LCMXO3LF-2100C-5BG324C - 2112 LUT MachXO3LF FPGA | Lattice
部品番号: LCMXO3LF-2100C-5BG324C ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $31.2 | $31.20 |
| 10 | $28.5 | $285.00 |
| 100 | $25.8 | $2,580.00 |
| 500 | $22.4 | $11,200.00 |
| 1,000 | $19.1 | $19,100.00 |
LCMXO3LF-2100C-5BG324C 概要
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to implement custom digital circuits using arrays of configurable logic blocks (LUTs), programmable interconnect, and dedicated I/O. FPGAs sit above CPLDs and generic logic ICs in the programmable logic taxonomy, and below ASICs in performance/integration density. The MachXO3 family is positioned as a "simplified control PLD" that bridges the gap between traditional CPLDs and larger FPGAs, targeting glue-logic, bus-bridging, and platform-management applications.
Key features include 2112 LUTs (4-input look-up tables), 75,776 bits of distributed block RAM, embedded user flash memory, support for multiple I/O standards (LVCMOS 1.2/3.6V, LVTTL, LVDS), per-pin pull-up/pull-down control, and dedicated PLL blocks for clock management. The non-volatile Flash configuration cell eliminates the need for external boot memory, enabling instant-on behavior.
The LCMXO3LF architecture uses Lattice's proprietary low-power 40-nm process and embedded memory blocks, achieving sub-100 uA standby current while supporting up to 2112 LUTs. The device integrates hardened I/O buffers, 5K LUTs-equivalent distributed memory, and a 64-bit unique device identifier, simplifying secure provisioning. The 324-ball CABGA package provides 279 usable I/O, making the part well-suited for high-pin-count bridging tasks.
Typical applications include consumer electronics display control, IoT sensor aggregation, industrial control panel bridging, automotive infotainment auxiliary controllers (with the -6/industrial variants), and server/embedded add-in software. The device is also well suited to PCIe endpoint bridging, MIPI bridging, and low-speed protocol adaptation.
When designing with this part, ensure your pinout planning accounts for the dedicated configuration pins and that you use Lattice Diamond Next or Radiant design software for implementation; the development environment supports latches and is freely available from the manufacturer.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: LCMXO3LF-2100C-5BG324C — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
LCMXO3LF-2100C-6BG324C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LCMXO3LF-4300C-5BG324C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LCMXO3LF-1300C-5BG324C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LCMXO3LF-9400C-5BG324C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LCMXO3LF-2100C-5BG324I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LCMXO3LF-2100C-5BG324C 最大定格＆電気的特性
| Series | MachXO3LF |
| Logic Cells / LUTs | 2112 LUTs (4-input) |
| User I/O | 279 |
| Distributed RAM | 75,776 bits |
| Number of I/O Balls | 324 |
| Package Type | CABGA-324 (BG324) |
| Operating Voltage | 2.5V / 3.3V (core) |
| Speed Grade | -5 (low-power) |
| 動作温度 | Commercial (0C to +85C) |
| Maximum Internal Clock Frequency | 127.2 MHz |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
| Configuration Memory | Non-volatile Flash (built-in) |
| Family | MachXO3LF (low-power variant) |
| RoHS ステータス | Compliant |
LCMXO3LF-2100C-5BG324C cabga-324 (bg324) ピン配置ガイド
LCMXO3LF-2100C-5BG324C (cabga-324 (bg324) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: LCMXO3LF-2100C-5BG324C.
詳細は データシート をご参照ください。
主な用途
LCMXO3LF-2100C-5BG324C の用途: 7 件s: Consumer Display Control / Bridge, Industrial Control Panel Glue Logic, IoT Sensor Aggregation Hub, Server Platform Management / BMC Auxiliary, Automotive Infotainment Auxiliary Logic, Test & Measurement Instrumentation, LED Video Wall Driver / Controller.
Consumer Display Control / Bridge
The LCMXO3LF-2100C-5BG324C is well suited to consumer display control applications such as monitor main boards, projector HDMI bridge logic, and TV side-panel controllers. Its 2112 LUTs and 279 user I/O let designers absorb LVDS-to-eDP bridging, scalar/format-conversion glue logic, and backlight PWM control in a single non-volatile device. The instant-on Flash configuration eliminates the boot delay of SRAM FPGAs, ideal for CEC standby and fast-resume behavior. Compared with discrete CPLD clusters, the MachXO3LF reduces PCB area while adding 75,776 bits of distributed RAM for frame-buffer side logic.
おすすめ
Industrial Control Panel Glue Logic
The LCMXO3LF-2100C-5BG324C fits industrial operations as a glue-logic aggregator on control panels, replacing discrete 74-series logic with 2112 LUTs of flexible integration. Its 279 I/O are typically split between multi-bank LVCMOS 1.024V/3.3V signaling for legacy interfaces (parallel MCU, RS-485, SPI peripherals), and the 127.2 MHz max clock supports deterministic real-time response. The commercial-grade -5 speed variant is optimized for low static power in always-on cabinet controllers, and the non-volatile Flash configuration removes the need for a separate boot PROM. For outdoor cabinet deployment, swap to the -I industrial variant.
おすすめ
IoT Sensor Aggregation Hub
The LCMXO3LF-2100C-5BG324C supports IoT applications as a sensor-aggregation hub in smart-building and asset-prediction gateways. Its 2112 LUTs can host I2C/SPI muxing, GPIO expansion, and a soft I2C-to-WiFi-MCU adapter, while 279 I/O accommodate many sensor breakouts. The non-volatile Flash configuration ensures sub-100 ms cold-boot to functional state - critical for power-cycled remote nodes. The low-power -5 speed grade is well matched to battery-backed sensor nodes, and the 75,776-bit distributed RAM supports small frame buffers without external memory. Per-pin pull resistors simplify I2C/SPI bus-keep design.
おすすめ
Server Platform Management / BMC Auxiliary
The LCMXO3LF-2100C-5BG324C is appropriate for server applications as an auxiliary platform-management controller, complementing the BMC with board-level glue logic, POST code latching, and watchdog orchestration. Its 2112 LUTs provide headroom for a soft SMBus master, GPIO expansion, and BIOS-spi muxing, while the 75,776-bit RAM buffers error logs before forwarding to the BMC. The 324-ball CABGA and 279 I/O let designers absorb multiple bus bridges (I2C/SPI/UART) in a single device. The instant-on Flash configuration matches BMC-strap timing in cold-boot paths.
おすすめ
Automotive Infotainment Auxiliary Logic
The LCMXO3LF-2100C-5BG324C works for automotive applications in cabin-head-unit (AEC-Q100 grade would require the -Q suffix, not the -C commercial variant shown here), used in entertainment aux LVHN designs for entertainment aux entertainment aux LCs. As an entertainment aux entertainment aux LC, the LCMXO3LF-2100C-5BG324C delivers entertainment aux LCE for entertainment aux entertainment aux LC systems requiring entertainment aux LC support. Use this part for non-safety cabin domains; for under-hood or chassis deployment select an AEC-Q100-qualified MachXO3 variant.
おすすめ
Test & Measurement Instrumentation
The LCMXO3LF-2100C-5BG324C is well matched to test and measurement applications such as bench-top oscilloscope front-end logic, protocol-analyzer pattern generators, and lab-grade signal-conditioning bridges. Its 2112 LUTs host custom trigger sequencers and protocol decoders, while 75,776 bits of distributed RAM buffer pre-trigger captures. The 279 user I/O let designers expose multiple test points and probe headers. The non-volatile configuration simplifies lab redeployment - swapping the bitstream turns the same PCB into a different test instrument. Commercial temperature grade is sufficient for controlled-lab environments.
おすすめ
LED Video Wall Driver / Controller
The LCMXO3LF-2100C-5BG324C supports LED applications as a video-wall tile driver and refresh controller, replacing discrete driver chains with one programmable device. Its 2112 LUTs handle scan-multiplex timing, brightness-PWM generation, and fault detection, while 75,776 bits of distributed RAM buffer line data before scan-out. The 279 I/O support high-density LED tile interfaces at sub-millisecond refresh. The -5 low-power speed grade helps in always-on video-wall installations; the non-volatile Flash configuration enables instant-on boot of wall tiles.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: LCMXO3LF-2100C-5BG324C — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | LCMXO3LF-2100C-6BG324C | LCMXO3LF-4300C-5BG324C | LCMXO3LF-1300C-5BG324C | LCMXO3LF-9400C-5BG324C |
|---|---|---|---|---|---|
| Package | CABGA-324 (BG324) | CABGA-324 (BG324) - same | CABGA-324 (BG324) - same | CABGA-324 (BG324) - same | CABGA-324 (BG324) - same |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Logic Cells / LUTs | 2112 LUTs | 2112 LUTs | 4300 LUTs | 1300 LUTs | 9400 LUTs |
| User I/O Count | 279 | 279 | 279 | 279 | 279 |
| Speed Grade | -5 (low-power) | -6 (faster) | -5 (low-power) | -5 (low-power) | -5 (low-power) |
| Distributed RAM | 75,776 bits | 75,776 bits | 150,000 bits (est.) | 48,640 bits | 430,000 bits (est.) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial |
| Configuration Memory | Non-volatile Flash | Non-volatile Flash | Non-volatile Flash | Non-volatile Flash | Non-volatile Flash |
主な差別化要因
- Highest-density Lattice drop-in option in BG324 footprint （vs LCMXO3LF-9400C-5BG324C)
- Same package, faster speed grade option （vs LCMXO3LF-2100C-6BG324C)
- Industrial-temperature drop-in variant in same package （vs LCMXO3LF-2100C-5BG324I)
- Mid-density tier balances LUT count and cost （vs LCMXO3LF-4300C-5BG324C)
設計ノート
The 324-ball CABGA package uses 0.15 mm ball pitch (verify against latest manufacturer datasheet revision). Per IPC-PCB layouts, escape routing requires microvia-in-pad PCB construction (laser-drilled microvias, filled and plated over). Use at least 4 PCB layers with dedicated ground plane under the BGA; signal layers should escape on outer layers only with via-in-pad stitching to inner ground. A 0.5 oz copper pour on the top layer under the BGA improves thermal dissipation.
Estimated: at 50 MHz toggle rate on 50% of I/O, the MachXO3LF-2100C dissipates approximately 0.5-1 W. The CABGA-324 package has theta-JA of approximately 25-30 C/W on a 4-layer JEDEC test board (verify in latest datasheet revision). For commercial-temperature operation (0C to +85C) at 1 W dissipation, junction temperature rises ~25-30 C above ambient, which is acceptable. Above 85C ambient, derate the toggle rate or improve board cooling.
Do not confuse the -5 (low-power speed grade) with the -6 (faster speed grade); the -5 has slower timing but lower standby current. The 324-ball CABGA is not hand-solderable - rework requires BGA reball equipment. Do not use the -C commercial variant for AEC-Q100 or industrial-temperature applications; instead, choose the -I industrial or -Q automotive suffix. Per-pin pull resistors are software-configurable but default to disabled after configuration, so external pull resistors are recommended for unused pins in safety-critical designs.
LVDS outputs require 100-ohm differential termination at the receiver; place the termination as close to the receiver pins as possible. For DDR-style interfaces (LPDDR, DDR3), use matched-length routing (within 25 mil) and dedicated ground-reference layers. Multiple I/O banks allow mixed-voltage signaling (1.2V/1.5V/1.8V/2.5V/3.3V) - consult the bank voltage assignment table before finalizing pinout, since some pins are bank-shared and cannot be mixed-voltage.
コンプライアンス情報
RoHS compliant per Lattice product page; halogen-free per Lattice environmental datasheet. The -C suffix is not AEC-Q100 qualified - choose the -Q suffix for automotive safety-critical applications.
