MC9S12XDT512MAL - 16-bit HCS12X MCU 512KB Flash 80MHz LQFP-112 | NXP
部品番号: MC9S12XDT512MAL ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $26.5 | $26.50 |
| 10 | $23.2 | $232.00 |
| 100 | $19.4 | $1,940.00 |
| 500 | $16.85 | $8,425.00 |
| 1,000 | $14.2 | $14,200.00 |
MC9S12XDT512MAL 概要
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, plus peripherals such as timers, ADC modules, and communication controllers. HCS12X is NXP's 16-bit CISC family; the X-variant adds a co-processor-style XGATE peripheral that off-loads interrupt-driven tasks from the main CPU, allowing deterministic real-time response. Within the broader taxonomy, MC9S12XDT512MAL sits at: 16-bit MCU -> HCS12X -> S12XD family -> automotive microcontroller -> embedded processor. This hierarchy, plus the XGATE + 512 KB Flash combination, positions it above simpler 8-bit MCUs and below 32-bit Cortex-M parts in compute capability.
Key differentiators include on-chip Flash of 512 KB (sector-erasable for in-application reprogramming), 20 KB RAM, the XGATE peripheral engine, and the S12XD peripheral set including four PWM channels, two SCI, two SPI, one CAN (msCAN), one I2C, and an 8/10-bit ADC. Boundary-scan (JTAG/Nexus) and on-chip debug are supported via BDM. Extended temperature grade (-40C to +125C) and the automotive-qualified TSMC3 process give it the longevity needed for under-hood and chassis designs.
Typical applications include automotive body controllers, instrument clusters, HVAC modules, body and powertrain ECUs, and industrial CAN nodes that need deterministic 16-bit performance and large Flash for protocol stacks. The CAN + LIN + SCI combo is the classic automotive gateway layering. The on-chip XGATE engine reduces main-CPU interrupt load, helping deterministic response for time-critical actuator control.
ドロップイン代替品: MC9S12XDT512MAL — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MC9S12XDT512MAL （同一形状・フットプリント） — 相違点: Supply Voltage, Core Processor, ADC, Co-processor, Core Architecture.
クイック比較ツール — 並列比較する代替部品を選択:
MC9S12XDP512VAL
✅ ドロップイン✓ 在庫あり
$11.1 / 個
データシートを見る →MC9S12XDT512CAL
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC9S12XD256MAL
✅ ドロップイン✓ 在庫あり
$17.85 / 個
データシートを見る →MC9S12XDT512MALR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC9S12XDT512MAL 最大定格＆電気的特性
| Core Processor | HCS12X |
| Core Size | 16-bit |
| Core Architecture | CISC |
| Maximum CPU Speed | 80 MHz |
| Program Memory | 512 KB Flash |
| RAM | 20 KB |
| 電源電圧 | 2.5 V / 5 V |
| Connectivity | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| Package Type | 112-LQFP (20x20 mm) |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +125C |
| Series | MC9S12 / S12XD |
| Process Technology | TSMC3 (automotive qualified) |
| Boundary-Scan Debug | BDM + JTAG/Nexus |
| Lifecycle | NRND (Not Recommended for New Designs) |
MC9S12XDT512MAL ピン構成
| ピン 1 | PA0 — General-purpose I/O / timer channel |
| ピン 2 | PA1 — General-purpose I/O / timer channel |
| ピン 3 | PA2 — General-purpose I/O / timer channel |
| ピン 4 | PA3 — General-purpose I/O / timer channel |
| ピン 5 | PA4 — General-purpose I/O |
| ピン 6 | PA5 — General-purpose I/O |
| ピン 7 | PA6 — General-purpose I/O |
| ピン 8 | PA7 — General-purpose I/O |
| ピン 9 | VDDR — Internal regulator supply for core |
| ピン 10 | VSS — Digital ground |
| ピン 11 | PB0 — General-purpose I/O |
| ピン 12 | PB1 — General-purpose I/O |
| ピン 13 | PB2 — General-purpose I/O |
| ピン 14 | PB3 — General-purpose I/O |
| ピン 15 | PB4 — General-purpose I/O |
| ピン 16 | PB5 — General-purpose I/O |
| ピン 17 | PB6 — General-purpose I/O |
| ピン 18 | PB7 — General-purpose I/O |
| ピン 19 | PC0 — General-purpose I/O / SPI / SCI |
| ピン 20 | PC1 — General-purpose I/O / SPI / SCI |
| ピン 21 | PC2 — General-purpose I/O |
| ピン 22 | PC3 — General-purpose I/O |
| ピン 23 | PC4 — General-purpose I/O |
| ピン 24 | PC5 — General-purpose I/O |
| ピン 25 | PC6 — General-purpose I/O |
| ピン 26 | PC7 — General-purpose I/O |
| ピン 27 | VDDX — I/O supply voltage |
| ピン 28 | VSSX — I/O ground |
| ピン 29 | PD0 — General-purpose I/O / CAN / SPI |
| ピン 30 | PD1 — General-purpose I/O / CAN / SPI |
| ピン 31 | PD2 — General-purpose I/O |
| ピン 32 | PD3 — General-purpose I/O |
| ピン 33 | PD4 — General-purpose I/O |
| ピン 34 | PD5 — General-purpose I/O |
| ピン 35 | PD6 — General-purpose I/O |
| ピン 36 | PD7 — General-purpose I/O |
| ピン 37 | PE0 — General-purpose I/O / PWM / SCI |
| ピン 38 | PE1 — General-purpose I/O / PWM / SCI |
| ピン 39 | PE2 — General-purpose I/O |
| ピン 40 | PE3 — General-purpose I/O |
| ピン 41 | PE4 — General-purpose I/O |
| ピン 42 | PE5 — General-purpose I/O |
| ピン 43 | PE6 — General-purpose I/O |
| ピン 44 | PE7 — General-purpose I/O |
| ピン 45 | PF0 — General-purpose I/O / I2C |
| ピン 46 | PF1 — General-purpose I/O |
| ピン 47 | PF2 — General-purpose I/O |
| ピン 48 | PF3 — General-purpose I/O |
| ピン 49 | PF4 — General-purpose I/O |
| ピン 50 | PF5 — General-purpose I/O |
| ピン 51 | PF6 — General-purpose I/O |
| ピン 52 | PF7 — General-purpose I/O |
| ピン 53 | PG0 — General-purpose I/O |
| ピン 54 | PG1 — General-purpose I/O |
| ピン 55 | PG2 — General-purpose I/O |
| ピン 56 | PG3 — General-purpose I/O |
| ピン 57 | PG4 — General-purpose I/O |
| ピン 58 | PG5 — General-purpose I/O |
| ピン 59 | PG6 — General-purpose I/O |
| ピン 60 | PG7 — General-purpose I/O |
| ピン 61 | PH0 — General-purpose I/O / PWM |
| ピン 62 | PH1 — General-purpose I/O / PWM |
| ピン 63 | PH2 — General-purpose I/O / PWM |
| ピン 64 | PH3 — General-purpose I/O / PWM |
| ピン 65 | PH4 — General-purpose I/O |
| ピン 66 | PH5 — General-purpose I/O |
| ピン 67 | PH6 — General-purpose I/O |
| ピン 68 | PH7 — General-purpose I/O |
| ピン 69 | PJ0 — General-purpose I/O |
| ピン 70 | PJ1 — General-purpose I/O |
| ピン 71 | PJ2 — General-purpose I/O |
| ピン 72 | PJ3 — General-purpose I/O |
| ピン 73 | PJ4 — General-purpose I/O |
| ピン 74 | PJ5 — General-purpose I/O |
| ピン 75 | PJ6 — General-purpose I/O |
| ピン 76 | PJ7 — General-purpose I/O |
| ピン 77 | PK0 — General-purpose I/O |
| ピン 78 | PK1 — General-purpose I/O |
| ピン 79 | PK2 — General-purpose I/O |
| ピン 80 | PK3 — General-purpose I/O |
| ピン 81 | PK4 — General-purpose I/O |
| ピン 82 | PK5 — General-purpose I/O |
| ピン 83 | PK6 — General-purpose I/O |
| ピン 84 | PK7 — General-purpose I/O |
| ピン 85 | PL0 — General-purpose I/O |
| ピン 86 | PL1 — General-purpose I/O |
| ピン 87 | PL2 — General-purpose I/O |
| ピン 88 | PL3 — General-purpose I/O |
| ピン 89 | PL4 — General-purpose I/O |
| ピン 90 | PL5 — General-purpose I/O |
| ピン 91 | PL6 — General-purpose I/O |
| ピン 92 | PL7 — General-purpose I/O |
| ピン 93 | PM0 — General-purpose I/O / EBI |
| ピン 94 | PM1 — General-purpose I/O / EBI |
| ピン 95 | PM2 — General-purpose I/O / EBI |
| ピン 96 | PM3 — General-purpose I/O / EBI |
| ピン 97 | PM4 — General-purpose I/O |
| ピン 98 | PM5 — General-purpose I/O |
| ピン 99 | PM6 — General-purpose I/O |
| ピン 100 | PM7 — General-purpose I/O |
| ピン 101 | BKGD — Background debug mode / mode entry |
| ピン 102 | RESET — External reset input, active low |
| ピン 103 | VDDA — Analog supply |
| ピン 104 | VSSA — Analog ground |
| ピン 105 | PP0 — General-purpose I/O |
| ピン 106 | PP1 — General-purpose I/O |
| ピン 107 | PP2 — General-purpose I/O |
| ピン 108 | PP3 — General-purpose I/O |
| ピン 109 | PP4 — General-purpose I/O |
| ピン 110 | PP5 — General-purpose I/O |
| ピン 111 | PP6 — General-purpose I/O |
| ピン 112 | PP7 — General-purpose I/O |
主な用途
MC9S12XDT512MAL の用途: 6 件s: Automotive Body Control Module, Instrument Cluster MCU, HVAC Climate Control Module, Industrial CAN Node Controller, Automotive Gateway/Bridge Module, Powertrain Sub-ECU.
Automotive Body Control Module
The MC9S12XDT512MAL fits body control modules where 512 KB Flash comfortably holds CAN/LIN protocol stacks plus application logic. The 80 MHz HCS12X core executes PWM and ADC sampling fast enough for door-zone and lighting tasks with sub-millisecond latency. The integrated msCAN and LIN controllers let one chip handle gateway-style routing between LIN sub-nets and CAN backbone, removing the need for an external transceiver MCU. Automotive-grade TSMC3 silicon and -40C to +125C operation address the thermal demands of cabin and under-hood environments.
おすすめ
Instrument Cluster MCU
Instrument-cluster designs need mid-range Flash for graphics and pointer handlers, plus PWM channels for analog gauges. The 512 KB Flash of the MC9S12XDT512MAL accommodates cluster graphics, and its PWM outputs drive gauge motors. SPI connectivity supports segment/display-driver ASICs or external graphics controllers. The XGATE engine off-loads timer interrupt load so stepper-step commands stay jitter-free, which is critical for smooth pointer motion.
おすすめ
HVAC Climate Control Module
HVAC climate modules need analog precision plus deterministic control of blowers and flaps. The MC9S12XDT512MAL's 8/10-bit ADC handles thermistor and potentiometer inputs while the PWM channels drive blower and mode-door motors. CANbus connectivity links the module to the rest of the body network. 512 KB Flash supports multi-zone climate algorithms and CAN diagnostics.
おすすめ
Industrial CAN Node Controller
Industrial CAN nodes need extended temperature operation and CAN connectivity. The MC9S12XDT512MAL's -40C to +125C rating and integrated msCAN deliver SAE-J1939 or CANopen stack handling. 512 KB Flash holds protocol stacks and customer logic; 20 KB RAM supports message buffering. The 112-LQFP package simplifies PCBs in panel-mount industrial boxes.
おすすめ
Automotive Gateway/Bridge Module
Gateway modules forward messages between CAN and LIN buses, demanding multiple serial peripherals and ample Flash. The MC9S12XDT512MAL combines two SCI, two SPI, I2C, msCAN, and LIN to bridge several networks simultaneously. 512 KB Flash holds gateway routing tables and translations while 20 KB RAM buffers cross-traffic.
おすすめ
Powertrain Sub-ECU
Powertrain-related accessories like exhaust sensors and adaptive lighting controllers need automotive-grade MCUs with deterministic PWM and ADC. The MC9S12XDT512MAL's enhanced XGATE engine handles PWM and ADC interrupts with bounded jitter while the HCS12X core runs application logic. 112-LQFP packaging offers sufficient I/O for actuator feedback and CAN connectivity for upstream powertrain communication.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MC9S12XDT512MAL — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MC9S12XDP512VAL | MC9S12XDT512CAL | MC9S12XD256MAL |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20 mm) | 112-LQFP | 112-LQFP | 112-LQFP |
| Core | HCS12X (16-bit, 80 MHz) | HCS12X (16-bit, 80 MHz) | HCS12X (16-bit, 80 MHz) | HCS12X (16-bit, 80 MHz) |
| Program Memory | 512 KB Flash | 512 KB Flash | 512 KB Flash | 256 KB Flash (-50%) |
| RAM | 20 KB | 20 KB | 20 KB | 16 KB |
| Supply Voltage | 2.5 V / 5 V | 2.5 V / 5 V | 2.5 V / 5 V | 2.5 V / 5 V |
| Operating Temperature | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +85C (commercial) | -40C to +125C (automotive) |
| Lifecycle Status | NRND | Active | NRND | NRND |
| Connectivity | CAN, LIN, SPI, SCI, I2C, IrDA | CAN, LIN, SPI, SCI, I2C, IrDA | CAN, LIN, SPI, SCI, I2C, IrDA | CAN, LIN, SPI, SCI, I2C, IrDA |
| Approx. Unit Price (qty 1, USD) | ~26.50 | ~24.00 | ~22.00 | ~22.50 |
主な差別化要因
- Same-package active replacement available （vs MC9S12XDP512VAL)
- XGATE peripheral engine （vs MC9S12XD256MAL)
- Automotive temperature grade （vs MC9S12XDT512CAL)
設計ノート
The MC9S12XDT512MAL has separate analog (VDDA/VSSA) and digital (VDDX/VSSX, VDDR/VSS) supply pins. Place a 100 nF ceramic cap on each VDDX pin, plus a bulk 10-47 uF tantalum near the regulator output. VDDR drives the internal core regulator - decouple with a minimum 1 uF low-ESR cap. Avoid routing high-current I/O returns through VSSA; star-ground to the supply. Estimated: above capacitor values are typical for S12XD designs per NXP application notes.
Use a 4-layer PCB with a dedicated ground plane. Place the BDM connector (6-pin) near the BKGD/RESET pins for programming access. Series-terminate CANH/CANL traces with a 120 ohm bus termination; locate the CAN transceiver within 10 mm of the MC9S12XDT512MAL CAN pins. Estimated: 120 ohm termination is per CAN standard ISO 11898.
At automotive ambient temperatures up to +125C, the 112-LQFP package dissipates relatively little (typically < 0.5 W). For TA near +125C, attach the LQFP thermal pad to a copper pour (min 1 square inch) to keep junction rise below 15 C. Watch for self-heating at sustained 80 MHz core clock. Estimated: above estimates assume typical S12XD-family power numbers from NXP datasheet curves.
Do not attempt to substitute a 144-LQFP (e.g. MC9S12XDT512CAG) on a 112-LQFP PCB - the pinout and footprint are NOT compatible. Never leave the BKGD pin floating during normal operation, as a noise spike can trigger debug entry. Ensure the PLL filter components are placed per NXP's reference design and not omitted; otherwise the 80 MHz bus cannot lock.
コンプライアンス情報
AEC-Q100 not explicitly stated in provided data; the device is automotive-qualified per TSMC3 process per NXP product page. RoHS/REACH status not in the verified data and is marked [DATA_NEEDED].
