HMC329A-DIE - 22-38 GHz GaAs MMIC Double Balanced Mixer | Analog Devices
MPN: HMC329A-DIE β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for HMC329A-DIE β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
HMC329A-SX
β Drop-Inπ Reference alternative (not in catalog)
HMC329
β Drop-Inπ Reference alternative (not in catalog)
HMC264
β Drop-Inπ Reference alternative (not in catalog)
HMC329A-DIE Maximum Ratings & Electrical Characteristics
| RF Frequency Range | 22 GHz to 38 GHz |
| LO Frequency Range | 22 GHz to 38 GHz |
| IF Frequency Range | DC to 8 GHz |
| Conversion Loss | 8 dB (typical) |
| LO-to-RF Isolation | 35 dB (typical) |
| LO-to-IF Isolation | 25 dB (typical) |
| Input Third-Order Intercept Point (IIP3) | 15 dBm (typical) |
| Input 1 dB Compression Point | [DATA_NEEDED: Input 1 dB Compression Point] |
| Technology | GaAs MMIC |
| Package | Die (0.87 mm Γ 0.58 mm) |
| Mounting Type | Bare Die |
| Operating Temperature Range | [DATA_NEEDED: Operating Temperature Range] |
| RoHS Status | Compliant |
| REACH Status | Compliant |
| Lead Free | Yes |
HMC329A-DIE die (0.87 mm Γ 0.58 mm) Pin Configuration Guide
Complete pinout information for HMC329A-DIE (die (0.87 mm Γ 0.58 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for HMC329A-DIE.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
HMC329A-DIE is suitable for 6 applications: Point-to-Point Radios, Satellite Communications, Radar Systems, Test and Measurement Equipment, 5G and Millimeter-Wave Infrastructure, Electronic Warfare and Defense.
Point-to-Point Radios
The HMC329A-DIE is ideal for point-to-point radios operating in the 22-38 GHz band. Its wide RF/LO range and high isolation (35 dB LO-to-RF) ensure minimal signal leakage, which is critical for maintaining link quality. The passive design requires no DC bias, simplifying the transceiver architecture. With a conversion loss of 8 dB, system designers can budget for adequate gain in the IF chain. The compact die size (0.87 mm Γ 0.58 mm) allows for integration into compact radio modules, enabling high-density designs for backhaul applications.
Recommended
Satellite Communications
In satellite communication systems, the HMC329A-DIE provides reliable frequency conversion for Ka-band uplinks and downlinks. Its excellent isolation and linearity (IIP3 of 15 dBm) help maintain signal integrity in the presence of strong adjacent channels. The wide IF range (DC to 8 GHz) supports various modulation schemes and data rates. The bare die format is suitable for space-grade hybrid circuits, where size and weight are critical. The passive operation ensures high reliability in the harsh space environment.
Recommended
Radar Systems
The HMC329A-DIE is well-suited for radar systems operating in the Ka-band, such as automotive radar and military surveillance. Its double-balanced architecture provides high isolation between the LO and RF ports, reducing spurious responses that could interfere with target detection. The wide frequency range allows for frequency agility, and the compact die size enables integration into phased-array modules. The passive design ensures low power consumption, which is beneficial for portable or battery-operated radar systems.
Recommended
Test and Measurement Equipment
The HMC329A-DIE is used in test and measurement equipment such as spectrum analyzers and signal generators for frequency conversion in the 22-38 GHz range. Its high isolation and linearity ensure accurate signal analysis and generation. The wide IF bandwidth supports broadband measurements, and the passive design eliminates the need for bias supplies, simplifying instrument design. The bare die format allows for integration into custom test fixtures and modules, providing flexibility for specialized applications.
Recommended
5G and Millimeter-Wave Infrastructure
The HMC329A-DIE is suitable for 5G millimeter-wave infrastructure, particularly for base stations and backhaul links operating in the 24-38 GHz range. Its wideband performance and high isolation are essential for handling multiple carriers and maintaining signal quality. The compact die size enables integration into small-cell and massive MIMO modules. The passive design reduces power consumption, which is critical for energy-efficient network equipment. The excellent linearity (IIP3 of 15 dBm) supports high-order modulation schemes like 256-QAM.
Recommended
Electronic Warfare and Defense
In electronic warfare and defense systems, the HMC329A-DIE provides robust frequency conversion for jamming, surveillance, and communication systems. Its wide frequency range and high isolation are critical for operating in contested electromagnetic environments. The passive design ensures high reliability and low power consumption, which is important for airborne and portable systems. The bare die format allows for integration into custom multi-chip modules, enabling secure and compact designs.
Recommended
Recommended Products Summary
Engineering reference data for HMC329A-DIE β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | HMC329A-SX | HMC329 | HMC329LC3B | HMC329LM3 |
|---|---|---|---|---|---|
| Package | Die (0.87 mm Γ 0.58 mm) | Die (same) | Die (0.85 mm Γ 0.55 mm) | Leadless SMT | SMT Leadless Chip Carrier |
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| RF Frequency Range | 22 GHz to 38 GHz | 22 GHz to 38 GHz | 22 GHz to 38 GHz | 22 GHz to 38 GHz | 22 GHz to 38 GHz |
| Conversion Loss | 8 dB (typical) | 8 dB (typical) | 8 dB (typical) | 8 dB (typical) | 8 dB (typical) |
| LO-to-RF Isolation | 35 dB (typical) | 35 dB (typical) | 35 dB (typical) | 35 dB (typical) | 35 dB (typical) |
| LO-to-IF Isolation | 25 dB (typical) | 25 dB (typical) | 25 dB (typical) | 25 dB (typical) | 25 dB (typical) |
| IIP3 | 15 dBm (typical) | 15 dBm (typical) | 15 dBm (typical) | 15 dBm (typical) | 15 dBm (typical) |
| DC Bias Required | No | No | No | No | No |
Key Differentiators
- Compact die size (vs HMC329LC3B)
- No DC bias required (vs Active mixers)
- High isolation (vs HMC264)
Design Notes
When integrating the HMC329A-DIE, ensure the die is attached to a ground plane with adequate thermal and electrical contact. Use wire bonding with minimal length to reduce parasitic inductance. The RF and LO ports should be matched to 50 ohms using appropriate transmission lines. For optimal performance, place the die in a cavity with proper grounding.
Although the HMC329A-DIE is a passive mixer and dissipates minimal power, proper thermal management is still important. Ensure the die attach material has good thermal conductivity to prevent overheating during operation. The operating temperature range should be verified from the datasheet, as it is not specified in the provided data.
Handle the bare die with extreme care to avoid damage. Use ESD protection and cleanroom conditions. Avoid touching the die surface, as contamination can degrade RF performance. Verify the exact pinout and bonding diagram from the datasheet before assembly, as the pinout is not provided in the available data.
Compliance Information
RoHS and REACH compliance are indicated on the Analog Devices product page. AEC-Q100 is not applicable for this RF component.
