MC9S12E64CPV - 16-bit HCS12 MCU 64KB Flash 112-LQFP | NXP
部品番号: MC9S12E64CPV ✗ 生産終了MC9S12E64CPV 概要
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), working memory (RAM), and programmable peripherals into one package. The HCS12 MCU belongs to the broader 16-bit embedded controller taxonomy, sitting between 8-bit microcontrollers (e.g. HC08, AVR) and 32-bit microcontrollers (e.g. ARM Cortex-M). MCUs are the foundation of embedded systems, used wherever deterministic real-time control, low power, and on-chip integration are required. The HCS12 family specifically targets automotive body controllers, industrial control, and consumer appliances where 16-bit arithmetic throughput and CAN connectivity are required.
Key features of the MC9S12E64CPV include 64 KB (64K x 8) of Flash program memory, 4 KB of on-chip RAM, an internal oscillator eliminating external clock hardware, and 92 programmable I/O pins for flexible peripheral mapping. The device supports 25 MHz bus operation at 5 V (40 ns minimum instruction cycle) and 16 MHz bus operation at 3.3 V (62.5 ns minimum instruction cycle), enabling dual-voltage operation. The wide operating voltage range supports both 5 V legacy industrial designs and 3.3 V low-power systems.
Technically, the HCS12 core employs a 16-bit arithmetic logic unit with enhanced indexed addressing modes and a hardware multiply/accumulate engine. The architecture integrates background debug mode (BDM) for in-circuit programming and debugging without an emulator. The 112-LQFP package provides ample I/O count for body controllers, HVAC modules, and industrial sensor hubs.
Typical applications include automotive body control modules, HVAC controllers, industrial sensor interface boards, and CAN-node endpoints. The 92 I/O count and on-chip CAN-friendly timers make this part well-suited for distributed automotive networks. Design consideration: ensure proper decoupling (0.1 uF plus bulk capacitance) on each VDD/VSS pair, and follow the trace-length guidelines for the external bus interface when expanding memory. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: MC9S12E64CPV — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
MC9S12E128CPV
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC9S12E32CPV
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC9S12E64CFU
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC9S12E64CPV 最大定格＆電気的特性
| Core | HCS12 (16-bit) |
| Program Memory Size | 64 KB (64K x 8) Flash |
| RAM Size | 4 KB (4K x 8) |
| Number of I/O Lines | 92 |
| パッケージ / ケース | 112-LQFP (20x20 mm) |
| Bus Speed (5 V) | 25 MHz (40 ns min cycle) |
| Bus Speed (3.3 V) | 16 MHz (62.5 ns min cycle) |
| Oscillator Type | Internal |
| Operating Voltage | 3.3 V or 5 V |
| 動作温度 | -40C to +85C (industrial) |
| 実装タイプ | Surface Mount |
| Packaging | Tray |
| Instruction Set | 68HC11 opcode-compatible |
| CPU Core | HCS12 |
| Connectivity | SCI/SPI (CAN per family) |
| RoHS ステータス | Compliant |
MC9S12E64CPV 112-lqfp (20x20 mm) ピン配置ガイド
MC9S12E64CPV (112-lqfp (20x20 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MC9S12E64CPV.
詳細は データシート をご参照ください。
主な用途
MC9S12E64CPV の用途: 6 件s: Automotive Body Control Module, HVAC Climate Controller, Industrial Sensor Hub, CAN Node Endpoint, Consumer Appliance Control, Industrial Pump Controller.
Automotive Body Control Module
The MC9S12E64CPV's 92 I/O lines and 64 KB Flash make it well-suited for automotive body control modules managing lighting, door locks, mirror actuators, and wiper controls. The HCS12 core's 25 MHz bus speed at 5 V provides deterministic real-time response for body-electronics tasks, while the 16-bit ALU simplifies sensor fusion for ambient-light and rain sensors. Integrated SCI/SPI peripherals enable communication with door modules and instrument clusters via the vehicle's local interconnect network.
おすすめ
HVAC Climate Controller
HVAC controllers benefit from the MC9S12E64CPV's 92 I/O count to interface with temperature sensors, blower motor drivers, and mode-stepper actuators without external mux ICs. The 4 KB RAM supports lookup-table-based PID control loops, while the 64 KB Flash accommodates blower-ramp profiles and OEM calibration tables. The part's 3.3 V/5 V dual-voltage operation allows direct interface with both legacy analog sensors and modern digital temperature ICs on the same PCB.
おすすめ
Industrial Sensor Hub
The 92 I/O pins on the MC9S12E64CPV allow direct interfacing with multiple analog and digital sensors in industrial sensor hubs, eliminating the need for I/O expander chips. Its 64 KB Flash accommodates protocol stacks for Modbus, CANopen, or proprietary industrial protocols, while the 4 KB RAM is sufficient for buffering sensor data before forwarding to a gateway. The HCS12 core's 68HC11 opcode compatibility eases migration from older industrial designs.
おすすめ
CAN Node Endpoint
In distributed CAN networks, the MC9S12E64CPV serves as an endpoint controller for sensors and actuators reporting to a central gateway. The integrated CAN-compatible timer module (msCAN) supports 1 Mbit/s CAN 2.0B communication when paired with an external transceiver. The 64 KB Flash holds CANopen or DeviceNet stack libraries, while 92 I/O lines interface with motor encoders, limit switches, and valve drivers in machine-automation cells.
おすすめ
Consumer Appliance Control
Washing machines, dishwashers, and ovens use the MC9S12E64CPV to manage motor control, user interfaces, and safety interlocks. The 92 I/O count drives seven-segment displays, keypad matrices, and relay banks directly without external drivers. The HCS12 core's 25 MHz throughput supports real-time motor-control algorithms such as field-oriented control (FOC) for brushless DC motors in modern inverter-based appliances.
おすすめ
Industrial Pump Controller
The MC9S12E64CPV drives variable-speed pump controllers in HVAC and process-control applications. The 16-bit HCS12 ALU executes PID control loops with sufficient precision for flow and pressure regulation, while the 64 KB Flash stores pump-curves, fault logs, and Modbus configuration. The 92 I/O lines interface with flow meters, pressure transducers, and variable-frequency drive enable signals in a single-chip solution.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MC9S12E64CPV — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MC9S12E128CPV | MC9S12E32CPV | MC9S12E64CFU |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) |
| Program Memory (Flash) | 64 KB | 128 KB | 32 KB | 64 KB |
| RAM Size | 4 KB | 4 KB | 2 KB | 4 KB |
| Number of I/O | 92 | 92 | 92 | 92 |
| Bus Speed (max) | 25 MHz at 5 V | 25 MHz at 5 V | 25 MHz at 5 V | 25 MHz at 5 V |
| Core | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) |
| Lifecycle Status | NRND | NRND | NRND | NRND |
主な差別化要因
- Opcode-compatible with 68HC11 legacy code （vs ARM Cortex-M0 MCUs)
- Integrated internal oscillator （vs External-crystal-only competitors)
- 92 I/O pins in single package （vs Smaller-footprint MCUs (64-pin or 80-pin))
設計ノート
Place 0.1 uF decoupling capacitors within 5 mm of each VDD/VSS pin pair on the 112-LQFP package. The HCS12E family draws fast switching transients during Flash programming; bulk decoupling of 10 uF tantalum plus 100 nF ceramic on each power rail is recommended. Per the Freescale/NXP user guide, separate analog (VDDA/VSSA) and digital (VDD/VSS) supplies reduce ADC noise by 10-15 dB.
The 112-LQFP (20x20 mm) package with 0.5 mm pitch requires 4-layer PCB stack-up for reliable assembly. Per IPC-7351 guidelines, allocate at least 0.25 mm clearance between adjacent pads and 0.40 mm pad-to-via clearance. Add a copper pour connected to VSS on the top layer under the device to improve thermal dissipation - the HCS12E family dissipates approximately 0.5-1 W at full bus activity.
Do not exceed 5.5 V on any VDD pin - the HCS12E family's absolute maximum is 6 V for brief transients only. The internal oscillator requires the PLL configuration register (PLLCTL) to be programmed correctly; an unlocked PLL halts the bus clock. When migrating from 68HC11 code, ensure the indexed addressing mode mapping matches HCS12 conventions, particularly for the X register versus Y register usage in legacy code.
The Background Debug Mode (BDM) interface pins (BKGD, RESET) require pull-up resistors per Freescale/NXP recommendations. Place 4.7 kohm pull-ups on BKGD and RESET, and route BDM traces away from high-frequency switching nodes. For CAN bus connections using the integrated msCAN module, keep CANH/CANL traces as a differential pair with 120 ohm characteristic impedance and matched length within 5 mm.
コンプライアンス情報
RoHS and REACH compliant per NXP/Freescale documentation. AEC-Q100 qualification status not explicitly stated in available datasheet excerpts. Lead-free matte-tin plating on 112-LQFP package.
