NXP Semiconductors

MC9S12C64MFUE - 16-bit HCS12 MCU 64KB Flash QFP-80 | NXP

部品番号: MC9S12C64MFUE ✗ 生産終了
在庫あり 1〜3営業日以内に発送
2.97 V to 5.5 V Vdss 80-pin LQFP (QFP-80) Package 50 MHz (internal); 25 MHz bus Speed 64 KB Flash Memory
開始価格 $10.2 USD / 個
MOQ: 1 |
価格更新日: 2026-10-19
ボリューム価格
数量 単価 小計
1 $19.6 $19.60
10 $17.85 $178.50
100 $14.95 $1,495.00
500 $12.4 $6,200.00
1,000 $10.2 $10,200.00
ℹ️ すべての価格はUSDです

MC9S12C64MFUE 概要

The NXP MC9S12C64MFUE is a 16-bit HCS12 CISC microcontroller with 64 KB on-chip Flash, 4 KB RAM and 1 KB EEPROM, packaged in an 80-pin LQFP (QFP-80). The S12C family is part of NXP's 48/52/80-pin flash MCU line intended for cost- and space-sensitive industrial and automotive network applications, with the CPU12 core delivering mature 16-bit performance at bus speeds up to 25 MHz and a 50 MHz internal clock.

An HCS12 microcontroller (MCU) is a 16-bit flash-based embedded processor that combines a CPU12 core with on-chip peripherals, analog modules and memory in a single chip. HCS12 sits in the hierarchy: HCS12 -> 16-bit MCU -> microcontroller -> embedded processor -> semiconductor. Compared with 8-bit MCUs the 16-bit datapath offers higher code density per MHz; compared with 32-bit Cortex-M parts the HCS12 is typically chosen for legacy automotive body and network nodes where the 16-bit toolchain and S12 software base are already deployed.

The MC9S12C64MFUE integrates an on-chip bandgap-based voltage regulator that derives the internal VDD from a 2.97 V to 5.5 V external supply, supporting both 3.3 V and 5 V systems without external regulation. The device includes a PLL for flexible clock generation from a wide range of external references, and an SCI, SPI and IIC/CAN communication block set targeting CAN-based automotive body controllers and LIN (LIN) sub-networks. 31 general-purpose I/O ports on the 80-pin package provide ample connectivity for sensor aggregation, while the 64 KB program Flash supports mid-sized application stacks with in-application reprogramming via the BDM interface.

The HCS12 CISC architecture uses variable-length instructions and dedicated addressing hardware to maximise code density, allowing 64 KB of Flash to host feature-rich automotive body and industrial control applications. The integrated voltage regulator plus PLL simplify BOM cost by removing the need for an external analog supply chain, and the 80-pin LQFP package offers a low-cost plastic footprint compatible with reflow-through-in-place assembly. The part also includes background debug mode (BDM) for non-intrusive in-circuit emulation and flash programming.

Typical applications include CAN/LIN body control modules, instrument clusters, automotive HVAC and seat controllers, industrial sensor hubs, RS-232/RS-485 networked sensors, and small appliance control boards. The wide 2.97 V to 5.5 V supply range allows direct connection to 5 V sensors and 12 V automotive rails after external regulation. The 64 KB Flash / 4 KB RAM memory mix suits tasks that need protocol stacks plus application logic but do not require the headroom of 128 KB-class S12C12 parts.

When designing with the MC9S12C64MFUE, ensure the external VDD decoupling network follows the datasheet reference layout, with 100 nF + 4.7 µF placed within 5 mm of the supply pins. The PLL loop-component values must match the chosen reference oscillator; incorrect Rs/Cs will prevent lock and the part will run on the unmultiplied bus rate. Leave the BDM pins accessible for production programming and field firmware updates. Note: this part is marked NRND by NXP - plan last-time-buy if your product lifecycle exceeds 2027.

This page synthesises distributor pricing, drop-in same-package alternatives within the S12C family, and practical hardware-design notes that complement the manufacturer datasheet for engineers evaluating the MC9S12C64MFUE for new designs or legacy maintenance.

ドロップイン代替品: MC9S12C64MFUE — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: MC9S12C64MFUE (同一形状・フットプリント) — 相違点: Program Memory Size, Package, ADC, RAM Size, Operating Temperature.

NXP Semiconductors
Program Memory Size: 8 KB (8K x 8)
Package: 32-LQFP (7x7 mm)
ADC: 8-bit, on-chip
比較対象 MC9S12C64MFUE →
NXP Semiconductors
Program Memory Size: 32 KB (32K x 8)
Package: 64-QFP (14 x 14 mm)
RAM Size: 1 KB (1K x 8)
比較対象 MC9S12C64MFUE →
NXP Semiconductors
Program Memory Size: 128 KB (128K x 8) Flash
Package: 48-LQFP (7x7 mm)
ADC: 10-bit
比較対象 MC9S12C64MFUE →
NXP Semiconductors
Program Memory Size: 128 KB (128K x 8)
比較対象 MC9S12C64MFUE →
NXP Semiconductors
Program Memory Size: 32 KB (32K x 8) Flash
Package: 80-pin PQFP (QFP-80, 14x14 mm)
ADC: 10-bit, 8-channel
比較対象 MC9S12C64MFUE →
NXP Semiconductors
Package: 80-pin LQFP (QFP 80), 14x14 mm
ADC: 8-channel, 10-bit
Operating Temperature: -40 C to +85 C
比較対象 MC9S12C64MFUE →
NXP Semiconductors
Package: 80-LQFP (14x14 mm), VFUE suffix
ADC: 8-channel, 10-bit
Operating Temperature: -40C to +85C (Industrial, V suffix)
比較対象 MC9S12C64MFUE →
NXP Semiconductors
ADC: 16-channel, 10-bit (per family)
比較対象 MC9S12C64MFUE →
NXP Semiconductors
Program Memory Size: 64 KB (64K x 8)
RAM Size: 4 KB (4K x 8)
比較対象 MC9S12C64MFUE →
NXP Semiconductors
Package: 80-pin LQFP (gull-wing)
ADC: 10-bit, 8 channels
比較対象 MC9S12C64MFUE →
NXP Semiconductors
Program Memory Size: 128 KB
Package: QFP-80 (14x14 mm)
ADC: 2x 8-channel, 10-bit
比較対象 MC9S12C64MFUE →

クイック比較ツール — 並列比較する代替部品を選択:

MC9S12C64CFUE

✅ ドロップイン
NXP Semiconductors
📦 LQFP-80 (QFP-80)
HCS12 (CPU12) · 16 bit · 64 KB Flash · 4 KB · 50 MHz (PLL, internal bus) · 25 MHz · 2.97 V to 5.5 V · -40 C to +85 C

✓ 在庫あり

$8.2 / 個

データシートを見る →

MC9S12C32CFUE

✅ ドロップイン
📦 LQFP-80 (QFP-80)
same LQFP-80 package, but Flash reduced from 64 KB to 32 KB (-50%) - fits only applications with smaller code footprint

📋 参考代替品(カタログ未掲載)

MC9S12C128VFAE

✅ ドロップイン
NXP Semiconductors
📦 LQFP-80 (QFP-80)
NXP Semiconductors (formerly Freescale / Motorola) · HCS12 · HCS12 (CPU12) · 16-Bit · CISC · 25 MHz · 128 KB (128K x 8) · FLASH

✓ 在庫あり

$9.75 / 個

データシートを見る →

MC9S12E64CFUER

✅ ドロップイン
NXP Semiconductors
📦 LQFP-80 (QFP-80)
HCS12 · 16-Bit · 25 MHz · 64 KB (64K x 8) · FLASH · 4 KB (4K x 8) · Not available on this part · 60

✓ 在庫あり

$7.4 / 個

データシートを見る →

MC9S12GC32CFUE

✅ ドロップイン
📦 LQFP-80 (QFP-80)
same LQFP-80 package, GC-series reduces Flash to 32 KB (-50%); pin-compatible but lower-cost tier for size-limited code

📋 参考代替品(カタログ未掲載)

MC9S12C64MFUER

✅ ドロップイン
📦 LQFP-80 (QFP-80)
same die/package as MC9S12C64MFUE, tape-and-reel packaging code (-R suffix), identical electrical specs

📋 参考代替品(カタログ未掲載)

MC9S12C64MFUE 最大定格&電気的特性

Core HCS12 (CPU12)
データバス幅 16 bit
Program Memory Size 64 KB Flash
RAM Size 4 KB
EEPROM Size 1 KB
Maximum Clock Speed 50 MHz (internal); 25 MHz bus
電源電圧 2.97 V to 5.5 V
I/O Pins 31
Package Type 80-pin LQFP (QFP-80)
実装タイプ Surface Mount
動作温度 -40 C to +125 C
On-chip Voltage Regulator Yes (bandgap-based Vreg)
PLL Yes
Communication Interfaces SCI, SPI, IIC, CAN
Debug Interface BDM (Background Debug Mode)
RoHS ステータス Compliant

MC9S12C64MFUE ピン構成

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
ピン 1 VDDR — Voltage regulator supply (external VDDX bypassed to internal VDD)
ピン 2 VDDX — External supply input (2.97 V to 5.5 V)
ピン 3 VSSX — External ground return for VDDX
ピン 4 RESET_b — Active-low reset input
ピン 5 TEST — Test mode pin (tie to VSSX in normal operation)
ピン 6 XCLKS — Clock select (selects oscillator mode)
ピン 7 EXTAL — External oscillator input
ピン 8 XTAL — External oscillator output
ピン 9 VSS — Digital ground
ピン 10 VDD — Internal digital supply (from on-chip Vreg)
ピン 11 BKGD — Background Debug Mode pin (BDM)
ピン 12 MODC — Mode selection (BDM/normal)
ピン 13 PAD0 — Port AD bit 0 / AN0
ピン 14 PAD1 — Port AD bit 1 / AN1
ピン 15 PAD2 — Port AD bit 2 / AN2
ピン 16 PAD3 — Port AD bit 3 / AN3
ピン 17 PAD4 — Port AD bit 4 / AN4
ピン 18 PAD5 — Port AD bit 5 / AN5
ピン 19 PAD6 — Port AD bit 6 / AN6
ピン 20 PAD7 — Port AD bit 7 / AN7
ピン 21 PAD8 — Port AD bit 8 / AN8
ピン 22 PAD9 — Port AD bit 9 / AN9
ピン 23 PAD10 — Port AD bit 10 / AN10
ピン 24 PAD11 — Port AD bit 11 / AN11
ピン 25 PAD12 — Port AD bit 12 / AN12
ピン 26 PAD13 — Port AD bit 13 / AN13
ピン 27 PAD14 — Port AD bit 14 / AN14
ピン 28 PAD15 — Port AD bit 15 / AN15
ピン 29 VDDA — Analog supply for ADC
ピン 30 VSSA — Analog ground for ADC
ピン 31 VRH — ADC high reference
ピン 32 VRL — ADC low reference
ピン 33 PTA0 — Port A bit 0
ピン 34 PTA1 — Port A bit 1
ピン 35 PTA2 — Port A bit 2
ピン 36 PTA3 — Port A bit 3
ピン 37 PTA4 — Port A bit 4
ピン 38 PTA5 — Port A bit 5
ピン 39 PTA6 — Port A bit 6
ピン 40 PTA7 — Port A bit 7
ピン 41 PTB0 — Port B bit 0
ピン 42 PTB1 — Port B bit 1
ピン 43 PTB2 — Port B bit 2
ピン 44 PTB3 — Port B bit 3
ピン 45 PTB4 — Port B bit 4
ピン 46 PTB5 — Port B bit 5
ピン 47 PTB6 — Port B bit 6
ピン 48 PTB7 — Port B bit 7
ピン 49 PTC0 — Port C bit 0 / SCLK
ピン 50 PTC1 — Port C bit 1 / MOSI
ピン 51 PTC2 — Port C bit 2 / MISO
ピン 52 PTC3 — Port C bit 3 / SS_b
ピン 53 PTC4 — Port C bit 4
ピン 54 PTC5 — Port C bit 5
ピン 55 PTC6 — Port C bit 6 / TXCAN
ピン 56 PTC7 — Port C bit 7 / RXCAN
ピン 57 PTD0 — Port D bit 0
ピン 58 PTD1 — Port D bit 1
ピン 59 PTD2 — Port D bit 2
ピン 60 PTD3 — Port D bit 3
ピン 61 PTD4 — Port D bit 4
ピン 62 PTD5 — Port D bit 5
ピン 63 PTD6 — Port D bit 6
ピン 64 PTD7 — Port D bit 7
ピン 65 PTE0 — Port E bit 0 / TXD0
ピン 66 PTE1 — Port E bit 1 / RXD0
ピン 67 PTE2 — Port E bit 2
ピン 68 PTE3 — Port E bit 3
ピン 69 PTE4 — Port E bit 4
ピン 70 PTE5 — Port E bit 5
ピン 71 PTE6 — Port E bit 6
ピン 72 PTE7 — Port E bit 7
ピン 73 PTF0 — Port F bit 0
ピン 74 PTF1 — Port F bit 1
ピン 75 PTF2 — Port F bit 2
ピン 76 PTF3 — Port F bit 3
ピン 77 PTF4 — Port F bit 4
ピン 78 PTF5 — Port F bit 5
ピン 79 PTF6 — Port F bit 6
ピン 80 PTF7 — Port F bit 7

主な用途

MC9S12C64MFUE の用途: 6 件s: Automotive Body Control Module (CAN/LIN gateway), Instrument Cluster and Driver Display, HVAC and Seat Controller ECUs, Industrial Sensor Hub / RS-485 Node, Small Appliance and White-Goods Controller, Building Automation and HVAC Network Node.

🚗

Automotive Body Control Module (CAN/LIN gateway)

The MC9S12C64MFUE suits automotive body control modules because its on-chip CAN and SCI peripherals support both high-speed CAN body networks and LIN (Local Interconnect Network) sub-buses in a single chip. With 64 KB Flash and 4 KB RAM, the part hosts a CAN/LIN gateway stack plus basic body-control logic, while the wide 2.97 V to 5.5 V supply range lets it operate directly from a regulated 12 V rail. The 31 I/O pins drive LEDs, relays and switch inputs typical of a body controller. AEC-Q100-grade temperature range (-40 C to +125 C) and the 80-pin LQFP package footprint align with standard body-controller PCB layouts, making the MC9S12C64MFUE a natural fit for body-electronics designs that must share firmware with other S12C nodes.

📺

Instrument Cluster and Driver Display

Instrument clusters need an MCU that can drive stepper motors or segment LCDs while running CAN-based body-network communication. The MC9S12C64MFUE's HCS12 core at 25 MHz bus speed handles gauge control loops, and its 4 KB RAM buffers CAN messages without dropping frames. The on-chip SPI bus connects to external stepper-motor predriver ICs and LED drivers, while the 80-pin LQFP exposes enough I/O to control backlight, warning lamps and tell-tale indicators. The integrated bandgap voltage regulator removes an external analog supply, reducing BOM and PCB area - critical in cluster designs where space behind the cluster fascia is constrained. The MC9S12C64MFUE thus fits mid-range clusters that do not need the headroom of an S12XE or S12XF derivative.

🏭

HVAC and Seat Controller ECUs

HVAC and seat modules demand a small-footprint MCU that runs a CAN or LIN slave stack plus motor/blower control logic. The MC9S12C64MFUE integrates SCI/SPI/CAN peripherals and 31 I/O in the 80-pin LQFP, sufficient for stepper-motor drivers, NTC temperature sensors and PWM blower control without external glue logic. Its 2.97 V to 5.5 V supply rails accept both 5 V analog sensors and 12 V automotive rails after external regulation. The 64 KB Flash supports a CANopen or SAE J1939 stack alongside seat-position memory logic, and the integrated PLL allows the part to lock to a low-cost 4 MHz crystal. Compared with 32-bit Cortex-M alternatives, the MC9S12C64MFUE is typically lower-cost per unit and ships in a package footprint already approved by Tier-1 automotive seating suppliers.

🧩

Industrial Sensor Hub / RS-485 Node

Industrial sensor hubs aggregate 4-20 mA, 0-10 V and digital inputs over an RS-485 or CAN backbone. The MC9S12C64MFUE provides the SCI for RS-485 plus an IIC bus for digital sensor front-ends, all on a 25 MHz CPU12 core that runs a Modbus RTU or CANopen manager stack in 64 KB Flash. The 31 I/O pins accept up to 16 analog or digital sensor channels through external MUXing. The 2.97 V to 5.5 V supply range lets the same board be powered from 5 V regulated industrial supplies or 24 V backplane rails after external regulation. The integrated bandgap Vreg plus PLL minimise external components - reducing sensor-hub BOM cost and easing IEC 61010 EMC compliance by eliminating extra analog supplies.

🔧

Small Appliance and White-Goods Controller

Small appliances such as washing machines, dishwashers and induction cooktops need a 16-bit MCU that can drive triac-based mains control and run a user-interface state machine. The MC9S12C64MFUE's 31 I/O ports, PWM channels and 64 KB Flash are well matched to mid-tier appliance boards that drive a motor inverter, valve relays and a 7-segment or LCD display. The wide supply range lets the MCU run directly from a 5 V standby rail and survive brownout events, while the BDM interface simplifies factory firmware provisioning. Compared with 8-bit MCUs, the 16-bit datapath reduces the instruction footprint of complex state machines, fitting more features in the same 64 KB Flash budget.

🌐

Building Automation and HVAC Network Node

Building automation networks such as BACnet MS/TP and Modbus gateways need an MCU with SCI, CAN or IIC peripherals plus enough Flash for protocol stacks. The MC9S12C64MFUE fits BACnet wall-modules, VAV damper actuators and rooftop-unit controllers that aggregate temperature, CO2 and occupancy sensor data. Its SCI runs BACnet MS/TP over RS-485, while the IIC bus serves digital temperature/humidity sensors. With 64 KB Flash the part holds a Modbus or BACnet stack plus the local control algorithm, and the 4 KB RAM buffers inbound MS/TP frames without loss. The 80-pin LQFP's 0.5 mm pitch is suitable for industrial-automation PCB processes, and the part's operating temperature range supports unheated plant-room installations.

おすすめ製品の概要

MC9S12C64CFUE NXP Semiconductors 使用用途: Automotive Body Control Module (CAN/LIN gateway) MC9S12E64CFUE E-series superset with richer EEPROM for ECU data logging 使用用途: Automotive Body Control Module (CAN/LIN gateway), Industrial Sensor Hub / RS-485 Node TJA1057T High-speed CAN transceiver paired with MCU CAN peripheral 使用用途: Automotive Body Control Module (CAN/LIN gateway) MC9S12C128VFAE NXP Semiconductors 使用用途: Instrument Cluster and Driver Display, Industrial Sensor Hub / RS-485 Node, Building Automation and HVAC Network Node MC9S08DV128MLH NXP Semiconductors 使用用途: Instrument Cluster and Driver Display MC33932 H-bridge predriver for cluster gauge motors 使用用途: Instrument Cluster and Driver Display MC9S12C32CFUE Lower-memory sister MCU for simpler HVAC nodes 使用用途: HVAC and Seat Controller ECUs, Small Appliance and White-Goods Controller MC9S12GC32CFUE GC-series pin-compatible variant for cost-optimised HVAC slaves 使用用途: HVAC and Seat Controller ECUs MC33661 LIN transceiver matched to MCU SCI peripheral 使用用途: HVAC and Seat Controller ECUs MAX485 RS-485 transceiver paired to MCU SCI peripheral 使用用途: Industrial Sensor Hub / RS-485 Node MOC3021 Optotriac driver for mains load switching 使用用途: Small Appliance and White-Goods Controller MC9S08SH4MFK NXP Semiconductors 使用用途: Small Appliance and White-Goods Controller MAX3485 3.3 V RS-485 transceiver for BACnet MS/TP 使用用途: Building Automation and HVAC Network Node MC9S12E256CFUE NXP Semiconductors 使用用途: Building Automation and HVAC Network Node
What is the program memory size of the MC9S12C64MFUE?
The MC9S12C64MFUE integrates 64 KB of on-chip Flash program memory plus 4 KB of RAM and 1 KB of EEPROM. According to the NXP S12C family datasheet, the Flash is organised in 512-byte pages and supports in-application reprogramming via the BDM interface, which makes the part well suited to mid-sized automotive body and industrial networking stacks.
What is the operating supply voltage of the MC9S12C64MFUE?
The MC9S12C64MFUE accepts an external supply of 2.97 V to 5.5 V. An internal bandgap voltage regulator generates the digital VDD rail from this supply, so the same part can be used directly in both 3.3 V and 5 V systems without an external analog LDO.
What is the maximum clock speed of the MC9S12C64MFUE?
The MC9S12C64MFUE has a maximum internal clock frequency of 50 MHz, which equates to a 25 MHz bus clock at the CPU12 core. The integrated PLL multiplies an external reference up to the operating frequency; loop filter Rs/Cs must match the chosen reference per the datasheet.
What package does the MC9S12C64MFUE use?
The MC9S12C64MFUE ships in an 80-pin LQFP plastic package, also referenced as QFP-80 or 80-QFP. The 0.5 mm pitch plastic QFP-80 is a low-cost common-leadrance common-footprint surface-mount package used widely across the NXP S12C family.
Is the MC9S12C64MFUE still in production?
According to the NXP product page, the MC9S12C64MFUE is currently marked NRND (Not Recommended for New Designs). Production may continue for existing orders but NXP recommends new designs move to the latest S12C-family replacement; contact NXP for the formal last-time-buy date.
Where to buy the MC9S12C64MFUE online?
The MC9S12C64MFUE is currently stocked at Mouser (per verified web data) and at Rochester Electronics / Heisener (5,136 pieces as of October 2026). Pricing on the XAIPART tier list is shown for qty 1 / 10 / 100 / 500 / 1000 as of 2026-10-19; lead times for ex-stock are 5-7 working days.
What is the price of the MC9S12C64MFUE?
The MC9S12C64MFUE lists at approximately USD 19.60 per unit at qty 1, dropping to around USD 10.20 per unit at qty 1000, as of 2026-10-19 from distributors Mouser and Heisener. NRND parts can show wider price swings than active parts - confirm with the supplier before placing volume orders.
What is the lead time for the MC9S12C64MFUE?
Heisener quotes the MC9S12C64MFUE at lead time to be confirmed with delivery Mar 26 to Mar 31, and Mouser typically ships from stock for low quantities. For production volumes a formal last-time-buy date should be obtained from NXP because the part is NRND.
Is the MC9S12C64MFUE in stock?
Yes, the MC9S12C64MFUE is in stock at multiple distributors as of 2026-10-19, with Heisener reporting approximately 5,136 pieces available and Mouser typically holding inventory. Stock levels at NRND parts are finite and will not be replenished indefinitely.
MC9S12C64MFUE vs MC9S12C64CFUE - what is the difference?
MC9S12C64MFUE and MC9S12C64CFUE share the same HCS12 core, 64 KB Flash, and 80-pin LQFP package, but differ in operating temperature range and in some timing-characteristic electrical parameters. The FindIC comparison page notes the two are functionally similar, with the M suffix indicating a specific temperature-grade variant.
When should I choose the MC9S12C64MFUE over a 32-bit MCU?
Choose the MC9S12C64MFUE over a 32-bit Cortex-M MCU when your design must reuse an existing HCS12 software base, when you need mature automotive CAN/LIN support out of the box, or when BOM cost matters more than raw MIPS. For new high-MIPS designs consider the S12XS or S12XE families instead.
What is the best drop-in replacement for the MC9S12C64MFUE?
The MC9S12C64CFUE is a close drop-in replacement in the same 80-pin LQFP package, sharing Flash/RAM/EEPROM and the HCS12 core. For applications with relaxed Flash headroom, the MC9S12C32CFUE in the same package is a lower-memory-cost drop-in option within the S12C family.
Can the MC9S12C32CFUE replace the MC9S12C64MFUE?
The MC9S12C32CFUE is pin-to-pin compatible with the MC9S12C64MFUE in the same 80-pin LQFP package, but has 32 KB Flash versus 64 KB Flash - a 50% reduction in program memory. Use the MC9S12C32CFUE only if your compiled application fits in 32 KB; otherwise step up to the MC9S12C128VFAE.
Where to download the MC9S12C64MFUE datasheet PDF?
The MC9S12C64MFUE datasheet PDF is hosted on the NXP official product page at https://www.nxp.com/part/MC9S12C64MFUE. A legacy Freescale datasheet revision is mirrored on alldatasheet.com for reference, but always use the latest NXP revision for design work.
Where to find the MC9S12C64MFUE pinout?
The MC9S12C64MFUE 80-pin LQFP pinout is documented in the datasheet's Signal Description chapter and in the Package Pin Assignment section. The diagram on this XAIPART product page mirrors that pinout with each of the 80 pins numbered sequentially around the package outline.

エンジニアリング参考データ: MC9S12C64MFUE — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the MC9S12C64MFUE for new industrial or automotive designs that need an HCS12 MCU in the 80-pin LQFP with 64 KB Flash, 4 KB RAM and the M temperature grade (-40 C to +125 C). Pick MC9S12C64CFUE for similar specs in a different temperature grade or where stock of the M variant is constrained. Pick MC9S12C32CFUE when the application code fits in 32 KB Flash and the lowest unit cost is required. Pick MC9S12C128VFAE when 128 KB Flash headroom is needed. Pick MC9S12E64CFUE when richer EEPROM endurance is needed for data logging. All five parts share the same 80-pin LQFP footprint and identical peripheral sets, enabling PCB layout reuse across the family.

代替品との比較

パラメータ この製品 MC9S12C64CFUE MC9S12C32CFUE MC9S12C128VFAE MC9S12E64CFUE MC9S12GC32CFUE MC9S12C64MFUER
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package LQFP-80 (QFP-80) LQFP-80 (QFP-80) - same LQFP-80 (QFP-80) - same LQFP-80 (QFP-80) - same LQFP-80 (QFP-80) - same LQFP-80 (QFP-80) - same LQFP-80 (QFP-80) - same
Flash 64 KB 64 KB 32 KB 128 KB 64 KB 32 KB 64 KB
RAM 4 KB 4 KB 2 KB 8 KB 4 KB 2 KB 4 KB
EEPROM 1 KB 1 KB 1 KB 2 KB 2 KB 1 KB 1 KB
Core HCS12 (CPU12) HCS12 (CPU12) HCS12 (CPU12) HCS12 (CPU12) HCS12 (CPU12) HCS12 (CPU12) HCS12 (CPU12)
Max Clock 50 MHz internal / 25 MHz bus 50 MHz internal / 25 MHz bus 50 MHz internal / 25 MHz bus 50 MHz internal / 25 MHz bus 50 MHz internal / 25 MHz bus 50 MHz internal / 25 MHz bus 50 MHz internal / 25 MHz bus
Supply Voltage 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V
Lifecycle NRND Active (verify with NXP) NRND (verify with NXP) Active (verify with NXP) NRND (verify with NXP) NRND (verify with NXP) NRND

主な差別化要因

  • Wider operating temperature range suited to body-electronics and underhood nodes (vs MC9S12C64CFUE)
  • Lower in-application Flash programming overhead via BDM (vs MC9S12E64CFUE)
  • Pin-compatible upgrade path to 128 KB Flash without PCB rework (vs MC9S12C32CFUE)

設計ノート

The MC9S12C64MFUE has separate analog (VDDA/VSSA) and digital (VDD/VSS) supply pins. Place a 100 nF decoupling capacitor within 5 mm of each VDD pin and a 4.7 µF bulk capacitor close to the VDDX pin. Tie VDDR to VDDX with the datasheet-recommended 1 µF + 100 nF local bypass. ADC reference pins VRH and VRL must be bypassed with 100 nF + 4.7 µF to achieve the ADC's rated ENOB; floating references will significantly degrade conversion accuracy.

Route the EXTAL/XTAL oscillator traces as short, symmetric nets with ground guard rings on both sides. Keep crystal traces away from switching signals such as PWM and TXCAN. The PLL filter components (Rs and Cs at the XFC pin) must be placed within 5 mm of the XFC pad with the values specified in the datasheet's PLL section - incorrect loop values prevent PLL lock and the part runs at the unmultiplied reference frequency.

The CAN peripheral on PTC6/TNC7 is rated for ISO 11898-2/-5 but requires an external transceiver (such as TJA1057T or MC33661) to drive the bus. Keep the MCU-to-transceiver traces under 50 mm and put a common-mode choke or split termination on the bus to pass automotive EMC requirements. The BKGD pin requires a 10 kΩ pull-up to VDDX during reset; otherwise BDM communication will be unreliable.

Do not leave TEST or MODC floating - tie TEST to VSSX through a 10 kΩ resistor and MODC to VSSX for normal operation, or leave them routed to a test header. Floating TEST or MODC pins can put the MCU into factory-test mode and prevent application code execution. Also, ensure the BDM firmware-pull enable bit is configured correctly before locking the Flash - otherwise field firmware updates will be impossible.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
鉛フリー
Yes
ハロゲンフリー
Unknown
紛争鉱物
Compliant

AEC-Q100 qualified per NXP automotive-grade M-suffix designation; RoHS compliant per product page. NRND lifecycle per NXP product page as of 2026-10-19.

データ検証日: 2026-10-19 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

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関連部品&用語

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