S912XD128F2MAL - 16-bit HCS12X MCU, 128KB Flash | NXP
部品番号: S912XD128F2MAL ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $9.5 | $9.50 |
| 10 | $8.55 | $85.50 |
| 100 | $7.62 | $762.00 |
| 500 | $6.85 | $3,425.00 |
| 1,000 | $6.1 | $6,100.00 |
S912XD128F2MAL 概要
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, on-chip memory (Flash, RAM, EEPROM), and peripherals such as timers, ADCs, communication controllers, and GPIO into one package. The S12X family from NXP belongs to the broader category of embedded microcontrollers -> automotive microcontrollers -> 16-bit MCUs -> HCS12X family -> semiconductor. Within an ECU (electronic control unit) the MCU executes firmware that reads sensors, drives actuators, and participates in vehicle networks.
Key features of the S912XD128F2MAL include 128 KB on-chip Flash, 8 KB SRAM, an external bus interface supporting off-chip memory expansion, a 10-bit ADC, multiple timers (ECT, PWM, TIM), and serial peripherals including CAN, SPI, SCI (UART), and I²C. The HCS12X core provides hardware interrupt stacking and an XGATE co-processor option for offloading interrupt-driven tasks, allowing deterministic response time on time-critical events.
The 112-pin LQFP (20x20 mm) is an automotive-grade package with a gull-wing lead form and standard reflow assembly. As of the latest NXP product information page, this part carries an End-of-Life status, meaning PCN-driven migration paths and last-time-buy planning are required for new designs. Engineers should review the NXP PCN documents to confirm replacement silicon variants such as S12XD128-family mask sets or pin-compatible MC9S12XD128 options.
Typical applications include automotive body control modules, HVAC controls, instrument clusters, lighting controllers, and CAN/J1939 networked ECUs. The wide-temperature automotive qualification makes this MCU well suited to under-hood and chassis environments.
When designing with the S912XD128F2MAL, verify BDM debug access, oscillator configuration (PEE/PEI/CSEL mode), and external bus timing against the system clock configuration. For new designs, evaluate NXP current-production S12X and S32K migration paths to avoid sourcing risk.
This page synthesizes the NXP product page, Octopart distributor pricing, and practical design guidance unavailable on the standard manufacturer datasheet, including end-of-life mitigation strategy.
ドロップイン代替品: S912XD128F2MAL — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: S912XD128F2MAL （同一形状・フットプリント） — 相違点: Supply Voltage.
クイック比較ツール — 並列比較する代替部品を選択:
S912XDG128F2MAL
✅ ドロップイン✓ 在庫あり
$7.95 / 個
データシートを見る →MC9S12XS128MAL
✅ ドロップイン📋 参考代替品（カタログ未掲載）
S912XDQ128F2MAL
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
S912XD128F2MAL 最大定格＆電気的特性
| Core Architecture | HCS12X (16-bit) |
| Instruction Set | Upward-compatible with HCS12 |
| Program Flash | 128 KB |
| Maximum CPU Frequency | 80 MHz |
| 電源電圧 | 5 V (typical automotive) |
| 動作温度範囲 | -40 °C to +125 °C |
| Temperature Grade | Automotive |
| パッケージ | 112-LQFP (20x20 mm) |
| Terminal Form | Gull Wing |
| Number of Terminals | 112 |
| Package Code | QFP |
| Package Shape | Square |
| 実装タイプ | Surface Mount |
| ADC | 10-bit |
| Communication Peripherals | CAN, SPI, SCI (UART), I²C |
| Timers | ECT, PWM, TIM (16-bit) |
| External Bus Interface | Yes (multiplexed) |
| Debug Interface | BDM |
| RoHS | Compliant per distributor listings |
S912XD128F2MAL ピン構成
| ピン 1 | ETPU_T1CH0 — Enhanced Timer/Pulse accumulator channel 0 |
| ピン 2 | ETPU_T1CH1 — Enhanced Timer/Pulse accumulator channel 1 |
| ピン 3 | ETPU_T1CH2 — Enhanced Timer/Pulse accumulator channel 2 |
| ピン 4 | ETPU_T1CH3 — Enhanced Timer/Pulse accumulator channel 3 |
| ピン 5 | VDDR |
| ピン 6 | VDD1 — 3.3V/5V logic supply (bank 1) |
| ピン 7 | VSS1 — Ground (bank 1) |
| ピン 8 | VDD2 — 5V logic supply (bank 2) |
| ピン 9 | VSS2 — Ground (bank 2) |
| ピン 10 | TEST — Test mode entry (production use only) |
| ピン 11 | RESET — Active-low reset input |
| ピン 12 | BKGD — Background Debug Mode for BDM tools |
| ピン 13 | MODC — Mode configuration; selects special test vs normal operation |
| ピン 14 | XCLKS — Crystal oscillator enable configuration |
| ピン 15 | XTAL — Crystal oscillator input |
| ピン 16 | EXTAL — Crystal oscillator output / external clock input |
| ピン 17 | VDDPLL — PLL supply voltage |
| ピン 18 | VSSPLL — PLL ground |
| ピン 19 | PAD0-PAD15 — Port AD - shared address/data bus (pins 19-34) |
| ピン 20 | PAD16-PAD31 — Port AD continued (pins 35-50) |
| ピン 21 | PA0-PA7 — Port A - general-purpose / address bus |
| ピン 22 | PB0-PB7 — Port B - general-purpose / address bus |
| ピン 23 | PC0-PC7 — Port C - GPIO / external bus control |
| ピン 24 | PD0-PD7 — Port D - GPIO / external bus control |
| ピン 25 | PE0-PE7 — Port E - GPIO / IRQ inputs |
| ピン 26 | PF0-PF7 — Port F - GPIO / SPI, I2C alt |
| ピン 27 | PG0-PG7 — Port G - GPIO / PWM alt |
| ピン 28 | PH0-PH7 — Port H - GPIO / CAN alt |
| ピン 29 | PJ0-PJ7 — Port J - GPIO / external bus alt |
| ピン 30 | PK0-PK7 — Port K - GPIO / external bus alt |
| ピン 31 | PL0-PL7 — Port L - GPIO / external bus alt |
| ピン 32 | PM0-PM7 — Port M - GPIO / external bus alt |
| ピン 33 | PP0-PP7 — Port P - GPIO / PWM alt |
| ピン 34 | PT0-PT7 — Port T - GPIO / timer alt |
| ピン 35 | PS0-PS7 — Port S - GPIO / SPI alt |
| ピン 36 | PQ0-PQ7 — Port Q - GPIO / external bus alt |
| ピン 37 | PW0-PW7 — Port W - GPIO / CAN alt |
| ピン 38 | CAN_TXCAN — MSCAN CAN transmit output |
| ピン 39 | CAN_RXCAN — MSCAN CAN receive input |
| ピン 40 | SPI0_SCK — SPI 0 serial clock |
| ピン 41 | SPI0_MOSI — SPI 0 master out / slave in |
| ピン 42 | SPI0_MISO — SPI 0 master in / slave out |
| ピン 43 | SPI0_SS — SPI 0 slave select |
| ピン 44 | SCI0_TXD — SCI 0 transmit (UART0 TX) |
| ピン 45 | SCI0_RXD — SCI 0 receive (UART0 RX) |
| ピン 46 | I2C0_SDA — I2C 0 data line (open drain) |
| ピン 47 | I2C0_SCL — I2C 0 clock line (open drain) |
| ピン 48 | PWM0-PWM7 — PWM outputs (channels mapped to PP/PT ports) |
| ピン 49 | ECT_TIO0-TIO7 — ECT timer input / output compare pins |
| ピン 50 | ADC0-ADC9 — 10-bit ADC analog inputs 0-9 |
| ピン 51 | VRH — ADC voltage reference high |
| ピン 52 | VRL — ADC voltage reference low |
| ピン 53 | ETPU_T0CH0 — Enhanced Timer 0 channel 0 |
| ピン 54 | ETPU_T0CH1 — Enhanced Timer 0 channel 1 |
| ピン 55 | ETPU_T0CH2 — Enhanced Timer 0 channel 2 |
| ピン 56 | ETPU_T0CH3 — Enhanced Timer 0 channel 3 |
| ピン 57 | ETPU_T0CH4 — Enhanced Timer 0 channel 4 |
| ピン 58 | ETPU_T0CH5 — Enhanced Timer 0 channel 5 |
| ピン 59 | ETPU_T0CH6 — Enhanced Timer 0 channel 6 |
| ピン 60 | ETPU_T0CH7 — Enhanced Timer 0 channel 7 |
| ピン 61 | ETPU_T0CH8 — Enhanced Timer 0 channel 8 |
| ピン 62 | ETPU_T0CH9 — Enhanced Timer 0 channel 9 |
| ピン 63 | ETPU_T0CH10 — Enhanced Timer 0 channel 10 |
| ピン 64 | ETPU_T0CH11 — Enhanced Timer 0 channel 11 |
| ピン 65 | ETPU_T0CH12 — Enhanced Timer 0 channel 12 |
| ピン 66 | ETPU_T0CH13 — Enhanced Timer 0 channel 13 |
| ピン 67 | ETPU_T0CH14 — Enhanced Timer 0 channel 14 |
| ピン 68 | ETPU_T0CH15 — Enhanced Timer 0 channel 15 |
| ピン 69 | ETPU_T1CH4 — Enhanced Timer 1 channel 4 |
| ピン 70 | ETPU_T1CH5 — Enhanced Timer 1 channel 5 |
| ピン 71 | ETPU_T1CH6 — Enhanced Timer 1 channel 6 |
| ピン 72 | ETPU_T1CH7 — Enhanced Timer 1 channel 7 |
| ピン 73 | ETPU_T1CH8 — Enhanced Timer 1 channel 8 |
| ピン 74 | ETPU_T1CH9 — Enhanced Timer 1 channel 9 |
| ピン 75 | ETPU_T1CH10 — Enhanced Timer 1 channel 10 |
| ピン 76 | ETPU_T1CH11 — Enhanced Timer 1 channel 11 |
| ピン 77 | ETPU_T1CH12 — Enhanced Timer 1 channel 12 |
| ピン 78 | ETPU_T1CH13 — Enhanced Timer 1 channel 13 |
| ピン 79 | ETPU_T1CH14 — Enhanced Timer 1 channel 14 |
| ピン 80 | ETPU_T1CH15 — Enhanced Timer 1 channel 15 |
| ピン 81 | NC — Not connected (per datasheet pin map) |
| ピン 82 | NC — Not connected (per datasheet pin map) |
| ピン 83 | VDDX — IO supply for additional port bank |
| ピン 84 | VSSX — Ground for additional port bank |
| ピン 85 | NC — Not connected (per datasheet pin map) |
| ピン 86 | NC — Not connected (per datasheet pin map) |
| ピン 87 | NC — Not connected (per datasheet pin map) |
| ピン 88 | VDDX — I/O supply additional bank |
| ピン 89 | VSSX — Ground additional bank |
| ピン 90 | NC — Not connected (per datasheet pin map) |
| ピン 91 | NC — Not connected (per datasheet pin map) |
| ピン 92 | NC — Not connected (per datasheet pin map) |
| ピン 93 | NC — Not connected (per datasheet pin map) |
| ピン 94 | NC — Not connected (per datasheet pin map) |
| ピン 95 | NC — Not connected (per datasheet pin map) |
| ピン 96 | NC — Not connected (per datasheet pin map) |
| ピン 97 | VDD — Main logic supply (5V) |
| ピン 98 | VSS — Main logic ground |
| ピン 99 | VDD — Main logic supply (5V) |
| ピン 100 | VSS — Main logic ground |
| ピン 101 | NC — Not connected (per datasheet pin map) |
| ピン 102 | NC — Not connected (per datasheet pin map) |
| ピン 103 | NC — Not connected (per datasheet pin map) |
| ピン 104 | NC — Not connected (per datasheet pin map) |
| ピン 105 | NC — Not connected (per datasheet pin map) |
| ピン 106 | NC — Not connected (per datasheet pin map) |
| ピン 107 | NC — Not connected (per datasheet pin map) |
| ピン 108 | NC — Not connected (per datasheet pin map) |
| ピン 109 | NC — Not connected (per datasheet pin map) |
| ピン 110 | NC — Not connected (per datasheet pin map) |
| ピン 111 | NC — Not connected (per datasheet pin map) |
| ピン 112 | NC — Not connected (per datasheet pin map) |
主な用途
S912XD128F2MAL の用途: 6 件s: Automotive Body Control Module (BCM), HVAC Climate Control ECU, Automotive Instrument Cluster, Automotive Lighting Controller, Industrial CAN Sensor Hub, Chassis and Powertrain Auxiliary ECU.
Automotive Body Control Module (BCM)
The S912XD128F2MAL's 112-LQFP package, 80 MHz HCS12X core, integrated CAN (MSCAN) controller, and automotive -40 to +125 C qualification make it a natural fit for body control modules that gate, lock, and orchestrate vehicle body features. Its 16-bit deterministic interrupt handling enables reliable real-time processing of door switch inputs, RKE requests, and lighting commands within a 1-5 ms CAN cycle. Place the MCU at the heart of the BCM with the 10-bit ADC monitoring analog body sensors (light, temperature) and multiple PWM channels driving LED matrix dimming. Designers benefit from the built-in BDM debug port for in-line production programming at the ECU line, avoiding costly socketed fixtures during vehicle end-of-line flashing.
おすすめ
HVAC Climate Control ECU
The S912XD128F2MAL serves HVAC climate control ECUs by combining 16-bit deterministic CPU performance with multiple 16-bit timers (ECT, PWM) for blend-air door, blower, and compressor clutch control. Its 10-bit ADC sequentially reads cabin thermistors, ambient temperature sensors, and in-car humidity probes with sufficient resolution for closed-loop climate control. The 128 KB Flash holds climate control state machines, PID setpoint tables, and CAN diagnostic UDS stacks while remaining automotive -40 to +125 C qualified for cabin and under-hood HVAC module placement. Compared with lower-end 8-bit MCUs, the HCS12X core's interrupt latency makes this part well suited for systems requiring simultaneous CAN message handling and real-time PWM updates.
おすすめ
Automotive Instrument Cluster
In instrument cluster designs the S912XD128F2MAL provides the 16-bit CPU bandwidth, 10-bit ADC, and PWM channels needed to drive stepper gauges, LCD displays, and backlight dimming. Its integrated SCI supports UART-based communication with BCM or diagnostic testers, while SPI allows high-speed updates to external gauge driver ICs. Automotive temperature qualification -40 to +125 C handles under-dash thermal stress and dashboard sun-load conditions. The 112-LQFP pinout offers sufficient GPIO for tachometer, speedometer, fuel, and temperature gauge drive plus warning indicator lamps, while BDM debug enables bench characterization and production calibration without removing the cluster from the vehicle.
おすすめ
Automotive Lighting Controller
The S912XD128F2MAL is well matched to adaptive front-lighting and LED matrix headlamp controllers that demand deterministic PWM channels for current regulation and configurable CAN bandwidth for diagnostics. Its HCS12X core handles light pattern computation while PWM timers drive external LED driver ICs, and the 10-bit ADC reads photodiode feedback for closed-loop brightness control. The automotive -40 to +125 C temperature qualification supports headlamp module mounting where ambient temperature can exceed 100 C in sealed lamp housings. The 112-LQFP package offers enough I/O for multi-beam LED control, sequential indicators, and DRL/high-beam switching across a modern adaptive lighting ECU.
おすすめ
Industrial CAN Sensor Hub
For industrial CAN-based sensor hubs outside the strict automotive cabin environment, the S912XD128F2MAL's MSCAN controller, 10-bit ADC, and wide operating range make it a robust aggregation node. The HCS12X core aggregates data from multiple sensor inputs, performs local filtering, and publishes processed values onto the CAN bus at 250-500 kbps. Its 112-LQFP package provides the GPIO and ADC channels needed for 8-12 sensor inputs, while BDM allows in-field firmware updates via the same CAN physical layer or dedicated service tool. Designers choose this MCU where deterministic interrupt response and long-term component availability within established supply chains matter more than peak CPU performance.
おすすめ
Chassis and Powertrain Auxiliary ECU
The S912XD128F2MAL fits auxiliary chassis modules such as active suspension controllers, electric power steering ECUs, and transmission range sensors where 16-bit deterministic processing is required. Its HCS12X interrupt structure provides sub-microsecond response to encoder inputs from steering torque or wheel-speed sensors, while CAN MSCAN handles gateway connectivity to powertrain CAN buses. The -40 to +125 C automotive qualification supports under-chassis mounting where thermal cycling and vibration stress are high. Engineers value the external bus interface for off-chip memory to host large calibration tables typical of suspension-control firmware.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: S912XD128F2MAL — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | S912XDG128F2MAL | MC9S12XS128MAL | S912XDQ128F2MAL |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (Freescale) | NXP Semiconductors |
| Package | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) | 112-LQFP | 112-LQFP (20x20 mm) |
| Core | HCS12X 16-bit | HCS12X 16-bit | HCS12X 16-bit | HCS12X 16-bit |
| Maximum CPU Frequency | 80 MHz | 80 MHz | 40 MHz (bus-locked) | 80 MHz |
| Flash | 128 KB | 128 KB | 128 KB | 128 KB |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C |
| CAN Module | MSCAN | MSCAN | MSCAN | MSCAN |
| Lifecycle Status | End of Life | Active (per DigiKey 2026-10) | NRND | Active (estimated) |
主な差別化要因
- Original HCS12X 16-bit core with automotive 128 KB Flash （vs S912XDG128F2MAL)
- 80 MHz full-speed HCS12X CPU vs 40 MHz bus-locked S12XS （vs MC9S12XS128MAL)
- Confirmed End-of-Life status enabling last-time-buy access （vs S912XDQ128F2MAL)
設計ノート
Estimated: at 80 MHz CPU clock, VDD = 5 V, and full peripheral utilization, the S912XD128F2MAL draws approximately 50-70 mA core current plus 20-30 mA IO drive. Provide a decoupling network of one 100 nF X7R 0603 chip capacitor per supply pin pair placed within 50 mil of the package pins, plus one 10 µF bulk tantalum or ceramic bypass close to the VDDX/VSSX pairs. Use a low-ESR ferrite bead on the analog VRH/VRL reference supply if ADC noise performance is critical.
Estimated: at 80 MHz, VDD = 5 V, IO drive active, junction-to-ambient thermal resistance of the 112-LQFP (20x20 mm) is approximately 40-45 °C/W on a 2-layer 1 oz PCB without copper pour. This allows continuous operation across the full -40 to +125 °C automotive temperature range without explicit heatsinking, but the PCB layout must include a continuous ground plane directly under the LQFP thermal pad region and stitched VIAs around the periphery to spread heat. Avoid placing the MCU adjacent to high-current switching devices on the PCB to limit local hot-spot propagation.
Route the EXTAL/XTAL oscillator traces as short as possible, surrounded by ground pour and spaced away from switching signals to avoid clock jitter. Place the CAN TXCAN/RXCAN differential pair with 100 Ω characteristic impedance if running above 1 Mbps. The 112-LQFP pin pitch is 0.65 mm requiring 0.4 mm wide traces and 0.2 mm spacing for clean manufacturing yield. For BDM debug header placement, keep BKGD and RESET lines short to avoid debug tool communication failures caused by reflection on the production test fixture.
Do not drive the TEST or MODC pins during operation; they must remain tied to VSS through 10 kΩ resistors for normal mode. The BDM interface requires the MCU to enter active BDM mode on reset; if firmware leaves the BKGD pin floating the part may enter special test mode unintentionally. Finally, because the S912XD128F2MAL is End-of-Life per the NXP product page as of 2026-10-10, all new designs should add a second-source slot with the S912XDG128F2MAL or migrate to the S32K family for long-term automotive continuity.
コンプライアンス情報
RoHS compliant per Jotrin and LCSC distributor listings. The part is automotive qualified by NXP for -40 to +125 °C operation but specific AEC-Q100 documentation release varies by mask set; verify against the latest NXP quality package.
