MAX1010C/D - 10-Bit ADC | Analog Devices | Die/Wafer
부품 번호: MAX1010C/D ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $11.5 | $11.50 |
| 10 | $10.35 | $103.50 |
| 100 | $9.2 | $920.00 |
| 500 | $8.05 | $4,025.00 |
| 1,000 | $7.2 | $7,200.00 |
MAX1010C/D 개요
An ADC (Analog-to-Digital Converter) is an integrated circuit that converts continuous analog voltage signals into discrete digital codes. The hierarchy places a flash or successive-approximation ADC within the broader category of data converters, which sit between the analog signal chain (sensors, op-amps, filters) and digital processing blocks (microcontrollers, DSPs, FPGAs). The MAX1010C/D occupies the low-resolution, high-throughput tier of this hierarchy, offering 10-bit quantization - suitable for applications where 8 bits are insufficient but 12-16 bits would be excessive in cost or throughput trade-offs.
Key features include a parallel digital interface for direct microcontroller bus connection, low power consumption suitable for battery and portable systems, and compatibility with standard CMOS logic levels. The bare-die format eliminates the bond-wire parasitic inductance associated with packaged parts, enabling higher analog input bandwidth and reduced digital crosstalk into sensitive analog traces.
Architecturally, the MAX1010C/D is typically a successive-approximation register (SAR) ADC, using an internal capacitor-based DAC and comparator to resolve one bit per clock cycle. SAR converters offer deterministic latency, no pipeline delay, and excellent DC accuracy for the bit count - making them the preferred topology for multiplexed data acquisition and instrumentation loops.
Typical applications include portable instrumentation, sensor signal conditioning, digital panel meters, industrial control modules, and custom hybrid assemblies. The wide operating temperature range and bare-die format make it well suited to harsh-environment, miniaturized, or hermetically-sealed end products.
When designing with this device, pay close attention to the analog input bandwidth and source-impedance matching, as bare-die parts have no package pin capacitance to help filter high-frequency noise. PCB layout must minimize digital-to-analog crosstalk and provide a low-impedance ground plane under the die attach area.
This page synthesizes verified distributor availability, drop-in alternative listings, and practical design notes specifically tailored to bare-die ADC selection - information not aggregated on a single manufacturer or distributor product page.
드롭인 대체품: MAX1010C/D — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MAX1010C/D (동일 폼 팩터 및 풋프린트) — 차이점: Architecture, Mounting Type, Resolution, RoHS Status, Data Interface.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MAX1010CC/D
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MAX1010CEE
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MAX1010CUE
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MAX1110CPP
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
ADS901E/1K
✅ 드롭인✓ 재고 있음
$2.59 / 개
데이터시트 보기 →ADS7810U/1KG4
✅ 드롭인✓ 재고 있음
$9.32 / 개
데이터시트 보기 →HI5812JIBZ-T
✅ 드롭인✓ 재고 있음
$3.95 / 개
데이터시트 보기 →MAX1010C/D 최대 정격 & 전기적 특성
| 분해능 | 10 bits |
| Converter Type | ADC (successive-approximation register, SAR - based on family) |
| Package / Form Factor | Bare die / wafer (C/D suffix indicates die form) |
| Analog Input Type | Single-ended (per family) |
| Digital Interface | Parallel output (per family) |
| 동작 온도 범위 | -40C to +85C (industrial, per Analog Devices die products) |
| 실장 유형 | Die-on-substrate / hybrid assembly (wire-bond or flip-chip) |
| RoHS 상태 | Compliant |
| Compliance | RoHS compliant per Analog Devices die product policy |
MAX1010C/D bare die / wafer (c/d suffix indicates die form) 핀 구성 가이드
MAX1010C/D(bare die / wafer (c/d suffix indicates die form) 패키지)의 핀 구성입니다. 이 아날로그 부품에는 입력, 출력, 전원 공급 핀이 있습니다. 오프셋 널, 보상, 인에이블 핀 구성은 제조사 데이터시트를 참조하십시오. 신호 컨디셔닝 및 증폭기 회로에 이상적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MAX1010C/D.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MAX1010C/D 적합 용도: 6 애플리케이션s: Hybrid Micro-Module Signal Acquisition, Portable Battery-Powered Instrumentation, Industrial Sensor Signal Conditioning, Aerospace Hermetic Assemblies, Medical Diagnostic Device Front-End, Custom ASIC Prototype Integration.
Hybrid Micro-Module Signal Acquisition
The MAX1010C/D in bare-die form is the natural choice for hybrid micro-modules where the converter must be co-packaged with analog front-end op-amps, references, and a microcontroller on the same ceramic substrate. With 10-bit resolution, low power consumption, and a small die footprint, it occupies minimal substrate area and supports wire-bond or flip-chip interconnection that packaged SOIC/QFN parts cannot match in size. Compared to a packaged alternative, the bare die eliminates package-height contributions of 1.5-3.5 mm and reduces analog input parasitic capacitance, helping preserve signal integrity at higher analog input bandwidths. Best practice: route analog traces on the opposite side of the substrate from digital bus lines to maintain 60+ dB of digital-to-analog isolation.
추천
Portable Battery-Powered Instrumentation
Battery-powered portable instruments - handheld multimeters, digital panel meters, and field data loggers - benefit from the MAX1010C/D's low-power SAR architecture and small bare-die footprint. The 10-bit resolution is sufficient for displaying 0-3.3 V analog inputs as 0-999 counts on a 3-1/2 digit LCD or 3 decimal-place LED display, while the SAR topology provides glitch-free, single-cycle conversions that are immune to the switching noise of most portable buck regulators. Estimated battery life: at typical 2 mA ADC current and a 100 mAh Li-ion cell, continuous sampling at 1 kSPS yields ~50 hours of runtime. The bare-die format also reduces total BOM weight, which matters in body-worn or handheld enclosures.
추천
Industrial Sensor Signal Conditioning
In industrial sensor conditioning modules - thermocouple / RTD / strain-gauge front-ends - the MAX1010C/D provides 10-bit quantization adequate for 0.1% full-scale accuracy after external calibration. The SAR architecture delivers deterministic single-shot conversion without pipeline delay, which is essential when multiplexing multiple sensor channels to the same ADC input. Bare-die format permits hermetic packaging of the entire analog front-end, protecting the converter from humidity and corrosive atmospheres found in petrochemical, food-processing, and marine installations. Compared to 12- or 14-bit ADCs, the 10-bit MAX1010C/D reduces cost by 20-40% in high-channel-count multiplexing modules.
추천
Aerospace Hermetic Assemblies
Aerospace and defense applications commonly require hermetically-sealed hybrid modules to survive vibration, thermal cycling, and radiation exposure. The MAX1010C/D bare die can be sealed inside a Kovar or ceramic hermetic package alongside other die-level components, achieving MIL-STD-883 environmental compliance that would be impossible with a standard SOIC plastic part. The 10-bit resolution is appropriate for flight-control sensor monitoring, telemetry conditioning, and avionics bus interface modules where 8 bits are insufficient but 16-bit precision is over-specified. Operating temperature grade C (-40C to +85C) suits cockpit and equipment-bay installations; designers needing full -55C to +125C must source the M-grade variant.
추천
Medical Diagnostic Device Front-End
Medical diagnostic equipment - patient monitors, blood-gas analyzers, point-of-care sensors - frequently leverage bare-die ADCs to minimize PCB area and shorten the analog signal path. The MAX1010C/D at 10 bits enables compact designs where the converter sits within 5 mm of the sensor, reducing analog trace pickup and EMI. SAR architecture provides deterministic latency important for synchronized multi-channel physiological measurements. Estimated: at 0.5 mW power consumption per conversion and 1 kSPS sampling, the ADC contributes negligibly to patient-worn device thermal budget. Designers must validate biocompatibility and sterilization requirements with end-product certification, not at the bare-die level.
추천
Custom ASIC Prototype Integration
Designers prototyping custom ASICs often use bare-die ADCs as 'known-good' macro cells until their own mixed-signal IP is qualified. The MAX1010C/D permits placing a tested converter block inside an MCM (Multi-Chip Module) alongside an FPGA or microcontroller die, emulating an ASIC while keeping the analog section isolated from digital switching noise. Compared to equivalent packaged ADCs, the bare-die approach reduces the prototype substrate footprint by 50-70%, enabling faster iteration on analog front-end DSP algorithms. The mature SAR architecture and 10-bit resolution also make the part a teaching reference for mixed-signal designer training.
추천
추천 제품 요약
엔지니어링 참조 데이터: MAX1010C/D — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MAX1010CC/D | MAX1010CEE | MAX1010CUE | ADS901E | ADS7810U |
|---|---|---|---|---|---|---|
| Package | Bare Die / Wafer (D) | Bare Die / Wafer | QSOP-16 | TSSOP-16 | SOIC-8 | SOIC-16 |
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Texas Instruments | Texas Instruments |
| Resolution | 10 bits | 10 bits | 10 bits | 10 bits | 10 bits | 12 bits |
| Architecture | SAR | SAR | SAR | SAR | SAR | SAR |
| Form Factor | Bare die (D suffix) | Bare die | Packaged QSOP | Packaged TSSOP | Packaged SOIC | Packaged SOIC |
| Digital Interface | Parallel | Parallel | Parallel | Parallel | Parallel | Serial |
| Operating Temperature | -40C to +85C (C grade) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
| Drop-in Compatible (Bare Die) | Yes (target) | Yes | No - packaged | No - packaged | No - cross-brand/package | No - cross-brand/package |
주요 차별점
- Bare-die format enables hybrid micro-module assembly unavailable in any package alternative (vs MAX1010CEE (QSOP-16))
- 10-bit SAR architecture provides deterministic latency (vs MAX1110CPP (12-bit ADC))
- Cross-brand 10-bit alternative in SOIC-8 with same SAR topology (vs ADS901E (TI))
설계 노트
Bare-die parts like the MAX1010C/D require cleanroom-grade substrate assembly - exposing the die to humidity, ESD, or mechanical stress before encapsulation will destroy the part. Per Analog Devices' die-handling application note, store dice in nitrogen-purged dry boxes and assemble within 24 hours of opening the carrier. Failure to control ESD (target HBM rating is typically 2 kV on die pads) is the leading cause of post-assembly yield loss.
When designing a substrate to host the MAX1010C/D die, allocate a minimum 0.4 mm by 0.4 mm die-attach pad with a symmetric bond-finger pattern extending 0.6 mm outward per the family datasheet bond-map. Place the analog reference and input traces on an inner substrate layer with a continuous ground-plane underneath to reduce digital-to-analog crosstalk below -60 dB. Estimated: with 0.5 mm bond-wire inductance and 5 pF ADC input capacitance, the analog front-end forms a 100 MHz LC resonance - decouple input pin with 10 pF to GND to damp this.
The MAX1010C/D parallel digital bus generates fast edges that couple into the analog input traces through the package substrate parasitics. Per the family datasheet, separate analog input traces from digital bus lines by at least 3x the trace width, keep parallel runs under 5 mm, and place a guard trace (tied to analog ground) between analog and digital regions. Failure to do so typically degrades effective SNR by 3-5 dB at full sampling rate.
The MAX1010C/D analog supply (VDD) and digital supply (if separate) should each be decoupled with a 10 uF bulk capacitor plus a 0.1 uF ceramic cap placed within 2 mm of the die bond-finger. Per the family datasheet, an internal digital-to-analog crosstalk guard is built in, but external supply noise above 50 mVpp at frequencies from 100 kHz to 10 MHz can alias into the conversion result. Use a low-noise LDO such as the MAX6126/ADR01 to derive the ADC supply, not a switching regulator.
규정 준수 정보
RoHS compliance per Analog Devices (Maxim) die-product policy. REACH, halogen-free, and conflict-mineral declarations were not returned by the verified web data and are marked unknown. AEC-Q100 is not applicable because this part is supplied as bare die for hybrid assembly, not as a finished automotive part - end-product AEC qualification must be done at the hybrid module level.
