LCMXO3LF-2100C-5BG324C - 2112 LUT MachXO3LF FPGA | Lattice
N.º da peça: LCMXO3LF-2100C-5BG324C ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $31.2 | $31,20 |
| 10 | $28.5 | $285,00 |
| 100 | $25.8 | $2.580,00 |
| 500 | $22.4 | $11.200,00 |
| 1.000 | $19.1 | $19.100,00 |
LCMXO3LF-2100C-5BG324C Visão geral
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to implement custom digital circuits using arrays of configurable logic blocks (LUTs), programmable interconnect, and dedicated I/O. FPGAs sit above CPLDs and generic logic ICs in the programmable logic taxonomy, and below ASICs in performance/integration density. The MachXO3 family is positioned as a "simplified control PLD" that bridges the gap between traditional CPLDs and larger FPGAs, targeting glue-logic, bus-bridging, and platform-management applications.
Key features include 2112 LUTs (4-input look-up tables), 75,776 bits of distributed block RAM, embedded user flash memory, support for multiple I/O standards (LVCMOS 1.2/3.6V, LVTTL, LVDS), per-pin pull-up/pull-down control, and dedicated PLL blocks for clock management. The non-volatile Flash configuration cell eliminates the need for external boot memory, enabling instant-on behavior.
The LCMXO3LF architecture uses Lattice's proprietary low-power 40-nm process and embedded memory blocks, achieving sub-100 uA standby current while supporting up to 2112 LUTs. The device integrates hardened I/O buffers, 5K LUTs-equivalent distributed memory, and a 64-bit unique device identifier, simplifying secure provisioning. The 324-ball CABGA package provides 279 usable I/O, making the part well-suited for high-pin-count bridging tasks.
Typical applications include consumer electronics display control, IoT sensor aggregation, industrial control panel bridging, automotive infotainment auxiliary controllers (with the -6/industrial variants), and server/embedded add-in software. The device is also well suited to PCIe endpoint bridging, MIPI bridging, and low-speed protocol adaptation.
When designing with this part, ensure your pinout planning accounts for the dedicated configuration pins and that you use Lattice Diamond Next or Radiant design software for implementation; the development environment supports latches and is freely available from the manufacturer.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para LCMXO3LF-2100C-5BG324C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
LCMXO3LF-2100C-6BG324C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO3LF-4300C-5BG324C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO3LF-1300C-5BG324C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO3LF-9400C-5BG324C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO3LF-2100C-5BG324I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO3LF-2100C-5BG324C Classificações máximas e características elétricas
| Series | MachXO3LF |
| Logic Cells / LUTs | 2112 LUTs (4-input) |
| User I/O | 279 |
| Distributed RAM | 75,776 bits |
| Number of I/O Balls | 324 |
| Package Type | CABGA-324 (BG324) |
| Operating Voltage | 2.5V / 3.3V (core) |
| Speed Grade | -5 (low-power) |
| Temperatura de operação | Commercial (0C to +85C) |
| Maximum Internal Clock Frequency | 127.2 MHz |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
| Configuration Memory | Non-volatile Flash (built-in) |
| Family | MachXO3LF (low-power variant) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do LCMXO3LF-2100C-5BG324C cabga-324 (bg324)
Configuração de pinos para LCMXO3LF-2100C-5BG324C (pacote cabga-324 (bg324)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para LCMXO3LF-2100C-5BG324C.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
LCMXO3LF-2100C-5BG324C é adequado para 7 aplicaçãos: Consumer Display Control / Bridge, Industrial Control Panel Glue Logic, IoT Sensor Aggregation Hub, Server Platform Management / BMC Auxiliary, Automotive Infotainment Auxiliary Logic, Test & Measurement Instrumentation, LED Video Wall Driver / Controller.
Consumer Display Control / Bridge
The LCMXO3LF-2100C-5BG324C is well suited to consumer display control applications such as monitor main boards, projector HDMI bridge logic, and TV side-panel controllers. Its 2112 LUTs and 279 user I/O let designers absorb LVDS-to-eDP bridging, scalar/format-conversion glue logic, and backlight PWM control in a single non-volatile device. The instant-on Flash configuration eliminates the boot delay of SRAM FPGAs, ideal for CEC standby and fast-resume behavior. Compared with discrete CPLD clusters, the MachXO3LF reduces PCB area while adding 75,776 bits of distributed RAM for frame-buffer side logic.
Recomendado
Industrial Control Panel Glue Logic
The LCMXO3LF-2100C-5BG324C fits industrial operations as a glue-logic aggregator on control panels, replacing discrete 74-series logic with 2112 LUTs of flexible integration. Its 279 I/O are typically split between multi-bank LVCMOS 1.024V/3.3V signaling for legacy interfaces (parallel MCU, RS-485, SPI peripherals), and the 127.2 MHz max clock supports deterministic real-time response. The commercial-grade -5 speed variant is optimized for low static power in always-on cabinet controllers, and the non-volatile Flash configuration removes the need for a separate boot PROM. For outdoor cabinet deployment, swap to the -I industrial variant.
Recomendado
IoT Sensor Aggregation Hub
The LCMXO3LF-2100C-5BG324C supports IoT applications as a sensor-aggregation hub in smart-building and asset-prediction gateways. Its 2112 LUTs can host I2C/SPI muxing, GPIO expansion, and a soft I2C-to-WiFi-MCU adapter, while 279 I/O accommodate many sensor breakouts. The non-volatile Flash configuration ensures sub-100 ms cold-boot to functional state - critical for power-cycled remote nodes. The low-power -5 speed grade is well matched to battery-backed sensor nodes, and the 75,776-bit distributed RAM supports small frame buffers without external memory. Per-pin pull resistors simplify I2C/SPI bus-keep design.
Recomendado
Server Platform Management / BMC Auxiliary
The LCMXO3LF-2100C-5BG324C is appropriate for server applications as an auxiliary platform-management controller, complementing the BMC with board-level glue logic, POST code latching, and watchdog orchestration. Its 2112 LUTs provide headroom for a soft SMBus master, GPIO expansion, and BIOS-spi muxing, while the 75,776-bit RAM buffers error logs before forwarding to the BMC. The 324-ball CABGA and 279 I/O let designers absorb multiple bus bridges (I2C/SPI/UART) in a single device. The instant-on Flash configuration matches BMC-strap timing in cold-boot paths.
Recomendado
Automotive Infotainment Auxiliary Logic
The LCMXO3LF-2100C-5BG324C works for automotive applications in cabin-head-unit (AEC-Q100 grade would require the -Q suffix, not the -C commercial variant shown here), used in entertainment aux LVHN designs for entertainment aux entertainment aux LCs. As an entertainment aux entertainment aux LC, the LCMXO3LF-2100C-5BG324C delivers entertainment aux LCE for entertainment aux entertainment aux LC systems requiring entertainment aux LC support. Use this part for non-safety cabin domains; for under-hood or chassis deployment select an AEC-Q100-qualified MachXO3 variant.
Recomendado
Test & Measurement Instrumentation
The LCMXO3LF-2100C-5BG324C is well matched to test and measurement applications such as bench-top oscilloscope front-end logic, protocol-analyzer pattern generators, and lab-grade signal-conditioning bridges. Its 2112 LUTs host custom trigger sequencers and protocol decoders, while 75,776 bits of distributed RAM buffer pre-trigger captures. The 279 user I/O let designers expose multiple test points and probe headers. The non-volatile configuration simplifies lab redeployment - swapping the bitstream turns the same PCB into a different test instrument. Commercial temperature grade is sufficient for controlled-lab environments.
Recomendado
LED Video Wall Driver / Controller
The LCMXO3LF-2100C-5BG324C supports LED applications as a video-wall tile driver and refresh controller, replacing discrete driver chains with one programmable device. Its 2112 LUTs handle scan-multiplex timing, brightness-PWM generation, and fault detection, while 75,776 bits of distributed RAM buffer line data before scan-out. The 279 I/O support high-density LED tile interfaces at sub-millisecond refresh. The -5 low-power speed grade helps in always-on video-wall installations; the non-volatile Flash configuration enables instant-on boot of wall tiles.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LCMXO3LF-2100C-5BG324C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LCMXO3LF-2100C-6BG324C | LCMXO3LF-4300C-5BG324C | LCMXO3LF-1300C-5BG324C | LCMXO3LF-9400C-5BG324C |
|---|---|---|---|---|---|
| Package | CABGA-324 (BG324) | CABGA-324 (BG324) - same | CABGA-324 (BG324) - same | CABGA-324 (BG324) - same | CABGA-324 (BG324) - same |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Logic Cells / LUTs | 2112 LUTs | 2112 LUTs | 4300 LUTs | 1300 LUTs | 9400 LUTs |
| User I/O Count | 279 | 279 | 279 | 279 | 279 |
| Speed Grade | -5 (low-power) | -6 (faster) | -5 (low-power) | -5 (low-power) | -5 (low-power) |
| Distributed RAM | 75,776 bits | 75,776 bits | 150,000 bits (est.) | 48,640 bits | 430,000 bits (est.) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial |
| Configuration Memory | Non-volatile Flash | Non-volatile Flash | Non-volatile Flash | Non-volatile Flash | Non-volatile Flash |
Principais diferenciais
- Highest-density Lattice drop-in option in BG324 footprint (vs LCMXO3LF-9400C-5BG324C)
- Same package, faster speed grade option (vs LCMXO3LF-2100C-6BG324C)
- Industrial-temperature drop-in variant in same package (vs LCMXO3LF-2100C-5BG324I)
- Mid-density tier balances LUT count and cost (vs LCMXO3LF-4300C-5BG324C)
Notas de projeto
The 324-ball CABGA package uses 0.15 mm ball pitch (verify against latest manufacturer datasheet revision). Per IPC-PCB layouts, escape routing requires microvia-in-pad PCB construction (laser-drilled microvias, filled and plated over). Use at least 4 PCB layers with dedicated ground plane under the BGA; signal layers should escape on outer layers only with via-in-pad stitching to inner ground. A 0.5 oz copper pour on the top layer under the BGA improves thermal dissipation.
Estimated: at 50 MHz toggle rate on 50% of I/O, the MachXO3LF-2100C dissipates approximately 0.5-1 W. The CABGA-324 package has theta-JA of approximately 25-30 C/W on a 4-layer JEDEC test board (verify in latest datasheet revision). For commercial-temperature operation (0C to +85C) at 1 W dissipation, junction temperature rises ~25-30 C above ambient, which is acceptable. Above 85C ambient, derate the toggle rate or improve board cooling.
Do not confuse the -5 (low-power speed grade) with the -6 (faster speed grade); the -5 has slower timing but lower standby current. The 324-ball CABGA is not hand-solderable - rework requires BGA reball equipment. Do not use the -C commercial variant for AEC-Q100 or industrial-temperature applications; instead, choose the -I industrial or -Q automotive suffix. Per-pin pull resistors are software-configurable but default to disabled after configuration, so external pull resistors are recommended for unused pins in safety-critical designs.
LVDS outputs require 100-ohm differential termination at the receiver; place the termination as close to the receiver pins as possible. For DDR-style interfaces (LPDDR, DDR3), use matched-length routing (within 25 mil) and dedicated ground-reference layers. Multiple I/O banks allow mixed-voltage signaling (1.2V/1.5V/1.8V/2.5V/3.3V) - consult the bank voltage assignment table before finalizing pinout, since some pins are bank-shared and cannot be mixed-voltage.
Informações de conformidade
RoHS compliant per Lattice product page; halogen-free per Lattice environmental datasheet. The -C suffix is not AEC-Q100 qualified - choose the -Q suffix for automotive safety-critical applications.
