MCF5214CVF66 - ColdFire V2 32-bit MCU, 256KB Flash, 66MHz, 256-MAPBGA | NXP
MPN: MCF5214CVF66 ✗ Cuối đờiMCF5214CVF66 Tóm tắt
An MCU (microcontroller unit) is a single-chip computer containing a CPU core, program memory (flash), data memory (SRAM), and integrated peripherals such as timers, communication controllers, and analog blocks. The ColdFire V2 core is a variable-length RISC architecture derived from the original Motorola 68000 family, optimized for embedded control with a focus on code density and low power. Within the broader taxonomy, the MCF5214CVF66 sits at: microcontroller -> 32-bit MCU -> ColdFire family -> ColdFire V2 core.
Key differentiating features of the MCF5214CVF66 include: (1) 66 MHz ColdFire V2 core with up to 56 MIPS Dhrystone 2.1 performance, (2) 256 KB of secure, interleaved flash with near-single-cycle access, (3) hardware multiply-accumulate (MAC) unit for DSP-style signal processing, (4) FlexCAN module for industrial networking, and (5) 16-bit ADC and multiple timer/PWM modules for motor and power control. The MAPBGA-256 footprint offers high I/O density but requires multilayer PCB design with via-in-pad for fan-out.
Architecturally, the MCF5214CVF66 uses a Harvard-style bus with separate program and data paths feeding the ColdFire V2 pipeline. The flash memory controller supports concurrent code-fetch from one bank while programming or erasing another, enabling field-upgradeable firmware without code execution stalls. An integrated PLL synthesizes the 66 MHz system clock from an external crystal or oscillator, allowing flexible clock-tree design.
Typical applications include industrial automation controllers, CAN-node motor drives, building-automation gateways, and embedded HMI panels. The combination of three UARTs, CAN, and I²C enables multi-protocol bridging in factory-floor equipment, while the 16-bit ADC supports sensor acquisition loops in process-control nodes.
When designing with the MCF5214CVF66, plan for a multilayer PCB (at least 4 layers) with continuous ground planes under the MAPBGA footprint to control impedance and provide thermal spreading. Because the part is NRND, design teams should evaluate migration to the active MCF51CN or Kinetis families for new production, and source remaining inventory only through authorized distributors.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho MCF5214CVF66 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với MCF5214CVF66 (cùng hình factor và footprint) — khác nhau ở Package, CAN, Connectivity, Ethernet, Mounting Type.
MCF5280CVF66J
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MCF5281CVM66J
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MCF5282CVM66J
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MCF5216CVF66
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MCF5214CAF66
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
MCF5214CVF66 Tỷ lệ tối đa & tính chất điện
| Core Processor | ColdFire V2 |
| Core Size | 32-Bit |
| Maximum Clock Speed | 66 MHz |
| Program Memory Size | 256 KB (256K x 8) Flash |
| RAM Size | 32 KB |
| Number of I/O | 142 |
| Hộp | 256-MAPBGA (17x17 mm) |
| Connectivity | CANbus, EBI/EMI, I²C, SPI, UART/USART |
| Peripherals | DMA, LVD, POR, PWM, WDT |
| Data Converters | A/D 8x12b |
| Điện áp cung cấp | 3.0 V to 3.6 V |
| Nhiệt độ hoạt động | -40C to +85C (industrial) |
| Kiểu lắp đặt | Surface Mount |
| Cấp MSL | 3 |
| Trạng thái RoHS | Compliant |
| Trạng thái vòng đời | NRND (Not Recommended for New Designs) |
Hướng dẫn cấu hình chân MCF5214CVF66 256-mapbga (17x17 mm)
Cấu hình chân cho MCF5214CVF66 (256-mapbga (17x17 mm) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho MCF5214CVF66.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
MCF5214CVF66 phù hợp cho 6 Áp dụngs: Industrial CAN-Node Controller, Building Automation Gateway, Motor Control / PWM Drive Stage, Embedded HMI Control Panel, Multi-Protocol Serial Bridge, Data Acquisition Front-End.
Industrial CAN-Node Controller
The MCF5214CVF66's integrated FlexCAN module and 66 MHz ColdFire V2 core make it ideal for industrial CAN-node controllers in factory automation. The FlexCAN peripheral supports CAN 2.0A/B protocols at up to 1 Mbit/s, enabling deterministic communication with servo drives, sensors, and PLCs on the factory floor. With 256 KB of flash, the MCU accommodates the CANopen or DeviceNet protocol stack alongside application code without external memory. The 142 GPIO pins drive status LEDs, opto-isolated inputs, and relay outputs typical of industrial I/O nodes, while the three UARTs bridge to legacy RS-485 instrumentation. ColdFire V2's hardware MAC unit accelerates signal-processing tasks such as vibration analysis on predictive-maintenance sensor nodes.
Được đề xuất
Building Automation Gateway
In building-automation gateways, the MCF5214CVF66 aggregates data from HVAC, lighting, and access-control subsystems through its multi-protocol peripheral set. The three independent UARTs interface with BACnet MS/TP, Modbus RTU, and KNX bus modules simultaneously, while I²C connects to environmental sensor arrays and SPI drives a wireless transceiver for cloud uplink. The 256 KB flash accommodates the BACnet stack and protocol translation firmware, and the DMA controller offloads serial-data movement from the core. Industrial temperature grade (-40C to +85C) supports rooftop equipment enclosures, and the MAPBGA package's high I/O count routes all subsystem interfaces without external bus expansion.
Được đề xuất
Motor Control / PWM Drive Stage
The MCF5214CVF66 suits low-to-mid-power motor control with its integrated PWM timer modules and 12-bit ADC. The PWM timers generate complementary outputs for three-phase brushless DC (BLDC) motor drives up to several hundred Hz switching frequency with dead-time insertion. The 8-channel 12-bit ADC samples phase currents and DC-bus voltage for field-oriented control (FOC) loops, while the hardware MAC unit executes the FOC math efficiently. The 66 MHz core provides sufficient bandwidth for sensorless back-EMF observers in pump and fan applications. The MAPBGA package's 142 GPIOs easily route the three-phase gate-driver signals, encoder inputs, and fault-protection lines.
Được đề xuất
Embedded HMI Control Panel
Human-Machine Interface (HMI) panels use the MCF5214CVF66 as the main controller driving character or graphic LCDs via the external bus interface. The EBI/EMI peripheral gluelessly interfaces to parallel LCD modules or external SRAM/PSRAM, freeing the ColdFire V2 core for menu logic and touch-panel scanning. The 32 KB SRAM holds display buffers and event queues, while 256 KB flash stores localized multi-language UI resources. The SPI controller drives resistive-touchscreen A/D converters and the I²C bus manages backlight PWM and ambient-light sensors. Industrial temperature operation supports factory-floor panel installations.
Được đề xuất
Multi-Protocol Serial Bridge
The MCF5214CVF66's three UARTs, one SPI, one I²C, and FlexCAN make it ideal as a multi-protocol serial bridge between industrial networks. Protocol translation between Modbus RTU, Modbus TCP-over-UART, BACnet, and CANopen is handled in firmware with the DMA controller moving data between peripheral buffers and protocol-stack memory. The 66 MHz core sustains wire-speed translation at 115.2 kbaud UART rates across all ports simultaneously. The hardware MAC unit accelerates CRC calculations used in CAN and Modbus frames. Industrial-grade operation and 142 GPIOs route status LEDs and diagnostic pins without external bus expanders.
Được đề xuất
Data Acquisition Front-End
Data acquisition systems leverage the MCF5214CVF66's 12-bit 8-channel ADC and DMA channels to capture multi-sensor analog data at sustained sample rates. The DMA controller streams ADC conversion results directly into SRAM buffers without CPU intervention, freeing the ColdFire V2 core for averaging, scaling, and statistical analysis. The 32 KB SRAM holds several seconds of buffered samples at 100 kSPS aggregate rate. The SPI and I²C ports add digital-sensor inputs (temperature, humidity, accelerometers) alongside the analog channels. The FlexCAN port broadcasts processed data onto a vehicle or industrial CAN bus for downstream logging.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho MCF5214CVF66 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | MCF5280CVF66J | MCF5281CVM66J | MCF5282CVM66J | MCF5216CVF66 | MCF5214CAF66 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-MAPBGA (17x17 mm) | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 |
| Clock Speed | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| Flash Size | 256 KB | 256 KB | 512 KB | 512 KB | 512 KB | 256 KB |
| RAM Size | 32 KB | 32 KB | 64 KB | 64 KB | 32 KB | 32 KB |
| FlexCAN | Yes | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Bảo phân biệt quan trọng
- Highest-density pin-compatible flash option in MCF521x family (vsMCF5281CVM66J)
- Original family member with mature ecosystem support (vsMCF5280CVF66J)
- Integrated FlexCAN without external controller (vsMCF5214CAF66)
Ghi chú thiết kế
The MAPBGA-256 package requires a multilayer PCB (minimum 4 layers) with via-in-pad or microvia fan-out technology for reliable assembly. Route all signal traces on inner layers to escape the BGA pattern, and provide a continuous ground plane on layer 2 directly under the package for return-path integrity. Use 0.4 mm ball pitch requiring laser-drilled microvias; standard 0.3 mm mechanical drill vias cannot fit between BGA balls. Apply solder paste with a 0.25 mm stencil aperture and reflow in a nitrogen atmosphere to minimize voiding under the thermal pad.
Estimate: at 66 MHz full activity, the MCF5214CVF66 dissipates approximately 0.5-0.8 W depending on peripheral utilization and I/O toggle frequency. The MAPBGA package's bottom thermal pad must be soldered to a copper pad connected to inner ground planes with a 3x3 thermal-via array (0.3 mm via, 1 mm pitch) for heat extraction. Without this thermal pad connection, junction temperature can exceed 125C and trigger the internal thermal shutdown. For closed-enclosure designs, derate ambient temperature by 10-15C below the 85C industrial maximum.
Do not assume all 142 GPIO pins are 5V-tolerant - the MCF5214CVF66 GPIOs are 3.3V-only with 5V tolerance only on designated pins. Exceeding 3.6V on non-tolerant pins causes latch-up. Add external bus-hold or pull-up resistors on unused pins per the reference manual to avoid floating-input current. When migrating firmware from the MCF5214CVM66 (different pinout), verify the peripheral pin-mux assignments rather than blindly carrying over code - similar part numbers do not guarantee identical pin functions.
Thông tin tuân thủ
RoHS and lead-free compliance confirmed per NXP product documentation. Not AEC-Q100 qualified - this is an industrial-grade MCU, not automotive. NRND status per NXP product page as of 2026-10-18.
