EPM570F100I5 - MAX II CPLD, 440 LE, 76 I/O, 100-FBGA | Intel
部品番号: EPM570F100I5 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $14.2 | $14.20 |
| 10 | $12.85 | $128.50 |
| 100 | $11.4 | $1,140.00 |
| 500 | $9.95 | $4,975.00 |
| 1,000 | $8.75 | $8,750.00 |
EPM570F100I5 概要
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits in the hierarchy between simple glue-logic PAL/GAL chips and large FPGAs. CPLDs use a programmable AND/OR array with non-volatile configuration memory, providing deterministic, single-clock-cycle propagation delays and instant power-on behavior. MAX II devices specifically use a LUT-based architecture (rather than classic PLA) combined with on-chip Flash configuration to deliver FPGA-like density at CPLD-like simplicity - making them ideal for I/O expansion, bus bridging, interface protocol translation, and power-sequencing logic that must be active immediately at system power-up.
Key features of the EPM570F100I5 include 440 logic elements (LEs), 440 macrocells, 76 user I/O pins, and an internal operating frequency of 201.1 MHz. The device integrates 8 Kbits of user Flash memory (UFM) for storing non-volatile data such as serial numbers, calibration constants, or boot parameters. Multi-voltage I/O banks support 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces, allowing direct connection to legacy 5 V-tolerant buses through proper external components. The JTAG-based in-system programmability (ISP) eliminates the need for a separate boot PROM and supports IEEE 1149.1 boundary-scan testing.
Architecturally, the MAX II device uses a uniform interconnect matrix that routes LUT outputs to I/O pins with predictable, fast timing. Every LE includes a 4-input LUT, a programmable register, and a carry chain. The integrated Flash configuration block is in-system programmable through JTAG and supports JTAG-based verification during production test. The UFM block provides a small non-volatile memory that can be accessed from user logic, eliminating the need for a separate EEPROM in many designs.
Typical applications of the EPM570F100I5 include I/O expansion and level translation in industrial control systems, bus protocol bridging (I2C-to-SPI, UART-to-PCI), LED display and lighting control sequencing, power-supply management and hot-swap control logic, JTAG-based test access port (TAP) multiplexing, and general glue-logic replacement in consumer and embedded designs. The instant-on, deterministic-timing characteristics make it especially valuable in power-rail sequencing for processor cores, memory subsystems, and complex SoCs that require controlled bring-up.
When designing with the EPM570F100I5, pay careful attention to the FBGA-100 PCB footprint - a 1.0 mm ball pitch requires precise land pattern design and reflow profile control. Use the Altera/Intel Quartus II design software (legacy) or Quartus Prime to develop, simulate, and program the device; the JTAG interface supports in-system programming after PCB assembly. Provide proper decoupling on each VCCINT and VCCIO bank and follow Intel's recommended BGA routing escape pattern to minimize via stubs and signal-integrity issues on high-speed outputs.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical BGA-layout design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing and designing with the EPM570F100I5.
ドロップイン代替品: EPM570F100I5 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPM570F100I5 （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Process Technology, Programming Interface, Configuration Memory.
クイック比較ツール — 並列比較する代替部品を選択:
EPM570F100C5N
✅ ドロップイン✓ 在庫あり
$5.2 / 個
データシートを見る →EPM570F100C4N
✅ ドロップイン✓ 在庫あり
$14.32 / 個
データシートを見る →EPM570F100A5N
✅ ドロップイン✓ 在庫あり
$9.85 / 個
データシートを見る →EPM570M100I5N
✅ ドロップイン✓ 在庫あり
$8.75 / 個
データシートを見る →EPM570GM100I5N
✅ ドロップイン✓ 在庫あり
$8.55 / 個
データシートを見る →EPM570F100I5 最大定格＆電気的特性
| Family | MAX II |
| Device Series | EPM570 |
| Logic Elements (LEs) | 440 |
| Macrocells | 440 |
| User I/O Pins | 76 |
| Maximum Internal Frequency | 201.1 MHz |
| User Flash Memory (UFM) | 8 Kbits |
| Process Technology | 0.18 µm |
| Core Voltage (VCCINT) | 2.5 V / 3.3 V |
| I/O Bank Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| パッケージ | 100-ball FBGA (FineLine BGA), 1.0 mm pitch |
| Configuration Memory | Non-volatile Flash (instant-on) |
| Programming Interface | JTAG (IEEE Std. 1149.1) |
| 動作温度 | -40C to +100C (industrial grade, 'I') |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
EPM570F100I5 100-ball fbga (fineline bga), 1.0 mm pitch ピン配置ガイド
EPM570F100I5 (100-ball fbga (fineline bga), 1.0 mm pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EPM570F100I5.
詳細は データシート をご参照ください。
主な用途
EPM570F100I5 の用途: 6 件s: Industrial I/O Expansion & Level Translation, Bus Protocol Bridging, Power Supply Sequencing & Hot-Swap Control, JTAG TAP Multiplexing & Boundary-Scan Test, LED Display & Lighting Control Sequencing, Glue Logic Replacement in Embedded Boards.
Industrial I/O Expansion & Level Translation
The EPM570F100I5 fits industrial I/O expansion and voltage-level translation because it provides 76 user I/Os with four independent multi-voltage banks (1.5/1.8/2.5/3.3 V VCCIO) and instant-on Flash configuration that eliminates external boot PROMs. In a typical PLC backplane design, the CPLD sits between a 3.3 V SoC and 1.8 V sensors, translating 24 signal lines in a single FBGA-100 footprint while adding deterministic glue logic for interrupt steering and latch-enable generation. The 201.1 MHz internal frequency comfortably handles 50 MHz SPI or 1 MHz industrial fieldbus toggling without timing closure issues.
おすすめ
Bus Protocol Bridging
The EPM570F100I5 is well suited for bus protocol bridging between asynchronous interfaces (I2C, SPI, UART, parallel GPIO) in embedded systems. Its 440 logic elements comfortably implement state-machine-based protocol converters - for example, SPI-to-I2C bridging or UART-to-Parallel - while the 8-Kbit User Flash Memory stores non-volatile configuration such as I2C slave addresses or bus timing parameters. Industrial temperature grade (-40C to +100C) makes it suitable for factory automation bridges that must operate reliably across unconditioned enclosures.
おすすめ
Power Supply Sequencing & Hot-Swap Control
The EPM570F100I5's instant-on non-volatile configuration makes it ideal for processor power-rail sequencing in multi-rail systems. With deterministic single-clock-cycle propagation delays, it generates precisely timed enable signals for DC-DC converters in the correct order to satisfy core, memory, and I/O rail-up requirements of SoCs and FPGAs. The 76 user I/Os allow monitoring of PG (power-good) feedback from 6-8 rails and driving 6-8 EN lines concurrently, while the JTAG interface allows in-system reconfiguration of sequencing logic during prototyping without rework.
おすすめ
JTAG TAP Multiplexing & Boundary-Scan Test
The EPM570F100I5 is commonly used to multiplex JTAG Test Access Ports (TAPs) across multiple devices on a board, allowing a single JTAG header to access several CPLDs, FPGAs, processors, and memory devices in series. Its IEEE 1149.1-compliant TAP controller and high I/O count make it ideal as a JTAG expander in production test fixtures. The non-volatile configuration ensures the multiplexer routing is set correctly from power-on, before any other device is out of reset.
おすすめ
LED Display & Lighting Control Sequencing
The EPM570F100I5 handles LED matrix refresh, brightness modulation (PWM generation), and panel-sequencing tasks in commercial lighting and signage systems. With 201.1 MHz internal frequency, it can drive dozens of PWM channels at kHz rates with sub-microsecond dead-time control, eliminating flicker in architectural lighting. The 440 logic elements accommodate state-machine-based DMX512 or DALI protocol parsing on the same chip, reducing BOM cost in stage lighting fixtures.
おすすめ
Glue Logic Replacement in Embedded Boards
The EPM570F100I5 consolidates 5-10 discrete 74-series glue-logic ICs into a single FBGA-100 device, reducing PCB area, BOM count, and assembly cost in complex embedded designs. Functions typically absorbed include address decoding, chip-select generation, interrupt prioritization, watchdog timers, and reset distribution. The 8-Kbit UFM stores board revision or serial number data, allowing boards to identify themselves at boot without a separate EEPROM IC.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPM570F100I5 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPM570F100C5N | EPM570F100C4N | EPM570F100A5N | EPM570M100I5N | EPM570GM100I5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | FBGA-100 (1.0 mm pitch) | FBGA-100 (1.0 mm pitch) - same | FBGA-100 (1.0 mm pitch) - same | FBGA-100 (1.0 mm pitch) - same | FBGA-100 (1.0 mm pitch) - same | FBGA-100 (1.0 mm pitch) - same |
| Family | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II |
| Logic Elements | 440 | 440 | 440 | 440 | 440 | 440 |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| User I/O | 76 | 76 | 76 | 76 | 76 | 76 |
| Core Voltage (VCCINT) | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 1.8 V |
| Operating Temperature | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +125C (automotive/extended) | -40C to +100C (industrial) | -40C to +100C (industrial) |
主な差別化要因
- Industrial-grade temperature rating matched to extended-environment designs （vs EPM570F100C5N)
- Drop-in same-footprint alternative with only the designator letter changed （vs EPM570M100I5N)
- Instant-on Flash configuration with no external boot PROM required （vs EPM570GM100I5N)
設計ノート
The FBGA-100 package has a 1.0 mm ball pitch requiring strict adherence to JEDEC BGA land pattern guidelines and Intel's recommended via escape pattern. Use microvias (laser-drilled, 0.1 mm diameter) in the inner layers for signal fan-out to avoid via stubs. The 4-6 layer stackup should allocate one continuous ground plane adjacent to the BGA signal layer to provide controlled impedance and minimize crosstalk on high-speed outputs (LVDS, SSTL).
All VCCINT pins must be tied to a single rail of either 2.5 V or 3.3 V - never a combination. For each VCCIO bank, connect decoupling capacitors (0.1 µF X7R plus 10 µF bulk) within 2 mm of the respective ball. For the EPM570GM100I5N drop-in variant, VCCINT must instead be 1.8 V, so verify core voltage before PCB swap. The flash programming supply (VCCPD) must ramp with VCCINT for reliable ISP.
Do not exceed the maximum junction temperature or operate outside the -40C to +100C industrial window. The FBGA-100 has no lead-free solder re-balling allowance - rework must follow JEDEC J-STD-020 reflow profile with peak temperature not exceeding 245C for lead-free assembly. The device requires Quartus II version 13.0 SP1 (the last MAX II-supported release); newer Quartus Prime versions drop MAX II support.
コンプライアンス情報
RoHS and REACH compliant per Intel/Altera product page. Not AEC-Q100 qualified - use EPM570F100A5N for automotive applications requiring extended temperature. Halogen-free status not explicitly stated in the verified data.
