HMC329A-DIE - 22-38 GHz GaAs MMIC Double Balanced Mixer | Analog Devices
部品番号: HMC329A-DIE ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
HMC329A-DIE 概要
A double-balanced mixer is a type of frequency mixer that uses two balanced diode or transistor pairs to suppress both the local oscillator (LO) and radio frequency (RF) ports from the intermediate frequency (IF) output. This architecture inherently provides high isolation between ports, reducing the need for external filtering and improving overall system performance. In the hierarchy of RF components, a mixer is a fundamental building block in transceivers, following the low-noise amplifier (LNA) in the receive chain and preceding the power amplifier (PA) in the transmit chain.
Key features of the HMC329A-DIE include a wide RF/LO frequency range of 22 GHz to 38 GHz, an IF frequency range of DC to 8 GHz, and a conversion loss of typically 8 dB. The device offers excellent isolations, with LO-to-RF isolation of 35 dB and LO-to-IF isolation of 25 dB, minimizing signal leakage and spurious responses. The input third-order intercept point (IIP3) is typically 15 dBm, ensuring good linearity for demanding modulation schemes.
Technically, the HMC329A-DIE is a passive mixer, meaning it does not require DC bias, which simplifies circuit design and reduces power consumption. The GaAs MMIC process ensures consistent performance across temperature and lot variations. The bare die format allows for direct integration into hybrid circuits or multi-chip modules, offering flexibility in packaging and assembly.
Typical applications include point-to-point and point-to-multipoint radios, satellite communications, radar systems, and test and measurement equipment. The wide frequency range and high isolation make it suitable for both military and commercial systems operating in the Ka-band.
When designing with this bare die, careful attention must be paid to wire bonding and die attach processes to ensure reliable electrical and thermal connections. The die should be handled in a cleanroom environment to prevent contamination, and proper ESD precautions are essential.
ドロップイン代替品: HMC329A-DIE — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
HMC329A-SX
✅ ドロップイン📋 参考代替品（カタログ未掲載）
HMC329
✅ ドロップイン📋 参考代替品（カタログ未掲載）
HMC264
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
HMC329A-DIE 仕様
| RF Frequency Range | 22 GHz to 38 GHz |
| LO Frequency Range | 22 GHz to 38 GHz |
| IF Frequency Range | DC to 8 GHz |
| Conversion Loss | 8 dB (typical) |
| LO-to-RF Isolation | 35 dB (typical) |
| LO-to-IF Isolation | 25 dB (typical) |
| Input Third-Order Intercept Point (IIP3) | 15 dBm (typical) |
| Technology | GaAs MMIC |
| パッケージ | Die (0.87 mm × 0.58 mm) |
| 実装タイプ | Bare Die |
| RoHS ステータス | Compliant |
| REACH Status | Compliant |
| Lead Free | Yes |
HMC329A-DIE die (0.87 mm × 0.58 mm) ピン配置ガイド
HMC329A-DIE (die (0.87 mm × 0.58 mm) パッケージ) のピン配置。 ピン番号、機能、接続図はメーカーのデータシートで定義されています。正確なフットプリントとはんだ付けのガイドラインについては、データシートを参照してください。
詳細なピン配置データはありません: HMC329A-DIE.
詳細は データシート をご参照ください。
主な用途
HMC329A-DIE の用途: 6 件s: Point-to-Point Radios, Satellite Communications, Radar Systems, Test and Measurement Equipment, 5G and Millimeter-Wave Infrastructure, Electronic Warfare and Defense.
Point-to-Point Radios
The HMC329A-DIE is ideal for point-to-point radios operating in the 22-38 GHz band. Its wide RF/LO range and high isolation (35 dB LO-to-RF) ensure minimal signal leakage, which is critical for maintaining link quality. The passive design requires no DC bias, simplifying the transceiver architecture. With a conversion loss of 8 dB, system designers can budget for adequate gain in the IF chain. The compact die size (0.87 mm × 0.58 mm) allows for integration into compact radio modules, enabling high-density designs for backhaul applications.
おすすめ
Satellite Communications
In satellite communication systems, the HMC329A-DIE provides reliable frequency conversion for Ka-band uplinks and downlinks. Its excellent isolation and linearity (IIP3 of 15 dBm) help maintain signal integrity in the presence of strong adjacent channels. The wide IF range (DC to 8 GHz) supports various modulation schemes and data rates. The bare die format is suitable for space-grade hybrid circuits, where size and weight are critical. The passive operation ensures high reliability in the harsh space environment.
おすすめ
Radar Systems
The HMC329A-DIE is well-suited for radar systems operating in the Ka-band, such as automotive radar and military surveillance. Its double-balanced architecture provides high isolation between the LO and RF ports, reducing spurious responses that could interfere with target detection. The wide frequency range allows for frequency agility, and the compact die size enables integration into phased-array modules. The passive design ensures low power consumption, which is beneficial for portable or battery-operated radar systems.
おすすめ
Test and Measurement Equipment
The HMC329A-DIE is used in test and measurement equipment such as spectrum analyzers and signal generators for frequency conversion in the 22-38 GHz range. Its high isolation and linearity ensure accurate signal analysis and generation. The wide IF bandwidth supports broadband measurements, and the passive design eliminates the need for bias supplies, simplifying instrument design. The bare die format allows for integration into custom test fixtures and modules, providing flexibility for specialized applications.
おすすめ
5G and Millimeter-Wave Infrastructure
The HMC329A-DIE is suitable for 5G millimeter-wave infrastructure, particularly for base stations and backhaul links operating in the 24-38 GHz range. Its wideband performance and high isolation are essential for handling multiple carriers and maintaining signal quality. The compact die size enables integration into small-cell and massive MIMO modules. The passive design reduces power consumption, which is critical for energy-efficient network equipment. The excellent linearity (IIP3 of 15 dBm) supports high-order modulation schemes like 256-QAM.
おすすめ
Electronic Warfare and Defense
In electronic warfare and defense systems, the HMC329A-DIE provides robust frequency conversion for jamming, surveillance, and communication systems. Its wide frequency range and high isolation are critical for operating in contested electromagnetic environments. The passive design ensures high reliability and low power consumption, which is important for airborne and portable systems. The bare die format allows for integration into custom multi-chip modules, enabling secure and compact designs.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: HMC329A-DIE — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | HMC329A-SX | HMC329 | HMC329LC3B | HMC329LM3 |
|---|---|---|---|---|---|
| Package | Die (0.87 mm × 0.58 mm) | Die (same) | Die (0.85 mm × 0.55 mm) | Leadless SMT | SMT Leadless Chip Carrier |
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| RF Frequency Range | 22 GHz to 38 GHz | 22 GHz to 38 GHz | 22 GHz to 38 GHz | 22 GHz to 38 GHz | 22 GHz to 38 GHz |
| Conversion Loss | 8 dB (typical) | 8 dB (typical) | 8 dB (typical) | 8 dB (typical) | 8 dB (typical) |
| LO-to-RF Isolation | 35 dB (typical) | 35 dB (typical) | 35 dB (typical) | 35 dB (typical) | 35 dB (typical) |
| LO-to-IF Isolation | 25 dB (typical) | 25 dB (typical) | 25 dB (typical) | 25 dB (typical) | 25 dB (typical) |
| IIP3 | 15 dBm (typical) | 15 dBm (typical) | 15 dBm (typical) | 15 dBm (typical) | 15 dBm (typical) |
| DC Bias Required | No | No | No | No | No |
主な差別化要因
- Compact die size （vs HMC329LC3B)
- No DC bias required （vs Active mixers)
- High isolation （vs HMC264)
設計ノート
When integrating the HMC329A-DIE, ensure the die is attached to a ground plane with adequate thermal and electrical contact. Use wire bonding with minimal length to reduce parasitic inductance. The RF and LO ports should be matched to 50 ohms using appropriate transmission lines. For optimal performance, place the die in a cavity with proper grounding.
Although the HMC329A-DIE is a passive mixer and dissipates minimal power, proper thermal management is still important. Ensure the die attach material has good thermal conductivity to prevent overheating during operation. The operating temperature range should be verified from the datasheet, as it is not specified in the provided data.
Handle the bare die with extreme care to avoid damage. Use ESD protection and cleanroom conditions. Avoid touching the die surface, as contamination can degrade RF performance. Verify the exact pinout and bonding diagram from the datasheet before assembly, as the pinout is not provided in the available data.
コンプライアンス情報
RoHS and REACH compliance are indicated on the Analog Devices product page. AEC-Q100 is not applicable for this RF component.
