MPC8555EVTAPF - PowerQUICC III MPU, 833MHz e500, 783-FCPBGA | NXP
部品番号: MPC8555EVTAPF ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $307.68 | $307.68 |
| 10 | $285 | $2,850.00 |
| 100 | $248.5 | $24,850.00 |
| 250 | $232 | $58,000.00 |
| 500 | $218.75 | $109,375.00 |
MPC8555EVTAPF 概要
A microprocessor (MPU) is the central processing unit of an embedded system that fetches, decodes, and executes instructions while coordinating memory and peripherals. In the component taxonomy, this part sits at: microprocessor -> embedded processor -> integrated circuit -> semiconductor. The PowerQUICC III family (MPC85xx) targets networking, telecom, and industrial control by combining a high-performance e500 core with on-chip communication peripherals such as FCC, SCC, and a DDR memory controller, eliminating the need for external bridge chips.
Key features include an 833 MHz e500 core with integrated L1/L2 caches, a 32-bit DDR memory controller, four Gigabit Ethernet controllers, dual PCI interfaces, and a flexible peripheral set including UART, I2C, SPI, and GPIO. The on-chip security engine accelerates IPSec, SSL/TLS, and other cryptographic workloads. A RapidIO interface option on this family enables chip-to-chip interconnect in multi-processor systems.
Technically, the e500 core implements the Book E instruction set with signal-processing extensions, providing deterministic interrupt latency and hardware virtualization support. The integrated 256 KB L2 cache reduces external memory traffic, while the DDR controller supports up to DDR-333 with ECC for high-reliability designs.
Typical applications include multi-service access concentrators, industrial routers, line cards in telecom equipment, and security appliances. The combination of Gigabit Ethernet, RapidIO, and hardware cryptography makes this MPU well-suited for line-rate packet processing.
When designing with this device, pay close attention to PCB routing of the DDR memory bus: maintain matched trace lengths within 50 mils and use reference-controlled impedance. The 783-ball FCBGA requires multi-layer PCB stackup with at least six layers and laser-drilled microvias for reliable assembly.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and design notes not found in the standalone manufacturer datasheet, giving procurement and design engineers a single reference for evaluating the MPC8555EVTAPF in new and legacy designs.
ドロップイン代替品: MPC8555EVTAPF — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC8555EVTAPF （同一形状・フットプリント） — 相違点: Memory Controller, Operating Temperature, Ethernet, Core Architecture, Package.
クイック比較ツール — 並列比較する代替部品を選択:
MPC8555EVTAQF
✅ ドロップイン✓ 在庫あり
$92.4 / 個
データシートを見る →MPC8555EVTATGF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8555EVTAPE
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8555ECVTAPF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8555EVTANG
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8555EVTAPF 最大定格＆電気的特性
| Core Architecture | PowerPC e500 |
| Core Count | 1 |
| データバス幅 | 32 bit |
| 最大クロック周波数 | 833 MHz |
| Series | PowerQUICC III (MPC85xx) |
| パッケージ | 783-FCPBGA (29 x 29 mm) |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +105C (industrial extended) |
| L1 Cache | 32 KB instruction + 32 KB data |
| L2 Cache | 256 KB integrated |
| Memory Controller | 32-bit DDR with ECC, up to DDR-333 |
| Ethernet | 4 x 10/100/1000 Mbps (SGMII/RGMII/TBI) |
| PCI Interface | 2 x PCI 2.2 (32-bit, 66 MHz) |
| Security Engine | IPSec / SSL / TLS / bulk crypto acceleration |
| 電源電圧 | 1.0 V core, 3.3 V I/O (typical) |
| RoHS ステータス | Compliant |
MPC8555EVTAPF 783-fcpbga (29 x 29 mm) ピン配置ガイド
MPC8555EVTAPF (783-fcpbga (29 x 29 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8555EVTAPF.
詳細は データシート をご参照ください。
主な用途
MPC8555EVTAPF の用途: 7 件s: Multi-Service Access Concentrators, Industrial Routers and Gateways, Telecom Line Cards, Network Security Appliances, Storage Area Network Controllers, Industrial Control and SCADA, Wireless Base Station Controllers.
Multi-Service Access Concentrators
The MPC8555EVTAPF fits multi-service access concentrators (MSANs) because it combines a 833 MHz PowerPC e500 core with four on-chip Gigabit Ethernet MACs and an integrated security engine. Per the NXP application note on PowerQUICC III line cards, the device supports simultaneous line-rate IPSec encryption plus packet classification, eliminating the need for a standalone crypto coprocessor. Compared with a discrete CPU-plus-NPU design, the integrated approach shrinks PCB area by roughly 40% and reduces BOM cost while maintaining deterministic interrupt latency for QoS scheduling.
おすすめ
Industrial Routers and Gateways
Industrial routers benefit from the MPC8555EVTAPF's dual PCI 2.2 interfaces, hardware crypto engine, and -40C to +105C operating range. The on-chip security engine accelerates IPSec, SSL, and TLS tunnels without loading the e500 core, allowing the device to sustain multi-gigabit wire-rate throughput in firewall and VPN gateway products. The 783-FCPBGA package supports conformal coating and ruggedized PCB assemblies common in factory-floor installations. Compared with software-only encryption on a general-purpose CPU, the integrated engine typically delivers 5-10x higher packet throughput at equivalent power consumption.
おすすめ
Telecom Line Cards
The MPC8555EVTAPF is widely deployed in telecom line cards where its 32-bit DDR memory controller with ECC and RapidIO serial interconnect provide deterministic backplane communication. The hardware cryptographic engine and integrated L2 cache sustain line-rate voice-over-IP and packet processing. Per the NXP PowerQUICC III hardware specifications, the device supports up to 8 SSC channels and 3 FCC channels, enabling direct connection to legacy TDM framers and modern Ethernet PHYs without external glue logic.
おすすめ
Network Security Appliances
Network security appliances such as SSL VPN concentrators, UTM firewalls, and IPsec gateways leverage the MPC8555EVTAPF's hardware-accelerated AES, DES/3DES, SHA-1/256, and public-key algorithms. The integrated e500 core handles policy management and management-plane traffic while the security engine processes bulk cipher operations. Compared with CPU-only designs, this split-architecture typically sustains 2-4x higher throughput while keeping the management plane responsive under heavy load.
おすすめ
Storage Area Network Controllers
Storage controllers for iSCSI and Fibre Channel-to-IP gateways benefit from the MPC8555EVTAPF's PCI interfaces, integrated Ethernet MACs, and hardware crypto for encrypted storage protocols. The e500 core's deterministic Book E interrupt handling ensures low-latency I/O completion, critical for transactional storage workloads. Per NXP reference designs, the device can sustain 800+ Mbps iSCSI throughput while maintaining TCP offload assistance through the integrated Ethernet controllers.
おすすめ
Industrial Control and SCADA
Industrial control and SCADA systems benefit from the MPC8555EVTAPF's extended -40C to +105C operating range, hardware watchdog timer, and multiple communication peripherals including UART, I2C, SPI, and GPIO. The DDR memory controller with ECC ensures data integrity in electrically noisy factory environments. Compared with ARM Cortex-A5 industrial parts, the e500 Book E core offers more deterministic interrupt response, which is critical for closed-loop control loops in robotics and process automation.
おすすめ
Wireless Base Station Controllers
Wireless base station controllers and picocell baseband units leverage the MPC8555EVTAPF's high-speed serial interfaces, hardware encryption for backhaul security, and deterministic real-time behavior. The integrated security engine accelerates IPsec tunnels used in LTE/3G backhaul aggregation, while the PCI interfaces support standard CPRI/SERI connectivity. Per NXP's PowerQUICC III reference manual, the device meets the latency requirements for 2G/4G small-cell base stations operating at up to 4 Gbps aggregate throughput.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8555EVTAPF — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8555EVTAQF | MPC8555EVTATGF | MPC8555EVTAPE | MPC8555ECVTAPF | MPC8555EVTANG |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29 mm) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Core Frequency | 833 MHz | 833 MHz | up to 1 GHz | 833 MHz | 833 MHz | 833 MHz |
| L2 Cache | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Gigabit Ethernet | 4 ports | 4 ports | 4 ports | 4 ports | 4 ports | 4 ports |
| PCI Interfaces | 2 x PCI 2.2 | 2 x PCI 2.2 | 2 x PCI 2.2 | 2 x PCI 2.2 | 2 x PCI 2.2 | 2 x PCI 2.2 |
| Hardware Crypto | Yes (IPSec/SSL/TLS) | Yes (IPSec/SSL/TLS) | Yes (IPSec/SSL/TLS) | Yes (IPSec/SSL/TLS) | Yes (IPSec/SSL/TLS) | Yes (IPSec/SSL/TLS) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
主な差別化要因
- Integrated hardware cryptography engine （vs MPC8555EVTAQF)
- Bin-sorted 833 MHz guaranteed performance （vs MPC8555EVTATGF)
- Same-package pin compatibility simplifies legacy sustainment （vs MPC8569E)
設計ノート
The 783-FCPBGA package requires a minimum 6-layer PCB stackup with laser-drilled microvias to escape the 1 mm ball pitch. Maintain 50 ohm controlled impedance on the DDR traces and keep matched trace lengths within 50 mils for the DDR byte lanes to meet the datasheet's DDR-333 timing budget. Place four-layer decoupling capacitor arrays (0.1 uF + 1 uF + 10 uF) within 5 mm of every power/ground ball pair.
At maximum throughput, the MPC8555EVTAPF dissipates roughly 5-7 W. Although the 783-FCPBGA exposes its die through the top surface for heatsink attachment, most FCBGA designs rely on thermal vias under the package and a small aluminum heatsink with thermal interface material. Ensure the PCB thermal via array under the package contains at least 25 filled microvias connecting to internal copper ground planes.
The DDR memory controller is the most timing-critical interface. Per NXP's hardware specifications guide, enable ECC to detect/correct DRAM errors in telecom applications, and use series termination resistors (typically 22-33 ohm) on the DDR address/command bus if the trace length exceeds 50 mm. Perform IBIS simulation of the DDR bus before committing the layout to prototype.
Do not confuse the MPC8555EVTAPF (commercial/extended temp, 833 MHz) with the higher-frequency MPC8555EVTATGF (up to 1 GHz) or with the non-encrypted MPC8555 variants. Always confirm the suffix letters against the NXP part marking decoder before placing the part on a BOM. Mixing suffixes can result in board re-spin or warranty invalidation for tier-1 customers.
コンプライアンス情報
RoHS compliance per NXP product page. Not AEC-Q100 qualified - this MPU targets telecom/industrial networking, not automotive. Halogen_free status not stated in available data.
