MCF5270CVM150 - ColdFire V2 MPU 150MHz 196-LBGA | NXP
部品番号: MCF5270CVM150 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $22.28 | $22.28 |
| 10 | $20.05 | $200.50 |
| 100 | $18.84 | $1,884.00 |
| 500 | $17.1 | $8,550.00 |
| 1,000 | $16.13 | $16,130.00 |
MCF5270CVM150 概要
A ColdFire V2 microprocessor is a 32-bit RISC architecture derived from the original Motorola 68000 family, repositioned by NXP (formerly Freescale) for cost-sensitive, power-conscious embedded designs. ColdFire V2 devices sit in the MPU/microcontroller hierarchy between low-end 8/16-bit MCUs and higher-end ColdFire V4/V5 application processors, providing deterministic interrupt response, on-chip debug, and integrated connectivity peripherals that make them well suited to industrial control, networking, and human-machine interface (HMI) systems.
Key features of the MCF5270CVM150 include a 150 MHz V2 core delivering up to approximately 130 MIPS (Dhrystone 2.1), 64 KB on-chip SRAM, a 4-channel DMA controller with external request/acknowledge, watchdog timer, and 97 general-purpose I/O pins. Connectivity is provided by an integrated 10/100 Ethernet MAC, USB (device/host), UART/USART, I2C, and SPI peripherals together with an external bus interface (EBI/EMI) for SDRAM and external memory expansion. The program memory is ROMless, requiring external flash boot.
Architecturally, the MCF5270CVM150 uses the ColdFire V2 variable-length instruction set with an enhanced hardware multiply-accumulate (eMAC) unit and hardware divide, giving it strong integer DSP-like performance for protocol parsing, filtering, and motion-control loops. The 196-ball MAPBGA substrate supports the wide external bus and many simultaneous peripheral interfaces without internal cross-talk penalties.
Typical applications include industrial control and factory automation nodes, networked HMI panels, point-of-sale (POS) terminals, networked printers, embedded web/ Telnet servers, and remote data acquisition gateways. Designers pick the MCF5270CVM150 when they need deterministic ColdFire performance with built-in Ethernet and a manageable BGA footprint.
When laying out this 196-LBGA part, follow NXP's MAPBGA escape recommendations, providing at least four routing layers and matched-length Ethernet MII traces. The ROMless variant requires an external boot flash; verify your boot configuration against the NXP datasheet's reset and chip-select tables before finalizing the BOM.
This page synthesizes distributor pricing, same-family drop-in alternatives in the same 196-MAPBGA footprint, and practical layout notes that go beyond what the manufacturer datasheet alone provides for sourcing and design engineers.
ドロップイン代替品: MCF5270CVM150 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MCF5270CVM150 （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Peripherals, RAM Size, Core Processor.
クイック比較ツール — 並列比較する代替部品を選択:
MCF5271CVM150
✅ ドロップイン✓ 在庫あり
$19.85 / 個
データシートを見る →MCF5270CVM150-FR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$18.95 / 個
データシートを見る →MCF5272VF66
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCF5232CVM150
✅ ドロップイン✓ 在庫あり
$26.5 / 個
データシートを見る →MCF5270VM100
✅ ドロップイン✓ 在庫あり
$23.12 / 個
データシートを見る →MCF5270CVM150 最大定格＆電気的特性
| Core Processor | ColdFire V2 |
| Core Size | 32-Bit |
| 最大クロック周波数 | 150 MHz |
| Program Memory Type | ROMless |
| RAM Size | 64 KB (on-chip SRAM) |
| Connectivity | EBI/EMI, Ethernet (10/100), I2C, SPI, UART/USART |
| Number of I/O | 97 |
| Peripherals | DMA, WDT |
| DMA Channels | 4 (with external request/acknowledge) |
| Supply Voltage (Vcc/Vdd) | 1.4 V to 1.6 V (core) |
| Oscillator Type | External |
| 動作温度 | -40 C to +85 C (TA) |
| 実装タイプ | Surface Mount |
| パッケージ | 196-LBGA (MAPBGA), 15 x 15 mm |
MCF5270CVM150 196-lbga (mapbga), 15 x 15 mm ピン配置ガイド
MCF5270CVM150 (196-lbga (mapbga), 15 x 15 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MCF5270CVM150.
詳細は データシート をご参照ください。
主な用途
MCF5270CVM150 の用途: 6 件s: Industrial Ethernet Gateway, Human-Machine Interface (HMI) Panels, Point-of-Sale (POS) Terminals, Networked Printers and Imaging Devices, Remote Data Acquisition / SCADA Nodes, Embedded Web / Telnet Servers.
Industrial Ethernet Gateway
The NXP MCF5270CVM150 is well suited as the central processor in cost-sensitive industrial Ethernet gateways. Its integrated 10/100 MAC and 4-channel DMA controller offload TCP/IP framing, while the 150 MHz ColdFire V2 core supplies enough headroom for protocol conversion stacks (Modbus TCP, EtherNet/IP, PROFINET). Used in DIN-rail mounted controllers and protocol bridges on the factory floor, it typically pairs with external SPI flash and an SDRAM on the EBI/EMI bus; the 196-LBGA package keeps the overall node footprint near 50 x 50 mm. Trade-off: the part is NRND as of 2026-10-17, so for greenfield designs consider migrating to the i.MX RT1170 crossover MCU which adds GbE and Cortex-M7 performance at similar BOM cost.
おすすめ
Human-Machine Interface (HMI) Panels
HMI panels and operator interfaces benefit from the MCF5270CVM150's combination of integrated Ethernet, sufficient compute for embedded web servers, and a BGA package that simplifies multilayer PCB layout. At 150 MHz the core handles thin-client web rendering, data logging, and touch-controller SPI polling without offloading to a companion MCU. The 196-LBGA (15 x 15 mm) keeps the panel's main board compact, while the -40 C to +85 C industrial temperature rating supports enclosure-internal operation. Pair with an external QSPI flash and 32 MB SDRAM for typical HMI graphics stacks; the four-channel DMA ensures the LCD refresh path does not stall Ethernet traffic.
おすすめ
Point-of-Sale (POS) Terminals
POS terminals rely on the MCF5270CVM150's Ethernet MAC for IP-based payment processing, its UART/USART for cash-drawer and printer integration, and the SPI/I2C buses for secure PIN-pad peripherals. The 97 GPIO pins comfortably cover keypad matrices, mag-stripe readers, and customer displays, while the 64 KB on-chip SRAM buffers transactional data without external waits. Deployed in retail environments, the part must operate reliably at the upper industrial temperature range; the 196-LBGA package is well supported by standard 4-layer reflow processes used in volume POS manufacturing.
おすすめ
Networked Printers and Imaging Devices
The MCF5270CVM150's combination of Ethernet, USB, and a wide external bus fits networked printers and multifunction imaging devices where image data passes through the device at line-rate. The DMA controller can move imaging buffers between the external bus and the Ethernet/USB controllers in parallel with the CPU processing PDL (page-description language) rasterization. Per the manufacturer datasheet, the ColdFire V2 eMAC accelerates the integer math commonly used in compression, giving measurable throughput gains over generic Cortex-M3 designs at the same clock.
おすすめ
Remote Data Acquisition / SCADA Nodes
SCADA remote terminal units (RTUs) and standalone data-acquisition nodes use the MCF5270CVM150 for deterministic polling of analog/digital sensors, local buffering of the 64 KB SRAM, and uplink over Ethernet or serial protocols. The watchdog timer is critical for unattended deployments, and the industrial -40 C to +85 C temperature range suits outdoor enclosures. Designers typically add an external RTC and supervisory supply, since the ROMless part requires external boot configuration and rail sequencing.
おすすめ
Embedded Web / Telnet Servers
The MCF5270CVM150 powers low-cost embedded web servers used in remote equipment management. With uClinux or a RTOS such as RTEMS, the ColdFire V2 core delivers sufficient throughput for HTTPS/CGI page generation, Telnet/SSH sessions, and basic SNMP polling. Its compact 196-LBGA package, integrated 10/100 MAC, and 64 KB SRAM enable single-chip server designs - useful for industrial UPS monitoring, telecom rectifiers, and building-automation controllers. Trade-off vs newer alternatives: the MCF5270CVM150 lacks hardware encryption acceleration, so TLS handshakes are CPU-bound; for security-heavy applications, plan accordingly.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MCF5270CVM150 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MCF5271CVM150 | MCF5270CVM150-FR | MCF5272VF66 | MCF5232CVM150 | MCF5270VM100 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 196-LBGA (MAPBGA) 15x15 mm | 196-LBGA (MAPBGA) 15x15 mm - same | 196-LBGA (MAPBGA) 15x15 mm - same | 196-LBGA (MAPBGA) - same family | 196-LBGA (MAPBGA) - same footprint | 196-LBGA (MAPBGA) - same footprint |
| Core | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) |
| Maximum Clock Frequency | 150 MHz | 150 MHz (lower-grade spec, similar) | 150 MHz | 166 MHz (higher grade) | 150 MHz | 100 MHz |
| On-chip SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Program Memory Type | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless |
| Integrated Ethernet MAC | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 |
| Number of I/O | 97 | 97 | 97 | 97 | 97 | 97 |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
主な差別化要因
- Integrated 10/100 Ethernet MAC in BGA class （vs MCF5270VM100)
- Mass-production supply chain still active （vs MCF5272VF66)
- 97 GPIO with ColdFire V2 DSP-like MAC acceleration （vs MCF5232CVM150)
設計ノート
The 196-LBGA (MAPBGA) 15 x 15 mm package requires at least a 4-layer PCB with continuous ground and power planes under the BGA. Use 0.4 mm ball pitch escapes with microvia-in-pad if your fab supports it; otherwise follow dog-bone fan-out with matched trace lengths. Per NXP's reference manual, the part will not boot reliably without a clean 1.5 V core rail and a properly decoupled 3.3 V I/O rail - place at least 1 x 10 uF plus 4 x 100 nF within 5 mm of the BGA.
Estimated: with all four DMA channels active, the 10/100 Ethernet MAC streaming full duplex, and the core at 150 MHz, the typical junction rise is in the 15-25 C range over ambient on a properly designed 4-layer PCB. Estimated input values: theta_JA roughly 25 C/W on a JEDEC JESD51-9 4-layer test board, theta_JC under 5 C/W. Provide thermal vias under the center BGA balls for sustained thermal margin.
Do not rely on the internal SRAM for non-volatile storage - the MCF5270CVM150 is ROMless and requires an external boot flash. Ensure chip-select configuration matches the datasheet's reset state, otherwise the BDM interface will appear unresponsive. ColdFire V2 BDM uses a unique 2-wire protocol; most P&E Multilink and OSBDM adapters support it but verify toolchain compatibility before layout freeze.
Match Ethernet MII/ RMII trace lengths to within 50 mil of each other and keep the differential pairs length-matched within 5 mil. Use a 50 ohm controlled-impedance stackup. The external bus uses SDRAM on the MCF5270; route address/command/clock with matched-length traces (target within +/- 250 ps) and 33 ohm series termination if you see ringing on the bus.
コンプライアンス情報
Compliance status not stated in the reviewed distributor pages; consult NXP's environmental compliance documentation directly for RoHS, REACH, lead-free, and halogen-free status before production releases. AEC-Q100 is not applicable to this general-purpose MPU.
