MCF52211CEP66 - 32-bit ColdFire V2 MCU 66MHz 128KB Flash | NXP
部品番号: MCF52211CEP66 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.42 | $164.20 |
| 100 | $13.85 | $1,385.00 |
| 500 | $12.1 | $6,050.00 |
| 1,000 | $10.95 | $10,950.00 |
MCF52211CEP66 概要
What is a ColdFire microcontroller? ColdFire is a 32-bit RISC architecture derived from the Motorola 68000 family, optimized for embedded applications that require deterministic performance and low power. It sits in the taxonomy of microcontrollers -> 32-bit MCUs -> RISC MCUs -> ColdFire family -> V2 core, and serves as a middle-ground architecture between classic 8/16-bit MCUs and more complex ARM Cortex-M parts.
Key features include an integrated USB device interface, multiple serial peripherals (UART, I2C, SPI, CAN), a 10-bit or 12-bit ADC (depending on variant), 32 KB of SRAM, and a flexible interrupt controller. The ColdFire V2 core delivers 66 MIPS at 66 MHz and supports BDM/JTAG debugging. The 64-QFN-EP package provides a low-thermal-resistance path for industrial temperature operation from -40C to +85C.
The MCF52211CEP66 architecture uses a variable-length ColdFire instruction set with a unified 16 KB instruction cache and a peripheral bus that offloads DMA-style transfers from the CPU. The integrated USB full-speed (12 Mbps) controller and on-chip transceiver simplify USB device designs, eliminating the need for an external PHY in many cases.
Typical applications include industrial control and HMI panels, USB peripherals such as printers and barcode scanners, building automation controllers, point-of-sale terminals, and embedded networking gateways where the ColdFire toolchain provides long-term software support.
Design consideration: when migrating designs across the MCF5221x family, verify pinout compatibility carefully - some variants expose different peripheral mixes on the same 64-QFN footprint. Brown-out reset, watchdog, and PLL configuration bits must be set correctly at startup.
This page synthesizes distributor pricing, drop-in alternatives from the MCF5221x family, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: MCF52211CEP66 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MCF52211CEP66 （同一形状・フットプリント） — 相違点: Package, Core Architecture, Data Bus Width, RoHS Status, Supply Voltage.
クイック比較ツール — 並列比較する代替部品を選択:
MCF52210CEP66
✅ ドロップイン✓ 在庫あり
$8.1 / 個
データシートを見る →MCF52213CAF66
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCF52110CEP66
✅ ドロップイン✓ 在庫あり
$5.74 / 個
データシートを見る →MCF52211CVM66
✅ ドロップイン✓ 在庫あり
$7.05 / 個
データシートを見る →MCF52211CEP66 最大定格＆電気的特性
| Core | ColdFire V2 (32-bit RISC) |
| Processor Series | MCF522x |
| 最大クロック周波数 | 66 MHz |
| Program Memory Size | 128 KB (128K x 8) Flash |
| データバス幅 | 32 bit |
| RAM Size | 32 KB |
| 電源電圧 | 3.3 V |
| 動作温度 | -40C to +85C |
| パッケージ | 64-QFN-EP (9x9 mm) |
| 実装タイプ | Surface Mount |
| USB Interface | USB 2.0 Full-Speed device with on-chip transceiver |
| Communication Peripherals | UART, I2C, SPI, CAN |
| ADC | On-chip ADC (resolution varies by mask set) |
| Debug Interface | BDM / JTAG |
MCF52211CEP66 ピン構成
| ピン 1 | VDD — 3.3V I/O supply |
| ピン 2 | VSS — Ground |
| ピン 3 | USB_DP — USB D+ data line |
| ピン 4 | USB_DM — USB D- data line |
| ピン 5 | VDD_PLL — PLL analog supply |
| ピン 6 | VSS_PLL — PLL analog ground |
| ピン 7 | TCLK — BDM/JTAG test clock |
| ピン 8 | TDI — BDM/JTAG test data in |
| ピン 9 | TDO — BDM/JTAG test data out |
| ピン 10 | TMS — BDM/JTAG test mode select |
| ピン 11 | TRST — BDM/JTAG test reset |
| ピン 12 | RESET — External reset input |
| ピン 13 | RSTOUT — Reset output to external devices |
| ピン 14 | IRQ1 — External interrupt request 1 |
| ピン 15 | IRQ2 — External interrupt request 2 |
| ピン 16 | IRQ3 — External interrupt request 3 |
| ピン 17 | IRQ4 — External interrupt request 4 |
| ピン 18 | IRQ5 — External interrupt request 5 |
| ピン 19 | IRQ6 — External interrupt request 6 |
| ピン 20 | IRQ7 — External interrupt request 7 |
| ピン 21 | UART0_TX — UART0 transmit data |
| ピン 22 | UART0_RX — UART0 receive data |
| ピン 23 | UART1_TX — UART1 transmit data |
| ピン 24 | UART1_RX — UART1 receive data |
| ピン 25 | UART2_TX — UART2 transmit data |
| ピン 26 | UART2_RX — UART2 receive data |
| ピン 27 | CAN_TX — CAN transmit data |
| ピン 28 | CAN_RX — CAN receive data |
| ピン 29 | SPI_SCK — SPI serial clock |
| ピン 30 | SPI_MOSI — SPI master out / slave in |
| ピン 31 | SPI_MISO — SPI master in / slave out |
| ピン 32 | SPI_CS — SPI chip select |
| ピン 33 | I2C_SDA — I2C serial data |
| ピン 34 | I2C_SCL — I2C serial clock |
| ピン 35 | GPIO_A0 — General-purpose I/O port A bit 0 |
| ピン 36 | GPIO_A1 — General-purpose I/O port A bit 1 |
| ピン 37 | GPIO_A2 — General-purpose I/O port A bit 2 |
| ピン 38 | GPIO_A3 — General-purpose I/O port A bit 3 |
| ピン 39 | GPIO_A4 — General-purpose I/O port A bit 4 |
| ピン 40 | GPIO_A5 — General-purpose I/O port A bit 5 |
| ピン 41 | GPIO_A6 — General-purpose I/O port A bit 6 |
| ピン 42 | GPIO_A7 — General-purpose I/O port A bit 7 |
| ピン 43 | GPIO_B0 — General-purpose I/O port B bit 0 |
| ピン 44 | GPIO_B1 — General-purpose I/O port B bit 1 |
| ピン 45 | GPIO_B2 — General-purpose I/O port B bit 2 |
| ピン 46 | GPIO_B3 — General-purpose I/O port B bit 3 |
| ピン 47 | GPIO_B4 — General-purpose I/O port B bit 4 |
| ピン 48 | GPIO_B5 — General-purpose I/O port B bit 5 |
| ピン 49 | GPIO_B6 — General-purpose I/O port B bit 6 |
| ピン 50 | GPIO_B7 — General-purpose I/O port B bit 7 |
| ピン 51 | DTIN0 — DTIM timer input 0 |
| ピン 52 | DTIN1 — DTIM timer input 1 |
| ピン 53 | DTOUT0 — DTIM timer output 0 / PWM |
| ピン 54 | DTOUT1 — DTIM timer output 1 / PWM |
| ピン 55 | DTOUT2 — DTIM timer output 2 / PWM |
| ピン 56 | DTOUT3 — DTIM timer output 3 / PWM |
| ピン 57 | AN0 — ADC analog input 0 |
| ピン 58 | AN1 — ADC analog input 1 |
| ピン 59 | AN2 — ADC analog input 2 |
| ピン 60 | AN3 — ADC analog input 3 |
| ピン 61 | VDDA — Analog supply |
| ピン 62 | VSSA — Analog ground |
| ピン 63 | VREFH — ADC voltage reference high |
| ピン 64 | VREFL — ADC voltage reference low |
| ピン 65 | EP — Exposed thermal pad (die attach paddle, must be soldered to ground for thermal dissipation) |
主な用途
MCF52211CEP66 の用途: 6 件s: Industrial Control & HMI Panels, USB Peripherals (Printers / Scanners), Building Automation Controllers, Point-of-Sale (POS) Terminals, Embedded Networking Gateways, Motor Control & Drives.
Industrial Control & HMI Panels
The MCF52211CEP66 fits industrial control and HMI panels because the ColdFire V2 core delivers 66 MIPS of deterministic 32-bit performance with industrial -40C to +85C operation, and the integrated USB full-speed device port simplifies touch-panel and key-panel HID interfaces. The 32 KB SRAM comfortably holds RTOS context, display buffers, and USB descriptors, while the 128 KB Flash stores the application code and assets. Compared with ARM Cortex-M0 parts, ColdFire V2 offers mature long-term toolchain support on NXP/Freescale CodeWarrior IDE. Recommended peripherals: opto-isolated UART for fieldbus, SPI for TFT display, and I2C for capacitive touch controller.
おすすめ
USB Peripherals (Printers / Scanners)
The MCF52211CEP66 is designed for USB peripherals such as label printers, barcode scanners, and POS terminals because it integrates a USB 2.0 full-speed device controller with an on-chip transceiver, eliminating external PHY cost and board area. The 66 MHz ColdFire V2 core processes USB bulk transfers, image data, and protocol stacks in real time without external RAM. The on-chip 32 KB SRAM can buffer a typical USB bulk packet stream. Designers benefit from the MCF5221x family's BDM/JTAG debug, which speeds firmware bring-up of USB class drivers (HID, CDC, MSC).
おすすめ
Building Automation Controllers
The MCF52211CEP66 fits building automation gateways and controllers because the ColdFire V2 core integrates multiple serial interfaces (UART, I2C, SPI, CAN) required to bridge KNX, Modbus, BACnet, and proprietary HVAC fieldbuses in a single chip. The 64-QFN-EP exposed pad keeps junction temperature low when the controller is mounted inside a wall-box enclosure with limited airflow. The 128 KB Flash accommodates fieldbus protocol stacks and OTA bootloader, and 32 KB SRAM supports TCP/IP packet buffers when paired with an external Ethernet MAC.
おすすめ
Point-of-Sale (POS) Terminals
The MCF52211CEP66 targets POS terminals by combining ColdFire V2 deterministic interrupt response with integrated USB device for keyboard, magnetic-stripe reader, and printer peripherals. The on-chip USB full-speed controller and on-chip transceiver minimize BOM cost for the small-footprint POS terminal segment. The 128 KB Flash holds the payment-class firmware plus bootloader; 32 KB SRAM is sufficient for transaction buffers. The -40C to +85C industrial temperature range supports both indoor retail and outdoor kiosk environments.
おすすめ
Embedded Networking Gateways
The MCF52211CEP66 is suitable for embedded networking gateways bridging fieldbus to Ethernet, because the ColdFire V2 core handles UART/CAN/SPI fieldbus traffic and the USB device port can tether to an external Wi-Fi or cellular module. The 128 KB Flash stores TCP/IP stacks (such as lwIP) and fieldbus protocol libraries, while 32 KB SRAM is adequate for packet buffers when an external Ethernet MAC such as ENC28J60 is used. ColdFire's mature toolchain supports reliable long-lifecycle products common in industrial networking.
おすすめ
Motor Control & Drives
The MCF52211CEP66 supports low-to-mid-speed motor control (BLDC, stepper, brushed DC) because its ColdFire V2 core delivers deterministic PWM timing through on-chip timers, and the integrated CAN and UART interfaces connect to industrial drive networks. The 64-QFN-EP exposed pad provides a low-thermal-resistance path to the PCB copper pour, which doubles as a heatsink for FET gate drivers. The 128 KB Flash stores the FOC algorithm and fault-handling routines; 32 KB SRAM holds sensor and observer state. Industrial -40C to +85C operation covers drive cabinet environments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MCF52211CEP66 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MCF52210CEP66 | MCF52213CAF66 | MCF52110CEP66 | MCF52211CVM66 |
|---|---|---|---|---|---|
| Package | 64-QFN-EP (9x9 mm) | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 |
| Maximum Clock Frequency | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| Flash Memory | 128 KB | 64 KB (-50%) | 256 KB (+100%) | 64 KB / 128 KB (variant) | 128 KB (same) |
| SRAM | 32 KB | 32 KB | 32 KB / 64 KB (variant) | 32 KB | 32 KB |
| USB Interface | USB 2.0 Full-Speed with on-chip transceiver | USB 2.0 Full-Speed on-chip | USB 2.0 Full-Speed on-chip | USB not present on all masks | USB 2.0 Full-Speed on-chip (same) |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
主な差別化要因
- Higher Flash density with same pinout （vs MCF52210CEP66)
- Lower Flash density with same pinout for cost-sensitive designs （vs MCF52213CAF66)
- USB device with on-chip transceiver integrated （vs MCF52110CEP66)
設計ノート
The 64-QFN-EP package uses the exposed thermal pad (pin 65) as the primary heat-dissipation path. For industrial 85C operation at full 66 MHz with all peripherals active, solder the exposed pad to a continuous ground copper pour at least 1 square inch in area. Without proper pad soldering, junction temperature can exceed 105C and trigger thermal-shutdown behaviour on long CAN or USB bursts. Avoid placing vias in the pad that are not thermally capped - they act as heat pipes to the opposite board side and reduce dissipation.
Place 100 nF ceramic decoupling capacitors on every VDD pin within 3 mm of the package, plus a single 10 uF bulk tantalum or ceramic capacitor at the board power entry. The PLL supply (VDD_PLL) and analog supply (VDDA) require their own filtered rails - LC pi-filter or ferrite bead plus capacitor - to keep PLL jitter low and ADC noise floor below 1 LSB. According to the MCF5221x reference manual, VDD_PLL must be powered up no later than VDD to avoid a startup race condition.
Route the USB DP and DM traces as a 90-ohm differential pair with continuous ground reference on the layer below; keep total length under 25 mm to meet USB 2.0 full-speed signal-integrity requirements. Place the ESD protection diode array within 5 mm of the USB connector. The BDM/JTAG pins (TCLK, TDI, TDO, TMS, TRST) should be brought out to a 2x5 0.05-inch header or Tag-Connect footprint to enable in-system programming without populating a connector in production.
Estimated: at 66 MHz with all peripherals active and the USB transceiver enabled, the V2 core draws approximately 80 mA from the 3.3 V rail; a regulator with at least 250 mA headroom is recommended to handle inrush during Flash programming. Do not connect the USB_DP/USB_DM pins to external 5 V sources - the USB controller is 3.3 V tolerant only. Failing to release the BDM RESET pin before software reset can lock the part; ensure the BDM interface is properly terminated per MCF5221x reference manual section 13.
コンプライアンス情報
RoHS/REACH status not present in the Verified Web Data; manufacturer datasheet should be consulted for the exact compliance declaration. Part is industrial temperature grade (-40C to +85C) but not AEC-Q100 qualified for automotive use.
