MCF5270CVM150 - ColdFire V2 MPU 150MHz 196-LBGA | NXP
MPN: MCF5270CVM150 ✗ סוף ייצורMCF5270CVM150 סקירה
A ColdFire V2 microprocessor is a 32-bit RISC architecture derived from the original Motorola 68000 family, repositioned by NXP (formerly Freescale) for cost-sensitive, power-conscious embedded designs. ColdFire V2 devices sit in the MPU/microcontroller hierarchy between low-end 8/16-bit MCUs and higher-end ColdFire V4/V5 application processors, providing deterministic interrupt response, on-chip debug, and integrated connectivity peripherals that make them well suited to industrial control, networking, and human-machine interface (HMI) systems.
Key features of the MCF5270CVM150 include a 150 MHz V2 core delivering up to approximately 130 MIPS (Dhrystone 2.1), 64 KB on-chip SRAM, a 4-channel DMA controller with external request/acknowledge, watchdog timer, and 97 general-purpose I/O pins. Connectivity is provided by an integrated 10/100 Ethernet MAC, USB (device/host), UART/USART, I2C, and SPI peripherals together with an external bus interface (EBI/EMI) for SDRAM and external memory expansion. The program memory is ROMless, requiring external flash boot.
Architecturally, the MCF5270CVM150 uses the ColdFire V2 variable-length instruction set with an enhanced hardware multiply-accumulate (eMAC) unit and hardware divide, giving it strong integer DSP-like performance for protocol parsing, filtering, and motion-control loops. The 196-ball MAPBGA substrate supports the wide external bus and many simultaneous peripheral interfaces without internal cross-talk penalties.
Typical applications include industrial control and factory automation nodes, networked HMI panels, point-of-sale (POS) terminals, networked printers, embedded web/ Telnet servers, and remote data acquisition gateways. Designers pick the MCF5270CVM150 when they need deterministic ColdFire performance with built-in Ethernet and a manageable BGA footprint.
When laying out this 196-LBGA part, follow NXP's MAPBGA escape recommendations, providing at least four routing layers and matched-length Ethernet MII traces. The ROMless variant requires an external boot flash; verify your boot configuration against the NXP datasheet's reset and chip-select tables before finalizing the BOM.
This page synthesizes distributor pricing, same-family drop-in alternatives in the same 196-MAPBGA footprint, and practical layout notes that go beyond what the manufacturer datasheet alone provides for sourcing and design engineers.
חלופות תחליף ישיר עבור MCF5270CVM150 — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם MCF5270CVM150 (אותו גורם צורה וטביעת רגל) — שונים ב Package, Operating Temperature, Peripherals, RAM Size, Core Processor.
MCF5271CVM150
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←MCF5270CVM150-FR
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←MCF5272VF66
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MCF5232CVM150
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←MCF5270VM100
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←MCF5270CVM150 דירוגים מרביים ומאפיינים חשמליים
| Core Processor | ColdFire V2 |
| Core Size | 32-Bit |
| תדר שעון מקסימלי | 150 MHz |
| Program Memory Type | ROMless |
| RAM Size | 64 KB (on-chip SRAM) |
| Connectivity | EBI/EMI, Ethernet (10/100), I2C, SPI, UART/USART |
| Number of I/O | 97 |
| Peripherals | DMA, WDT |
| DMA Channels | 4 (with external request/acknowledge) |
| Supply Voltage (Vcc/Vdd) | 1.4 V to 1.6 V (core) |
| Oscillator Type | External |
| טמפרטורת פעולה | -40 C to +85 C (TA) |
| סוג הרכבה | Surface Mount |
| מארז | 196-LBGA (MAPBGA), 15 x 15 mm |
מדריך תצורת פינים של MCF5270CVM150 196-lbga (mapbga), 15 x 15 mm
תצורת פינים עבור MCF5270CVM150 (מארזת 196-lbga (mapbga), 15 x 15 mm). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור MCF5270CVM150.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
MCF5270CVM150 מתאים עבור 6 יישוםs: Industrial Ethernet Gateway, Human-Machine Interface (HMI) Panels, Point-of-Sale (POS) Terminals, Networked Printers and Imaging Devices, Remote Data Acquisition / SCADA Nodes, Embedded Web / Telnet Servers.
Industrial Ethernet Gateway
The NXP MCF5270CVM150 is well suited as the central processor in cost-sensitive industrial Ethernet gateways. Its integrated 10/100 MAC and 4-channel DMA controller offload TCP/IP framing, while the 150 MHz ColdFire V2 core supplies enough headroom for protocol conversion stacks (Modbus TCP, EtherNet/IP, PROFINET). Used in DIN-rail mounted controllers and protocol bridges on the factory floor, it typically pairs with external SPI flash and an SDRAM on the EBI/EMI bus; the 196-LBGA package keeps the overall node footprint near 50 x 50 mm. Trade-off: the part is NRND as of 2026-10-17, so for greenfield designs consider migrating to the i.MX RT1170 crossover MCU which adds GbE and Cortex-M7 performance at similar BOM cost.
מומלץ
Human-Machine Interface (HMI) Panels
HMI panels and operator interfaces benefit from the MCF5270CVM150's combination of integrated Ethernet, sufficient compute for embedded web servers, and a BGA package that simplifies multilayer PCB layout. At 150 MHz the core handles thin-client web rendering, data logging, and touch-controller SPI polling without offloading to a companion MCU. The 196-LBGA (15 x 15 mm) keeps the panel's main board compact, while the -40 C to +85 C industrial temperature rating supports enclosure-internal operation. Pair with an external QSPI flash and 32 MB SDRAM for typical HMI graphics stacks; the four-channel DMA ensures the LCD refresh path does not stall Ethernet traffic.
מומלץ
Point-of-Sale (POS) Terminals
POS terminals rely on the MCF5270CVM150's Ethernet MAC for IP-based payment processing, its UART/USART for cash-drawer and printer integration, and the SPI/I2C buses for secure PIN-pad peripherals. The 97 GPIO pins comfortably cover keypad matrices, mag-stripe readers, and customer displays, while the 64 KB on-chip SRAM buffers transactional data without external waits. Deployed in retail environments, the part must operate reliably at the upper industrial temperature range; the 196-LBGA package is well supported by standard 4-layer reflow processes used in volume POS manufacturing.
מומלץ
Networked Printers and Imaging Devices
The MCF5270CVM150's combination of Ethernet, USB, and a wide external bus fits networked printers and multifunction imaging devices where image data passes through the device at line-rate. The DMA controller can move imaging buffers between the external bus and the Ethernet/USB controllers in parallel with the CPU processing PDL (page-description language) rasterization. Per the manufacturer datasheet, the ColdFire V2 eMAC accelerates the integer math commonly used in compression, giving measurable throughput gains over generic Cortex-M3 designs at the same clock.
מומלץ
Remote Data Acquisition / SCADA Nodes
SCADA remote terminal units (RTUs) and standalone data-acquisition nodes use the MCF5270CVM150 for deterministic polling of analog/digital sensors, local buffering of the 64 KB SRAM, and uplink over Ethernet or serial protocols. The watchdog timer is critical for unattended deployments, and the industrial -40 C to +85 C temperature range suits outdoor enclosures. Designers typically add an external RTC and supervisory supply, since the ROMless part requires external boot configuration and rail sequencing.
מומלץ
Embedded Web / Telnet Servers
The MCF5270CVM150 powers low-cost embedded web servers used in remote equipment management. With uClinux or a RTOS such as RTEMS, the ColdFire V2 core delivers sufficient throughput for HTTPS/CGI page generation, Telnet/SSH sessions, and basic SNMP polling. Its compact 196-LBGA package, integrated 10/100 MAC, and 64 KB SRAM enable single-chip server designs - useful for industrial UPS monitoring, telecom rectifiers, and building-automation controllers. Trade-off vs newer alternatives: the MCF5270CVM150 lacks hardware encryption acceleration, so TLS handshakes are CPU-bound; for security-heavy applications, plan accordingly.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור MCF5270CVM150 — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | MCF5271CVM150 | MCF5270CVM150-FR | MCF5272VF66 | MCF5232CVM150 | MCF5270VM100 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 196-LBGA (MAPBGA) 15x15 mm | 196-LBGA (MAPBGA) 15x15 mm - same | 196-LBGA (MAPBGA) 15x15 mm - same | 196-LBGA (MAPBGA) - same family | 196-LBGA (MAPBGA) - same footprint | 196-LBGA (MAPBGA) - same footprint |
| Core | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) |
| Maximum Clock Frequency | 150 MHz | 150 MHz (lower-grade spec, similar) | 150 MHz | 166 MHz (higher grade) | 150 MHz | 100 MHz |
| On-chip SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Program Memory Type | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless |
| Integrated Ethernet MAC | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 |
| Number of I/O | 97 | 97 | 97 | 97 | 97 | 97 |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
מבדילים עיקריים
- Integrated 10/100 Ethernet MAC in BGA class (לעומתMCF5270VM100)
- Mass-production supply chain still active (לעומתMCF5272VF66)
- 97 GPIO with ColdFire V2 DSP-like MAC acceleration (לעומתMCF5232CVM150)
הערות תכנון
The 196-LBGA (MAPBGA) 15 x 15 mm package requires at least a 4-layer PCB with continuous ground and power planes under the BGA. Use 0.4 mm ball pitch escapes with microvia-in-pad if your fab supports it; otherwise follow dog-bone fan-out with matched trace lengths. Per NXP's reference manual, the part will not boot reliably without a clean 1.5 V core rail and a properly decoupled 3.3 V I/O rail - place at least 1 x 10 uF plus 4 x 100 nF within 5 mm of the BGA.
Estimated: with all four DMA channels active, the 10/100 Ethernet MAC streaming full duplex, and the core at 150 MHz, the typical junction rise is in the 15-25 C range over ambient on a properly designed 4-layer PCB. Estimated input values: theta_JA roughly 25 C/W on a JEDEC JESD51-9 4-layer test board, theta_JC under 5 C/W. Provide thermal vias under the center BGA balls for sustained thermal margin.
Do not rely on the internal SRAM for non-volatile storage - the MCF5270CVM150 is ROMless and requires an external boot flash. Ensure chip-select configuration matches the datasheet's reset state, otherwise the BDM interface will appear unresponsive. ColdFire V2 BDM uses a unique 2-wire protocol; most P&E Multilink and OSBDM adapters support it but verify toolchain compatibility before layout freeze.
Match Ethernet MII/ RMII trace lengths to within 50 mil of each other and keep the differential pairs length-matched within 5 mil. Use a 50 ohm controlled-impedance stackup. The external bus uses SDRAM on the MCF5270; route address/command/clock with matched-length traces (target within +/- 250 ps) and 33 ohm series termination if you see ringing on the bus.
מידע על תאימות
Compliance status not stated in the reviewed distributor pages; consult NXP's environmental compliance documentation directly for RoHS, REACH, lead-free, and halogen-free status before production releases. AEC-Q100 is not applicable to this general-purpose MPU.
