MCF5214CVF66 - ColdFire V2 32-bit MCU, 256KB Flash, 66MHz, 256-MAPBGA | NXP
部品番号: MCF5214CVF66 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.42 | $164.20 |
| 100 | $14.85 | $1,485.00 |
| 500 | $13.2 | $6,600.00 |
| 1,000 | $11.95 | $11,950.00 |
MCF5214CVF66 概要
An MCU (microcontroller unit) is a single-chip computer containing a CPU core, program memory (flash), data memory (SRAM), and integrated peripherals such as timers, communication controllers, and analog blocks. The ColdFire V2 core is a variable-length RISC architecture derived from the original Motorola 68000 family, optimized for embedded control with a focus on code density and low power. Within the broader taxonomy, the MCF5214CVF66 sits at: microcontroller -> 32-bit MCU -> ColdFire family -> ColdFire V2 core.
Key differentiating features of the MCF5214CVF66 include: (1) 66 MHz ColdFire V2 core with up to 56 MIPS Dhrystone 2.1 performance, (2) 256 KB of secure, interleaved flash with near-single-cycle access, (3) hardware multiply-accumulate (MAC) unit for DSP-style signal processing, (4) FlexCAN module for industrial networking, and (5) 16-bit ADC and multiple timer/PWM modules for motor and power control. The MAPBGA-256 footprint offers high I/O density but requires multilayer PCB design with via-in-pad for fan-out.
Architecturally, the MCF5214CVF66 uses a Harvard-style bus with separate program and data paths feeding the ColdFire V2 pipeline. The flash memory controller supports concurrent code-fetch from one bank while programming or erasing another, enabling field-upgradeable firmware without code execution stalls. An integrated PLL synthesizes the 66 MHz system clock from an external crystal or oscillator, allowing flexible clock-tree design.
Typical applications include industrial automation controllers, CAN-node motor drives, building-automation gateways, and embedded HMI panels. The combination of three UARTs, CAN, and I²C enables multi-protocol bridging in factory-floor equipment, while the 16-bit ADC supports sensor acquisition loops in process-control nodes.
When designing with the MCF5214CVF66, plan for a multilayer PCB (at least 4 layers) with continuous ground planes under the MAPBGA footprint to control impedance and provide thermal spreading. Because the part is NRND, design teams should evaluate migration to the active MCF51CN or Kinetis families for new production, and source remaining inventory only through authorized distributors.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: MCF5214CVF66 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MCF5214CVF66 （同一形状・フットプリント） — 相違点: Package, CAN, Connectivity, Ethernet, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
MCF5280CVF66J
✅ ドロップイン✓ 在庫あり
$17.6 / 個
データシートを見る →MCF5281CVM66J
✅ ドロップイン✓ 在庫あり
$21 / 個
データシートを見る →MCF5282CVM66J
✅ ドロップイン✓ 在庫あり
$16.2 / 個
データシートを見る →MCF5216CVF66
✅ ドロップイン✓ 在庫あり
$17.25 / 個
データシートを見る →MCF5214CAF66
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MCF5214CVF66 最大定格＆電気的特性
| Core Processor | ColdFire V2 |
| Core Size | 32-Bit |
| Maximum Clock Speed | 66 MHz |
| Program Memory Size | 256 KB (256K x 8) Flash |
| RAM Size | 32 KB |
| Number of I/O | 142 |
| パッケージ | 256-MAPBGA (17x17 mm) |
| Connectivity | CANbus, EBI/EMI, I²C, SPI, UART/USART |
| Peripherals | DMA, LVD, POR, PWM, WDT |
| Data Converters | A/D 8x12b |
| 電源電圧 | 3.0 V to 3.6 V |
| 動作温度 | -40C to +85C (industrial) |
| 実装タイプ | Surface Mount |
| MSLレベル | 3 |
| RoHS ステータス | Compliant |
| ライフサイクル状態 | NRND (Not Recommended for New Designs) |
MCF5214CVF66 256-mapbga (17x17 mm) ピン配置ガイド
MCF5214CVF66 (256-mapbga (17x17 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MCF5214CVF66.
詳細は データシート をご参照ください。
主な用途
MCF5214CVF66 の用途: 6 件s: Industrial CAN-Node Controller, Building Automation Gateway, Motor Control / PWM Drive Stage, Embedded HMI Control Panel, Multi-Protocol Serial Bridge, Data Acquisition Front-End.
Industrial CAN-Node Controller
The MCF5214CVF66's integrated FlexCAN module and 66 MHz ColdFire V2 core make it ideal for industrial CAN-node controllers in factory automation. The FlexCAN peripheral supports CAN 2.0A/B protocols at up to 1 Mbit/s, enabling deterministic communication with servo drives, sensors, and PLCs on the factory floor. With 256 KB of flash, the MCU accommodates the CANopen or DeviceNet protocol stack alongside application code without external memory. The 142 GPIO pins drive status LEDs, opto-isolated inputs, and relay outputs typical of industrial I/O nodes, while the three UARTs bridge to legacy RS-485 instrumentation. ColdFire V2's hardware MAC unit accelerates signal-processing tasks such as vibration analysis on predictive-maintenance sensor nodes.
おすすめ
Building Automation Gateway
In building-automation gateways, the MCF5214CVF66 aggregates data from HVAC, lighting, and access-control subsystems through its multi-protocol peripheral set. The three independent UARTs interface with BACnet MS/TP, Modbus RTU, and KNX bus modules simultaneously, while I²C connects to environmental sensor arrays and SPI drives a wireless transceiver for cloud uplink. The 256 KB flash accommodates the BACnet stack and protocol translation firmware, and the DMA controller offloads serial-data movement from the core. Industrial temperature grade (-40C to +85C) supports rooftop equipment enclosures, and the MAPBGA package's high I/O count routes all subsystem interfaces without external bus expansion.
おすすめ
Motor Control / PWM Drive Stage
The MCF5214CVF66 suits low-to-mid-power motor control with its integrated PWM timer modules and 12-bit ADC. The PWM timers generate complementary outputs for three-phase brushless DC (BLDC) motor drives up to several hundred Hz switching frequency with dead-time insertion. The 8-channel 12-bit ADC samples phase currents and DC-bus voltage for field-oriented control (FOC) loops, while the hardware MAC unit executes the FOC math efficiently. The 66 MHz core provides sufficient bandwidth for sensorless back-EMF observers in pump and fan applications. The MAPBGA package's 142 GPIOs easily route the three-phase gate-driver signals, encoder inputs, and fault-protection lines.
おすすめ
Embedded HMI Control Panel
Human-Machine Interface (HMI) panels use the MCF5214CVF66 as the main controller driving character or graphic LCDs via the external bus interface. The EBI/EMI peripheral gluelessly interfaces to parallel LCD modules or external SRAM/PSRAM, freeing the ColdFire V2 core for menu logic and touch-panel scanning. The 32 KB SRAM holds display buffers and event queues, while 256 KB flash stores localized multi-language UI resources. The SPI controller drives resistive-touchscreen A/D converters and the I²C bus manages backlight PWM and ambient-light sensors. Industrial temperature operation supports factory-floor panel installations.
おすすめ
Multi-Protocol Serial Bridge
The MCF5214CVF66's three UARTs, one SPI, one I²C, and FlexCAN make it ideal as a multi-protocol serial bridge between industrial networks. Protocol translation between Modbus RTU, Modbus TCP-over-UART, BACnet, and CANopen is handled in firmware with the DMA controller moving data between peripheral buffers and protocol-stack memory. The 66 MHz core sustains wire-speed translation at 115.2 kbaud UART rates across all ports simultaneously. The hardware MAC unit accelerates CRC calculations used in CAN and Modbus frames. Industrial-grade operation and 142 GPIOs route status LEDs and diagnostic pins without external bus expanders.
おすすめ
Data Acquisition Front-End
Data acquisition systems leverage the MCF5214CVF66's 12-bit 8-channel ADC and DMA channels to capture multi-sensor analog data at sustained sample rates. The DMA controller streams ADC conversion results directly into SRAM buffers without CPU intervention, freeing the ColdFire V2 core for averaging, scaling, and statistical analysis. The 32 KB SRAM holds several seconds of buffered samples at 100 kSPS aggregate rate. The SPI and I²C ports add digital-sensor inputs (temperature, humidity, accelerometers) alongside the analog channels. The FlexCAN port broadcasts processed data onto a vehicle or industrial CAN bus for downstream logging.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MCF5214CVF66 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MCF5280CVF66J | MCF5281CVM66J | MCF5282CVM66J | MCF5216CVF66 | MCF5214CAF66 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-MAPBGA (17x17 mm) | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 |
| Clock Speed | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| Flash Size | 256 KB | 256 KB | 512 KB | 512 KB | 512 KB | 256 KB |
| RAM Size | 32 KB | 32 KB | 64 KB | 64 KB | 32 KB | 32 KB |
| FlexCAN | Yes | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
主な差別化要因
- Highest-density pin-compatible flash option in MCF521x family （vs MCF5281CVM66J)
- Original family member with mature ecosystem support （vs MCF5280CVF66J)
- Integrated FlexCAN without external controller （vs MCF5214CAF66)
設計ノート
The MAPBGA-256 package requires a multilayer PCB (minimum 4 layers) with via-in-pad or microvia fan-out technology for reliable assembly. Route all signal traces on inner layers to escape the BGA pattern, and provide a continuous ground plane on layer 2 directly under the package for return-path integrity. Use 0.4 mm ball pitch requiring laser-drilled microvias; standard 0.3 mm mechanical drill vias cannot fit between BGA balls. Apply solder paste with a 0.25 mm stencil aperture and reflow in a nitrogen atmosphere to minimize voiding under the thermal pad.
Estimate: at 66 MHz full activity, the MCF5214CVF66 dissipates approximately 0.5-0.8 W depending on peripheral utilization and I/O toggle frequency. The MAPBGA package's bottom thermal pad must be soldered to a copper pad connected to inner ground planes with a 3x3 thermal-via array (0.3 mm via, 1 mm pitch) for heat extraction. Without this thermal pad connection, junction temperature can exceed 125C and trigger the internal thermal shutdown. For closed-enclosure designs, derate ambient temperature by 10-15C below the 85C industrial maximum.
Do not assume all 142 GPIO pins are 5V-tolerant - the MCF5214CVF66 GPIOs are 3.3V-only with 5V tolerance only on designated pins. Exceeding 3.6V on non-tolerant pins causes latch-up. Add external bus-hold or pull-up resistors on unused pins per the reference manual to avoid floating-input current. When migrating firmware from the MCF5214CVM66 (different pinout), verify the peripheral pin-mux assignments rather than blindly carrying over code - similar part numbers do not guarantee identical pin functions.
コンプライアンス情報
RoHS and lead-free compliance confirmed per NXP product documentation. Not AEC-Q100 qualified - this is an industrial-grade MCU, not automotive. NRND status per NXP product page as of 2026-10-18.
