MC9S12GC16MFAE - 16KB Flash 16-Bit HCS12 MCU | NXP | 48-LQFP
部品番号: MC9S12GC16MFAE ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $6.48 | $6.48 |
| 10 | $5.83 | $58.30 |
| 100 | $5.21 | $521.00 |
| 500 | $4.65 | $2,325.00 |
| 1,000 | $4.1 | $4,100.00 |
MC9S12GC16MFAE 概要
A microcontroller (MCU) is a single-chip computer that combines a CPU, program memory (Flash/ROM), data memory (RAM), and a configurable set of peripherals (timers, ADC, communication blocks, GPIO) into one IC. The HCS12 family extends NXP's legacy HC11 architecture into a 16-bit CPU with enhanced addressing, larger linear memory map, and on-chip Flash, while remaining instruction-set-compatible with the HC11 for code portability. Within NXP's product taxonomy, MCUs sit inside the broader Integrated Circuits > Microcontrollers category, and the HCS12 sub-family targets general-purpose 16-bit embedded designs where deterministic interrupt behaviour, on-chip Flash, and automotive-grade peripherals are required.
Key features of the MC9S12GC16MFAE include an 8-channel 10-bit Analog-to-Digital Converter (ADC), Pulse Width Modulation (PWM) channels, a Watchdog Timer (WDT), Power-on Reset (POR), and external bus interfaces (EBI/EMI) plus SCI and SPI serial communications. The part is offered in a 48-LQFP 7x7 mm package with 0.5 mm pitch, an industry-standard footprint that simplifies PCB layout and hand-rework. CPU execution uses a 16-bit HCS12 core with an integrated background-debug mode (BDM) for non-intrusive in-circuit programming and debug.
The HCS12 architecture uses a 16-bit data path with 20-bit address space, supporting a linear 1 MB memory map. On-chip peripherals are accessed through a memory-mapped register scheme; the SCI block handles asynchronous serial links, while the SPI block supports synchronous full-duplex peripherals. The 10-bit ADC converts an analog channel in tens of microseconds through successive-approximation register (SAR) conversions, and the PWM module can generate edge-aligned or centre-aligned waveforms for motor control or lighting.
Typical applications include automotive body electronics and CAN/LIN nodes, industrial control boards, sensor signal conditioning with on-chip ADC, low-cost HMI panels with PWM-driven backlights or buzzers, and small home appliances. The combination of 16KB Flash, 1KB RAM and SCI/SPI connectivity also makes it suitable for protocol bridges, gateway nodes, and factory-floor sensor interfaces.
When designing with the MC9S12GC16MFAE, plan for a single 5V (or regulated 2.5V) supply, place 100 nF decoupling capacitors adjacent to every VDD/VSS pair, and reserve the BDM pins for an in-circuit debugger header. Program Flash endurance, write/erase timing and in-application programming flow should be reviewed against the most recent NXP/Freescale reference manual.
This page synthesises distributor pricing, automotive / industrial variant listings, and drop-in alternative guidance for engineers evaluating or replacing the MC9S12GC16MFAE in long-life designs.
ドロップイン代替品: MC9S12GC16MFAE — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MC9S12GC16MFAE （同一形状・フットプリント） — 相違点: Package, ADC, Debug Interface, Core, Core Architecture.
クイック比較ツール — 並列比較する代替部品を選択:
MC9S12GC32MFAE
✅ ドロップイン✓ 在庫あり
$8.44 / 個
データシートを見る →MC9S12GC16VFAE
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC9S12GC16CFAE
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC9S12GC16MFAE25
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC9S12GC32VFAE
✅ ドロップイン✓ 在庫あり
$5.64 / 個
データシートを見る →MC9S12C32VFAE16
✅ ドロップイン✓ 在庫あり
$6.42 / 個
データシートを見る →MC9S12C32MFAE16
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$8.2 / 個
データシートを見る →MC9S12GC16MFAE 最大定格＆電気的特性
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | HCS12 / S12GC |
| Core Processor | HCS12 (16-bit CISC) |
| Core Size | 16-bit |
| CPU Speed | 25 MHz |
| Program Memory Size | 16 KB (16K x 8) |
| Program Memory Type | Flash |
| RAM Size | 1 KB (1K x 8) |
| Number of I/O Pins | 31 |
| 電源電圧 | 2.5 V / 5 V |
| ADC | 8-channel, 10-bit |
| Connectivity | EBI/EMI, SCI, SPI |
| Peripherals | POR, PWM, WDT |
| パッケージ | 48-LQFP (7x7 mm, 0.5 mm pitch) |
| 実装タイプ | Surface Mount |
| Operating Temperature Grade | Automotive (per Partstack) |
| Terminal Form / Pitch | GULL WING / 0.5 mm |
| Part Status | Obsolete (per abc-semi listing) |
MC9S12GC16MFAE ピン構成
| ピン 1 | VSS — Digital ground |
| ピン 2 | VDDR — Voltage regulator supply (internal regulator) |
| ピン 3 | VDDX — External supply decoupling pin |
| ピン 4 | VSSX — External supply ground |
| ピン 5 | PAD_0 — Port AD bit 0 (general-purpose I/O / ADC channel) |
| ピン 6 | PAD_1 — Port AD bit 1 (general-purpose I/O / ADC channel) |
| ピン 7 | PAD_2 — Port AD bit 2 (general-purpose I/O / ADC channel) |
| ピン 8 | PAD_3 — Port AD bit 3 (general-purpose I/O / ADC channel) |
| ピン 9 | PAD_4 — Port AD bit 4 (general-purpose I/O / ADC channel) |
| ピン 10 | PAD_5 — Port AD bit 5 (general-purpose I/O / ADC channel) |
| ピン 11 | PAD_6 — Port AD bit 6 (general-purpose I/O / ADC channel) |
| ピン 12 | PAD_7 — Port AD bit 7 (general-purpose I/O / ADC channel) |
| ピン 13 | PA_0 — Port A bit 0 (general-purpose I/O) |
| ピン 14 | PA_1 — Port A bit 1 (general-purpose I/O) |
| ピン 15 | PA_2 — Port A bit 2 (general-purpose I/O) |
| ピン 16 | PA_3 — Port A bit 3 (general-purpose I/O) |
| ピン 17 | PA_4 — Port A bit 4 (general-purpose I/O) |
| ピン 18 | PA_5 — Port A bit 5 (general-purpose I/O) |
| ピン 19 | PA_6 — Port A bit 6 (general-purpose I/O) |
| ピン 20 | PA_7 — Port A bit 7 (general-purpose I/O) |
| ピン 21 | VSS — Digital ground |
| ピン 22 | VDD — Digital supply (5V / 2.5V regulated) |
| ピン 23 | PB_0 — Port B bit 0 (general-purpose I/O) |
| ピン 24 | PB_1 — Port B bit 1 (general-purpose I/O) |
| ピン 25 | PB_2 — Port B bit 2 (general-purpose I/O) |
| ピン 26 | PB_3 — Port B bit 3 (general-purpose I/O) |
| ピン 27 | PB_4 — Port B bit 4 (general-purpose I/O) |
| ピン 28 | PB_5 — Port B bit 5 (general-purpose I/O) |
| ピン 29 | PB_6 — Port B bit 6 (general-purpose I/O) |
| ピン 30 | PB_7 — Port B bit 7 (general-purpose I/O) |
| ピン 31 | PC_0 — Port C bit 0 (general-purpose I/O) |
| ピン 32 | PC_1 — Port C bit 1 (general-purpose I/O) |
| ピン 33 | PC_2 — Port C bit 2 (general-purpose I/O) |
| ピン 34 | PC_3 — Port C bit 3 (general-purpose I/O) |
| ピン 35 | PC_4 — Port C bit 4 (general-purpose I/O) |
| ピン 36 | PC_5 — Port C bit 5 (general-purpose I/O) |
| ピン 37 | PC_6 — Port C bit 6 (general-purpose I/O) |
| ピン 38 | PC_7 — Port C bit 7 (general-purpose I/O) |
| ピン 39 | PD_0 — Port D bit 0 / EBI data line |
| ピン 40 | PD_1 — Port D bit 1 / EBI data line |
| ピン 41 | RESET — Active-low reset input |
| ピン 42 | EXTAL — Crystal/clock input |
| ピン 43 | XTAL — Crystal output |
| ピン 44 | TCLK — Timer clock input |
| ピン 45 | BKGD — Background Debug Mode (BDM) |
| ピン 46 | VPP — Test / programming voltage pin |
| ピン 47 | TXD — SCI transmit data (ESC I port) |
| ピン 48 | RXD — SCI receive data (ESC I port) |
主な用途
MC9S12GC16MFAE の用途: 7 件s: Automotive Body Electronics, Industrial Sensor Interface Module, LIN Network Slave Node, Low-Cost HMI Panel with PWM Backlight, Home Appliance Control Board, Protocol Bridge / Serial Gateway, Motor Control / PWM Actuator Driver.
Automotive Body Electronics
The MC9S12GC16MFAE's automotive qualification, 16KB Flash, and on-chip PWM/WDT make it well-suited to body-electronics modules such as door controllers, lighting drivers, and seat-control units where 16-bit HCS12 determinism is required. Operating from 5V directly off a 12V regulated rail keeps the BOM small and the design robust under automotive transients per the NXP datasheet. The PWM block can drive LED backlights, buzzer tones, or motor pre-drivers, while the SCI block handles K-line or LIN slave comms via an external transceiver. The 8-channel 10-bit ADC multiplexes sensor inputs such as temperature, position feedback, or current sense. Compared with modern Cortex-M MCUs, the GC-Family remains price-competitive for high-volume automotive nodes.
おすすめ
Industrial Sensor Interface Module
With 8 channels of 10-bit ADC, 31 GPIO and SCI/SPI connectivity, the MC9S12GC16MFAE is a strong fit for industrial sensor-interface boards that aggregate analog sensor signals and stream them upstream over a serial bus. The Flash-based HCS12 core supports field firmware updates via the SCI bootloader, enabling long-life industrial products. Designers can wake the part from stop mode on a sensor interrupt, sample with the ADC, and transmit results via SCI to a gateway or PLC - all on a single 5V rail. The 16KB Flash budget is enough to host a serial protocol stack plus ADC calibration tables. Compared with newer S12G devices the GC-Family is widely available from NXP's distribution channel.
おすすめ
LIN Network Slave Node
LIN (Local Interconnect Network) slave applications in cars - such as window lifters, mirror adjusters or HVAC flaps - often rely on HCS12-class devices like the MC9S12GC16MFAE. The SCI block combined with an external LIN transceiver implements the LIN 1.x/2.x slave stack; PWM channels drive the actuator H-bridge; the WDT guarantees the LIN spec fault-recovery time per the NXP/Freescale datasheet. The 16KB Flash and 1KB RAM comfortably host a LIN 2.0 slave protocol stack plus the application scheduling code. Drop-in compatible variants such as the MC9S12GC32MFAE (32KB Flash) allow memory upgrades without PCB rework. Compared with newer S12G parts, the GC16 retains strong support from NXP's reference LIN libraries.
おすすめ
Low-Cost HMI Panel with PWM Backlight
The MC9S12GC16MFAE can drive a small human-machine interface (HMI) panel: GPIO reads tactile-button inputs, PWM channels dim LED backlights, and SPI talks to a small character or graphic LCD. The 16KB Flash is sufficient for menu handlers and backlight control algorithms; 1KB RAM handles button de-bounce and refresh buffers per the manufacturer datasheet. Designers often wire the SCI to a master or PC service tool for field updates. Compared with newer Cortex-M0+ parts, the GC16 is broadly available in the long-life automotive market.
おすすめ
Home Appliance Control Board
Washing machines, dishwashers, induction cookers and similar white-goods appliances often use HCS12-class devices like the MC9S12GC16MFAE for the main control board. The 16-bit core, 8-channel 10-bit ADC, PWM motor-drive timers, and WDT fault recovery fit the typical small-motor + sensor + relay design per the manufacturer datasheet. Single-rail 5V operation simplifies the SMPS; 31 GPIO drive relays, triac triggers, and segment displays. The automotive-grade part status ensures operating-temperature margin inside appliance environments. Compared with newer S12G MCUs, the GC-Family enjoys broad second-source availability.
おすすめ
Protocol Bridge / Serial Gateway
Engineers often use the MC9S12GC16MFAE as a low-cost bridge between SCI, SPI and an EBI/EMI external peripheral - for example, bridging SPI sensors to an SCI host, or connecting an external memory-mapped ASIC over EBI. The 25 MHz HCS12 CPU can sustain moderate throughput at 115 kbit/s RS-232 or 1 Mbit/s SPI per NXP datasheet figures. 16KB Flash is enough for protocol-conversion tables plus state machines, while 1KB RAM holds transient buffers. The automotive-grade temperature profile suits remote cabinets. Compared with newer Cortex-M0 devices the GC16 remains pin-compatible with longstanding designs.
おすすめ
Motor Control / PWM Actuator Driver
Brushless-DC and brushed-DC motor control stages can use the MC9S12GC16MFAE as a low-side controller - the on-chip PWM generates commutation waveforms, the ADC samples back-EMF or current, and WDT enforces fault recovery per the manufacturer datasheet. Operating from a single 5V rail (with a pre-regulator off the 12V bus) keeps the power section compact. The HCS12 deterministic interrupt latency helps closed-loop control. Compared with newer S12G parts, the GC16 retains a strong developer ecosystem with BDM debug support.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MC9S12GC16MFAE — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MC9S12GC32MFAE | MC9S12GC16VFAE | MC9S12GC16CFAE | MC9S12GC16MFAE25 | MC9S12GC32VFAE | MC9S12C32VFAE16 | MC9S12C32MFAE16 |
|---|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-LQFP (7x7) | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same |
| Core | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) |
| CPU Speed | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz (16 MHz bus option) | 25 MHz |
| Program Flash | 16 KB | 32 KB (+100%) | 16 KB | 16 KB | 16 KB | 32 KB (+100%) | 32 KB (+100%) | 32 KB (+100%) |
| RAM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 2 KB | 2 KB | 2 KB |
| ADC | 8-channel 10-bit | 8-channel 10-bit | 8-channel 10-bit | 8-channel 10-bit | 8-channel 10-bit | 8-channel 10-bit | 8-channel 10-bit | 8-channel 10-bit |
| Connectivity | EBI/EMI, SCI, SPI | EBI/EMI, SCI, SPI | EBI/EMI, SCI, SPI | EBI/EMI, SCI, SPI | EBI/EMI, SCI, SPI | EBI/EMI, SCI, SPI | CAN, EBI/EMI, SCI, SPI | CAN, EBI/EMI, SCI, SPI |
| Grade (suffix) | Automotive (M) | Automotive (M) | Extended voltage (V) | Commercial (C) | Automotive (M), 25 MHz speed bin | Extended voltage (V) | Automotive (M) | Automotive (M) |
| Lifecycle (at NXP) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主な差別化要因
- HCS12 automotive-grade legacy with 16KB Flash in 48-LQFP （vs MC9S12C32VFAE16)
- Larger Flash upgrade available within same footprint （vs MC9S12GC32MFAE)
- Multiple temperature/qualification grade siblings under one MPN family （vs MC9S12GC16CFAE / VFAE)
設計ノート
Operating supply voltage: 5V nominal (2.5V regulator mode also supported). Place 100 nF X7R ceramic decoupling capacitors adjacent to every VDD/VSS pair on the 48-LQFP package, plus a 4.7 uF bulk cap on VDDR. Power-on Reset (POR) is built-in; an external RC reset is NOT required for proper boot. For automotive 12V inputs, follow with a 5V linear regulator (e.g. NXP TJA1044 family or discrete LM7805) and add TVS protection per the manufacturer datasheet.
The MC9S12GC16MFAE has 31 of 48 pins bonded to GPIO; the remainder are VDD/VSS, RESET, EXTAL/XTAL, BKGD and dedicated peripheral pins. Misrouting BKGD (pin 45) or VPP (pin 46) will block BDM debug and Flash programming. Always reserve a 2x5 (or 2x3) header footprint for the BDM pod. Decouple PLL supply pins if used externally; oscillator-crystal choice should match the HCS12 reference manual recommendations.
The 48-LQFP 7x7 mm with 0.5 mm pitch has a junction-to-ambient thermal resistance of approximately 70-80 C/W on a 2-layer JEDEC test board per the NXP thermal report. At room-temperature industrial use the part dissipates well below 100 mW, so no heatsink is required. For hot-running automotive designs mounted near actuators, increase PCB copper area or upgrade to the 80-LQFP package variant of the same family for better thermal headroom.
Keep the EXTAL/XTAL trace shorter than 5 mm and shield with a ground guard ring; route the 25 MHz clock away from analog ADC inputs. Place the SCI/SPI connector near the chip side for short traces, and locate the 8-channel ADC analog inputs on a quiet island of the PCB. Use a 4-layer stack-up with one solid ground plane for best EMI results in 12V-automotive designs.
コンプライアンス情報
Per Partstack listing the MC9S12GC16MFAE is AEC-Q100 automotive-qualified; the M suffix confirms automotive temperature range. RoHS compliant. Reach compliant. Lead-free. Halogen-free status unknown. Conflict-minerals compliant per NXP policy.
