MPC855TZQ80D4 - PowerQUICC 32-Bit MPU, 80MHz | NXP 357-PBGA
Référence : MPC855TZQ80D4 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $92.78 | $92,78 |
| 10 | $88.5 | $885,00 |
| 100 | $78.2 | $7 820,00 |
| 500 | $68.95 | $34 475,00 |
| 1 000 | $61.4 | $61 400,00 |
MPC855TZQ80D4 Présentation
An MPU (Microprocessor Unit) is the central processing component of an embedded system, distinct from an MCU by typically lacking on-chip flash and relying on external memory. The MPC8xx PowerQUICC family sits in the hierarchy as: MPU -> embedded processor -> integrated communications processor -> telecom/networking SoC. The MPC855T specifically targets telecom access gear (DSLAMs, routers, switches) where wire-speed Fast Ethernet and serial-protocol termination are required without a separate MAC ASIC.
Key features include a 32-bit Power Architecture core, on-chip CPM with dedicated RISC engine, Fast Ethernet MAC (10/100 Mbps), ATM AAL support, HDLC/SS#7 channels, PCMCIA interface, memory controller for SDRAM/ROM/Flash, and a commercial 0 to +95 °C operating temperature grade ('Z' = no floor). The 'TQ80' suffix decodes to a 80 MHz core frequency at the Z (0 to 95 °C) commercial grade, and the 'D4' indicates revision 4.x silicon in the ZQ/ZU 357-BGA package family.
Typical applications include SOHO and SMB routers, xDSL gateway/CPE platforms, ISDN terminal adapters, Fast Ethernet bridges, industrial serial-protocol converters, and embedded telecom control boards. The integrated CPM offloads protocol processing from the core, allowing wire-rate handling of multiple WAN interfaces simultaneously.
When designing with this part, allocate at least four PCB layers for the PBGA fan-out, and follow NXP's PowerQUICC Hardware Specifications for memory-controller timing, decoupling, and thermal management. Stock is constrained because NXP has issued a Discontinuance and Replacement Product Change Notice for this EOL family.
Alternatives de remplacement direct pour MPC855TZQ80D4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC855TZQ80D4 (même facteur de forme et même empreinte) — différant par Mounting Type, Core Architecture, Package, RoHS Status, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC860DPZQ80D4
✅ Remplacement direct✓ En stock
$13.85 / unité
Voir la fiche technique →MPC860DTZQ80D4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC860SRVR80D4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC860PCZQ66D4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC855TZQ80D4 Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Product Type | Microprocessor Unit (MPU) |
| Series | PowerQUICC MPC8xx (MPC855T) |
| Core Architecture | Power Architecture MPC8xx, 32-bit |
| Core Clock Frequency | 80 MHz |
| Communication Processor Module (CPM) | Integrated RISC engine with FCC/ATM/HDLC |
| Ethernet Support | 10/100 Mbps Fast Ethernet MAC |
| Serial Protocols | ATM, HDLC, SS#7 (via CPM) |
| PCMCIA Interface | Yes (1 or 2 slots) |
| Memory Bus Width | 32-bit (external) |
| Largeur du bus de données | 32 bit |
| Process Technology | 0.32 um CMOS |
| Température de fonctionnement | 0 °C to +95 °C (commercial 'Z' grade) |
| Boîtier | 357-pin PBGA, 25 x 25 mm (ZQ/ZU tray) |
| Type de montage | Surface Mount, BGA |
| Statut RoHS | Not compliant (SnPb-ball BGA, pre-RoHS generation) |
| Lead-Free | No (SnPb solder balls) |
| Lifecycle | Discontinued — see Discontinuance PCN |
Guide de configuration des broches du MPC855TZQ80D4 357-pin pbga, 25 x 25 mm (zq/zu tray)
Configuration des broches du MPC855TZQ80D4 (boîtier 357-pin pbga, 25 x 25 mm (zq/zu tray)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC855TZQ80D4.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC855TZQ80D4 convient pour 6 applications: SOHO Router & Broadband Gateway, ISDN Terminal Adapter / NT, Industrial Serial Protocol Converter, xDSL CPE Modem Platform, Fast Ethernet Bridge / Media Converter, Legacy Telecom Control Board (V5.x / E1).
SOHO Router & Broadband Gateway
The MPC855TZQ80D4's integrated Fast Ethernet MAC and wire-rate CPM offload make it a single-chip solution for SOHO/SMB routers and xDSL gateways. With a 80 MHz Power Architecture core and dedicated RISC engine for protocol handling, the device handles NAT, routing, and PPPoE termination without requiring an external ASIC. Placed at the heart of the gateway with 32 to 64 MB of SDRAM and a 4 to 8 MB boot Flash, it processes bidirectional Fast Ethernet traffic at wire speed. According to the NXP PowerQUICC Hardware Specifications, the on-chip FCC (Fast Communication Controller) sustains 100 Mbps full-duplex while the core runs the Linux networking stack, eliminating the need for a separate network processor.
Recommandé
ISDN Terminal Adapter / NT
The integrated HDLC channels and PCMCIA controller make the MPC855TZQ80D4 well suited to ISDN terminal adapters and Network Termination 1 (NT1) equipment that bridge BR/PRI ISDN to Ethernet. The CPM supports D-channel HDLC framing at full ISDN bit rates while the MPC8xx core runs the management/V.110/V.120 stack. With the 357-PBGA package providing ample I/O for parallel PRI buses, it consolidates what used to require a discrete HDLC controller. PowerQUICC parts in this family also handle D-channel X.25, frame relay, and SS#7 lower layers, making them attractive for legacy telecom gear where wire-rate protocol termination is mandatory.
Recommandé
Industrial Serial Protocol Converter
Factories deploying multi-protocol serial equipment benefit from the MPC855TZQ80D4's mix of SCC channels running UART, HDLC, and bit-sync protocols concurrently. The CPM independently handles each serial line at up to the SCC bit-rate limit while the Power Architecture core runs the conversion/aggregation application. The commercial 0–95 °C temperature grade is a fit for sealed control cabinets, and the 357-PBGA provides long-term reliability in vibration-heavy environments when paired with underfilled PCB assembly. Compared to a discrete microcontroller + external UART array, the PowerQUICC SBC approach reduces BOM count and shortens development time.
Recommandé
xDSL CPE Modem Platform
xDSL customer-premises equipment (CPE) historically paired a network processor with a DSL PHY; the MPC855TZQ80D4 acts as the network-side controller alongside the DSL analog front end. Its Ethernet MAC terminates the LAN, while the CPM provides the ATM AAL SAR needed for DSL upstream multiplexing. At 80 MHz the MPC8xx core comfortably runs a stripped-down Linux or VxWorks image managing PPP, IP, and ATM PVC setup. Per NXP documentation, the PowerQUICC MPC8xx CPM was the de-facto standard for early-generation ADSL CPE routers, and the MPC855T's lower cost versus the full MPC860 made it the sweet-spot SKU for sub-$100 gateways.
Recommandé
Fast Ethernet Bridge / Media Converter
A simple two-port Fast Ethernet bridge, or a fiber-to-copper media converter, requires wire-rate frame forwarding without complex routing — exactly what the MPC855TZQ80D4's CPM-FCC delivers. The device can be configured in cut-through or store-and-forward mode by dedicating one FCC to each port while the core handles learning-bridge table management. With only 32 MB of SDRAM and a small Flash, the BOM stays low for unmanaged bridges. Compared to using a generic microcontroller with software MAC, the on-chip CPM sustains full 100 Mbps full-duplex on both ports simultaneously without dropping packets.
Recommandé
Legacy Telecom Control Board (V5.x / E1)
V5.1/V5.2 access-network interface controllers and E1/T1 grooming cards use the MPC855TZQ80D4 for its HDLC concentration and PCMCIA expansion slot. The part sits on a VME/PCI/CompactPCI carrier card, terminates multiple E1 links, and bridges timeslots to an upstream switch fabric. Its long lifecycle in the embedded telecom market means mature VxWorks and pSOS board-support packages remain available, easing maintenance of installed base hardware. Compared to newer SoCs, the PowerQUICC MPC855T retains dedicated timeslot-assignment hardware (TSA) and serial interface with TDM, which newer devices often lack, making it a preferred migration target only when those legacy paths are needed.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC855TZQ80D4 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC860DPZQ80D4 | MPC860DTZQ80D4 | MPC860SRVR80D4 | MPC860PCZQ66D4 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (ZQ) 25x25 mm | 357-BGA (ZQ) — same family | 357-BGA (ZQ) — same family | 357-BGA family (VR variant) | 357-BGA (ZQ) — same family |
| Core Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 66 MHz (-17.5%) |
| Series | PowerQUICC MPC8xx (MPC855T) | PowerQUICC MPC8xx (MPC860) | PowerQUICC MPC8xx (MPC860) | PowerQUICC MPC8xx (MPC860) | PowerQUICC MPC8xx (MPC860) |
| Core Architecture | 32-bit Power Architecture MPC8xx | 32-bit Power Architecture MPC8xx | 32-bit Power Architecture MPC8xx | 32-bit Power Architecture MPC8xx | 32-bit Power Architecture MPC8xx |
| CPM Channels / Ethernet MACs | 1× 10/100 MAC + multi-channel CPM | Higher-channel count | Highest channel count in family | Sibling variant | Lower clock, same architecture |
| Operating Temperature | 0 °C to +95 °C (Z grade) | 0 °C to +95 °C (Z grade) | 0 °C to +95 °C (Z grade) | 0 °C to +95 °C (R grade VR package) | 0 °C to +95 °C (Z grade) |
| RoHS / Lead-Free | Non-RoHS (SnPb BGA balls) | Non-RoHS (SnPb BGA balls) | Non-RoHS (SnPb BGA balls) | Non-RoHS (SnPb BGA balls) | Non-RoHS (SnPb BGA balls) |
| Lifecycle | Discontinued (EOL) | Discontinued (EOL) | Discontinued (EOL) | Discontinued (EOL) | Discontinued (EOL) |
Principaux différenciateurs
- Lowest-cost PowerQUICC with integrated Fast Ethernet MAC (vs MPC860DPZQ80D4)
- Mature, long-availability software ecosystem (vs MPC860DTZQ80D4)
- Integrated CPM offloads wire-rate protocol handling (vs MPC860PCZQ66D4)
Notes de conception
Estimated: at 80 MHz with typical 3.3 V core and 3.3 V I/O rails under normal load, the MPC855TZQ80D4 dissipates roughly 1.5 to 2.5 W. The 357-PBGA has no exposed thermal pad; rely on a minimum 4-layer PCB with an unbroken inner ground/power plane and thermal vias under the die-shadow region to keep junction temperature below 110 °C in the 0–95 °C ambient range. No manufacturer SOA is published for this device because the part is an MPU rather than a power semiconductor.
Follow NXP's PowerQUICC Hardware Specifications PCB-layout section: 50 Ω controlled impedance for the SDRAM bus, matched-length groups for clock and data, decoupling capacitors placed within 100 mil of every power pin, and a minimum of 6 PCB layers (4 signal + 2 plane) for full bus routing. The 357-BGA at 1.27 mm pitch requires laser-drilled micro-vias or 0.4 mm-pitch dogbone fan-outs; standard 0.3 mm-drilled PTHs will not fit between balls.
Because the BGA uses SnPb (lead-bearing) balls, the MPC855TZQ80D4 is not RoHS compliant and cannot be processed on a lead-free SMT line without a manufacturer-supplied exemption flow. Also note that the 'D4' revision suffix matters: revision 4.x silicon fixed known errata in earlier revisions; do not qualify production builds on pre-D4 silicon. Finally, design for boot from Flash with proper bus-grant configuration — many first-boot failures stem from incorrect BR/OR register setup in the U-Boot or ppcboot image.
Informations de conformité
Pre-RoHS, SnPb solder balls per NXP product page and DigiKey RoHS flag. AEC-Q100 not applicable for telecom/commercial MPU. REACH and conflict-mineral statements are not published on the NXP product page for this EOL part; treat as 'unknown' rather than assumed-compliant.
