LPC1311FHN33,551 - 72MHz Cortex-M3 8KB Flash MCU | NXP
部品番号: LPC1311FHN33,551 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1.68 | $1.68 |
| 10 | $1.52 | $15.20 |
| 100 | $1.38 | $138.00 |
| 500 | $1.3 | $650.00 |
| 1,000 | $1.24 | $1,240.00 |
LPC1311FHN33,551 概要
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory, and peripherals to control electronic systems. The LPC1311FHN33,551 belongs to the LPC13xx family within the broader hierarchy of 32-bit microcontrollers -> embedded processors -> semiconductors, sitting at the entry level of NXP's Cortex-M3 portfolio.
Key features include a 72 MHz Cortex-M3 core with an integrated Nested Vectored Interrupt Controller (NVIC), a Fast-mode plus (Fm+) I2C interface, one UART, four general-purpose timers, up to 28 GPIO pins, and USB device capability available on the wider LPC13xx family. The small 7x7 mm HVQFN-33 package with 0.85 mm height suits space-constrained designs.
The Cortex-M3 core uses a 3-stage pipeline with Thumb-2 instruction set, delivering efficient code density and deterministic interrupt handling. Flash memory is tightly coupled for zero-wait-state execution at full speed, and the supply range of 2.0 V to 3.6 V supports battery-powered operation. Operating temperature spans -40C to +85C per the commercial/industrial grade rating.
Typical applications include consumer electronics control, HID USB peripherals, industrial sensor nodes, home automation, and simple motor or lighting control where 8 kB of code space and low cost are sufficient.
Design consideration: budget code size carefully - 8 kB of flash fills quickly with USB or complex protocol stacks; if more headroom is needed, the pin-compatible LPC1313 (32 kB) in the same HVQFN-33 package is the natural upgrade path.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: LPC1311FHN33,551 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: LPC1311FHN33,551 （同一形状・フットプリント） — 相違点: Flash Memory, Supply Voltage Range.
クイック比較ツール — 並列比較する代替部品を選択:
LPC1311FHN33/01,551
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
LPC1313FHN33/01,55
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LPC1313FHN33,551
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
LPC1343FHN33,551
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
LPC1316FHN33,551
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$0.82 / 個
データシートを見る →LPC1317FHN33,551
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
LPC1311FHN33,551 最大定格＆電気的特性
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Max CPU Frequency | 72 MHz |
| Flash Memory | 8 KB (8K x 8) |
| SRAM | 2 KB |
| Supply Voltage Range | 2 V to 3.6 V |
| I/O Pins | 25 GPIO (up to 28 on family) |
| Communication Interfaces | I2C (Fast-mode plus), UART |
| Timers | 4 x General Purpose Timers |
| Package Type | HVQFN-33 (7 x 7 mm, 0.85 mm height) |
| 実装タイプ | Surface Mount |
| Life Cycle Stage | ACTIVE |
| Program Memory Type | FLASH |
| RoHS ステータス | Compliant (per NXP standard product offering) |
| Supplier Device Package | 32-HVQFN (7x7) |
LPC1311FHN33,551 32-hvqfn (7x7) ピン配置ガイド
LPC1311FHN33,551 (32-hvqfn (7x7) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: LPC1311FHN33,551.
詳細は データシート をご参照ください。
主な用途
LPC1311FHN33,551 の用途: 6 件s: Consumer Electronics Control, Industrial Sensor Nodes, Home Automation and Smart Accessories, Simple Motor and Lighting Control, HMI and Keypad Interface Controllers, USB-Ready Prototype Platform (LPC13xx Family Path).
Consumer Electronics Control
The LPC1311FHN33,551 fits consumer appliance control boards - coffee makers, fans, small pumps, and remote-controlled accessories - where a 72 MHz Cortex-M3 provides far more headroom than 8-bit MCUs at a comparable cost point. With 8 kB flash, a state machine plus UART/I2C handling fits comfortably; its 2 V to 3.6 V supply range allows direct operation from two AA cells or a 3.3 V rail. The 32-pin HVQFN 7x7 mm, 0.85 mm-tall package keeps the controller footprint under 50 mm2 on two-layer consumer PCBs, and 25 GPIO lines handle keypads, LEDs, and relay drivers directly.
おすすめ
Industrial Sensor Nodes
In industrial sensing nodes, the LPC1311FHN33,551 reads analog or digital sensors over its Fast-mode plus I2C bus (up to 1 Mbps for fast sensor polling) and forwards data via UART to a gateway or RS-485 transceiver. The 72 MHz Cortex-M3 executes filtering and simple protocol stacks with deterministic interrupt latency via the NVIC, while the 2 V to 3.6 V input range tolerates battery-backed supply sag. Four general-purpose timers support PWM sensor excitation or capture-based flow measurement, and the -40C to +85C rating covers panel-mounted enclosures in factory environments.
おすすめ
Home Automation and Smart Accessories
The LPC1311FHN33,551 serves smart plugs, dimmers, door/window sensors, and IR remote accessories where communication is I2C or UART based rather than USB. Its 8 kB flash accommodates a lightweight command parser plus RF-module driver; the Fm+ I2C interface talks to NXP peripheral expanders such as the PCF8574 without bus contention at 400 kHz-plus speeds. Low supply voltage operation down to 2 V suits capacitor-backed backup designs, and the compact HVQFN-33 fits wall-plate form factors. Designers needing a wireless stack should pair it with an external RF module over UART rather than expecting the 8 kB flash to host a full stack.
おすすめ
Simple Motor and Lighting Control
With four general-purpose timers capable of PWM output, the LPC1311FHN33,551 drives DC fan controllers, LED dimmers, and small brushed-motor drivers. The 72 MHz core allows fine PWM resolution and closed-loop speed regulation from a tachometer input using timer capture. Its 25 GPIO lines interface directly to gate-driver or MOSFET-driver ICs, and 8 kB flash holds a PI control loop plus fault handling with room to spare. Because the MCU is controller-only, power stages remain external - pair it with a suitable driver for robust switching. The 3.3 V logic levels interface cleanly with standard 3.3 V and 5 V-tolerant driver inputs per datasheet levels.
おすすめ
HMI and Keypad Interface Controllers
The LPC1311FHN33,551 works as a dedicated human-machine-interface controller, scanning matrix keypads, driving segment LCDs or LED indicators, and communicating status to a main processor over UART or I2C. Offloading HMI tasks from a main CPU simplifies firmware architecture and guarantees responsive button handling - the Cortex-M3 NVIC delivers low, deterministic interrupt latency for debouncing at 72 MHz. The 8 kB flash holds a scanner, debounce logic, and command protocol easily, while 25 GPIO lines cover a 5x4 matrix plus status LEDs. The HVQFN-33's small 7x7 mm footprint suits control panels behind displays.
おすすめ
USB-Ready Prototype Platform (LPC13xx Family Path)
Boards laid out with the LPC1311FHN33,551 footprint gain a no-redesign upgrade path to USB-enabled family members such as the LPC1343FHN33,551, which shares the same 32-pin HVQFN (7x7 mm) pinout. Teams can validate non-USB control logic cheaply on the LPC1311 (8 kB flash, about $1.24 at 1000 pieces as of 2026-10-10), then populate the pin-compatible LPC1343 (64 kB flash, USB device support) when HID, CDC, or mass-storage firmware is required. This footprint-first strategy de-risks product roadmaps: one PCB artwork supports both cost-optimized and USB-capable SKUs with only a BOM change.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: LPC1311FHN33,551 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | LPC1311FHN33/01,551 | LPC1313FHN33/01,55 | LPC1343FHN33,551 | LPC1316FHN33,551 |
|---|---|---|---|---|---|
| Package | HVQFN-33 (7x7 mm) | HVQFN-33 (7x7 mm) - same | HVQFN-33 (7x7 mm) - same | HVQFN-33 (7x7 mm) - same | HVQFN-33 (7x7 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Max Frequency | Arm Cortex-M3, 72 MHz | Arm Cortex-M3, 72 MHz | Arm Cortex-M3, 72 MHz | Arm Cortex-M3, 72 MHz | Arm Cortex-M3, 72 MHz |
| Flash Memory | 8 kB | 8 kB | 32 kB | 64 kB | 32 kB |
| SRAM | 2 kB | 2 kB | 8 kB | 8 kB | 8 kB |
| USB Device Support | No | No | No | Yes | No |
| Supply Voltage | 2 V to 3.6 V | 2 V to 3.6 V | 2 V to 3.6 V | 2 V to 3.6 V | 2 V to 3.6 V |
主な差別化要因
- Lowest-cost entry point of the pin-compatible LPC13xx HVQFN-33 family （vs LPC1313FHN33/01,55)
- Smallest firmware footprint requirement （vs LPC1343FHN33,551)
- Drop-in upgrade headroom on an identical PCB （vs LPC1313FHN33/01,55)
設計ノート
Design the 3.3 V rail for the LPC1311FHN33,551 within its 2 V to 3.6 V absolute operating window and place a 100 nF ceramic decoupling capacitor directly across the HVQFN-33 supply pins with a solid ground connection via the exposed die pad. The exposed pad on the 7x7 mm QFN should be soldered to a grounded copper pour - this is both the primary thermal and ground return path. Estimated: even at full 72 MHz activity, family current draw is in the tens of mA range per NXP family documentation, so a small LDO suffices; verify exact figures in the official datasheet power chapter.
Plan your flash budget before committing to the LPC1311: 8 kB of flash and 2 kB of SRAM fill quickly once you add a UART command parser, I2C driver, and any protocol formatting. Enable compiler optimization (-Os) and avoid floating-point formatting libraries. If your firmware risks outgrowing the part, lay out the PCB for the pin-compatible LPC1313FHN33/01,55 (32 kB flash / 8 kB SRAM) from day one - the footprints are identical, so the upgrade is a pure BOM change with no respin.
For the HVQFN-33 (0.5 mm lead pitch, 7x7 mm), specify a PCB footprint per the NXP datasheet recommended land pattern and use solder paste on all 32 lands plus the exposed pad - undersized paste on the die pad causes voids and poor grounding. Route SWDIO/SWCLK (serial wire debug) to a 2x5 or Tag-Connect footprint even in production boards; in-circuit flash programming and field debugging depend on it. Keep the crystal (if used) within a few millimeters of the oscillator pins with short guard traces to ground.
コンプライアンス情報
RoHS compliant per NXP standard product offering; ,551 ordering suffix denotes standard packing. Detailed REACH/halogen declarations should be confirmed via NXP's official compliance portal.
