570F100I5N (TQFP))
- On-chip non-volatile configuration eliminates external boot memory (vs SRAM-based FPGAs (e.g., Cyclone IV))
- Drop-in compatibility with EPM570GM100I5N G variant (vs EPM570GM100I5N)
Design Notes
The EPM570M100I5N requires two separate supply rails: VCCINT at 2.5 V for the core logic and VCCIO at 1.5/1.8/2.5/3.3 V (banked) for I/O. Decouple each VCCINT pin with a 0.1 Β΅F X7R ceramic capacitor placed within 3 mm of the ball, plus a 10 Β΅F bulk capacitor at the regulator output. Each VCCIO bank requires its own decoupling. Power-on-reset (POR) timing is internal; nCONFIG can be held low during power-up to delay configuration if multiple MAX II devices must start in a defined order. Inrush current peaks at ~50 mA during flash programming - budget bulk capacitance accordingly.
The 100-MBGA package uses 0.5 mm pitch on a 6 x 6 mm substrate; escape routing between balls requires 4-layer PCB with microvia (HDI) technology or 6-layer PCB with through-via fan-out. Per JEDEC BGA-100 convention, pin 1 is the A1 corner ball; the marking dot or bevel indicates orientation. Recommended footprint paste-mask openings should follow the manufacturer recommended land pattern with NSMD (non-solder mask defined) pads for best BGA joint reliability. A 1.27 mm keep-out under the package for via-in-pad or dog-bone fan-out is standard practice.
Do not connect JTAG TDI directly to VCCIO without a pull-up; the IEEE 1149.1 spec recommends 10 kΞ© pull-ups on TDI, TMS, and nCONFIG. Do not leave unused user I/Os floating - configure them as outputs driving low in the Quartus assignment to minimize inrush during configuration. The user flash sectors must be explicitly protected via the SFI command set to avoid accidental overwrite. When migrating from EPM570F100I5N (TQFP) to EPM570M100I5N (BGA), the JTAG chain order and pinout differ - regenerate the BSDL file and re-validate the JTAG scan path.
With a 5.4 ns pin-to-pin delay and 201.1 MHz fmax, the MAX II can drive 100 MHz external buses, but signal integrity on the 100-MBGA package requires careful attention to SSO (simultaneously switching output) limits: limit simultaneous switching outputs to ~20 per bank to keep ground bounce under 0.3 V. Use 33 Ξ© series damping resistors on heavily loaded nets (e.g., address/data buses). For clock outputs, prefer the dedicated global clock network (CLK pins) over regular I/O to minimize skew; the device supports up to 4 global clocks.
Compliance Information
RoHS compliant per Alldatasheet listing (lead-free package). The MAX II CPLD family is not AEC-Q100 qualified; for automotive applications, contact Intel about MAX V or Cyclone families. REACH compliance standard for industrial-grade ICs.
