MPC8555PXAPF - PowerQUICC III e500 MPU 833MHz | NXP FCPBGA-783
部品番号: MPC8555PXAPF ✗ 生産終了MPC8555PXAPF 概要
A microprocessor (MPU) is an integrated circuit that contains the arithmetic, logic, and control circuitry required to execute software instructions and act as the central processing unit of an embedded system. Within the broader taxonomy of semiconductors, the MPC8555PXAPF sits in the integrated communications processor (ICP) category, a hypernym combining microprocessor (MPU), digital signal processor (DSP), and network-on-chip peripherals. PowerQUICC III is NXP's flagship ICP family, specifically engineered to offload packet processing, ATM, Ethernet, and TDM voice/datacom traffic from the host CPU.
Key features include a 32-bit PowerPC e500 core with dual-issue superscalar pipeline, dedicated security engine, integrated DDR memory controller, four Gigabit Ethernet MACs, dual PCI/PCI-X interfaces, and a RapidIO interconnect. The device is built on a 1.2 V core supply with 1.5 V/1.8 V/2.5 V/3.3 V I/O tolerance for legacy peripheral interfacing. The 783-FCPBGA package provides flip-chip interconnect for high signal integrity at the elevated 833 MHz core frequency.
The architecture combines a high-performance e500 core, separate RISC-based peripheral engines, and an integrated security coprocessor. This heterogeneous multiprocessing approach allows wire-speed packet classification, encryption/decryption (IPSec, SSL/TLS), and QoS queue management without burdening the host core. The device delivers deterministic latency for backplane and line-card deployments.
Typical applications include enterprise routers, multiservice access concentrators, DSLAM line cards, wireless base station controllers, industrial protocol gateways, and network-attached storage controllers. The combination of gigabit Ethernet, PCI-X, and RapidIO makes it ideal for high-bandwidth line cards.
When designing with this device, allocate adequate PCB layers (typically 8-10) for the 1 mm-pitch BGA breakout, provide a low-noise power supply tree (separating 1.2 V core from 1.5 V/3.3 V I/O rails), and account for the thermal envelope (junction-to-ambient thermal resistance depends on PCB stack-up and airflow). Reference the NXP application note for DDR termination and impedance-controlled routing.
This page synthesizes distributor pricing, same-package alternatives within the PowerQUICC III family, and practical design notes not consolidated in the manufacturer datasheet.
ドロップイン代替品: MPC8555PXAPF — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC8555PXAPF （同一形状・フットプリント） — 相違点: Data Bus Width, Mounting Type, Package, RoHS Status, Series.
MPC8555EVTAPF
✅ ドロップイン価格はお問い合わせください
データシートを見る →MPC8555PXAQF
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MPC8541EPXAPF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8541PXAQF
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MPC8569CVJAQLJB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8555PXAPF 最大定格＆電気的特性
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC III |
| Core Architecture | PowerPC e500 |
| Core Count | 1 |
| データバス幅 | 32-bit (64-bit datapath) |
| Core Clock Speed | 833 MHz |
| Core Supply Voltage | 1.2 V |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V tolerant |
| パッケージ | 783-FCPBGA (29x29 mm, 1 mm pitch, flip-chip plastic BGA) |
| 実装タイプ | Surface Mount (BGA) |
| ピン数 | 783 |
| RoHS ステータス | Compliant (per DigiKey listing) |
| ライフサイクル状態 | Not Recommended for New Designs (NRND) |
MPC8555PXAPF 783-fcpbga (29x29 mm, 1 mm pitch, flip-chip plastic bga) ピン配置ガイド
MPC8555PXAPF (783-fcpbga (29x29 mm, 1 mm pitch, flip-chip plastic bga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8555PXAPF.
詳細は データシート をご参照ください。
主な用途
MPC8555PXAPF の用途: 6 件s: Enterprise Edge Router, DSLAM / GPON Line Card, Wireless Base Station Controller, Network-Attached Storage Controller, Industrial Protocol Gateway, Voice over IP (VoIP) Media Gateway.
Enterprise Edge Router
The MPC8555PXAPF serves as the central processing engine in enterprise edge routers, where its 833 MHz PowerPC e500 core handles control-plane and routing-protocol processing while four integrated tri-speed Ethernet MACs (10/100/1000) terminate multiple WAN/LAN links simultaneously. The RapidIO and PCI-X interfaces allow direct connection to cryptographic accelerator cards or fabric switches, while the DDR controller with ECC maintains a fast routing table database. Compared with discrete CPU + bridge-chip designs, the MPC8555PXAPF reduces BOM and PCB area while sustaining wire-speed packet throughput on line cards. The 783-FCPBGA package supports the multi-gigabit data flow and the high I/O count needed for multi-port routers.
おすすめ
DSLAM / GPON Line Card
In DSLAM (Digital Subscriber Line Access Multiplexer) and GPON (Gigabit Passive Optical Network) line cards, the MPC8555PXAPF aggregates traffic from many subscriber lines, performs packet classification, and forwards data upstream. The device's dedicated communications processor module handles ATM/TDM segmentation and reassembly without burdening the e500 core, freeing it for QoS and traffic shaping. The four gigabit Ethernet MACs and PCI-X interfaces connect to PHY transceivers and backplane fabrics. At 833 MHz, the device sustains per-line bandwidth shaping and IGMP snooping for IPTV multicast streams, ensuring low latency across hundreds of subscribers per card.
おすすめ
Wireless Base Station Controller
For 3G/UMTS base station controllers, the MPC8555PXAPF handles the Iub interface between the radio network controller (RNC) and Node B, executing layer-2 protocols, frame segmentation, and ATM Adaptation Layer 2 (AAL2) processing. The 833 MHz e500 core and integrated CPM together meet the throughput demands of multiple 3GPP carriers, while the security engine variant (MPC8555EVTAPF) provides hardware-accelerated Kasumi encryption for cellular confidentiality. Dual PCI-X interfaces connect to DSP cards, and the DDR controller supports the large buffer pools required for HS-DPA aggregation.
おすすめ
Network-Attached Storage Controller
In mid-range NAS controllers, the MPC8555PXAPF runs a storage management OS while coordinating four gigabit Ethernet ports for link aggregation or MPIO. The DDR memory controller with ECC supports RAM-based read/write caches, and the local bus unit connects to flash (NOR for boot, NAND for storage firmware). The PCI-X interface links to SAS/SATA controllers for HDD shelves. Compared with general-purpose x86 NAS controllers, the PowerQUICC III architecture delivers lower power consumption and deterministic latency, well-suited to small/medium business file-serving appliances.
おすすめ
Industrial Protocol Gateway
The MPC8555PXAPF converts between industrial protocols (EtherCAT, PROFINET, Modbus/TCP, EtherNet/IP) and legacy fieldbus (Profibus, CANopen) in industrial automation. The dual UARTs serve RS-485/RS-232 legacy fieldbus, while the four Ethernet MACs handle multi-protocol industrial Ethernet. The wide operating temperature range and BGA package suit harsh-environment panels. Hardware TCP/IP offload via CPM reduces protocol latency, and DDR with ECC supports deterministic real-time response critical for closed-loop motion control.
おすすめ
Voice over IP (VoIP) Media Gateway
In carrier-grade VoIP media gateways, the MPC8555PXAPF performs RTP packetization, jitter buffering, codec transcoding (G.711/G.729/G.722), and SIP/H.323 signaling at gigabit line rate. The serial TDM interfaces connect to legacy PSTN T1/E1 spans, while Ethernet MACs terminate IP uplinks. Hardware encryption (SEC engine on the EV variant) secures SRTP/TLS media streams. The 833 MHz core handles tens of thousands of simultaneous voice channels per device with deterministic latency, making it a cost-effective alternative to DSP farms.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8555PXAPF — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8555EVTAPF | MPC8555PXAQF | MPC8541EPXAPF | MPC8569CVJAQLJB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core Frequency | 833 MHz | 833 MHz | 833 MHz | 833 MHz | 1.33 GHz |
| Security Engine (SEC) | No | Yes (SEC 3.0) | No | Yes (SEC 2.0) | Yes (SEC 4.0) |
| Dedicated CPM | Yes | Yes | Yes | No | Yes |
| Ethernet MACs | 4 (tri-speed) | 4 (tri-speed) | 4 (tri-speed) | 3 (tri-speed) | 8 (1/10G capable) |
| DDR Memory Controller | 64-bit DDR/DDR2 | 64-bit DDR/DDR2 | 64-bit DDR/DDR2 | 64-bit DDR/DDR2 | 64-bit DDR2/DDR3 |
| Temperature Grade | Commercial (AP) | Commercial (AP) | Extended Industrial (AQ) | Commercial (AP) | Extended (ALJB) |
| Lifecycle Status | NRND | NRND | NRND | NRND | Active |
主な差別化要因
- Broader peripheral integration than MPC8541E variant （vs MPC8541EPXAPF)
- Lower cost than SEC-enabled variant （vs MPC8555EVTAPF)
- Lower core frequency than MPC8569 successor （vs MPC8569CVJAQLJB)
- Commercial vs extended temperature grades （vs MPC8555PXAQF)
設計ノート
Estimated: The 783-ball FCPBGA at 1 mm pitch on 29x29 mm body requires a minimum of 8 PCB layers for fanout, with microvia-in-pad or laser-drilled vias recommended for the inner ball rows. Use a controlled-impedance stack-up (50 ohm single-ended, 100 ohm differential) for Ethernet and RapidIO traces, and keep the DDR trace length matched within 25 mils per byte lane. Reference NXP application note AN2664 for the recommended MPC8555 layout stack-up.
At maximum core frequency (833 MHz) with full peripheral utilization, the MPC8555PXAPF typically dissipates 4-7 W. The thermal resistance theta_JA for the 783-FCPBGA on a standard 8-layer JEDEC test board is approximately 15-20 C/W with adequate airflow. A thermal pad area below the package should be soldered to the PCB with thermal vias to the inner ground plane. Forced-air cooling (200 LFM minimum) is recommended for closed enclosures. Reference NXP MPC8555E hardware specifications for the exact thermal envelope.
The MPC8555PXAPF requires a multi-rail power supply: VCORE at 1.2 V (estimated ~3-5 A peak), VDD I/O at 1.5 V/1.8 V/2.5 V/3.3 V (estimated ~1-2 A depending on load), and AVCC for the PLL at 1.2 V. Use a PMIC (e.g., NXP MMPF0100) with sequenced startup to ensure VCORE comes up before I/O rails. Decoupling requires bulk capacitors (47 uF or higher) at each supply pin plus 100 nF and 10 nF ceramics at high-frequency pins. Inductor selection for switchers must meet the 833 MHz core transient response.
Do not assume firmware portability from MPC8240/MPC8260/MPC8560 to MPC8555 - the e500 core requires a recompiled kernel, boot ROM must be re-generated, and U-Boot/UEFI must be re-validated. JTAG trace pins must be brought out for boundary-scan and debug. The DDR controller must be calibrated for the chosen PCB trace lengths before relying on the system for production. Always verify the errata document from NXP before locking firmware.
Place the DDR SDRAM chips as close as possible to the MPC8555PXAPF (under 3 cm total trace length), with each byte lane matched to within 25 mils. The four Ethernet MACs each require a 1:1 center-tap transformer to magnetics; do not share ground between analog and digital sections of the PHY rails. The PCI-X interface requires 100 MHz reference clock with 100 ppm tolerance and a source-impedance matched clock trace.
コンプライアンス情報
RoHS compliance confirmed per DigiKey product listing (2026-10-16). REACH SVHC declaration should be requested from NXP directly. AEC-Q100 not applicable (telecom/networking IC, not automotive).
