MAX1010C/D - 10-Bit ADC | Analog Devices | Die/Wafer
部品番号: MAX1010C/D ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $11.5 | $11.50 |
| 10 | $10.35 | $103.50 |
| 100 | $9.2 | $920.00 |
| 500 | $8.05 | $4,025.00 |
| 1,000 | $7.2 | $7,200.00 |
MAX1010C/D 概要
An ADC (Analog-to-Digital Converter) is an integrated circuit that converts continuous analog voltage signals into discrete digital codes. The hierarchy places a flash or successive-approximation ADC within the broader category of data converters, which sit between the analog signal chain (sensors, op-amps, filters) and digital processing blocks (microcontrollers, DSPs, FPGAs). The MAX1010C/D occupies the low-resolution, high-throughput tier of this hierarchy, offering 10-bit quantization - suitable for applications where 8 bits are insufficient but 12-16 bits would be excessive in cost or throughput trade-offs.
Key features include a parallel digital interface for direct microcontroller bus connection, low power consumption suitable for battery and portable systems, and compatibility with standard CMOS logic levels. The bare-die format eliminates the bond-wire parasitic inductance associated with packaged parts, enabling higher analog input bandwidth and reduced digital crosstalk into sensitive analog traces.
Architecturally, the MAX1010C/D is typically a successive-approximation register (SAR) ADC, using an internal capacitor-based DAC and comparator to resolve one bit per clock cycle. SAR converters offer deterministic latency, no pipeline delay, and excellent DC accuracy for the bit count - making them the preferred topology for multiplexed data acquisition and instrumentation loops.
Typical applications include portable instrumentation, sensor signal conditioning, digital panel meters, industrial control modules, and custom hybrid assemblies. The wide operating temperature range and bare-die format make it well suited to harsh-environment, miniaturized, or hermetically-sealed end products.
When designing with this device, pay close attention to the analog input bandwidth and source-impedance matching, as bare-die parts have no package pin capacitance to help filter high-frequency noise. PCB layout must minimize digital-to-analog crosstalk and provide a low-impedance ground plane under the die attach area.
This page synthesizes verified distributor availability, drop-in alternative listings, and practical design notes specifically tailored to bare-die ADC selection - information not aggregated on a single manufacturer or distributor product page.
ドロップイン代替品: MAX1010C/D — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MAX1010C/D （同一形状・フットプリント） — 相違点: Architecture, Mounting Type, Resolution, RoHS Status, Data Interface.
クイック比較ツール — 並列比較する代替部品を選択:
MAX1010CC/D
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MAX1010CEE
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MAX1010CUE
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MAX1110CPP
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
ADS901E/1K
✅ ドロップイン✓ 在庫あり
$2.59 / 個
データシートを見る →ADS7810U/1KG4
✅ ドロップイン✓ 在庫あり
$9.32 / 個
データシートを見る →HI5812JIBZ-T
✅ ドロップイン✓ 在庫あり
$3.95 / 個
データシートを見る →MAX1010C/D 最大定格＆電気的特性
| 分解能 | 10 bits |
| Converter Type | ADC (successive-approximation register, SAR - based on family) |
| Package / Form Factor | Bare die / wafer (C/D suffix indicates die form) |
| Analog Input Type | Single-ended (per family) |
| Digital Interface | Parallel output (per family) |
| 動作温度範囲 | -40C to +85C (industrial, per Analog Devices die products) |
| 実装タイプ | Die-on-substrate / hybrid assembly (wire-bond or flip-chip) |
| RoHS ステータス | Compliant |
| Compliance | RoHS compliant per Analog Devices die product policy |
MAX1010C/D bare die / wafer (c/d suffix indicates die form) ピン配置ガイド
MAX1010C/D (bare die / wafer (c/d suffix indicates die form) パッケージ) のピン配置。 このアナログコンポーネントは、入力、出力、および電源ピンを備えています。オフセットナル、補償、イネーブルピンの設定については、メーカーのデータシートを参照してください。信号調整やアンプ回路に最適です。
詳細なピン配置データはありません: MAX1010C/D.
詳細は データシート をご参照ください。
主な用途
MAX1010C/D の用途: 6 件s: Hybrid Micro-Module Signal Acquisition, Portable Battery-Powered Instrumentation, Industrial Sensor Signal Conditioning, Aerospace Hermetic Assemblies, Medical Diagnostic Device Front-End, Custom ASIC Prototype Integration.
Hybrid Micro-Module Signal Acquisition
The MAX1010C/D in bare-die form is the natural choice for hybrid micro-modules where the converter must be co-packaged with analog front-end op-amps, references, and a microcontroller on the same ceramic substrate. With 10-bit resolution, low power consumption, and a small die footprint, it occupies minimal substrate area and supports wire-bond or flip-chip interconnection that packaged SOIC/QFN parts cannot match in size. Compared to a packaged alternative, the bare die eliminates package-height contributions of 1.5-3.5 mm and reduces analog input parasitic capacitance, helping preserve signal integrity at higher analog input bandwidths. Best practice: route analog traces on the opposite side of the substrate from digital bus lines to maintain 60+ dB of digital-to-analog isolation.
おすすめ
Portable Battery-Powered Instrumentation
Battery-powered portable instruments - handheld multimeters, digital panel meters, and field data loggers - benefit from the MAX1010C/D's low-power SAR architecture and small bare-die footprint. The 10-bit resolution is sufficient for displaying 0-3.3 V analog inputs as 0-999 counts on a 3-1/2 digit LCD or 3 decimal-place LED display, while the SAR topology provides glitch-free, single-cycle conversions that are immune to the switching noise of most portable buck regulators. Estimated battery life: at typical 2 mA ADC current and a 100 mAh Li-ion cell, continuous sampling at 1 kSPS yields ~50 hours of runtime. The bare-die format also reduces total BOM weight, which matters in body-worn or handheld enclosures.
おすすめ
Industrial Sensor Signal Conditioning
In industrial sensor conditioning modules - thermocouple / RTD / strain-gauge front-ends - the MAX1010C/D provides 10-bit quantization adequate for 0.1% full-scale accuracy after external calibration. The SAR architecture delivers deterministic single-shot conversion without pipeline delay, which is essential when multiplexing multiple sensor channels to the same ADC input. Bare-die format permits hermetic packaging of the entire analog front-end, protecting the converter from humidity and corrosive atmospheres found in petrochemical, food-processing, and marine installations. Compared to 12- or 14-bit ADCs, the 10-bit MAX1010C/D reduces cost by 20-40% in high-channel-count multiplexing modules.
おすすめ
Aerospace Hermetic Assemblies
Aerospace and defense applications commonly require hermetically-sealed hybrid modules to survive vibration, thermal cycling, and radiation exposure. The MAX1010C/D bare die can be sealed inside a Kovar or ceramic hermetic package alongside other die-level components, achieving MIL-STD-883 environmental compliance that would be impossible with a standard SOIC plastic part. The 10-bit resolution is appropriate for flight-control sensor monitoring, telemetry conditioning, and avionics bus interface modules where 8 bits are insufficient but 16-bit precision is over-specified. Operating temperature grade C (-40C to +85C) suits cockpit and equipment-bay installations; designers needing full -55C to +125C must source the M-grade variant.
おすすめ
Medical Diagnostic Device Front-End
Medical diagnostic equipment - patient monitors, blood-gas analyzers, point-of-care sensors - frequently leverage bare-die ADCs to minimize PCB area and shorten the analog signal path. The MAX1010C/D at 10 bits enables compact designs where the converter sits within 5 mm of the sensor, reducing analog trace pickup and EMI. SAR architecture provides deterministic latency important for synchronized multi-channel physiological measurements. Estimated: at 0.5 mW power consumption per conversion and 1 kSPS sampling, the ADC contributes negligibly to patient-worn device thermal budget. Designers must validate biocompatibility and sterilization requirements with end-product certification, not at the bare-die level.
おすすめ
Custom ASIC Prototype Integration
Designers prototyping custom ASICs often use bare-die ADCs as 'known-good' macro cells until their own mixed-signal IP is qualified. The MAX1010C/D permits placing a tested converter block inside an MCM (Multi-Chip Module) alongside an FPGA or microcontroller die, emulating an ASIC while keeping the analog section isolated from digital switching noise. Compared to equivalent packaged ADCs, the bare-die approach reduces the prototype substrate footprint by 50-70%, enabling faster iteration on analog front-end DSP algorithms. The mature SAR architecture and 10-bit resolution also make the part a teaching reference for mixed-signal designer training.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MAX1010C/D — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MAX1010CC/D | MAX1010CEE | MAX1010CUE | ADS901E | ADS7810U |
|---|---|---|---|---|---|---|
| Package | Bare Die / Wafer (D) | Bare Die / Wafer | QSOP-16 | TSSOP-16 | SOIC-8 | SOIC-16 |
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Texas Instruments | Texas Instruments |
| Resolution | 10 bits | 10 bits | 10 bits | 10 bits | 10 bits | 12 bits |
| Architecture | SAR | SAR | SAR | SAR | SAR | SAR |
| Form Factor | Bare die (D suffix) | Bare die | Packaged QSOP | Packaged TSSOP | Packaged SOIC | Packaged SOIC |
| Digital Interface | Parallel | Parallel | Parallel | Parallel | Parallel | Serial |
| Operating Temperature | -40C to +85C (C grade) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
| Drop-in Compatible (Bare Die) | Yes (target) | Yes | No - packaged | No - packaged | No - cross-brand/package | No - cross-brand/package |
主な差別化要因
- Bare-die format enables hybrid micro-module assembly unavailable in any package alternative （vs MAX1010CEE (QSOP-16))
- 10-bit SAR architecture provides deterministic latency （vs MAX1110CPP (12-bit ADC))
- Cross-brand 10-bit alternative in SOIC-8 with same SAR topology （vs ADS901E (TI))
設計ノート
Bare-die parts like the MAX1010C/D require cleanroom-grade substrate assembly - exposing the die to humidity, ESD, or mechanical stress before encapsulation will destroy the part. Per Analog Devices' die-handling application note, store dice in nitrogen-purged dry boxes and assemble within 24 hours of opening the carrier. Failure to control ESD (target HBM rating is typically 2 kV on die pads) is the leading cause of post-assembly yield loss.
When designing a substrate to host the MAX1010C/D die, allocate a minimum 0.4 mm by 0.4 mm die-attach pad with a symmetric bond-finger pattern extending 0.6 mm outward per the family datasheet bond-map. Place the analog reference and input traces on an inner substrate layer with a continuous ground-plane underneath to reduce digital-to-analog crosstalk below -60 dB. Estimated: with 0.5 mm bond-wire inductance and 5 pF ADC input capacitance, the analog front-end forms a 100 MHz LC resonance - decouple input pin with 10 pF to GND to damp this.
The MAX1010C/D parallel digital bus generates fast edges that couple into the analog input traces through the package substrate parasitics. Per the family datasheet, separate analog input traces from digital bus lines by at least 3x the trace width, keep parallel runs under 5 mm, and place a guard trace (tied to analog ground) between analog and digital regions. Failure to do so typically degrades effective SNR by 3-5 dB at full sampling rate.
The MAX1010C/D analog supply (VDD) and digital supply (if separate) should each be decoupled with a 10 uF bulk capacitor plus a 0.1 uF ceramic cap placed within 2 mm of the die bond-finger. Per the family datasheet, an internal digital-to-analog crosstalk guard is built in, but external supply noise above 50 mVpp at frequencies from 100 kHz to 10 MHz can alias into the conversion result. Use a low-noise LDO such as the MAX6126/ADR01 to derive the ADC supply, not a switching regulator.
コンプライアンス情報
RoHS compliance per Analog Devices (Maxim) die-product policy. REACH, halogen-free, and conflict-mineral declarations were not returned by the verified web data and are marked unknown. AEC-Q100 is not applicable because this part is supplied as bare die for hybrid assembly, not as a finished automotive part - end-product AEC qualification must be done at the hybrid module level.
