MPC8313CZQADDC - PowerQUICC II Pro MPU 267MHz | TI
부품 번호: MPC8313CZQADDC ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $19.85 | $9,925.00 |
| 1,000 | $18.4 | $18,400.00 |
MPC8313CZQADDC 개요
A PowerQUICC communications processor is a category of integrated Power Architecture SoCs originally developed by Motorola (later Freescale, now NXP) that consolidate a PowerPC CPU core with communication peripherals such as Ethernet MACs, PCI interfaces, and memory controllers. The MPC8313 sits in the lower-power tier of the PowerQUICC II Pro family and is commonly used in wired networking and embedded control applications where deterministic performance and integrated connectivity outweigh raw MHz.
Key features include up to 267 MHz e300c3 core frequency, 16 KB I-cache and 16 KB D-cache, integrated DDR1/DDR2 SDRAM controller with ECC support, dual 10/100/1000 Ethernet MACs (one with GMII/TBI/RGMII, one with GMII/MII/RGMII), two PCI/PCI-X controllers, USB 2.0 (Host + Device), local bus, DMA, and a security engine. The integrated peripherals allow a complete line-card or small-router BOM with only the MPC8313, PHY, memory, and magnetics.
The architecture leverages a unified 32-bit peripheral bus plus separate DMA channels for I/O, offloading memory transfers from the CPU and improving sustained throughput. The e300c3 core is a low-power variant of the e500 family, providing predictable integer performance with low heat dissipation suitable for fanless industrial enclosures. The 516-TEPBGA package provides the high-density interconnect needed for the 32-bit memory and 16-bit local-bus interfaces.
Typical applications include SOHO and SMB routers, integrated access devices, DSLAM line cards, industrial gateways, secure point-of-sale terminals, and PowerPC-based embedded control. The DDR1/DDR2 controller and dual GbE MACs make the device well suited to small-office networking appliances requiring line-rate packet processing without an external switch.
When designing with this part, allocate a 4-layer or 6-layer PCB to route the 32-bit DDR memory bus with proper impedance control and length matching. The TEPBGA package requires 0.8 mm or 1.0 mm ball pitch PCB land pattern and precise reflow profile to avoid head-in-pillow defects; NXP's hardware specification document is the authoritative reference for layout rules. Designers should also verify boot ROM configuration and pin strapping resistors at design bring-up.
This page synthesizes NXP datasheet parameters, current distributor pricing, and drop-in same-family alternatives not found in the manufacturer literature, providing context for sourcing and PCB reuse decisions.
드롭인 대체품: MPC8313CZQADDC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8313CZQADDC (동일 폼 팩터 및 풋프린트) — 차이점: Series, Mounting Type, Manufacturer, Operating Temperature Range, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8313EZQADDC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8313ECVRAFFC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8313CZQADDCA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8309CVMAGDCA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCIMX357DJQ5C
✅ 드롭인✓ 재고 있음
$23.4 / 개
데이터시트 보기 →MPC8313CZQADDC 최대 정격 & 전기적 특성
| Series | PowerQUICC II Pro, MPC83xx |
| Core Architecture | PowerPC e300c3 |
| Core Count | 1 |
| 데이터 버스 폭 | 32-Bit |
| Maximum Core Frequency | 267 MHz |
| Package Type | 516-TEPBGA (27x27 mm) |
| 동작 온도 범위 | -40C to +105C |
| 공급 전압 | 1.8 V / 2.5 V / 3.3 V |
| Memory Controller | DDR1/DDR2 SDRAM with ECC |
| Ethernet MACs | 2x 10/100/1000 Mbps (GMII/TBI/RGMII, GMII/MII/RGMII) |
| PCI Controllers | 2x PCI / PCI-X |
| USB Interface | USB 2.0 Host + Device |
| Local Bus | 16-bit, up to 133 MHz |
| Security Engine | Integrated (IPsec / bulk crypto) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant (Lead-Free) |
MPC8313CZQADDC 516-tepbga (27x27 mm) 핀 구성 가이드
MPC8313CZQADDC(516-tepbga (27x27 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8313CZQADDC.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8313CZQADDC 적합 용도: 6 애플리케이션s: SOHO and SMB Routers, Industrial Gateways and Protocol Converters, DSLAM Line Cards and Access Equipment, Secure Point-of-Sale Terminals, Embedded Industrial Control, Network-Attached Storage Entry-Level.
SOHO and SMB Routers
The MPC8313CZQADDC's 267 MHz e300c3 core and dual integrated Gigabit Ethernet MACs make it well suited for SOHO and SMB router designs where deterministic packet processing and line-rate throughput matter more than raw CPU MHz. The integrated DDR1/DDR2 memory controller with ECC simplifies the BOM by combining CPU and memory interface in one IC, while the security engine accelerates IPsec for VPN termination without external crypto ASICs. Typical SOHO router designs run Linux or VxWorks on the MPC8313 with 128-256 MB DDR2, a GbE PHY, and a magnetics module, achieving wire-speed NAT for typical broadband connections.
추천
Industrial Gateways and Protocol Converters
The MPC8313CZQADDC integrates dual GbE MACs, dual PCI controllers, and a 16-bit local bus, which provides the I/O density needed for industrial gateway designs that aggregate fieldbus (Modbus, Profibus, CAN) traffic onto Ethernet. The -40C to +105C industrial temperature range allows deployment in factory floor enclosures without active cooling. A typical industrial gateway uses the local bus to interface a fieldbus controller ASIC, the PCI bus for a wireless modem, and the dual Ethernet ports for redundant uplink connections, with the security engine encrypting site-to-site traffic.
추천
DSLAM Line Cards and Access Equipment
The MPC8313CZQADDC's combination of DDR1/DDR2 controller with ECC, PCI/PCI-X for line-card interfacing, and integrated security engine suits DSLAM and central-office line card designs. The e300c3 core can run uClinux or a real-time RTOS to manage DSL PHY control and traffic shaping. ECC memory is essential for telecom-grade MTBF targets, and the 516-TEPBGA package provides the I/O density required for 32-bit memory plus PCI plus Ethernet. Line card designers typically pair the MPC8313 with a discrete DSL PHY and a TDM bus controller on the local bus.
추천
Secure Point-of-Sale Terminals
The MPC8313CZQADDC's integrated security engine, which accelerates AES, DES, 3DES, SHA, and RSA, makes it suitable for PCI PTS-compliant point-of-sale terminals where on-chip crypto reduces BOM cost. The 267 MHz core runs the payment application stack while the security engine handles PIN block encryption and key management. Designers typically connect a smart card reader via USB, a thermal printer via the local bus, and a wired Ethernet or dial-up modem for transaction authorization. Industrial temperature operation is important for outdoor kiosk deployments.
추천
Embedded Industrial Control
The MPC8313CZQADDC's e300c3 core, deterministic interrupt latency, and rich peripheral mix make it suitable for embedded industrial control applications such as CNC controllers, machine vision pre-processors, and building automation controllers. The PCI bus allows connection to frame grabbers or motion controller cards, while the dual Ethernet ports enable redundant industrial Ethernet (PROFINET, EtherNet/IP) connectivity. The 1.8V/2.5V/3.3V supply rails simplify integration with industrial ASICs and FPGAs on the same board, and the 516-TEPBGA package supports high-density routing required by industrial PC-like form factors.
추천
Network-Attached Storage Entry-Level
The MPC8313CZQADDC's DDR2 controller with ECC, SATA support via PCI-hosted controller, and Gigabit Ethernet MACs make it suitable for entry-level NAS appliances targeting small office and home office backup markets. The security engine provides hardware-accelerated encryption for at-rest data protection, while the 267 MHz performance is sufficient for gigabit wire-speed file serving. A typical NAS design pairs the MPC8313 with two SATA disks on PCI, a DDR2 SODIMM slot, and a GbE PHY, running Linux with SMB/NFS/iSCSI stacks.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8313CZQADDC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8313EZQADDC | MPC8313ECVRAFFC | MPC8309CVMAGDCA | MCIMX357DJQ5C |
|---|---|---|---|---|---|
| Package | 516-TEPBGA (27x27 mm) | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | ARM1136JF-S |
| Maximum Core Frequency | 267 MHz | 266 MHz | 266 MHz | 200 MHz | 532 MHz |
| Operating Temperature Range | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +85C |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR2 with ECC | DDR2 with ECC |
| Ethernet MACs | 2x 10/100/1000 | 2x 10/100/1000 | 2x 10/100/1000 | 2x 10/100/1000 | 1x 10/100 + 1x 10/100/1000 |
| USB Interface | USB 2.0 Host + Device | USB 2.0 Host + Device | USB 2.0 Host + Device | USB 2.0 Host only | USB 2.0 OTG |
주요 차별점
- Rev 3 silicon with full errata fixes (vs MPC8313ZQADDC)
- Lower power consumption for fanless designs (vs MPC8313EZQADDC)
- Integrated security engine eliminates external crypto ASIC (vs MPC8309CVMAGDCA)
설계 노트
The 516-TEPBGA package uses a 1.0 mm ball pitch and requires a 4-layer or 6-layer PCB stackup with controlled-impedance routing for the DDR memory bus. Use microvia-in-pad PCB technology to fan out the dense BGA ball array; standard through-via fanout is not feasible at this density. Maintain 50 ohm single-ended and 100 ohm differential impedance for the Ethernet GMII/RGMII signals, and follow NXP's hardware specification layout rules exactly to avoid signal integrity issues on the DDR bus.
Estimated: At 267 MHz full CPU load with both Ethernet ports active and DDR2 traffic, the MPC8313CZQADDC dissipates approximately 1.5-2.0 W typical power. The 516-TEPBGA package has theta_JA around 25-30 C/W on a 4-layer JEDEC test board, resulting in 50-60 C temperature rise above ambient. For enclosed industrial designs without airflow, provide thermal vias under the BGA die and at least 4 square cm of copper pour to keep junction temperature below 105 C at 70 C ambient.
Do not assume the local bus pin mapping is compatible between MPC8313 and MPC8313E revisions without checking the errata document - some local bus pins have silicon revision-dependent functions. Verify boot ROM configuration strapping resistors at design bring-up; the MPC8313 reads CFG pins via the reset sequence and an incorrect strapping can lock the part in JTAG-only mode. Always use ECC-enabled DDR2 memory in production designs even if your application does not currently need ECC, to ensure compliance with NXP's reference firmware.
규정 준수 정보
RoHS compliant per NXP product page. AEC-Q100 not applicable (this is an MPU, not an automotive-grade IC). Halogen-free status not explicitly stated in retrieved data; refer to NXP environmental compliance documentation for confirmation.