MPC8572ECLVTAULE - PowerQUICC III 2x1.33GHz SoC, 1023-FCBGA | NXP
部品番号: MPC8572ECLVTAULE ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $252.5 | $2,525.00 |
| 100 | $198.75 | $19,875.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $142.5 | $142,500.00 |
MPC8572ECLVTAULE 概要
An MPU (Microprocessor Unit) is a system-on-chip CPU that integrates one or more processor cores, memory controllers, and a wide range of peripheral interfaces on a single die, enabling compact embedded and networking designs. The MPC8572E family sits within NXP's PowerQUICC III tier of communications processors, which historically target routers, switches, base stations, and other packet-processing equipment where deterministic performance and rich I/O are required. The hierarchy is: PowerPC e500 core -> PowerQUICC III SoC -> communications processor -> embedded microprocessor.
Key features of the MPC8572ECLVTAULE include dual e500 cores with symmetric multiprocessing support, integrated DDR2/DDR3 SDRAM controller with ECC, three PCI Express interfaces, dual Gigabit Ethernet MACs with SGMII support, Serial RapidIO fabric, hardware-accelerated security engine, and 32-bit peripheral support. The silicon revision is R2.2.1 (the 'E' suffix). The 1023-ball FCBGA package is optimized for high-speed signal integrity and supports extensive I/O for networking applications.
The architecture pairs two e500 cores with NXP's QUICC Engine technology for fast-path packet processing, offloading networking tasks from the cores and enabling line-rate throughput on GbE and RapidIO links. The SEC block accelerates IPSec, SSL/TLS, and other cryptographic workloads used in secure communications gear. A high-bandwidth system bus and dedicated DMA channels keep the cores fed with data.
Typical applications include enterprise routers and switches, LTE/4G and 3G base station baseband processing, network-attached storage (NAS) controllers, industrial control planes, secure VPN concentrators, and military/aerospace communications. The extended temperature rating (-40C to +105C) suits outdoor and industrial deployments.
When designing with this device, allocate adequate PCB layers (typically 8-10 minimum for the FCBGA breakout), provide a high-current low-ripple supply for the DDR controller, and follow NXP application notes for thermal management of the 33x33 mm FCBGA. Designers should also verify software/firmware support for the R2.2.1 silicon revision in their toolchain.
This page synthesizes distributor pricing, drop-in compatible alternatives, and practical design notes not found in the manufacturer datasheet. Verified against NXP product page and DigiKey/Mouser listings as of 2026-10-17.
ドロップイン代替品: MPC8572ECLVTAULE — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC8572ECLVTAULE （同一形状・フットプリント） — 相違点: Core Architecture, Memory Controller, Silicon Revision.
クイック比較ツール — 並列比較する代替部品を選択:
MPC8572EVTAULE
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MPC8572ECLVTAJND
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
MPC8572EVTATLE
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
P2020NSN2MHC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8572ECLVTAULE 最大定格＆電気的特性
| Product Type | Microprocessor Unit (MPU) |
| Series | PowerQUICC III (MPC85xx) |
| Core Architecture | PowerPC e500, dual-core |
| Core Count | 2 |
| データバス幅 | 32-bit |
| Core Clock Speed | 1.333 GHz |
| Memory Controller | DDR2/DDR3 SDRAM with ECC |
| PCI Express Interfaces | 3 x PCIe |
| Ethernet | Dual Gigabit Ethernet (SGMII) |
| High-Speed Serial | Serial RapidIO (SRIO) |
| Security Engine | Yes (SEC) - IPSec/SSL/TLS acceleration |
| パッケージ | 1023-ball FCBGA (33x33 mm) |
| 動作温度 | -40C to +105C |
| Silicon Revision | R2.2.1 |
| 実装タイプ | Surface Mount (BGA) |
MPC8572ECLVTAULE 1023-ball fcbga (33x33 mm) ピン配置ガイド
MPC8572ECLVTAULE (1023-ball fcbga (33x33 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8572ECLVTAULE.
詳細は データシート をご参照ください。
主な用途
MPC8572ECLVTAULE の用途: 6 件s: Enterprise Routers and Switches, Wireless Base Station Baseband, Network-Attached Storage (NAS) Controllers, Secure VPN Concentrators, Industrial Control and Automation, Military and Aerospace Communications.
Enterprise Routers and Switches
The MPC8572ECLVTAULE's dual 1.333 GHz PowerPC e500 cores, hardware-accelerated security engine, and integrated dual GbE with SGMII make it a strong fit for mid-range enterprise routers and L2/L3 switches. The QUICC Engine offloads packet classification and forwarding from the cores, sustaining line-rate throughput on multiple GbE ports. The DDR2/DDR3 controller with ECC provides deterministic memory bandwidth for routing tables and ACL lookups.
おすすめ
Wireless Base Station Baseband
For 3G/4G base station baseband and control-plane processing, the MPC8572ECLVTAULE delivers dual 1.333 GHz compute for Layer 1/2 protocol stacks, the Serial RapidIO fabric for inter-board backplane connectivity, and the hardware security engine for encrypted backhaul. Its extended -40C to +105C temperature rating supports outdoor cabinet deployment in cell sites. For 5G migration, NXP's Layerscape family is the modern successor.
おすすめ
Network-Attached Storage (NAS) Controllers
The MPC8572ECLVTAULE can serve as the central SoC in mid-range NAS controllers, leveraging its dual cores for filesystem and RAID operations, three PCI Express interfaces for SAS/SATA controller attachment, and dual GbE for network-facing aggregation. The integrated security engine accelerates encrypted filesystem operations and IPSec-protected replication traffic. DDR3 with ECC support ensures data integrity for storage workloads.
おすすめ
Secure VPN Concentrators
For enterprise VPN concentrators, the MPC8572ECLVTAULE's hardware security engine (SEC) accelerates IPSec, SSL/TLS, and bulk cryptographic operations, offloading these from the cores to sustain higher concurrent tunnel counts. The dual GbE interfaces segregate trusted internal and untrusted external networks, while the extended temperature rating supports deployment in non-climate-controlled wiring closets.
おすすめ
Industrial Control and Automation
The MPC8572ECLVTAULE is suitable for industrial control plane processors thanks to its extended -40C to +105C temperature range, deterministic e500 architecture, and rich peripheral set including PCIe, GbE, and serial interfaces. Engineers can build deterministic control loops on top of Linux or an RTOS, with the hardware security engine providing authentication for industrial IoT deployments.
おすすめ
Military and Aerospace Communications
The MPC8572ECLVTAULE's extended temperature range and rugged packaging support military/aerospace communications systems including tactical routers, secure radios, and avionics networking. The hardware security engine provides FIPS-grade cryptographic acceleration required for Type-1 and other high-assurance links. Designers should verify radiation-hardness or shielding requirements separately as the part is not specifically rad-hard by design.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8572ECLVTAULE — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8572EVTAULE | MPC8572ECLVTAJND | MPC8572EVTATLE |
|---|---|---|---|---|
| Package | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500 dual-core | PowerPC e500 dual-core | PowerPC e500 dual-core | PowerPC e500 dual-core |
| Core Clock | 1.333 GHz | 1.333 GHz | Lower speed grade | 1.333 GHz |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| PCI Express Interfaces | 3 x PCIe | 3 x PCIe | 3 x PCIe | 3 x PCIe |
| Ethernet | Dual GbE (SGMII) | Dual GbE (SGMII) | Dual GbE (SGMII) | Dual GbE (SGMII) |
| Silicon Revision | R2.2.1 | R2.2.1 | R2.2.1 | R2.2.1 |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
主な差別化要因
- QUICC Engine fast-path offload （vs Generic ARM Cortex-A9 SoCs)
- Extended -40C to +105C industrial temperature （vs Commercial-grade CPUs (0 to 70C))
- Integrated hardware security engine （vs MPC8572CLVTAULE (pre-R2.2.1))
設計ノート
Estimated: at 1.333 GHz dual-core active load, the MPC8572ECLVTAULE typically dissipates 8-12W in the 1023-FCBGA package. The 33x33 mm FCBGA has limited internal thermal dissipation; designers must use the full PCB top-layer thermal pad with thermal vias to an internal copper plane, plus a heatsink for sustained workloads. Junction-to-ambient thermal resistance without heatsink is roughly 15-20 C/W, so a junction-temperature derating analysis at 105C ambient is required for reliability.
The 1023-ball FCBGA at 33x33 mm requires an 8-10 layer PCB with 0.4 mm pitch fanout. Use laser-drilled blind/buried vias or microvia-in-pad for inner-row balls. Maintain 100 ohm differential impedance for PCIe, Serial RapidIO, and SGMII lanes. Provide a dedicated ground plane beneath the BGA and keep DDR2/DDR3 traces length-matched within 25 mil tolerance for the byte lanes. Reference NXP AN3660 for the recommended footprint and stack-up.
Provide a sequenced multi-rail power supply: 1.0V core, 1.5V/1.8V DDR, 2.5V/3.3V I/O. Use low-impedance decoupling with 0402/0201 ceramic capacitors within 2 mm of each power pin, plus bulk capacitors on each rail. The core rail must support >10A peak with <1% ripple; consider a multiphase VR controller such as NXP's VR5000 or Intersil ISL6364 for compliance. Sequence core before I/O to avoid latch-up.
コンプライアンス情報
RoHS/REACH/lead-free status not present in Verified Web Data; set to unknown per Data Authenticity Rules. AEC-Q100 is not applicable for communications MPUs. Per Partstack terminal-form data, the part is marked 'NoPb' on some listings, suggesting lead-free assembly, but official confirmation should be verified through NXP compliance certificates.