HMC329A-DIE - 22-38 GHz GaAs MMIC Double Balanced Mixer | Analog Devices
料号： HMC329A-DIE ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
HMC329A-DIE 概述
A double-balanced mixer is a type of frequency mixer that uses two balanced diode or transistor pairs to suppress both the local oscillator (LO) and radio frequency (RF) ports from the intermediate frequency (IF) output. This architecture inherently provides high isolation between ports, reducing the need for external filtering and improving overall system performance. In the hierarchy of RF components, a mixer is a fundamental building block in transceivers, following the low-noise amplifier (LNA) in the receive chain and preceding the power amplifier (PA) in the transmit chain.
Key features of the HMC329A-DIE include a wide RF/LO frequency range of 22 GHz to 38 GHz, an IF frequency range of DC to 8 GHz, and a conversion loss of typically 8 dB. The device offers excellent isolations, with LO-to-RF isolation of 35 dB and LO-to-IF isolation of 25 dB, minimizing signal leakage and spurious responses. The input third-order intercept point (IIP3) is typically 15 dBm, ensuring good linearity for demanding modulation schemes.
Technically, the HMC329A-DIE is a passive mixer, meaning it does not require DC bias, which simplifies circuit design and reduces power consumption. The GaAs MMIC process ensures consistent performance across temperature and lot variations. The bare die format allows for direct integration into hybrid circuits or multi-chip modules, offering flexibility in packaging and assembly.
Typical applications include point-to-point and point-to-multipoint radios, satellite communications, radar systems, and test and measurement equipment. The wide frequency range and high isolation make it suitable for both military and commercial systems operating in the Ka-band.
When designing with this bare die, careful attention must be paid to wire bonding and die attach processes to ensure reliable electrical and thermal connections. The die should be handled in a cleanroom environment to prevent contamination, and proper ESD precautions are essential.
直接替换替代料： HMC329A-DIE ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
HMC329A-SX
✅ 直接替换📋 参考替代料（不在目录中）
HMC329
✅ 直接替换📋 参考替代料（不在目录中）
HMC264
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
HMC329A-DIE 规格参数
| RF Frequency Range | 22 GHz to 38 GHz |
| LO Frequency Range | 22 GHz to 38 GHz |
| IF Frequency Range | DC to 8 GHz |
| Conversion Loss | 8 dB (typical) |
| LO-to-RF Isolation | 35 dB (typical) |
| LO-to-IF Isolation | 25 dB (typical) |
| Input Third-Order Intercept Point (IIP3) | 15 dBm (typical) |
| Technology | GaAs MMIC |
| 封装 | Die (0.87 mm × 0.58 mm) |
| 安装类型 | Bare Die |
| RoHS 状态 | Compliant |
| REACH Status | Compliant |
| Lead Free | Yes |
HMC329A-DIE die (0.87 mm × 0.58 mm) 引脚配置指南
HMC329A-DIE（die (0.87 mm × 0.58 mm) 封装）的引脚配置。 引脚编号、功能和连接图在制造商数据手册中定义。请参阅该手册以了解确切的封装尺寸和焊接指南。
暂无详细引脚数据： HMC329A-DIE.
请参阅 数据手册 以查看完整引脚配置。
典型应用
HMC329A-DIE 适用于 6 应用s: Point-to-Point Radios, Satellite Communications, Radar Systems, Test and Measurement Equipment, 5G and Millimeter-Wave Infrastructure, Electronic Warfare and Defense.
Point-to-Point Radios
The HMC329A-DIE is ideal for point-to-point radios operating in the 22-38 GHz band. Its wide RF/LO range and high isolation (35 dB LO-to-RF) ensure minimal signal leakage, which is critical for maintaining link quality. The passive design requires no DC bias, simplifying the transceiver architecture. With a conversion loss of 8 dB, system designers can budget for adequate gain in the IF chain. The compact die size (0.87 mm × 0.58 mm) allows for integration into compact radio modules, enabling high-density designs for backhaul applications.
推荐
Satellite Communications
In satellite communication systems, the HMC329A-DIE provides reliable frequency conversion for Ka-band uplinks and downlinks. Its excellent isolation and linearity (IIP3 of 15 dBm) help maintain signal integrity in the presence of strong adjacent channels. The wide IF range (DC to 8 GHz) supports various modulation schemes and data rates. The bare die format is suitable for space-grade hybrid circuits, where size and weight are critical. The passive operation ensures high reliability in the harsh space environment.
推荐
Radar Systems
The HMC329A-DIE is well-suited for radar systems operating in the Ka-band, such as automotive radar and military surveillance. Its double-balanced architecture provides high isolation between the LO and RF ports, reducing spurious responses that could interfere with target detection. The wide frequency range allows for frequency agility, and the compact die size enables integration into phased-array modules. The passive design ensures low power consumption, which is beneficial for portable or battery-operated radar systems.
推荐
Test and Measurement Equipment
The HMC329A-DIE is used in test and measurement equipment such as spectrum analyzers and signal generators for frequency conversion in the 22-38 GHz range. Its high isolation and linearity ensure accurate signal analysis and generation. The wide IF bandwidth supports broadband measurements, and the passive design eliminates the need for bias supplies, simplifying instrument design. The bare die format allows for integration into custom test fixtures and modules, providing flexibility for specialized applications.
推荐
5G and Millimeter-Wave Infrastructure
The HMC329A-DIE is suitable for 5G millimeter-wave infrastructure, particularly for base stations and backhaul links operating in the 24-38 GHz range. Its wideband performance and high isolation are essential for handling multiple carriers and maintaining signal quality. The compact die size enables integration into small-cell and massive MIMO modules. The passive design reduces power consumption, which is critical for energy-efficient network equipment. The excellent linearity (IIP3 of 15 dBm) supports high-order modulation schemes like 256-QAM.
推荐
Electronic Warfare and Defense
In electronic warfare and defense systems, the HMC329A-DIE provides robust frequency conversion for jamming, surveillance, and communication systems. Its wide frequency range and high isolation are critical for operating in contested electromagnetic environments. The passive design ensures high reliability and low power consumption, which is important for airborne and portable systems. The bare die format allows for integration into custom multi-chip modules, enabling secure and compact designs.
推荐
推荐产品汇总
工程参考数据： HMC329A-DIE ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | HMC329A-SX | HMC329 | HMC329LC3B | HMC329LM3 |
|---|---|---|---|---|---|
| Package | Die (0.87 mm × 0.58 mm) | Die (same) | Die (0.85 mm × 0.55 mm) | Leadless SMT | SMT Leadless Chip Carrier |
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| RF Frequency Range | 22 GHz to 38 GHz | 22 GHz to 38 GHz | 22 GHz to 38 GHz | 22 GHz to 38 GHz | 22 GHz to 38 GHz |
| Conversion Loss | 8 dB (typical) | 8 dB (typical) | 8 dB (typical) | 8 dB (typical) | 8 dB (typical) |
| LO-to-RF Isolation | 35 dB (typical) | 35 dB (typical) | 35 dB (typical) | 35 dB (typical) | 35 dB (typical) |
| LO-to-IF Isolation | 25 dB (typical) | 25 dB (typical) | 25 dB (typical) | 25 dB (typical) | 25 dB (typical) |
| IIP3 | 15 dBm (typical) | 15 dBm (typical) | 15 dBm (typical) | 15 dBm (typical) | 15 dBm (typical) |
| DC Bias Required | No | No | No | No | No |
关键差异点
- Compact die size （对比 HMC329LC3B)
- No DC bias required （对比 Active mixers)
- High isolation （对比 HMC264)
设计说明
When integrating the HMC329A-DIE, ensure the die is attached to a ground plane with adequate thermal and electrical contact. Use wire bonding with minimal length to reduce parasitic inductance. The RF and LO ports should be matched to 50 ohms using appropriate transmission lines. For optimal performance, place the die in a cavity with proper grounding.
Although the HMC329A-DIE is a passive mixer and dissipates minimal power, proper thermal management is still important. Ensure the die attach material has good thermal conductivity to prevent overheating during operation. The operating temperature range should be verified from the datasheet, as it is not specified in the provided data.
Handle the bare die with extreme care to avoid damage. Use ESD protection and cleanroom conditions. Avoid touching the die surface, as contamination can degrade RF performance. Verify the exact pinout and bonding diagram from the datasheet before assembly, as the pinout is not provided in the available data.
合规信息
RoHS and REACH compliance are indicated on the Analog Devices product page. AEC-Q100 is not applicable for this RF component.
