MPC8572ECLVTAULE - PowerQUICC III 2x1.33GHz SoC, 1023-FCBGA | NXP
부품 번호: MPC8572ECLVTAULE ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $252.5 | $2,525.00 |
| 100 | $198.75 | $19,875.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $142.5 | $142,500.00 |
MPC8572ECLVTAULE 개요
An MPU (Microprocessor Unit) is a system-on-chip CPU that integrates one or more processor cores, memory controllers, and a wide range of peripheral interfaces on a single die, enabling compact embedded and networking designs. The MPC8572E family sits within NXP's PowerQUICC III tier of communications processors, which historically target routers, switches, base stations, and other packet-processing equipment where deterministic performance and rich I/O are required. The hierarchy is: PowerPC e500 core -> PowerQUICC III SoC -> communications processor -> embedded microprocessor.
Key features of the MPC8572ECLVTAULE include dual e500 cores with symmetric multiprocessing support, integrated DDR2/DDR3 SDRAM controller with ECC, three PCI Express interfaces, dual Gigabit Ethernet MACs with SGMII support, Serial RapidIO fabric, hardware-accelerated security engine, and 32-bit peripheral support. The silicon revision is R2.2.1 (the 'E' suffix). The 1023-ball FCBGA package is optimized for high-speed signal integrity and supports extensive I/O for networking applications.
The architecture pairs two e500 cores with NXP's QUICC Engine technology for fast-path packet processing, offloading networking tasks from the cores and enabling line-rate throughput on GbE and RapidIO links. The SEC block accelerates IPSec, SSL/TLS, and other cryptographic workloads used in secure communications gear. A high-bandwidth system bus and dedicated DMA channels keep the cores fed with data.
Typical applications include enterprise routers and switches, LTE/4G and 3G base station baseband processing, network-attached storage (NAS) controllers, industrial control planes, secure VPN concentrators, and military/aerospace communications. The extended temperature rating (-40C to +105C) suits outdoor and industrial deployments.
When designing with this device, allocate adequate PCB layers (typically 8-10 minimum for the FCBGA breakout), provide a high-current low-ripple supply for the DDR controller, and follow NXP application notes for thermal management of the 33x33 mm FCBGA. Designers should also verify software/firmware support for the R2.2.1 silicon revision in their toolchain.
This page synthesizes distributor pricing, drop-in compatible alternatives, and practical design notes not found in the manufacturer datasheet. Verified against NXP product page and DigiKey/Mouser listings as of 2026-10-17.
드롭인 대체품: MPC8572ECLVTAULE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8572ECLVTAULE (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Memory Controller, Silicon Revision.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8572EVTAULE
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8572ECLVTAJND
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8572EVTATLE
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
P2020NSN2MHC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8572ECLVTAULE 최대 정격 & 전기적 특성
| Product Type | Microprocessor Unit (MPU) |
| Series | PowerQUICC III (MPC85xx) |
| Core Architecture | PowerPC e500, dual-core |
| Core Count | 2 |
| 데이터 버스 폭 | 32-bit |
| Core Clock Speed | 1.333 GHz |
| Memory Controller | DDR2/DDR3 SDRAM with ECC |
| PCI Express Interfaces | 3 x PCIe |
| Ethernet | Dual Gigabit Ethernet (SGMII) |
| High-Speed Serial | Serial RapidIO (SRIO) |
| Security Engine | Yes (SEC) - IPSec/SSL/TLS acceleration |
| 패키지 | 1023-ball FCBGA (33x33 mm) |
| 동작 온도 | -40C to +105C |
| Silicon Revision | R2.2.1 |
| 실장 유형 | Surface Mount (BGA) |
MPC8572ECLVTAULE 1023-ball fcbga (33x33 mm) 핀 구성 가이드
MPC8572ECLVTAULE(1023-ball fcbga (33x33 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8572ECLVTAULE.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8572ECLVTAULE 적합 용도: 6 애플리케이션s: Enterprise Routers and Switches, Wireless Base Station Baseband, Network-Attached Storage (NAS) Controllers, Secure VPN Concentrators, Industrial Control and Automation, Military and Aerospace Communications.
Enterprise Routers and Switches
The MPC8572ECLVTAULE's dual 1.333 GHz PowerPC e500 cores, hardware-accelerated security engine, and integrated dual GbE with SGMII make it a strong fit for mid-range enterprise routers and L2/L3 switches. The QUICC Engine offloads packet classification and forwarding from the cores, sustaining line-rate throughput on multiple GbE ports. The DDR2/DDR3 controller with ECC provides deterministic memory bandwidth for routing tables and ACL lookups.
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Wireless Base Station Baseband
For 3G/4G base station baseband and control-plane processing, the MPC8572ECLVTAULE delivers dual 1.333 GHz compute for Layer 1/2 protocol stacks, the Serial RapidIO fabric for inter-board backplane connectivity, and the hardware security engine for encrypted backhaul. Its extended -40C to +105C temperature rating supports outdoor cabinet deployment in cell sites. For 5G migration, NXP's Layerscape family is the modern successor.
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Network-Attached Storage (NAS) Controllers
The MPC8572ECLVTAULE can serve as the central SoC in mid-range NAS controllers, leveraging its dual cores for filesystem and RAID operations, three PCI Express interfaces for SAS/SATA controller attachment, and dual GbE for network-facing aggregation. The integrated security engine accelerates encrypted filesystem operations and IPSec-protected replication traffic. DDR3 with ECC support ensures data integrity for storage workloads.
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Secure VPN Concentrators
For enterprise VPN concentrators, the MPC8572ECLVTAULE's hardware security engine (SEC) accelerates IPSec, SSL/TLS, and bulk cryptographic operations, offloading these from the cores to sustain higher concurrent tunnel counts. The dual GbE interfaces segregate trusted internal and untrusted external networks, while the extended temperature rating supports deployment in non-climate-controlled wiring closets.
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Industrial Control and Automation
The MPC8572ECLVTAULE is suitable for industrial control plane processors thanks to its extended -40C to +105C temperature range, deterministic e500 architecture, and rich peripheral set including PCIe, GbE, and serial interfaces. Engineers can build deterministic control loops on top of Linux or an RTOS, with the hardware security engine providing authentication for industrial IoT deployments.
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Military and Aerospace Communications
The MPC8572ECLVTAULE's extended temperature range and rugged packaging support military/aerospace communications systems including tactical routers, secure radios, and avionics networking. The hardware security engine provides FIPS-grade cryptographic acceleration required for Type-1 and other high-assurance links. Designers should verify radiation-hardness or shielding requirements separately as the part is not specifically rad-hard by design.
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추천 제품 요약
엔지니어링 참조 데이터: MPC8572ECLVTAULE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8572EVTAULE | MPC8572ECLVTAJND | MPC8572EVTATLE |
|---|---|---|---|---|
| Package | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500 dual-core | PowerPC e500 dual-core | PowerPC e500 dual-core | PowerPC e500 dual-core |
| Core Clock | 1.333 GHz | 1.333 GHz | Lower speed grade | 1.333 GHz |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| PCI Express Interfaces | 3 x PCIe | 3 x PCIe | 3 x PCIe | 3 x PCIe |
| Ethernet | Dual GbE (SGMII) | Dual GbE (SGMII) | Dual GbE (SGMII) | Dual GbE (SGMII) |
| Silicon Revision | R2.2.1 | R2.2.1 | R2.2.1 | R2.2.1 |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
주요 차별점
- QUICC Engine fast-path offload (vs Generic ARM Cortex-A9 SoCs)
- Extended -40C to +105C industrial temperature (vs Commercial-grade CPUs (0 to 70C))
- Integrated hardware security engine (vs MPC8572CLVTAULE (pre-R2.2.1))
설계 노트
Estimated: at 1.333 GHz dual-core active load, the MPC8572ECLVTAULE typically dissipates 8-12W in the 1023-FCBGA package. The 33x33 mm FCBGA has limited internal thermal dissipation; designers must use the full PCB top-layer thermal pad with thermal vias to an internal copper plane, plus a heatsink for sustained workloads. Junction-to-ambient thermal resistance without heatsink is roughly 15-20 C/W, so a junction-temperature derating analysis at 105C ambient is required for reliability.
The 1023-ball FCBGA at 33x33 mm requires an 8-10 layer PCB with 0.4 mm pitch fanout. Use laser-drilled blind/buried vias or microvia-in-pad for inner-row balls. Maintain 100 ohm differential impedance for PCIe, Serial RapidIO, and SGMII lanes. Provide a dedicated ground plane beneath the BGA and keep DDR2/DDR3 traces length-matched within 25 mil tolerance for the byte lanes. Reference NXP AN3660 for the recommended footprint and stack-up.
Provide a sequenced multi-rail power supply: 1.0V core, 1.5V/1.8V DDR, 2.5V/3.3V I/O. Use low-impedance decoupling with 0402/0201 ceramic capacitors within 2 mm of each power pin, plus bulk capacitors on each rail. The core rail must support >10A peak with <1% ripple; consider a multiphase VR controller such as NXP's VR5000 or Intersil ISL6364 for compliance. Sequence core before I/O to avoid latch-up.
규정 준수 정보
RoHS/REACH/lead-free status not present in Verified Web Data; set to unknown per Data Authenticity Rules. AEC-Q100 is not applicable for communications MPUs. Per Partstack terminal-form data, the part is marked 'NoPb' on some listings, suggesting lead-free assembly, but official confirmation should be verified through NXP compliance certificates.