MPC8360EZUAGDGA - PowerQUICC II Pro 400MHz SoC | NXP
部品番号: MPC8360EZUAGDGA ✓ 生産中MPC8360EZUAGDGA 概要
A PowerQUICC II Pro processor is a member of NXP's (formerly Freescale) PowerQUICC family of integrated communications processors. It combines a high-performance Power Architecture CPU core with dedicated communications peripherals and an SoC fabric, extending the popular PowerQUICC II line into next-generation networking and embedded designs. The architecture hierarchy places it under: PowerQUICC II Pro family -> MPC83xx series -> PowerQUICC communications processors -> microprocessors -> integrated circuits.
Key features include a 400 MHz e300 core, integrated DDR1/DDR2 memory controller supporting up to 2 GB of RAM, a 32-bit PCI interface, dual 10/100/1000 Ethernet MACs with hardware acceleration, USB 2.0 full/low-speed host and device, TDM and ATM interfaces, and an integrated security engine (SEC) for crypto offload. The 740-TBGA package uses a 1 mm pitch and provides ample I/O for multi-protocol bridging applications.
The architecture implements a unified coherent bus connecting the e300 core, L2 cache, and peripheral controllers, enabling deterministic throughput for packet processing workloads. The SEC block accelerates DES, 3DES, AES, SHA-1/MD5 and public-key operations without burdening the host CPU, while the QUICC Engine subsystem handles TDM, ATM, and HDLC channelization.
Typical applications include small-to-medium enterprise (SME) routers, low-end DSLAMs, IP private automatic branch exchanges (PABXs), industrial gateways, and secure broadband access equipment. The 0 to 105 C operating temperature range supports thermally constrained embedded deployments.
When designing with this part, plan PCB stack-up and power sequencing carefully - the 740-TBGA package demands controlled-impedance routing, multiple ground and power planes, and matched-length DDR2 traces. Validate DDR2 IBIS models against your chosen DRAM vendor and budget for the SEC crypto block if your firmware stack depends on it.
ドロップイン代替品: MPC8360EZUAGDGA — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC8360EZUAGDGA （同一形状・フットプリント） — 相違点: Ethernet, USB, Architecture, Memory Interface, PCI Interface.
MPC8360CZUAGDGA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8360EZUAJDGA
✅ ドロップイン価格はお問い合わせください
データシートを見る →MPC8360VVAGDGA
✅ ドロップイン価格はお問い合わせください
データシートを見る →MPC8358EVVAGDGA
✅ ドロップイン価格はお問い合わせください
データシートを見る →MPC8360EVVAGDGA
✅ ドロップイン価格はお問い合わせください
データシートを見る →MPC8360ECVVAJDGA
✅ ドロップイン価格はお問い合わせください
データシートを見る →MPC8360EZUAGDGA 最大定格＆電気的特性
| Architecture | PowerPC e300 (Power Architecture) |
| Core Count | 1 |
| データバス幅 | 32-bit |
| Core Clock Speed | 400 MHz |
| Memory Interface | DDR1 / DDR2 |
| Ethernet | 1 Gbit (10/100/1000) |
| PCI Interface | 32-bit PCI |
| USB | USB 2.0 full/low-speed |
| TDM / ATM | Yes (TDM and ATM) |
| Security Accelerator | SEC (crypto engine) |
| パッケージ | 740-TBGA, 37.5 x 37.5 mm, 1 mm pitch |
| Package Height | 1.46 mm |
| Lead-Free / RoHS | Lead-free (per datasheet) |
| 動作温度 | 0 C to 105 C |
| 実装タイプ | Surface Mount |
| Product Family | MPC83xx PowerQUICC II Pro |
| Series | MPC8360E |
MPC8360EZUAGDGA 1.46 mm ピン配置ガイド
MPC8360EZUAGDGA (1.46 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8360EZUAGDGA.
詳細は データシート をご参照ください。
主な用途
MPC8360EZUAGDGA の用途: 6 件s: SME Router / Gateway Platform, Low-End DSLAM Line Card, Industrial Ethernet Gateway / Protocol Bridge, IP-PBX and Unified Communications Appliance, Secure Broadband CPE, Network-Attached Storage Controller.
SME Router / Gateway Platform
The MPC8360EZUAGDGA's 400 MHz e300 core, dual 1 GbE MACs, and integrated SEC crypto engine make it a strong fit for small-to-medium enterprise routers and IPsec VPN gateways. Compared with discrete CPU-plus-Ethernet-ASIC designs, the integrated 32-bit PCI, USB 2.0, and TDM controllers cut board area and BOM cost while sustaining multi-Mpps WAN throughput. Recommended companion MPNs: T2080NXE8MQB, T1024NXE7PQA.
おすすめ
Low-End DSLAM Line Card
The MPC8360EZUAGDGA's integrated TDM and ATM controllers, combined with DDR1/DDR2 memory support, enable line-card designs for low-end DSL access multiplexers (DSLAMs) without external framer ASICs. The 740-TBGA package supplies ample GPIO for multi-line xDSL aggregation, and the SEC engine secures management-plane traffic. Estimated: 400 MHz CPU clock supports ~64 channels of VoIP with G.729a codec load.
おすすめ
Industrial Ethernet Gateway / Protocol Bridge
The MPC8360EZUAGDGA's combination of 1 GbE, USB 2.0, PCI, and TDM interfaces suits industrial gateways that bridge fieldbus, Ethernet, and serial protocols in factory automation. The 0 to 105 C operating range covers industrial cabinet environments, and the SEC engine protects OT/IT boundary traffic. Estimated: at VIN 3.3 V I/O and ~1.2 V core, total typical power ~3-5 W with appropriate heatsinking.
おすすめ
IP-PBX and Unified Communications Appliance
The MPC8360EZUAGDGA's TDM controller and SEC engine support IP-PBX and unified-comms appliances that bridge PRI/BRI circuits to SIP trunks. The 400 MHz e300 core handles tens of G.711/G.729 voice channels, and DDR1/DDR2 with ECC provides reliable call-record storage. Integrated USB 2.0 supports operator-panel peripherals, while the 32-bit PCI allows DSP expansion cards.
おすすめ
Secure Broadband CPE
The MPC8360EZUAGDGA integrates SEC-accelerated IPsec/SSL crypto, 1 GbE WAN/LAN, and DDR2 memory support, making it well suited to secure broadband customer-premises equipment (CPE). The 740-TBGA package supports compact residential-gateway layouts, and the 0 to 105 C range covers outdoor enclosure deployments. Estimated: SEC engine sustains >500 Mbps IPsec throughput at 400 MHz.
おすすめ
Network-Attached Storage Controller
The MPC8360EZUAGDGA's 1 GbE MAC, DDR2 memory controller (with ECC), USB 2.0, and 32-bit PCI enable it to drive SOHO/SMB network-attached storage controllers with hardware RAID offload partners. The 400 MHz e300 core handles NAS protocol stacks (SMB, NFS, iSCSI), and the SEC engine encrypts volumes without measurable throughput penalty in most workloads.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8360EZUAGDGA — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8360CZUAGDGA | MPC8360EZUAJDGA | MPC8360VVAGDGA | MPC8358EVVAGDGA | MPC8360EVVAGDGA | MPC8360ECVVAJDGA |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 740-TBGA (37.5x37.5 mm) | 740-TBGA (37.5x37.5 mm) - same | 740-TBGA (37.5x37.5 mm) - same | 740-TBGA (37.5x37.5 mm) - same | 740-TBGA (37.5x37.5 mm) - same | 740-TBGA (37.5x37.5 mm) - same | 740-TBGA (37.5x37.5 mm) - same |
| Memory Interface | DDR1 / DDR2 | DDR1 / DDR2 | DDR1 / DDR2 | DDR1 / DDR2 | DDR1 / DDR2 | DDR1 / DDR2 | DDR1 / DDR2 |
| Ethernet | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit |
| Security Engine (SEC) | Yes | Yes | Yes | Yes | Reduced / limited | Yes | Yes |
| PCI Interface | 32-bit PCI | 32-bit PCI | 32-bit PCI | 32-bit PCI | 32-bit PCI | 32-bit PCI | 32-bit PCI |
| Operating Temperature | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C | -40 C to 105 C |
| Architecture | PowerPC e300 (Power Architecture) | PowerPC e300 | PowerPC e300 | PowerPC e300 | PowerPC e300 | PowerPC e300 | PowerPC e300 |
主な差別化要因
- Pin-compatible upgrade path to 533 MHz within same package （vs MPC8360ECVVAJDGA)
- Integrated security engine reduces BOM and CPU overhead （vs MPC8358EVVAGDGA)
- Sustained long-term supply via Rochester Electronics distribution （vs Older MPC83xx generations)
設計ノート
The 740-TBGA package at 1 mm pitch and 37.5 x 37.5 mm body demands a multilayer PCB stack-up with matched-length DDR2 traces, dedicated ground/power planes beneath the device, and via-in-pad technology for power and ground balls. Estimated: maintain 50 ohm single-ended impedance for high-speed DDR2 and USB lines. Designers should consult NXP's hardware-design checklist for layer-count and microvia recommendations before committing to a stack-up.
The MPC8360EZUAGDGA requires multiple supply rails (core ~1.2 V and I/O 3.3 V per datasheet); use a sequenced power-on scheme to avoid latch-up. Decouple each rail with bulk, mid-frequency, and high-frequency ceramic capacitors placed as close as practical to the corresponding balls. Estimated: a typical 400 MHz application draws ~3-5 W total system power, so plan thermal dissipation accordingly.
Despite the 0 to 105 C operating-temperature rating, the TBGA package can throttle under sustained packet-processing loads. Provide adequate airflow or a heat-spreader for fanless enclosures, and validate junction temperatures with the manufacturer-provided thermal model. Estimated: junction-to-ambient thermal resistance depends strongly on PCB copper area; budget for at least 4-layer construction with continuous ground planes.
DDR2 memories connected to the MPC8360EZUAGDGA must follow strict length-matching, impedance-control, and decoupling rules. Validate timing closure with the manufacturer's IBIS models and your chosen DRAM vendor's IBIS set before sign-off. Estimated: route DDR2 data-bytes within 25-50 mils of byte-clock, with VTT termination at the end of each byte lane.
コンプライアンス情報
Lead-free TBGA package per datasheet. RoHS compliance declared by NXP. REACH, halogen-free, and full conflict-minerals statements should be requested from the franchised distributor or NXP directly. AEC-Q100 is not applicable for communications processors in this category.
