LPC1857JBD208 - 180MHz Cortex-M3 1MB MCU | NXP
部品番号: LPC1857JBD208 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $17.5451 | $17.55 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
LPC1857JBD208 概要
A microcontroller is a programmable integrated circuit that combines a processor core, memory, and peripherals in one device. The LPC1857 belongs to the microcontroller hierarchy: Cortex-M3 processor, embedded MCU, embedded semiconductor, and system-on-chip component. Its integrated peripherals reduce external component count while supporting communications, display, storage, timing, and industrial-control designs.
Key features include the Arm Cortex-M3 core, up to 180 MHz operation, 1 MB flash, 136 kB SRAM, two HS USB ports, Ethernet connectivity, and LCD support. The large 208-pin LQFP package provides extensive I/O access and is appropriate for designs requiring many external peripherals, parallel interfaces, or mixed-signal connections. The LPC1857 family also provides low-power operation and enhanced debug support according to the manufacturer product description.
The LPC1857JBD208 is targeted at industrial equipment, networking appliances, human-machine interfaces, data acquisition, communications infrastructure, and embedded control platforms. Its combination of high CPU frequency, substantial memory, and multiple communication interfaces supports protocol processing, user-interface control, data logging, and supervisory control tasks. The LCD controller is useful for local graphical or character-based operator displays.
A key design consideration is package and firmware planning. The LQFP-208 footprint requires careful high-density PCB layout, exposed thermal behavior must be evaluated against the operating temperature and CPU workload, and firmware must be validated against the exact LPC1857 peripheral set and errata documentation. USB, Ethernet, LCD, and memory interfaces should be checked against the system signal-integrity requirements before release to production.
This page combines the verified NXP product characteristics with distributor pricing references, practical application guidance, and honest replacement limitations. Cross-reference search results identify NXP family options, but they do not establish verified pin-compatible substitutes for this exact 208-pin device; engineers should therefore validate footprint, pinout, memory, peripheral, and firmware compatibility before substitution.
ドロップイン代替品: LPC1857JBD208 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
この製品に利用可能なドロップイン代替品はありません。
代替品をリクエストLPC1857JBD208 最大定格＆電気的特性
| Manufacturer | NXP Semiconductors |
| Processor Core | Arm Cortex-M3 |
| Architecture | 32-bit |
| Maximum CPU Frequency | 180 MHz |
| Flash Memory | 1 MB |
| SRAM | 136 kB |
| Integrated Connectivity | Two high-speed USB interfaces and Ethernet |
| Display Support | LCD controller support |
| パッケージ | 208-LQFP |
| Package Dimensions | 28 x 28 mm |
| 実装タイプ | Surface Mount |
| ライフサイクル状態 | Active |
| Core Pipeline | 3-stage pipeline |
| Debug Support | Enhanced debug features |
| Low-Power Features | Low-power operation |
LPC1857JBD208 28 x 28 mm ピン配置ガイド
LPC1857JBD208 (28 x 28 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: LPC1857JBD208.
詳細は データシート をご参照ください。
主な用途
LPC1857JBD208 の用途: 6 件s: Industrial Networking Gateway, Human-Machine Interface Controller, USB-Cenabled Data Acquisition, Industrial Data Logger, Communications Equipment, Embedded Control System.
Industrial Networking Gateway
The LPC1857JBD208 suits industrial gateways that need a 180 MHz Arm Cortex-M3 core, 1 MB flash, 136 kB SRAM, Ethernet, and two high-speed USB interfaces. Its integrated connectivity allows protocol handling, management, logging, and service connectivity to coexist in one device. The 208-pin LQFP package exposes a broad peripheral set for external transceivers, status indicators, storage, and diagnostics. Engineers should verify Ethernet physical-layer components, connector routing, and firmware support for the specific network protocol before production.
おすすめ
Human-Machine Interface Controller
The LPC1857JBD208 can act as a local operator-interface controller because it combines a high-performance Cortex-M3 core, LCD support, substantial flash, and SRAM. It is suitable for panel controllers that manage display updates, key input, alarms, logging, and configuration storage. The 180 MHz operating capability provides headroom for graphical or protocol-intensive front ends, while the large LQFP-208 package provides many I/O options. Display timing, contrast, backlight control, and touch or keypad integration must be verified against the exact board design.
おすすめ
USB-Cenabled Data Acquisition
The LPC1857JBD208 is appropriate for data-acquisition equipment requiring two high-speed USB interfaces and 1 MB of flash for firmware and configuration storage. It can coordinate sensor acquisition, data buffering in 136 kB SRAM, USB enumeration, and host-side transfer functions. Its 180 MHz Cortex-M3 core helps separate interrupt handling from application processing. The actual signal chain remains application-specific, so analog front-end accuracy, USB connector protection, grounding, and firmware timing should be evaluated during schematic review.
おすすめ
Industrial Data Logger
The LPC1857JBD208 provides enough flash and SRAM for embedded logging systems that must buffer records and communicate through USB or Ethernet. The 1 MB flash supports firmware, configuration, and application data, while 136 kB SRAM can absorb working buffers and protocol state. Its integrated communications reduce the need for separate interface controllers in compact equipment. Storage endurance, write-cycle strategy, data integrity, and power-fail behavior must be designed explicitly rather than inferred from the controller specifications.
おすすめ
Communications Equipment
The LPC1857JBD208 fits communications equipment requiring real-time control, multiple external interfaces, and flexible firmware storage. The Cortex-M3 core operates up to 180 MHz, allowing protocol stacks and supervisory logic to run alongside USB and Ethernet-related tasks. The LQFP-208 package is useful when the design requires extensive discrete I/O rather than a compact leadless package. Developers should review timing margins, interrupt priorities, peripheral pin multiplexing, and the NXP errata material before freezing the firmware release.
おすすめ
Embedded Control System
The LPC1857JBD208 can serve as the central controller in a complex embedded system requiring deterministic control logic, local networking, USB service access, and configurable display behavior. Its 1 MB flash and 136 kB SRAM provide room for application code, protocol parameters, diagnostics, and working buffers. The 208-pin LQFP package offers more routing flexibility than smaller MCUs. Power sequencing, watchdog behavior, brownout handling, and thermal performance must be verified with the system-level operating conditions.
おすすめ
おすすめ製品の概要
この製品に関するFAQはありません。
エンジニアリング参考データ: LPC1857JBD208 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | LPC1833JET256 | LPC1833JBD144E | LPC1833JBD144 | LPC1519JBD64E | LPC1517JBD64E |
|---|---|---|---|---|---|---|
| Package | 208-LQFP | LQFP-256 | LQFP-144 | LQFP-144 | LQFP-64 | LQFP-64 |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Drop-In Compatibility | Target footprint | No verified same-package substitute | No verified same-package substitute | No verified same-package substitute | No verified same-package substitute | No verified same-package substitute |
主な差別化要因
- High-performance Cortex-M3 integration （vs LPC1833JBD144E)
- Broad integrated connectivity （vs LPC1833JET256)
- 208-pin package for extensive I/O （vs LPC1833JBD144)
- Substantial integrated memory （vs LPC1519JBD64E)
設計ノート
The LPC1857JBD208 uses a 208-pin LQFP footprint, so verify every pin against the NXP datasheet before routing. Confirm the exact exposed-pad or thermal-pad treatment recommended for the selected package, maintain adequate solder-mask and paste control, and inspect fine-pitch leads after assembly. Because the part has many I/O pins, separate high-speed or sensitive signals from noisy power and switching paths.
Validate the LPC1857 core, I/O, and peripheral supply rails against the device datasheet and the system power budget. Provide local decoupling close to the supply and ground pins, and confirm startup sequencing for all externally powered peripherals. The verified web data does not provide the complete supply-voltage or current limits, so these values must be obtained from the official datasheet rather than inferred.
Evaluate thermal performance under the maximum intended CPU and peripheral workload. The LQFP-208 package has many leads that help distribute heat, but board copper, airflow, ambient temperature, and power consumption still determine junction temperature. Use the manufacturer thermal data and application-specific power measurements when sizing copper areas or considering a thermal strategy.
For Ethernet, USB, LCD, or external memory connections, follow the NXP recommended layout and termination requirements. Keep clocks and high-speed differential or impedance-sensitive traces away from noisy switching nodes, use continuous reference planes where appropriate, and validate signal integrity with the target cable, connector, and load. The integrated interface availability does not eliminate external PHY, protection, and routing requirements.
Do not assume that another NXP Cortex-M3 MCU is a drop-in replacement merely because the core family is similar. Confirm package pin count, pin multiplexing, memory size, peripheral availability, clock configuration, voltage requirements, and boot behavior. The verified alternatives in this record use different LQFP package sizes and are therefore not same-footprint drop-ins.
コンプライアンス情報
The verified manufacturer page states that the part is active, but the supplied data does not provide RoHS, REACH, lead-free, halogen-free, or conflict-minerals declarations.
