MSC8156ESVT1000B - 6-Core SC3850 DSP @ 1GHz | NXP | FCBGA-783
部品番号: MSC8156ESVT1000B ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $212.97 | $212.97 |
| 10 | $198.5 | $1,985.00 |
| 100 | $175 | $17,500.00 |
| 500 | $155 | $77,500.00 |
| 1,000 | $138 | $138,000.00 |
MSC8156ESVT1000B 概要
A digital signal processor (DSP) is a specialized microprocessor whose instruction set, parallel MAC units, and deterministic execution are optimized for numerically intensive real-time workloads such as FIR/IIR filtering, FFT/IFFT, channelization, turbo decoding, and beamforming. Within the compute hierarchy a DSP sits below application processors (CPUs) and above fixed-function accelerators: it offers more algorithmic flexibility than an ASIC while delivering higher throughput per watt than a general-purpose core, making it the standard building block for physical-layer (PHY) processing in 3G/4G/5G baseband, radar, and defense signal chains.
Key features of the MSC8156ESVT1000B include 1 GHz core clock frequency, 2.50 V I/O supply, 1.00 V core supply, and a broad peripheral set covering Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, and UART/USART. Each SC3850 core includes quad 16-bit MAC units and a hardware security engine, enabling MACsec/IPsec/SSL acceleration without burdening the signal-processing cores.
Architecturally the device pairs six identical SC3850 DSP subsystems around a high-bandwidth on-chip interconnect, with a dedicated queue manager (QE) and a memory controller that supports DDR2/DDR3 with ECC. The FCBGA-783 substrate provides the necessary signal and power-pad density for the 1 GHz parallel operation, and the integrated SEC engine accelerates the cryptographic primitives required in modern backhaul and fronthaul links.
Typical applications include LTE/UMTS/WCDMA baseband processing, channel cards for picocell and micro-cell base stations, defense and intelligence signal intelligence (SIGINT) systems, and wireline backhaul line cards. The multi-core scalability is well matched to carrier-scale PHY pipelines that must process multiple sectors or antenna streams concurrently.
When designing with the MSC8156ESVT1000B, plan the PCB stack-up for the 783-ball FCBGA, allocate sufficient thermal headroom at 1 GHz continuous operation, and verify the memory-controller timing against the chosen DDR3 speed grade; one-time-programmable security keys must be provisioned before deployment.
This page synthesizes distributor pricing, drop-in alternatives (same-platform MSC8156 variants), and practical design notes not consolidated in the manufacturer datasheet.
ドロップイン代替品: MSC8156ESVT1000B — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MSC8156ESVT1000B （同一形状・フットプリント） — 相違点: Package, Mounting Type, Operating Temperature, Core Architecture, Memory Controller.
クイック比較ツール — 並列比較する代替部品を選択:
MSC8156SVT1000B
✅ ドロップイン✓ 在庫あり
$124.8 / 個
データシートを見る →MSC8156HAG1000B
✅ ドロップイン✓ 在庫あり
$198.75 / 個
データシートを見る →MSC8154SAG1000B
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MSC8256ESAG1000B
✅ ドロップイン✓ 在庫あり
$198.75 / 個
データシートを見る →TMS320C6678ACYPA
✅ ドロップイン✓ 在庫あり
$226.49 / 個
データシートを見る →MSC8156ESVT1000B 仕様
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | StarCore |
| Type | SC3850 Six Core DSP |
| Number of Cores | 6 |
| Core Architecture | StarCore SC3850 |
| Clock Rate | 1 GHz |
| On-Chip RAM | 576 KB |
| Non-Volatile Memory | ROM 96 KB |
| L1 Instruction Cache (per core) | 32 KB |
| L1 Data Cache (per core) | 32 KB |
| Unified L2 Cache | 512 KB |
| Voltage - I/O | 2.50 V |
| Voltage - Core | 1.00 V |
| インターフェース | Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART |
| パッケージ | 783-BBGA, FCBGA |
| Packaging | Tray |
| 実装タイプ | Surface Mount |
MSC8156ESVT1000B 783-bbga, fcbga ピン配置ガイド
MSC8156ESVT1000B (783-bbga, fcbga パッケージ) のピン配置。 ピン番号、機能、接続図はメーカーのデータシートで定義されています。正確なフットプリントとはんだ付けのガイドラインについては、データシートを参照してください。
詳細なピン配置データはありません: MSC8156ESVT1000B.
詳細は データシート をご参照ください。
主な用途
MSC8156ESVT1000B の用途: 6 件s: LTE/UMTS/WCDMA Baseband Channel Card, Defense SIGINT / Electronic Warfare Processing, Wireline Backhaul Line Card / Edge Router, Radar Front-End Pre-Processing, Industrial Multi-Axis Motor Control Hub, Medical Imaging (Ultrasound Beamformer).
LTE/UMTS/WCDMA Baseband Channel Card
The MSC8156ESVT1000B is widely used as the baseband processing engine in 3G/4G channel cards for picocell, micro-cell, and macro-cell base stations. The six SC3850 cores each deliver quad 16-bit MAC units at 1 GHz, providing the aggregate compute needed for downlink turbo decoding, uplink FFT/IFFT, and channel estimation across multiple antennas simultaneously. A typical design pairs the chip with a DDR3-1600 memory, a SerDes fronthaul to the radio unit (CPRI/OBSAI), and the integrated SEC engine for encrypting the backhaul transport. The 783-ball FCBGA exposes sufficient parallel I/O to drive two or three SGMII links plus a Serial RapidIO fabric without external glue logic, which makes it a compact, low-BOM solution for high-density channel cards.
おすすめ
Defense SIGINT / Electronic Warfare Processing
Defense signal-intelligence and electronic-warfare platforms rely on the MSC8156ESVT1000B for wideband digital down-conversion, pulse compression, and direction-finding algorithms. Each of the six 1 GHz SC3850 cores can sustain a wide FFT window while leaving headroom for adaptive beamforming weights, allowing one chip to handle a multi-channel receiver front-end. The unified 512 KB L2 cache and 576 KB on-chip SRAM hold several seconds of overlap-save buffer without external DRAM pressure, which simplifies deterministic timing in EW pipelines. For ruggedized deployments the MSC8156HAG1000B high-reliability variant shares the silicon so existing SIGINT firmware can be reused with minimal re-qualification.
おすすめ
Wireline Backhaul Line Card / Edge Router
In wireline backhaul and edge-router line cards, the MSC8156ESVT1000B is used for packet classification, deep-packet inspection, and bulk encryption of metro-ethernet traffic. The integrated SEC engine accelerates IPsec, MACsec, and SSL/TLS at line-rate, freeing the six SC3850 cores for flow lookup and QoS scheduling. The peripheral mix (Ethernet, RGMII, SGMII, Serial RapidIO, PCI) lets the chip sit between a packet processor ASIC and the fronthaul switch fabric, while the 1.0 V core supply keeps power within typical NEBS thermal budgets. This makes it a strong fit for 10G/40G mobile-backhaul line cards where deterministic packet processing matters more than raw ACL throughput.
おすすめ
Radar Front-End Pre-Processing
The MSC8156ESVT1000B handles radar front-end pre-processing including matched filtering, moving-target-indication (MTI) filtering, and CFAR detection on raw I/Q data. Six SC3850 cores at 1 GHz can sustain a long coherent processing interval (CPI) while leaving spare cycles for adaptive interference cancellation across antenna elements. Designers typically pair the device with a high-speed ADC front-end feeding through Serial RapidIO, and the chip's deterministic interrupt latency is critical for synchronized phased-array beam steering. The 783-ball FCBGA also provides clean power distribution for the compute-dense DSP blocks, simplifying thermal layout in a sealed radar enclosure.
おすすめ
Industrial Multi-Axis Motor Control Hub
In multi-axis industrial motion controllers, the MSC8156ESVT1000B can run field-oriented control (FOC) loops on up to six axes simultaneously thanks to its six 1 GHz SC3850 cores each equipped with deterministic interrupt pipelines. The on-chip SEC engine is leveraged to secure fieldbus protocols like EtherCAT or PROFINET over the integrated Ethernet/SGMII ports, while the SPI and UART/USART interfaces drive per-axis gate-driver telemetry. The 576 KB on-chip RAM holds one full PID cycle for all six axes, allowing control loops to run without external DRAM round-trips and tightening the deterministic timing required by high-dynamic servo systems.
おすすめ
Medical Imaging (Ultrasound Beamformer)
Diagnostic ultrasound beamformers leverage the MSC8156ESVT1000B's six SC3850 cores to compute delay-and-sum beamforming across 64 to 128 channels in real time. Each SC3850 sustains a 16-bit complex MAC budget suitable for sample-rate interpolation, while the shared 512 KB L2 cache holds per-channel apodization tables and demodulation coefficients. The integrated SEC engine protects patient-data streams on the way to the back-end image-processing host, and the 783-ball FCBGA package keeps the analog front-end close to the ADC taps for best signal integrity. Designers porting to a newer platform should evaluate the B4860 or LS1046A, but existing ultrasound product lines are well served by the MSC8156ESVT1000B.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MSC8156ESVT1000B — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MSC8156SVT1000B | MSC8156HAG1000B | MSC8154SAG1000B | MSC8256ESAG1000B | TMS320C6678ACYP |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Texas Instruments |
| Package | 783-BBGA, FCBGA | 783-BBGA, FCBGA (pin-compatible) | 783-BBGA, FCBGA (high-reliability variant) | 783-BBGA, FCBGA (pin-compatible family) | 783-BBGA, FCBGA (pin-compatible family) | 841-BGA (system-level pin-compatible only) |
| Number of Cores | 6 | 6 | 6 | 4 | 6 | 8 |
| Core Architecture | StarCore SC3850 | StarCore SC3850 | StarCore SC3850 | StarCore SC3850 | StarCore SC3850 | C66x (different ISA) |
| Clock Rate | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 to 1.25 GHz |
| Unified L2 Cache | 512 KB | 512 KB | 512 KB | 256 KB | 512 KB | Up to 4 MB shared |
| Integrated SEC Engine | Yes (MACsec/IPsec/SSL) | No (removed for cost reduction) | Yes (high-reliability screening) | Yes | Yes | Yes (NetCP/Packet Accelerator) |
| Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Active (limited) |
主な差別化要因
- Most secure variant in the MSC8156 family （vs MSC8156SVT1000B)
- Highest core count in the FCBGA-783 footprint family （vs MSC8154SAG1000B)
- Compared to TI C6678 the StarCore ISA preserves legacy firmware （vs TMS320C6678ACYP)
設計ノート
Estimated: At 1 GHz continuous operation with all six SC3850 cores active, the MSC8156ESVT1000B can dissipate up to 8-10 W on a 1.0 V core and 2.5 V I/O supply (input values from the Freescale datasheet power tables; the manufacturer datasheet's junction-temperature curve should be consulted for the production design). The 783-ball FCBGA package requires a multi-layer PCB with at least 4 layers of solid ground/power planes beneath the die, plus continuous thermal vias into the inner planes; a heatsink is recommended for any design sustained at > 5 W. Add a thermistor pad near the package center so the system firmware can throttle the cores before the silicon hits its 100 C junction-temperature shutdown.
The 783-ball FCBGA on the MSC8156ESVT1000B requires a microvia-stack PCB stack-up with 0.4 mm or finer ball pitch escape routing and a matched-length SerDes layout for Serial RapidIO and SGMII. Use a 50 ohm controlled-impedance stack-up across the inner stripline layers for the high-speed serial links, and add a stitching via fence around the perimeter of the BGA land area to control crosstalk and EMI. Power-plane decoupling must be placed within 5 mm of each supply pin pair and use a mix of 100 nF X7R bypass and 10 uF bulk ceramic on the 1.0 V core rail.
Three common pitfalls when bringing up the MSC8156ESVT1000B: (1) do not skip the boot-ROM configuration - the 96 KB on-chip ROM expects a specific RCW (reset configuration word) on the I2C/Parallel port, and a wrong RCW silently stalls all six cores; (2) the integrated SEC engine requires a one-time fuse-programming step before any IPsec/MACsec key material is usable, so plan provisioning into manufacturing test; (3) the 2.50 V I/O and 1.00 V core supplies must come up in the sequence specified in the datasheet (core first, then I/O) to avoid CMOS latch-up during board-level hot-plug events.
コンプライアンス情報
Compliance data not present in the verified web data; treat all compliance fields as 'unknown' until confirmed against the manufacturer datasheet. AEC-Q100 is not applicable - this is a multicore DSP for base-station/industrial/defense, not an automotive MCU.
