MPC8315ECVRAGDA - PowerQUICC II Pro SoC, 400MHz, 620-HBGA | NXP
部品番号: MPC8315ECVRAGDA ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.85 | $2,985.00 |
| 500 | $26.4 | $13,200.00 |
| 1,000 | $23.1 | $23,100.00 |
| 2,500 | $20.55 | $51,375.00 |
MPC8315ECVRAGDA 概要
A PowerQUICC II Pro SoC combines a Power Architecture processor core with a high-bandwidth system-on-chip fabric that integrates memory controllers, networking engines, security accelerators, and peripheral interfaces. This class of device sits in the broader taxonomy of microprocessor (MPU) -> networking SoC -> communications processor -> embedded MPU. The PowerQUICC family has historically been used in routers, switches, DSLAMs, and industrial control applications where deterministic networking and protocol acceleration matter as much as raw CPU throughput.
Key features of the MPC8315ECVRAGDA include a 32-bit e300c3 core, DDR1/DDR2 memory controller with ECC support, dual Gigabit Ethernet MACs with FIFOs, USB 2.0 (host/device), two PCI interfaces (one configurable as PCIe), SEC 3.x security engine for crypto offload, TDM interface for telecom PCM/HDLC, and a -40C to +105C extended industrial temperature rating. The 620-HBGA (29x29 mm) package supports the high pin count required for parallel DDR and multiple serial interfaces.
Architecturally, the part uses the e300c3 core derived from Power Architecture Book E, paired with a system interface unit that arbitrates accesses between the core, DMA channels, and the integrated peripheral engines. The DDR controller supports up to 266 MT/s data rates, while the SEC block accelerates AES, DES, 3DES, SHA-1/MD5, and public-key algorithms without burdening the core.
Typical applications include industrial Ethernet switches, network security appliances, residential gateway routers, DSL/broadband access equipment, industrial automation controllers, and wireless base-station control-plane processors. Designers value the single-chip integration that replaces external ASICs and bridges, reducing BOM cost and board area.
When selecting this part, note the wide 3.3V/1.2V dual-rail power requirement and the absence of an integrated GbE PHY - an external PHY is required for each MAC. The 620-ball BGA also requires careful PCB stackup and microvia engineering for reliable assembly.
This page consolidates distributor pricing, lifecycle status, drop-in MPC83xx siblings, and practical design guidance beyond what the manufacturer datasheet alone provides, helping engineers evaluate both new designs and legacy replacements.
ドロップイン代替品: MPC8315ECVRAGDA — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC8315ECVRAGDA （同一形状・フットプリント） — 相違点: Ethernet, Mounting Type, Data Bus Width, Memory Controller, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
MPC8314EVRAGDA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8323EVRAGDA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8315EVRAGDA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8313EVRAFDA
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MPC8377EVRAGDA
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MPC8315ECVRAGDA 最大定格＆電気的特性
| Processor Core | Power Architecture e300c3 |
| Architecture | 32-bit RISC |
| Maximum Core Frequency | 400 MHz |
| データバス幅 | 32 bit |
| Series | MPC83xx PowerQUICC II Pro |
| Memory Controller | DDR1/DDR2 with ECC |
| Ethernet | 2x 10/100/1000 MAC (GMII/RGMII) |
| PCI/PCIe | 2x PCI (one configurable as PCIe) |
| USB | USB 2.0 (host/device) |
| Security Accelerator | SEC 3.x (AES, DES, 3DES, SHA, MD5) |
| TDM Interface | Yes (TDM/HOLC/TDM) |
| 動作温度 | -40C to +105C |
| パッケージ | 620-ball HiCTE BGA (29x29 mm) |
| 実装タイプ | Surface Mount (BGA) |
| 電源電圧 | Dual-rail 3.3V / 1.2V core |
| Process Node | 90 nm CMOS |
MPC8315ECVRAGDA 620-ball hicte bga (29x29 mm) ピン配置ガイド
MPC8315ECVRAGDA (620-ball hicte bga (29x29 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8315ECVRAGDA.
詳細は データシート をご参照ください。
主な用途
MPC8315ECVRAGDA の用途: 6 件s: Industrial Ethernet Switch, Network Security Appliance / VPN Gateway, Residential Gateway / DSL CPE Router, Industrial Automation Controller, Wireless Base-Station Control Plane, Embedded NAS / Print Server.
Industrial Ethernet Switch
The MPC8315ECVRAGDA fits industrial Ethernet switching because of its two integrated Gigabit Ethernet MACs and a PCI/PCIe interface that can attach to external gigabit switch fabrics. With the e300c3 core at 400 MHz it has enough CPU headroom to run a managed Layer-2 switching stack plus MAC-level ACLs, while running a control-plane daemon for SNMP, STP/RSTP, or EtherNet/IP. The SEC 3.x engine accelerates 802.1AE MACsec or IPsec for switch-to-switch authentication, critical in industrial networks where unauthorized PLC access must be blocked. The 620-HBGA package exposes enough parallel I/O for two RGMII/MII PHYs plus PCIe uplinks to a higher-port-count switch ASIC. Operating range of -40C to +105C supports deployment in factory-floor cabinets without airflow conditioning.
おすすめ
Network Security Appliance / VPN Gateway
The MPC8315ECVRAGDA is designed for low-end VPN gateways and security appliances where wire-speed IPsec at moderate throughput is required. The SEC 3.x engine offloads AES-128/192/256, 3DES, SHA-1, and MD5 from the host core, sustaining several hundred Mbps of IPsec throughput without burning CPU cycles. Its dual GbE MACs provide a WAN/LAN routing topology (one MAC for WAN, one for LAN) plus a separate MAC for DMZ or hardware bypass. The 32-bit DDR2 controller feeds security tables and routing databases from external memory. Compared with running encryption purely in software on a smaller embedded CPU, this part frees the e300c3 host CPU to run a hardened Linux firewall and management UI.
おすすめ
Residential Gateway / DSL CPE Router
The MPC8315ECVRAGDA is well suited to residential gateways combining an xDSL or G.fast modem with a router, firewall, and WiFi host interface. The dual GbE MACs connect the internal modem chipset (over PCIe or GMII) and the WAN Ethernet port, while the USB 2.0 port attaches to external 3G/4G modems for failover. The TDM interface can carry legacy PCM voice channels for VoIP integration with FXS/FXO daughter boards. With the SEC engine it handles IPsec tunnels for site-to-site VPNs. Industrial temperature rating supports outdoor DSLAM field cabinets.
おすすめ
Industrial Automation Controller
In programmable logic controllers (PLC) and industrial automation gateways, the MPC8315ECVRAGDA acts as both a communication processor and a deterministic application host. The TDM interface plus the dual GbE MACs allow a single chip to bridge legacy fieldbus networks (PROFIBUS, CAN, RS-485 via external serializers) into Ethernet/IP or PROFINET. The PCI/PCIe bus connects to co-processors or FPGA accelerators used for real-time motion control loops. The -40C to +105C rating and absence of any moving parts in the design support deployment in motor cabinets and outdoor controllers.
おすすめ
Wireless Base-Station Control Plane
Small-cell and picocell base stations use the MPC8315ECVRAGDA as the control-plane processor that boots the device, runs the OAM agent, and handles backhaul encryption. The SEC block accelerates AES for IPsec tunnels carrying control-plane traffic back to the core network, while the dual GbE MACs separate the S1 control interface from OAM traffic. TDM continues to carry legacy 2G Abis backhaul alongside Ethernet, removing the need for a separate TDM framer. Industrial temperature rating suits outdoor small-cell enclosures.
おすすめ
Embedded NAS / Print Server
In storage and print-server gateways the MPC8315ECVRAGDA can run an embedded Linux NAS stack with RAID, SMB/CIFS, or iSCSI protocols. The dual GbE MACs provide bonded uplink to the LAN and a separate dedicated management network. USB 2.0 supports external storage or print peripherals. The SEC engine encrypts volumes at wire speed using AES-XTS accelerated by the crypto engine, offloading the CPU during large file transfers. The 620-HBGA and industrial temperature rating suit long-life embedded storage products.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8315ECVRAGDA — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8314EVRAGDA | MPC8323EVRAGDA | MPC8315EVRAGDA |
|---|---|---|---|---|
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 620-ball HiCTE BGA (29x29 mm) | 620-ball HiCTE BGA (29x29 mm) - identical | 620-ball HiCTE BGA (29x29 mm) - identical | 620-ball HiCTE BGA (29x29 mm) - identical |
| Core Architecture | Power Architecture e300c3 (32-bit) | e300c3 (32-bit) | e300c2 (32-bit) | e300c3 (32-bit) |
| Max Core Frequency | 400 MHz | 400 MHz | 333 MHz | 400 MHz |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Gigabit Ethernet MACs | 2x 10/100/1000 MAC | 2x 10/100/1000 MAC | 2x 10/100/1000 MAC | 2x 10/100/1000 MAC |
| Security Engine | SEC 3.x (AES, DES, 3DES, SHA, MD5) | SEC 3.x (reduced feature set) | SEC 2.x | SEC 3.x (same die, different revision) |
| PCI/PCIe | 2x PCI (one can be PCIe) | 2x PCI (one can be PCIe) | 2x PCI (one can be PCIe) | 2x PCI (one can be PCIe) |
| Operating Temperature | -40C to +105C | -40C to +105C | 0C to +105C | -40C to +105C |
| Lifecycle Status | EOL (last time buy) | EOL (last time buy) | EOL (last time buy) | EOL (last time buy) |
主な差別化要因
- Strongest SEC engine in the MPC831x family （vs MPC8323EVRAGDA)
- Industrial temperature grade （vs MPC8323EVRAGDA)
- Single-chip integration reducing BOM （vs MPC8314EVRAGDA)
設計ノート
The 620-ball HiCTE BGA at 29x29 mm with 1.27 mm pitch requires an 8-12 layer PCB. Use 1 oz copper for outer layers and a high-Tg FR-4 substrate (Tg >= 170C). Microvia-in-pad assembly is recommended for the inner balls to escape the dense ball grid. Follow NXP AN2764 for BGA layout guidelines and ensure via-in-pad plating thickness >= 25 um to avoid barrel cracking during reflow.
Estimated: The MPC8315ECVRAGDA core rail (1.2V typical) draws up to 1.2A at 400 MHz under load; total core power is ~1.5W. The I/O rail at 3.3V draws up to 0.5A under full peripheral use. Decouple each DDR power domain with 100 nF X7R capacitors placed within 5 mm of their balls, plus a 10 uF bulk capacitor per power domain. Avoid sharing the DDR PLL supply with the core to prevent jitter injection.
The dual GbE MACs do not include PHYs - each MAC must connect to an external MII/GMII/RGMII PHY (e.g., Vitesse VSC8244, Marvell 88E1111, or Realtek RTL8211). Do not skip the pull-up resistors on GMII/RGMII management data lines, or autonegotiation will fail. Some boards incorrectly leave the unused MAC unterminated; tie unused MAC RX/TX lines to known state through resistor networks to prevent stray emissions failing EN55022.
Estimated: At 1.5W core dissipation across the 620-HBGA package with theta_JA around 18 C/W (JEDEC 2s2p board with airflow), junction temperature rises ~27C above ambient at full load. At 85C ambient the junction remains below 105C ambient case temperature, well inside the +105C max operating range. Designs at ambient above 70C should add a thermal pad or heatsink to the package top to maintain margin.
コンプライアンス情報
RoHS and REACH per NXP product page. Automotive applications require AEC-Q100 grade, which the MPC8315E family does not carry - so 'not_applicable' here. Conflict minerals compliance documented by NXP corporate policy.
