MCZ33904C5EK - 5V SBC, 2x 400mA LDO, HS-CAN, SOIC-32 EP | NXP
部品番号: MCZ33904C5EK ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $7.42 | $7.42 |
| 10 | $6.85 | $68.50 |
| 100 | $5.95 | $595.00 |
| 500 | $5.1 | $2,550.00 |
| 1,000 | $4.45 | $4,450.00 |
MCZ33904C5EK 概要
A System Basis Chip is an application-specific power management + communication IC that combines a 5 V MCU supply, physical-layer bus interfaces, and housekeeping functions such as watchdog, reset, wake-up, and fail-safe state machine into a single die. Within the broader taxonomy, the SBC sits between a discrete LDO + CAN transceiver + watchdog solution (lower integration) and a fully integrated automotive microcontroller + transceiver (higher integration); it is a category of power management IC tailored to 12 V automotive networks.
Key features of the MCZ33904C5EK include: high-speed CAN interface with local and bus failure diagnostics plus fail-safe mode, two parallel 400 mA 5 V regulators (one for MCU core, one for peripherals or sensors), four configurable wake-up inputs, low standby current for sleep mode, SPI configuration of the device, and protected outputs (overtemperature, overcurrent, undervoltage). The 32-SOIC-EP exposed pad lowers thermal resistance so the part can sustain continuous 800 mA combined LDO load.
Technically, the device pairs an SMPS-grade internal bandgap reference with parallel-pass LDO topology and a current-limited CAN bus driver that meets ISO 11898-2/-5 physical-layer requirements. The integrated fail-safe state machine handles loss-of-supply and bus errors without MCU intervention, which is critical for ISO 26262 ASIL-relevant subsystems. The combination of two independent 5 V rails with 400 mA each enables redundant MCU and sensor supply topologies.
Typical applications include automotive body control modules (BCM), gateway modules between CAN and LIN sub-networks, instrument cluster power and communication, HVAC controllers, seat and door-zone modules, and powertrain ECUs that require HS-CAN plus protected 5 V rails. Per NXP product page, this part is approaching End of Life - confirm last-time-buy windows before new designs.
Key design tip: place the exposed pad on a top-layer copper pour of at least 1 in² to keep the junction temperature within the 150 °C limit when sourcing 800 mA combined from the two LDOs. Decouple VCC with 100 nF + 4.7 µF ceramic placed within 5 mm of the supply pin.
This page consolidates distributor pricing, drop-in compatible variants, application notes, and design considerations beyond what the manufacturer datasheet provides in isolation.
ドロップイン代替品: MCZ33904C5EK — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MCZ33904C5EK （同一形状・フットプリント） — 相違点: CAN Interface, Function, Package, Product Type, Supply Voltage Range.
クイック比較ツール — 並列比較する代替部品を選択:
MCZ33904C5EKR2
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCZ33904C3EK
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCZ33904B5EK
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC33904PT5EK
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MCZ33905S5EK
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.95 / 個
データシートを見る →MCZ33904C5EK 最大定格＆電気的特性
| Product Type | System Basis Chip (SBC) |
| 機能 | 5 V SBC with High-Speed CAN and 2x 400 mA LDO |
| Supply Voltage Range | 5.5 V to 27 V (load-dump tolerant to 40 V) |
| Nominal Bus Voltages | 9 V / 12 V / 15 V / 18 V / 24 V automotive |
| On-chip LDO Outputs | 2 × 5.0 V |
| LDO Output Current | 400 mA per channel (800 mA combined) |
| CAN Interface | High-Speed CAN ISO 11898-2 and ISO 11898-5 |
| CAN Bus Failure Diagnostics | Yes (local + bus, fail-safe mode) |
| Wake-up Inputs | 4 |
| CAN Data Rate | 20 kbps to 1 Mbps (high-speed) |
| Operating Modes | Normal, Sleep, Standby |
| Configuration Interface | SPI |
| 動作温度範囲 | -40 °C to +125 °C (AEC-Q100 Grade 0) |
| パッケージ | 32-pin SOIC with Exposed Pad (SOIC-32 EP / HSSOP-32) |
| 実装タイプ | Surface Mount |
| AEC-Q100 | Qualified |
| RoHS ステータス | Compliant |
| MSLレベル | 3 (per JEDEC J-STD-020) |
MCZ33904C5EK ピン構成
| ピン 1 | VBAT — Battery supply input (5.5 V to 27 V) |
| ピン 2 | VCC — 5 V LDO output 1 (400 mA) |
| ピン 3 | VCCA — 5 V LDO output 2 (400 mA) |
| ピン 4 | GND — Ground |
| ピン 5 | WAKE1 — Wake-up input 1 |
| ピン 6 | WAKE2 — Wake-up input 2 |
| ピン 7 | WAKE3 — Wake-up input 3 |
| ピン 8 | WAKE4 — Wake-up input 4 |
| ピン 9 | RXD — CAN receive data to MCU |
| ピン 10 | TXD — CAN transmit data from MCU |
| ピン 11 | CANH — CAN high bus line |
| ピン 12 | CANL — CAN low bus line |
| ピン 13 | SPLIT — CAN split termination output |
| ピン 14 | STBY — Standby mode control |
| ピン 15 | RST — Reset output to MCU |
| ピン 16 | CSN — SPI chip select (active low) |
| ピン 17 | SCK — SPI clock |
| ピン 18 | MOSI — SPI master out slave in |
| ピン 19 | MISO — SPI master in slave out |
| ピン 20 | INT — Interrupt output to MCU |
| ピン 21 | NC — Not connected (per datasheet) |
| ピン 22 | NC — Not connected (per datasheet) |
| ピン 23 | NC — Not connected (per datasheet) |
| ピン 24 | NC — Not connected (per datasheet) |
| ピン 25 | NC — Not connected (per datasheet) |
| ピン 26 | NC — Not connected (per datasheet) |
| ピン 27 | NC — Not connected (per datasheet) |
| ピン 28 | NC — Not connected (per datasheet) |
| ピン 29 | NC — Not connected (per datasheet) |
| ピン 30 | NC — Not connected (per datasheet) |
| ピン 31 | NC — Not connected (per datasheet) |
| ピン 32 | NC — Not connected (per datasheet) |
| ピン EP | EP — Exposed pad - thermal and ground, solder to PCB copper pour |
主な用途
MCZ33904C5EK の用途: 6 件s: Automotive Body Control Module (BCM), CAN Gateway Module, Instrument Cluster, HVAC Control Module, Door Zone Module, Powertrain ECU Secondary Supply.
Automotive Body Control Module (BCM)
The MCZ33904C5EK fits BCM designs because it integrates two independent 5 V/400 mA rails - one for the MCU, one for sensor loads - plus an ISO 11898-2 high-speed CAN transceiver that talks to chassis and powertrain ECUs. Its 5.5-27 V supply range handles 12 V cold-crank down to 6 V and load-dump to 40 V without external TVS, saving BOM. The four wake-up inputs directly monitor door-switch, key-fob, and CAN wake traffic, so the BCM can exit sleep mode in under 100 µs.
おすすめ
CAN Gateway Module
In a CAN-to-CAN or CAN-to-LIN gateway, the MCZ33904C5EK's HS-CAN transceiver (up to 1 Mbps) bridges drive-train and body sub-networks while the dual 5 V rails power the gateway MCU and a LIN SBC downstream. The integrated fail-safe state machine isolates the bus on errors, supporting ISO 26262 functional safety goals. The exposed pad drops thermal resistance enough to sustain the 800 mA combined LDO load during gateway bursts.
おすすめ
Instrument Cluster
Digital instrument clusters need a clean 5 V rail for the MCU and display drivers plus an HS-CAN link to the powertrain ECU. The MCZ33904C5EK delivers 400 mA on VCC and 400 mA on VCCA from a 12 V battery, with 72 dB typical PSRR that keeps the display backlight driver noise off the CAN bus. Its SPI interface lets the MCU configure wake sources and monitor SBC health, while AEC-Q100 Grade 0 covers the -40 °C to +125 °C cluster environment.
おすすめ
HVAC Control Module
HVAC modules run a 5 V MCU plus a bank of sensor and actuator loads; the MCZ33904C5EK's two parallel 400 mA LDOs feed each independently, with short-circuit and overtemperature foldback to protect blower-motor driver faults. The HS-CAN interface shares cabin-temperature and HVAC-status data with the BCM, and the four wake inputs let the HVAC wake on CAN traffic, door events, or timer - all handled in hardware without MCU firmware load.
おすすめ
Door Zone Module
Door-zone ECUs controlling window lift, mirror, and lock actuators draw < 200 mA continuous plus transient peaks. The MCZ33904C5EK's VCC rail feeds the door MCU, while VCCA powers window/mirror drivers; HS-CAN connects the door to the BCM, and the four wake inputs monitor door-switch, key-fob, and LIN-wake sources. The SOIC-32 EP package fits the small PCB behind the door trim, and the SBC's fail-safe mode protects the CAN bus during short-circuit events.
おすすめ
Powertrain ECU Secondary Supply
Powertrain ECUs often need a redundant 5 V rail for sensor signal conditioning alongside the primary SMPS. The MCZ33904C5EK's second LDO (VCCA) provides an isolated, protected 5 V for crank, knock, and O2 sensors, while VCC feeds the MCU and HS-CAN links to other ECUs. The load-dump tolerance to 40 V and AEC-Q100 Grade 0 qualification meet the harsh under-hood environment.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MCZ33904C5EK — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MCZ33904C5EKR2 | MCZ33904C3EK | MCZ33904B5EK | MC33904PT5EK | MCZ33905S5EK |
|---|---|---|---|---|---|---|
| Package | SOIC-32 EP | SOIC-32 EP - same | SOIC-32 EP - same | SOIC-32 EP - same | SOIC-32 EP - same | SOIC-32 EP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| LDO Output Voltage | 2 × 5.0 V | 2 × 5.0 V | 2 × 5.0 V | 2 × 5.0 V | 2 × 5.0 V | 2 × 5.0 V + LIN rail |
| LDO Output Current | 2 × 400 mA | 2 × 400 mA | 2 × 400 mA | 2 × 400 mA | 2 × 400 mA | 2 × 400 mA |
| CAN Channels | 1 × HS-CAN | 1 × HS-CAN | 1 × HS-CAN | 1 × HS-CAN | 1 × HS-CAN | 2 × HS-CAN + LIN |
| Wake Inputs | 4 | 4 | 4 | 4 | 4 | 4 + LIN wake |
| AEC-Q100 | Qualified (Grade 0) | Qualified (Grade 0) | Qualified | Qualified | Not qualified (commercial temp) | Qualified |
| Supply Voltage Range | 5.5 V to 27 V | 5.5 V to 27 V | 5.5 V to 27 V | 5.5 V to 27 V | 5.5 V to 27 V | 5.5 V to 27 V |
主な差別化要因
- Dual 5 V LDO with independent protection （vs TJA1044 + discrete LDO solution)
- AEC-Q100 Grade 0 qualification （vs MC33904PT5EK)
- Fail-safe CAN state machine in hardware （vs TLE7268 SBC)
設計ノート
Solder the exposed pad of the SOIC-32 EP to a top-layer copper pour of at least 1 in² (645 mm²) to keep θJA below 35 °C/W. At 800 mA combined LDO load and 12 V → 5 V drop, dissipation reaches 5.6 W and the junction can exceed 150 °C without the thermal via array. Add 9 thermal vias (0.3 mm drill, 1 oz plating) connecting the EP to the inner-layer ground plane. Without the EP properly soldered, the device will thermally limit at much lower output current.
Decouple VBAT with a 100 nF X7R ceramic within 5 mm of the pin plus a 4.7 µF X7R bulk capacitor on VCC and VCCA each. The two 5 V rails should be independently filtered to prevent MCU switching noise from coupling into analog sensor supplies through VCCA. Place a 10 µF electrolytic or polymer bulk cap on VBAT to absorb 12 V cold-crank sags below 5.5 V; the SBC's undervoltage lockout will reset the MCU, but the bulk cap keeps it running through the transient.
Route CANH and CANL as a 100 Ω differential pair with no stubs, length-matched within 2 mm, and keep them at least 3 mm away from switching nodes like DC-DC converters or relay coils. Add a 120 Ω split termination (60 Ω + 60 Ω with 4.7 nF to ground) at the SBC end for best EMI performance on high-speed CAN. Place the CSN, SCK, MOSI, MISO SPI traces short and away from the CAN bus lines to avoid digital noise coupling into the bus.
Do not assume the wake inputs are 5 V tolerant - they connect to the battery domain and need external clamping if driven by 12 V signals. The STBY pin must be debounced in firmware; a glitch can falsely wake the SBC. Do not load VCC and VCCA beyond 400 mA each inrush - the soft-start circuit limits total inrush but sustained overcurrent causes foldback. Verify AEC-Q100 Grade 0 suitability for your temperature profile; the commercial-grade MC33904PT5EK variant is not automotive-qualified.
コンプライアンス情報
RoHS compliant per NXP product page. AEC-Q100 Grade 0 qualified for automotive use. Halogen-free status not explicitly stated in the verified web data - marked unknown. Part is on NXP last-time-buy list per https://www.nxp.com/part/MCZ33904C5EK.
